E2D0048-39-22 This version: Feb. 1999 MSC1157 Previous version: May. 1997 ¡ Semiconductor MSC1157 ¡ Semiconductor Speaker Drive Amplifier GENERAL DESCRIPTION The MSC1157, designed specifically to operate at a low voltage with low current consumption, is a power amplifier developed for driving a speaker for a voice IC. The voltage gains can be adjusted over a range of up to ten. The differential output can directly drive a speaker without any output coupling capacitors. The MSC 1157, because of its ability to stand by, is ideally suitable for portable equipment applications powered by a battery. FEATURES • Low voltage operation • Low current dissipation Operating current • Standby function • High output current • Differential outputs : 2.0 to 6.0 V (Single power supply) : : : : 1.6mA without load (typ.) Current dissipation less than 1 mA in standby 350mA peak A speaker can be directly connected between differential outputs. : Gain can be adjusted by use of an external resistor. • Adjustable gain • Package options: 8-pin plastic DIP (DIP8-P-300-2.54) (Product name : MSC1157RS) 8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name : MSC1157MS-K) Chip BLOCK DIAGRAM VCC STBY SEL VCC Logic 52 kW VCC + 5 kW 50 kW + AIN GND SP – VR – 5 kW SP 20 kW 100 kW 1/13 ¡ Semiconductor MSC1157 PIN CONFIGURATION (TOP VIEW) VR 1 8 SEL AIN 2 7 STBY SP 3 6 SP GND 4 5 VCC 8-Pin Plastic DIP or 8-Pin Plastic SOP PIN DESCRIPTIONS Pin Symbol Type 5 VCC — 4 GND — 2 AIN I Description Power supply pin. Ground pin. Signal input pin for analog signal inputs, etc. Digital input pins. Setting these pins configures the standby status. See the table below for how to set the pins. SEL 0 1 7, 8 STBY, SEL I Clock STBY Status 0 Operation 1 Standby Clock Operation 0 Standby 1 Operation Clock Operation 0 Operation 1 Operation Clock Unstable Operation Applying a clock between 32kHz and 4MHz to either the STBY or the SEL pin leads the IC to operation status regardless of the status set at the other pin. Applying clocks to both of the pins at the same time may cause malfunction. Refer to the section, RECOMMENDED OPERATING CONDITIONS since clock frequencies are changed by setting the SEL pin. Bias output pin for internal circuits. This pin is at GND potential during standby. 1 VR O Connecting a capacitor between VR and the GND pin reduces the pop-up noise at power on and improves the ripple elimination ratio. 3 SP O Speaker output pin. This pin outputs a negative phase with respect to the input signal. 6 SP O Speaker output pin. This pin outputs a positive phase with respect to the input signal. 2/13 ¡ Semiconductor MSC1157 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Remark Power Supply Voltage VCC Ta=25°C –0.3 to +6.5 V VCC Input Voltage VIN Ta=25°C –0.3 to VCC+0.3 V IOMAX Ta=25°C PD Ta=25°C Junction Temperature TjMAX — Storage Temperature TSTG — Maximum Output Current Power Dissipation STBY AIN, SEL (*1) SP, SP ±400 mA 470 mW DIP type 400 mW SOP type 125 °C Chip –55 to +150 °C *1 Avoid shorting the output pins (SP and SP) to VCC or GND because the IC may be damaged. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min. Max. Power Supply Voltage VCC — 2.0 6.0 V Load Impedance (*2) RL — 8.0 — W Peak Load Current IO-P — "H" Input Voltage VIH "L" Input Voltage VIL For STBY and SEL pins Unit — 350 mA 0.7 VCC — V — 0.3 VCC V 32 k 4.096 M SEL = "L" At clock input STBY Operating Frequency (*3) fSTBY VCC ≥ 2.4 V Hz SEL = "H" At clock input 32 k 1M –20 +70 VCC ≥ 2.4 V Operating Temperature Top — °C *2 A speaker of 8 W (standard) or more should be used. *3 The input of clocks may cause a little noise in output waveforms. It is recommended to input the DC voltage to inprove voice quality. 