MAXIM DS12CR887-5+

19-5217; Rev 6; 4/10
RTCs with Constant-Voltage Trickle Charger
Features
The DS12R885 is a functional drop-in replacement for
the DS12885 real-time clock (RTC). The device provides an RTC/calendar, one time-of-day alarm, three
maskable interrupts with a common interrupt output, a
programmable square wave, and 114 bytes of batterybacked static RAM. The date at the end of the month is
automatically adjusted for months with fewer than 31
days, including correction for leap years. It also operates in either 24-hour or 12-hour format with an AM/PM
indicator. A precision temperature-compensated circuit
monitors the status of VCC. If a primary power failure is
detected, the device automatically switches to a backup supply. The VBACKUP pin supports a rechargeable
battery or a super cap and includes an integrated,
always enabled trickle charger. The DS12R885 is
accessed through a multiplexed byte-wide interface,
which supports both Intel and Motorola modes. The
DS12CR887 and DS12R887 integrate the DS12R885
die with a crystal and battery.
♦ Trickle-Charge Capability for a Rechargeable
Battery or Super Cap
♦ Selectable Intel or Motorola Bus Timing
♦ RTC Counts Seconds, Minutes, Hours, Day, Date,
Month, and Year with Leap-Year Compensation to
2100
♦ Interrupt Output with Three Independently
Maskable Interrupt Flags
♦ Time-of-Day Alarm is Once-per-Second to Onceper-Day
♦ Periodic Rates from 122µs to 500ms
♦ End-of-Clock Update Cycle Flag
♦ 14 Bytes of Clock and Control Registers
♦ 114 Bytes of General-Purpose Battery-Backed NV
RAM with Clear Input
♦ Programmable Square-Wave Output
♦ Automatic Power-Fail Detect and Switch Circuitry
♦ +5.0V or +3.3V Operation
♦ Industrial Temperature Range
♦ DS12CR887 Encapsulated DIP (EDIP) Module with
Integrated Battery and Crystal
♦ DS12R887 BGA Module Surface-Mountable
Package with Integrated Crystal and
Rechargeable Battery
Applications
Embedded Systems
Utility Meters
Security Systems
Network Hubs, Bridges, and Routers
Typical Operating Circuit
CRYSTAL
X1
AS
RESET
RCLR
DS
CS
PINPACKAGE
DS12R885S-5+
-40°C to +85°C
24 SO
(300 mils)
DS12R885-5
DS12R885S-5+
T&R
-40°C to +85°C
24 SO
(300 mils)
DS12R885-5
DS12R885S-33+ -40°C to +85°C
24 SO
(300 mils)
DS12R885-33
24 SO
DS12R885S-33+
-40°C to +85°C
(300 mils)
T&R
DS12R885-33
DS12CR887-5+ -40°C to +85°C
24 EDIP
(700 mils)
DS12CR887-5
DS12CR887-33+ -40°C to +85°C
24 EDIP
(700 mils)
DS12CR887-33
VCC
R/W
DS83C520
TEMP RANGE
PART
VCC
X2
Ordering Information
DS12R885
AD(0–7)
SQW
VBACKUP
IRQ
MOT
±
GND
SUPER
CAP
Pin Configurations appear at end of data sheet.
TOP MARK*
DS12R887-5
-40°C to +85°C 48 BGA
DS12R887-5
DS12R887-33
-40°C to +85°C 48 BGA
DS12R887-33
+Denotes a lead(Pb)-free/RoHS-compliant package.
T&R = Tape and reel.
*A “+” anywhere on the top mark indicates a lead(Pb)-free
device.
______________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1
DS12R885/DS12CR887/DS12R887
General Description
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
ABSOLUTE MAXIMUM RATINGS
Voltage Range on VCC Pin Relative to Ground .....-0.3V to +6.0V
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range
EDIP, BGA ........................................................-40°C to +85°C
SO ...................................................................-55°C to +125°C
Lead Temperature (soldering, 10s) .................................+260°C
(Note: EDIP is hand or wave-soldered only.)
Soldering Temperature (reflow)
SO .................................................................................+260°C
BGA...............................................................................+240°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
MIN
TYP
MAX
-33
CONDITIONS
2.97
3.3
3.63
-5
4.5
5.0
5.5
UNITS
V
Supply Voltage (Note 2)
VCC
VBACKUP Input Voltage
(DS12R885 Only)
VBACKUP
(Note 2)
2.0
VOUT
V
Input Logic 1
VIH
(Note 2)
2.2
VCC +
0.3
V
Input Logic 0
VIL
(Note 2)
-0.3
+0.8
V
VCC Power-Supply Current
(Note 3)
ICC1
VCC Standby Current (Note 4)
ICCS
Input Leakage
-33
0.7
2
-5
0.8
2
-5
0.250
0.5
-33
0.140
0.3
I IL
-1.0
+1.0
mA
mA
μA
I/O Leakage
I OL
(Note 5)
-1.0
+1.0
μA
Input Current
IMOT
(Note 6)
-1.0
+500
μA
Output Current at 2.4V
I OH
(Note 2)
-1.0
Output Current at 0.4V
I OL
Power-Fail Voltage (Note 2)
VRT Trip Point
VPF
VRTTRIP
mA
(Note 2)
4.0
-33
2.7
2.88
2.97
-5
4.05
4.33
4.5
-33
-5
mA
V
1.3
V
Trickle-Charger Current-Limiting
Resistor
R1
DS12R885 Only
10
k
Trickle-Charger Output Voltage
VOUT
DS12R885 Only
3.05
V
2
_____________________________________________________________________
RTCs with Constant-Voltage Trickle Charger
(VCC = 0V, VBACKUP = 3.2V, TA = -40°C to +85°C, unless otherwise noted.) (Note 1)
PARAMETER
VBACKUP Current (OSC On);
TA = +25°C, VBACKUP = 3.0V
VBACKUP Current (Oscillator Off)
SYMBOL
IBACKUP2
CONDITIONS
MIN
(Note 7)
TYP
MAX
UNITS
800
1000
nA
100
nA
MAX
UNITS
DC
ns
IBACKUPDR (Note 7)
AC ELECTRICAL CHARACTERISTICS
(VCC = 4.5V to 5.5V, TA = -40°C to +85°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
Cycle Time
Pulse Width, DS Low or R/W
tCYC
180
PWEL
80
ns
Pulse Width, DS High or R/W
PWEH
65
ns
Input Rise and Fall
tR, tF
R/W Hold Time
tRWH
0
30
ns
R/W Setup Time Before DS/E
tRWS
10
ns
Chip-Select Setup Time Before
DS or R/W
tCS
5
ns
Chip-Select Hold Time
tCH
0
ns
Read-Data Hold Time
tDHR
5
Write-Data Hold Time
tDHW
0
ns
Address Valid Time to AS Fall
tASL
20
ns
35
ns
ns
Address Hold Time to AS Fall
tAHL
5
ns
Delay Time DS/E to AS Rise
tASD
10
ns
Pulse Width AS High
PWASH
30
ns
Delay Time, AS to DS/E Rise
tASED
35
ns
Output Data Delay Time from DS
or R/W
tDDR
Data Setup Time
tDSW
50
ns
Reset Pulse Width
tRWL
5
μs
IRQ Release from DS
t IRDS
0
2
μs
IRQ Release from RESET
t IRR
0
2
μs
(Note 8)
15
60
ns
_____________________________________________________________________
3
DS12R885/DS12CR887/DS12R887
DC ELECTRICAL CHARACTERISTICS (DS12R885 Only)
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
AC ELECTRICAL CHARACTERISTICS
(VCC = 2.97V to 3.63V, TA = -40°C to +85°C.) (Note 1)
PARAMETER
Cycle Time
SYMBOL
tCYC
CONDITIONS
MIN
280
TYP
MAX
DC
UNITS
ns
Pulse Width, DS Low or R/W High
PWEL
130
ns
Pulse Width, DS High or R/W Low
PWEH
90
ns
Input Rise and Fall
tR, tF
R/W Hold Time
tRWH
0
ns
R/W Setup Time Before DS
tRWS
15
ns
Chip-Select Setup Time Before
DS or R/W
tCS
8
ns
Chip-Select Hold Time
tCH
0
ns
30
Read-Data Hold Time
tDHR
5
Write-Data Hold Time
tDHW
0
ns
Address Valid Time to AS Fall