3/13 ¡ Semiconductor MSC1157 ELECTRICAL CHARACTERISTICS Parameter AIN Input Resistance Voltage Gain Symbol Unless otherwise specified, Ta=25°C, VCC=2 to 6 V Condition Min. Typ. Max. Unit kW RIN — 14 20 26 AV1 AINÆSP 13.44 14 14.49 AV2 SPÆSP –1.94 0 +1.58 AV3 AINÆ(Between SP-SP) 19.46 20 20.51 100 178 — mW 300 440 — mW — 1.2 — % — 0.37 — % 30 43 — dB VCC=2 V 0.53 0.65 0.77 VCC=6 V 2.49 2.61 2.73 — — ±30 mV VCC–1.15 VCC–1.04 — V — 0.17 0.3 V POUT1 Output Power POUT2 THD1 Total Harmonic Distortion THD2 Ripple Elimination Ratio RR Output DC Voltage (*4) VO VCC=3 V, f=1 kHz RL=8 W, THD≥10% VCC=6 V, f=1 kHz RL=32 W, THD≥10% VCC=3 V, RL=8 W f=1 kHz, POUT=45 mW VCC=6 V, RL=32 W f=1 kHz, POUT=125 mW f=1 kHz, C2=4.7 mF In no signal state dB V Output Offset Voltage DVO Output "H" Voltage VOH Output "L" Voltage VOL STBY, SEL IIH VI=VCC — — ±0.1 mA Input Current IIL VI=GND — — ±0.1 mA Between SP-SP AIN=VCC or GND IOUT=–100 mA AIN=VCC or GND IOUT=100 mA VR Equivalent Resistance RVR — 18 25 32 kW Circuit Current During Operation ICC VCC=6 V, RL=• 1.1 1.6 2.4 mA Circuit Current During Standby ICCS — — — 1.0 mA *4 The typical value of the output voltage in no signal state is determined from the following equation. VO = (VCC – 0.67) 50 kW 50 kW + 52 kW 4/13 ¡ Semiconductor MSC1157 APPLICATION CIRCUIT + C4 C3 – Standby Select Input Standby Input SEL VCC SP STBY C1 AIN Audio Input VR Speaker GND SP + C2 – • If parasitic capacitance of 60pF or more exists between GND and the speaker output pin SP or SP, oscillation may occur. Implement the circuit mount design so as to be less than 60pF. • C1 is the AC coupling capacitor. Cutoff frequency fc on the low frequency side is determined by the following equation. Choose a value of C1 according to the bandwidth. 1 (Hz) 2 ¥ p ¥ C1 ¥ 20k • Choose a value of C2 that is 80 to 100 times as large as that of C1. • When the standby function is not used, connect the pins STBY and SEL to VCC or GND. • It is recommended that the capacitor C4 (approximately 0.1mF) having better high frequency characteristics and the capacitor C3 (approximately 10mF) be placed between the pins VCC and GND. fc = 5/13 ¡ Semiconductor MSC1157 GAIN ADJUSTMENT 1. Gain Adjustment Using Input Resistance (This approach allows gain adjustment with fewer external components) Standby Select Input Standby Input VCC SEL SP STBY R1 C1 Audio Input AIN Speaker VR GND SP + C2 – • Cutoff frequency fc on the low frequency side is determined from the equation: 1 (Hz) 2 ¥ p ¥ C1 ¥ (R1 + 20k) • Voltage gain AV1 is determined from the equation: . fc = . . AV1 = . 100k (V/V) R1 + 20k 2. Gain Adjustment Using Feedback Resistance (This approach has the advantage over the above approach (less noise approach), but the number of components is increased) Standby Select Input Standby Input SEL VCC SP STBY C1 R1 Audio Input AIN VR Speaker GND SP + C2 – R2 • Cutoff frequency fc on the low frequency side is determined from the equation: 1 . R1 + R2 ¥ 20k (W) Zin = (Hz) . R2 + 120k 2 ¥ p ¥ C1 ¥ Zin • Voltage gain AV1 is determined from the equation: . fc = . 5 . AV1 = . 1+ R1 20k + 6 ¥ R1 R2 (V/V) 6/13 ¡ Semiconductor MSC1157 OPERATING CHARACTERISTICS Power Dissipation vs. Ambient Temperature Maxiumum Output Amplitude vs. Voltage Supply 800 12 Maximum Output Amplitude VOM [V] Power Dissipation PD [mW] 700 600 500 400 DIP SOP 300 200 100 0 -30 -20 -10 0 10 20 30 40 50 60 70 8 RL=8W 6 4 2 0 80 90 100 RL=• RL=64W RL=32W RL=16W 10 1 2 3 Ambient Temperature Ta [°C] RL=16W VCC=6.0V 800 600 Power Dissipation PD [mW] 800 Power Dissipation PD [mW] 7 1000 RL=8W VCC=4.5V 400 VCC=3.0V 600 VCC=6.0V 400 VCC=4.5V 200 200 100 200 300 400 500 0 600 VCC=3.0V 100 200 300 400 500 600 500 600 Output Power POUT [mW] Output Power POUT [mW] Power Dissipation vs. Output Power Power Dissipation vs. Output Power 