tASL
30
ns
Address Hold Time to AS Fall
tAHL
15
ns
Delay Time DS to AS Rise
tASD
15
ns
PWASH
45
ns
Delay Time, AS to DS Rise
tASED
55
ns
Output Data Delay Time from DS
or R/W
tDDR
Data Setup Time
tDSW
70
Reset Pulse Width
tRWL
5
IRQ Release from DS
t IRDS
0
2
μs
IRQ Release from RESET
t IRR
0
2
μs
Pulse Width AS High
4
(Note 8)
_____________________________________________________________________
20
55
ns
80
ns
ns
ns
μs
RTCs with Constant-Voltage Trickle Charger
PWASH
tASED
AS
tASD
tCYC
PWEH
PWEL
DS
tRWS
tRWH
R/ W
tCH
tCS
CS
tDSW
tDHW
AD0–AD7
WRITE
tAHL
tASL
tDHR
AD0–AD7
READ
tDDR
Intel Bus Write Timing
tCYC
AS
PWASH
tASD
DS
tASED
tASD
R/W
PWEH
PWEL
tCH
tCS
CS
tASL
tAHL
tDSW
tDHW
AD0–AD7
WRITE
_____________________________________________________________________
5
DS12R885/DS12CR887/DS12R887
Motorola Bus Read/Write Timing
RTCs with Constant-Voltage Trickle Charger
DS12R885/DS12CR887/DS12R887
Intel Bus Read Timing
tCYC
PWASH
AS
tASD
tASED
DS
PWEH
PWEL
tASD
R/W
tCH
tCS
CS
tASL
tDHR
tDDR
tAHL
AD0–AD7
IRQ Release Delay Timing
DS
RESET
tRWL
IRQ
tIRR
tIRDS
Power-Up/Power-Down Timing
VCC
VPF(MAX)
VPF(MIN)
tF
tR
tRPU
tDR
INPUTS
RECOGNIZED
DON'T CARE
RECOGNIZED
HIGH-Z
OUTPUTS
6
VALID
_____________________________________________________________________
VALID
RTCs with Constant-Voltage Trickle Charger
(TA = -40°C to +85°C) (Note 1)
PARAMETER
SYMBOL
Recovery at Power-Up
CONDITIONS
MIN
TYP
MAX
UNITS
200
ms
tRPU
20
VCC Fall Time; VPF(MAX) to
VPF(MIN)
tF
300
µs
VCC Rise Time; VPF(MIN) to
VPF(MAX)
tR
0
µs
DATA RETENTION (DS12CR887)
PARAMETER
SYMBOL
Expected Data Retention
tDR
CONDITIONS
TA = +25°C
MIN
TYP
MAX
5
UNITS
Years
CAPACITANCE
(TA = +25°C)
PARAMETER
SYMBOL
Capacitance on All Input Pins
Except X1 and X2
CIN
Capacitance on IRQ, SQW, and
DQ Pins
CIO
CONDITIONS
MIN
TYP
MAX
UNITS
(Note 9)
10
pF
(Note 9)
10
pF
AC TEST CONDITIONS
PARAMETER
TEST CONDITIONS
Input Pulse Levels (-5)
0 to 3.0V
Input Pulse Levels (-33)
0 to 2.7V
Output Load Including Scope and Jig (-5)
50pF + 1TTL Gate
Output Load Including Scope and Jig (-33)
25pF + 1TTL Gate
Input and Output Timing Measurement Reference Levels
Input/Output: VIL maximum and VIH minimum
Input-Pulse Rise and Fall Times
5ns
WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Note 9:
Limits at -40°C are guaranteed by design and not production tested.
All voltages are referenced to ground.
All outputs are open.
Specified with CS = DS = R/W = RESET = VCC; MOT, AS, AD0–AD7 = 0; VBACKUP open.
Applies to the AD0 to AD7 pins, the IRQ pin, and the SQW pin when each is in a high-impedance state.
The MOT pin has an internal 20kΩ pulldown.
Measured with a 32.768kHz crystal attached to X1 and X2.
Measured with a 50pF capacitance load.
Guaranteed by design. Not production tested.
_____________________________________________________________________
7
DS12R885/DS12CR887/DS12R887
POWER-UP/POWER-DOWN CHARACTERISTICS
Typical Operating Characteristics
(VCC = +3.3V, TA = +25°C, unless otherwise noted.)
IBACKUP vs. VBACKUP
(DS12R885)
VBACKUP vs. VCC vs. IBACKUP
(DS12R885)
DS12R885 toc02
3.0
0μA
-15μA
2.8
600
VBACKUP (V)
SUPPLY CURRENT (nA)
VCC = 0V
DS12R885 toc01
625
-30μA
2.6
-45μA
2.4
575
-60μA
2.2
550
2.0
2.3
2.5
2.8
3.0
VCC (V)
IBACKUP vs. TEMPERATURE
(DS12R885)
OSCILLATOR FREQUENCY
vs. SUPPLY VOLTAGE
32768.10
DS12R885 toc03
650
625
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VBACKUP (V)
VCC = 0V,
VBACKUP = 3.0V
32768.08
32768.06
FREQUENCY (Hz)
600
575
550
525
DS12R885 toc04
2.0
SUPPLY CURRENT (nA)
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
32768.04
32768.02
32768.00
32767.98
32767.96
500
32767.94
475
32767.92
32767.90
450
-40 -25 -10
5
20
35
50
65
80
2.0
2.5
TEMPERATURE (°C)
8
_____________________________________________________________________
3.0
3.5
4.0
SUPPLY (V)
4.5
5.0
5.5
RTCs with Constant-Voltage Trickle Charger
X1
OSC
DIVIDE
BY 8
DIVIDE
BY 64
DIVIDE
BY 64
X2
DS12R887/
DS12CR887
ONLY
VCC
GND
DS12R887/
DS12CR887
ONLY
16:1 MUX
POWER
CONTROL
AND
TRICKLE
CHARGER
VBACKUP
DS12R885
SQUAREWAVE
GENERATOR
SQW
IRQ
GENERATOR
IRQ
CS
R/W
REGISTERS A, B, C, D
DS
BUS
INTERFACE
AS
MOT
RESET
CLOCK/CALENDAR
UPDATE LOGIC
CLOCK/CALENDAR AND
ALARM REGISTERS
BUFFERED CLOCK/
CALENDAR AND ALARM
REGISTERS
AD0–AD7
USER RAM
114 BYTES
RLCR
Pin Description
SO
PIN
EDIP
BGA
1
1
C5
MOT
2
—
—
X1
3
—
—
X2
4–11
4–11
F4, D4,
F3, D3,
F2, D2,
F1, D1
NAME
AD0–
AD7
FUNCTION
Motorola or Intel Bus Timing Selector. This pin selects one of two bus types. When
connected to VCC, Motorola bus timing is selected. When connected to GND or left
disconnected, Intel bus timing is selected. The pin has an internal pulldown resistor.
Connections for Standard 32.768kHz Quartz Crystal. The internal oscillator circuitry is
designed for operation with a crystal having a 12.5pF specified load capacitance (CL).
Pin X1 is the input to the oscillator and can optionally be connected to an external
32.768kHz oscillator. The output of the internal oscillator, pin X2, is left unconnected if
an external oscillator is connected to pin X1.
Multiplexed, Bidirectional Address/Data Bus. The addresses are presented during the first
portion of the bus cycle and latched into the DS12R885 by the falling edge of AS. Write
data is latched by the falling edge of DS (Motorola timing) or the rising edge of R/W (Intel
timing). In a read cycle, the DS12R885 outputs data during the latter portion of DS (DS and
R/W high for Motorola timing, DS low and R/W high for Intel timing). The read cycle is
terminated and the bus returns to a high-impedance state as DS transitions low in the case
of Motorola timing or as DS transitions high in the case of Intel timing.
_____________________________________________________________________
9
DS12R885/DS12CR887/DS12R887
Functional Diagram
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
Pin Description (continued)
SO
PIN
EDIP
12, 16
12
13
14
14
D5–D8,
E1–E8,
F5–F8
C1
C3
NAME
GND
FUNCTION
Ground
CS
Chip-Select Input. The active-low chip-select signal must be asserted low for a bus cycle
in the DS12R885 to be accessed. CS must be kept in the active state during DS and AS
for Motorola timing and during DS and R/W for Intel timing. Bus cycles that take place
without asserting CS latch addresses, but no access occurs. When VCC is below VPF volts,
the DS12R885 inhibits access by internally disabling the CS input. This action protects the
RTC data and the RAM data during power outages.
AS
Address Strobe Input. A positive-going address-strobe pulse serves to demultiplex the
bus. The falling edge of AS causes the address to be latched within the DS12R885. The
next rising edge that occurs on the AS bus clears the address regardless of whether CS is
asserted. An address strobe must immediately precede each write or read access. If a
write or read is performed with CS deasserted, another address strobe must be performed
prior to a read or write access with CS asserted.
15
15
C2
R/W
Read/Write Input. The R/W pin has two modes of operation. When the MOT pin is
connected to VCC for Motorola timing, R/W is at a level that indicates whether the current
cycle is a read or write. A read cycle is indicated with a high level on R/W while DS is high.
A write cycle is indicated when R/W is low during DS. When the MOT pin is connected to
GND for Intel timing, the R/W signal is an active-low signal. In this mode, the R/W pin
operates in a similar fashion as the write-enable signal (WE) on generic RAMs. Data are
latched on the rising edge of the signal.