1000 1000 RL=32W RL=64W 800 Power Dissipation PD [mW] 800 Power Dissipation PD [mW] 6 Power Dissipation vs. Output Power Power Dissipation vs. Output Power 600 400 VCC=6.0V 200 600 400 200 VCC=4.5V VCC=3.0V 0 5 Supply Voltage VCC [V] 1000 0 4 100 200 300 400 Output Power POUT [mW] 500 600 0 VCC=6.0V VCC=3.0V 100 VCC=4.5V 200 300 400 Output Power POUT [mW] 7/13 ¡ Semiconductor MSC1157 VR Rise Time vs. Capacitor Value (C2) Circuit Current vs. Voltage Supply 10000 2E-3 1000 VR Rise Time (0 to 90%) [ms] Circuit Current ICC [A] 1.5E-3 1E-3 5E-4 0 1 2 3 4 5 6 100 10 1 0.1 7 1E-2 0.1 Output Voltage vs. Load Current Output Voltage vs. Load Current 0 2 SP Output Output "H" Voltage VOH (VCC-VO) [V] 1.6 Output "L" Voltage VOL [V] SP Output -0.2 1.4 1.2 1 VCC=2.0V 0.8 0.6 VCC=3.0V VCC=6.0V 0.4 -0.4 -0.6 VCC=6.0V VCC=3.0V -0.8 -1 VCC=2.0V -1.2 -1.4 -1.6 -1.8 0.2 0 50 100 150 200 250 300 -2 350 0 50 100 0 SP Output Output "H" Voltage VOH (VCC-VO) [V] Output "L" Voltage VOL [V] 1.6 1.4 1.2 VCC=2.0V 0.6 0.4 VCC=3.0V VCC=6.0V 0.2 0 50 100 150 200 250 Load Current IOUT [mA] 250 300 350 300 350 SP Output -0.2 1.8 1 200 Output Voltage vs. Load Current Output Voltage vs. Load Current 0.8 150 Load Current IOUT [mA] Load Current IOUT [mA] 2 100 10 Capacitor C2 [mF] Supply Voltage VCC [V] 1.8 1 300 -0.4 -0.6 VCC=6.0V VCC=3.0V -0.8 -1 V =2.0V CC -1.2 -1.4 -1.6 -1.8 350 -2 0 50 100 150 200 250 Load Current IOUT [mA] 8/13 ¡ Semiconductor MSC1157 Circuit Curent vs. Ambient Temperature Circuit Current [mA] 2.4 2.2 2 VCC = 6.0V 1.8 1.6 VCC = 2.0V 1.4 1.2 1 0.8 -40 Range of Ambient Temp. -20 0 20 40 60 80 100 120 140 100 120 140 Ambient Temperature [°C] VR Resistance vs. Ambient Temperature VR Resistance [kW] 64 60 56 52 48 44 40 36 -40 Range of Ambient Temp. -20 0 20 40 60 80 Circuit Current during standby ICCS [mA] Ambient Temperature [°C] Circuit Current during Standby vs. Ambient Temperature (VCC = 6.0V) 3 2.6 2.2 1.8 1.4 1 0.6 Range of Ambient Temp. 0.2 -0.2 -40 -20 0 20 40 60 80 100 120 140 Ambient Temperature [°C] 9/13 ¡ Semiconductor MSC1157 f=1kHz Total Harmonic Distortion vs. Output 10 Total Harmonic Distortion THD [%] VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W 5 VCC=6V RL=16W 0 0 100 200 300 400 500 600 Output Power POUT [mW] f=3kHz Total Harmonic Distortion vs. Output Total Harmonic Distortion THD [%] 10 VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W 5 VCC=6V RL=16W 0 0 100 200 300 400 500 600 Output Power POUT [mW] Voltage Gain vs. Frequency Ripple Elimination Ratio vs. Frequency 26 20 23 10 C2=0 mF C1 =0 . mF 22 11 8 5 C1 =0 .1m F 14 Ripple Elimination Ratio RR [dB] 17 F .47m C1=0 C1 =0 .04 7m F Voltage Gain AV3 [dB] 20 C1 Vi 2 SEL VCC SP STBY AIN SP VR GND VO -1 -4 Vi SEL VCC SP STBY AIN SP VR GND C2 0 -10 -20 -30 C 2= 2.2 C 2= 4.7 C 2= C 2= -40 mF VO mF 10m F 22m F -50 -60 -70 20 100 1k Frequency f [Hz] 10k 20k -80 50 100 1k 10k 20k Frequency f [Hz] 10/13 ¡ Semiconductor MSC1157 PAD CONFIGURATION Pad Layout Chip size Chip thickness Pad size (PV aperture) Substrate potential Pad location diagram : X=2.3mm, Y=2.4mm : 350±30mm : 110¥110mm : GND Y-Axis 2 1 8 7 X-Axis 3 6 5 4 Pad Coordinates (Chip center is located at X=0 and Y=0.) (Unit: µm) Pad No. Pad Name X-AXIS Y-AXIS 1 VR –133 1035 2 AIN –985 1035 3 SP –950 –263 4 GND –180 –1027 5 VCC 240 –914 6 SP 950 –263 7 STBY 985 1035 8 SEL 159 1035 11/13 ¡ Semiconductor MSC1157 PACKAGE DIMENSIONS (Unit : mm) DIP8-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.46 TYP. 12/13 ¡ Semiconductor MSC1157 (Unit : mm) SOP8-P-250-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.10 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 13/13 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. 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