22
2, 3, 16,
20–22
A3
N.C.
No Connection. This pin should remain unconnected. On the EDIP, these pins are missing
by design.
17
10
13
BGA
17
A1
DS
Data Strobe or Read Input. The DS pin has two modes of operation depending on the level of
the MOT pin. When the MOT pin is connected to VCC, Motorola bus timing is selected. In this
mode, DS is a positive pulse during the latter portion of the bus cycle and is called data
strobe. During read cycles, DS signifies the time that the DS12R885 is to drive the
bidirectional bus. In write cycles, the trailing edge of DS causes the DS12R885 to latch the
written data. When the MOT pin is connected to GND, Intel bus timing is selected. DS
identifies the time period when the DS12R885 drives the bus with read data. In this mode, the
DS pin operates in a similar fashion as the output-enable (OE) signal on a generic RAM.
____________________________________________________________________
RTCs with Constant-Voltage Trickle Charger
PIN
SO
18
EDIP
18
BGA
A2
NAME
FUNCTION
RESET
Reset Input. The active-low RESET pin has no effect on the clock, calendar, or RAM. On
power-up, the RESET pin can be held low for a time to allow the power supply to
stabilize. The amount of time that RESET is held low is dependent on the application.
However, if RESET is used on power-up, the time RESET is low should exceed 200ms to
ensure that the internal timer that controls the DS12R885 on power-up has timed out.
When RESET is low and VCC is above VPF, the following occurs:
A. Periodic interrupt-enable (PIE) bit is cleared to 0.
B. Alarm interrupt-enable (AIE) bit is cleared to 0.
C. Update-ended interrupt-enable (UIE) bit is cleared to 0.
D. Periodic-interrupt flag (PF) bit is cleared to 0.
E. Alarm-interrupt flag (AF) bit is cleared to 0.
F. Update-ended interrupt flag (UF) bit is cleared to 0.
G. Interrupt-request status flag (IRQF) bit is cleared to 0.
H. IRQ pin is in the high-impedance state.
I. The device is not accessible until RESET is returned high.
J. Square-wave output-enable (SQWE) bit is cleared to 0.
In a typical application, RESET can be connected to VCC. This connection allows the
DS12R885 to go in and out of power fail without affecting any of the control registers.
IRQ
Interrupt Request Output. The IRQ pin is an active-low output of the DS12R885 that can
be used as an interrupt input to a processor. The IRQ output remains low as long as the
status bit causing the interrupt is present and the corresponding interrupt-enable bit is
set. The processor program normally reads the C register to clear the IRQ pin. The
RESET pin also clears pending interrupts. When no interrupt conditions are present, the
IRQ level is in the high-impedance state. Multiple interrupting devices can be
connected to an IRQ bus, provided that they are all open drain. The IRQ pin is an opendrain output and requires an external pullup resistor to VCC.
19
19
A4
20
—
—
Connection for Rechargeable Battery or Super Cap. This pin provides trickle charging
VBACKUP when VCC is greater than VBACKUP. On the DS12CR887 and DS12R887, the VBACKUP pin
is missing and is internally connected to a lithium cell.
A5
RCLR
RAM Clear. The active-low RCLR pin is used to clear (set to logic 1) all 114 bytes of
general-purpose RAM, but does not affect the RAM associated with the RTC. To clear
the RAM, RCLR must be forced to an input logic 0 during battery-backup mode when
VCC is not applied. The RCLR function is designed to be used through a human
interface (shorting to ground manually or by a switch) and not to be driven with external
buffers. This pin is internally pulled up. Do not use an external pullup resistor on this
pin.
21
—
23
23
C4
SQW
Square-Wave Output. The SQW pin can output a signal from one of 13 taps provided by
the 15 internal divider stages of the RTC. The frequency of the SQW pin can be changed
by programming Register A, as shown in Table 3. The SQW signal can be turned on and
off using the SQWE bit in Register B. The SQW signal is not available when VCC is less
than VPF.
24
24
A6–A8,
B1–B8,
C6–C8
VCC
DC Power Pin for Primary Power Supply. When VCC is applied within normal limits, the
device is fully accessible and data can be written and read. When VCC is below VPF
reads and writes are inhibited.
____________________________________________________________________
11
DS12R885/DS12CR887/DS12R887
Pin Description (continued)
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
Detailed Description
The DS12R885 is a drop-in replacement for the
DS12885 RTC. The device provides 14 bytes of realtime clock/calendar, alarm, and control/status registers
and 114 bytes of nonvolatile, battery-backed static
RAM. A time-of-day alarm, three maskable interrupts
with a common interrupt output, and a programmable
square-wave output are available. The DS12R885 also
operates in either 24-hour or 12-hour format with an
AM/PM indicator. A precision temperature-compensated circuit monitors the status of V CC . If a primary
power-supply failure is detected, the device automatically switches to a backup supply. The backup supply
input supports either a rechargeable battery or a super
cap, and includes an integrated trickle charger. The
trickle charger is always enabled. The DS12R885 is
accessed through a multiplexed address/data bus that
supports Intel and Motorola modes.
The DS12R887 is a surface-mount package using the
DS12R885 die, a 32.768kHz crystal, and a rechargeable battery. The device provides a real-time clock/calendar, one time-of-day alarm, three maskable interrupts
with a common interrupt output, a programmable
square wave, and 114 bytes of nonvolatile, batterybacked static RAM. The date at the end of the month is
automatically adjusted for months with fewer than 31
days, including correction for leap years. It also operates in either 24-hour or 12-hour format with an AM/PM
indicator. A precision temperature-compensated circuit
monitors the status of VCC. If a primary power failure is
detected, the device automatically switches to a backup battery included in the package. The device is
accessed through a multiplexed byte-wide interface,
which supports both Intel and Motorola modes.
The DS12CR887 EDIP integrates a DS12R885 die with
a crystal and battery. The charging circuit on the
DS12R885 die is disabled. The battery has sufficient
capacity to power the oscillator and registers for five
years in the absence of VCC at +25°C.
The DS12R887 BGA includes a crystal and a rechargeable battery. A fully charged battery can power the oscillator and registers (typical current at +25°C) in the
absence of V CC for approximately 11 days (10% of
capacity consumed) or 98 days (90% capacity consumed). When the discharge depth is 10% of capacity,
the battery can be recharged up to 1,000 times. If the discharge depth is 90% of capacity, the battery can be
recharged up to 30 times. Thus, the life of the device
would be approximately 30 years (11 days X 1,000
cycles) or 8 years (98 days x 30 cycles). Charging time to
full capacity is approximately two days with VCC applied.
12
Please consult related application notes for detailed
information on battery lifetime versus depth of discharge, and expected product lifetime based upon
battery cycles.
Oscillator Circuit
The DS12R885 uses an external 32.768kHz crystal. The
oscillator circuit does not require any external resistors
or capacitors to operate. Table 1 specifies several crystal parameters for the external crystal. Figure 1 shows a
functional schematic of the oscillator circuit. An enable
bit in the control register controls the oscillator.
Oscillator startup times are highly dependent upon
crystal characteristics, PC board leakage, and layout.
High ESR and excessive capacitive loads are the major
contributors to long startup times. A circuit using a
crystal with the recommended characteristics and
proper layout usually starts within one second.
Table 1. Crystal Specifications*
PARAMETER
SYMBOL
Nominal
Frequency
fO
Series
Resistance
ESR
Load
Capacitance
CL
MIN
TYP
MAX UNITS
32.768
kHz
50
12.5
k
pF
*The crystal, traces, and crystal input pins should be isolated
from RF generating signals. Refer to Application Note 58:
Crystal Considerations with Dallas Real-Time Clocks (RTCs) for
additional specifications.
COUNTDOWN
CHAIN
C L1
CL2
RTC REGISTERS
DS12R885
X1
X2
CRYSTAL
Figure 1. Oscillator Circuit Showing Internal Bias Network
____________________________________________________________________
RTCs with Constant-Voltage Trickle Charger
Clock Accuracy
The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match
between the capacitive load of the oscillator circuit and
the capacitive load for which the crystal was trimmed.
Additional error is added by crystal frequency drift
caused by temperature shifts. External circuit noise coupled into the oscillator circuit can result in the clock running fast. Figure 2 shows a typical PC board layout for
isolation of the crystal and oscillator from noise. Refer to
Application Note 58: Crystal Considerations with Dallas
Real-Time Clocks (RTCs) for more detailed information.
The DS12R887 and DS12CR887 are calibrated at the
factory to an accuracy of ±1 minute per month at
+25°C during data-retention time for the period tDR.
Power-Down/Power-Up
Considerations
The real-time clock continues to operate regardless of
the VCC input level, and the RAM and alarm memory
locations remain nonvolatile. V BACKUP must remain
within the minimum and maximum limits when VCC is
not applied. When VCC is applied and exceeds VPF
(power-fail trip point), the device becomes accessible
after tREC—if the oscillator is running and the oscillator
countdown chain is not in reset (Register A). This time
allows the system to stablize after power is applied. If
the oscillator is not enabled, the oscillator-enable bit is
enabled on power-up, and the device becomes immediately accessible.
Time, Calendar, and Alarm
Locations
The time and calendar information is obtained by reading the appropriate register bytes. The time, calendar,
and alarm are set or initialized by writing the appropriate register bytes. The contents of the 10 time, calendar, and alarm bytes can be either binary or
binary-coded decimal (BCD) format.
The day-of-week register increments at midnight, incrementing from 1 through 7. The day-of-week register is
LOCAL GROUND PLANE (LAYER 2)
X1
CRYSTAL
X2
NOTE: AVOID ROUTING SIGNAL LINES
IN THE CROSSHATCHED AREA
(UPPER LEFT QUADRANT) OF
THE PACKAGE UNLESS THERE IS
A GROUND PLANE BETWEEN THE
SIGNAL LINE AND THE DEVICE PACKAGE.
GND
Figure 2. Layout Example
used by the daylight saving function, so the value 1 is
defined as Sunday. The date at the end of the month is
automatically adjusted for months with fewer than 31
days, including correction for leap years.
Before writing the internal time, calendar, and alarm registers, the SET bit in Register B should be written to logic
1 to prevent updates from occurring while access is
being attempted. In addition to writing the 10 time, calendar, and alarm registers in a selected format (binary or
BCD), the data mode bit (DM) of Register B must be set
to the appropriate logic level. All 10 time, calendar, and
alarm bytes must use the same data mode. The SET bit
in Register B should be cleared after the data mode bit
has been written to allow the RTC to update the time and
calendar bytes. Once initialized, the RTC makes all
updates in the selected mode. The data mode cannot be
changed without reinitializing the 10 data bytes. Tables
2A and 2B show the BCD and binary formats of the time,
calendar, and alarm locations.
The 24/12 bit cannot be changed without reinitializing the
hour locations. When the 12-hour format is selected, the
higher-order bit of the hours byte represents PM when it
is logic 1. The time, calendar, and alarm bytes are always
accessible because they are double-buffered. Once per
second the seven bytes are advanced by one second
and checked for an alarm condition.
If a read of the time and calendar data occurs during
an update, a problem exists where seconds, minutes,
hours, etc., may not correlate. The probability of reading incorrect time and calendar data is low. Several
____________________________________________________________________
13
DS12R885/DS12CR887/DS12R887
An external 32.768kHz oscillator can also drive the
DS12R885. In this configuration, the X1 pin is connected
to the external oscillator signal and the X2 pin is left
unconnected.
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
methods of avoiding any possible incorrect time and
calendar reads are covered later in this text.
The three alarm bytes can be used in two ways. First,
when the alarm time is written in the appropriate hours,
minutes, and seconds alarm locations, the alarm interrupt is initiated at the specified time each day, if the
alarm-enable bit is high. In this mode, the “0” bits in the
alarm registers and the corresponding time registers
must always be written to 0 (Table 2A and 2B). Writing
the 0 bits in the alarm and/or time registers to 1 can
result in undefined operation.
The second use condition is to insert a “don’t care”
state in one or more of the three alarm bytes. The don’tcare code is any hexadecimal value from C0 to FF. The
two most significant bits of each byte set the don’t-care
condition when at logic 1. An alarm is generated each
hour when the don’t-care bits are set in the hours byte.
Similarly, an alarm is generated every minute with
don’t-care codes in the hours and minute alarm bytes.
The don’t-care codes in all three alarm bytes create an
interrupt every second.
All 128 bytes can be directly written or read, except for
the following:
1) Registers C and D are read-only.
2) Bit 7 of register A is read-only.
3) The MSB of the seconds byte is read-only.
Table 2A. Time, Calendar, and Alarm Data Modes—BCD Mode (DM = 0)
ADDRESS
00H
BIT 7
0
01H
0
BIT 6
BIT 5
BIT 4
10 Seconds
BIT 3
10 Seconds
BIT 2
BIT 1
Seconds
BIT 0
Seconds
FUNCTION
Seconds
RANGE
00–59
Seconds Alarm
00–59
02H
0
10 Minutes
Minutes
Minutes
00–59
03H
0
10 Minutes
Minutes
Minutes Alarm
00–59
Hours
Hours
1–12 +AM/PM
00–23
Hours
Hours Alarm
1–12 +AM/PM
00–23
04H
05H
AM/PM
0
AM/PM
0
0
0
07H
0
0
08H
0
0
09H
10 Hours
10 Hours
0
0
06H
0AH
0
0
10 Hours
10 Hours
0
0
0
Day
01–07
Date
Day
Date
01–31
Month
Month
01–12
Year
Year
00–99
Control
—
10 Date
0
10 Months
10 Years
UIP
DV2
DV1
DV0
RS3
RS2
RS1
RS0
0BH
SET
PIE
AIE
UIE
SQWE
DM
24/12
DSE
Control
—
0CH
IRQF
PF
AF
UF
0
0
0
0
Control
—
0DH
VRT
0
0
0
0
0
0
0
Control
—
0EH-7F
X
X
X
X
X
X
X
X
RAM
—
X = Read/Write Bit.
Note: Unless otherwise specified, the state of the registers is not defined when power is first applied. Except for the seconds register, 0 bits in the time and date registers can be written to 1, but may be modified when the clock updates. 0 bits should always be
written to 0 except for alarm mask bits.
14
____________________________________________________________________
RTCs with Constant-Voltage Trickle Charger
ADDRESS
00H
BIT 7
0
BIT 6
0
BIT 5
01H
0
0
Seconds
Seconds Alarm
00–3B
02H
0
0
Minutes
Minutes
00–3B
03H
0
0
Minutes
Minutes Alarm
00–3B
Hours
01–0C +AM/PM
00–17
Hours Alarm
01–0C +AM/PM
00–17
01–07
01–1F
01–0C
00–63
—
—
AM/PM
04H
BIT 4
BIT 3
BIT 2
Seconds
0
0
BIT 0
FUNCTION
Seconds
Hours
0
0
Hours
AM/PM
05H
BIT 1
0
0
0
0
0
0
0
Hours
Hours
0
06H
07H
08H
09H
0AH
0
0
0
0
UIP
0
0
0
DV2
DV1
0BH
SET
PIE
AIE
0CH
IRQF
PF
0DH
VRT
0
0EH-7F
X
X
0
Date
DV0
Year
RS3
RS2
RS1
RS0
Day
Date
Month
Year
Control
UIE
SQWE
DM
24/12
DSE
Control
AF
UF
0
0
0
0
Control
—
0
0
0
0
0
0
Control
—
X
X
X
X
X
X
RAM
—
0
Day
RANGE
00–3B
Month
X = Read/Write Bit.
Note: Unless otherwise specified, the state of the registers is not defined when power is first applied. Except for the seconds register, 0 bits in the time and date registers can be written to 1, but may be modified when the clock updates. 0 bits should always be
written to 0 except for alarm mask bits.
____________________________________________________________________
15
DS12R885/DS12CR887/DS12R887
Table 2B. Time, Calendar, and Alarm Data Modes—Binary Mode (DM = 1)
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
Control Registers
The DS12R885 has four control registers that are
accessible at all times, even during the update cycle.
Control Register A
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
UIP
DV2
DV1
DV0
RS3
RS2
RS1
RS0
Bit 7: Update-In-Progress (UIP). This bit is a status
flag that can be monitored. When the UIP bit is a 1, the
update transfer occurs soon. When UIP is a 0, the
update transfer does not occur for at least 244µs. The
time, calendar, and alarm information in RAM is fully
available for access when the UIP bit is 0. The UIP bit is
read-only and is not affected by RESET. Writing the
SET bit in Register B to a 1 inhibits any update transfer
and clears the UIP status bit.
Bits 6, 5, and 4: DV2, DV1, DV0. These three bits are
used to turn the oscillator on or off and to reset the
countdown chain. A pattern of 010 is the only combination of bits that turn the oscillator on and allow the RTC
to keep time. A pattern of 11x enables the oscillator but
holds the countdown chain in reset. The next update
occurs at 500ms after a pattern of 010 is written to DV0,
DV1, and DV2.
16
Bits 3 to 0: Rate Selector (RS3, RS2, RS1, RS0).
These four rate-selection bits select one of the 13 taps
on the 15-stage divider or disable the divider output.
The tap selected can be used to generate an output
square wave (SQW pin) and/or a periodic interrupt. The
user can do one of the following:
1) Enable the interrupt with the PIE bit;
2)
3)
Enable the SQW output pin with the SQWE bit;
Enable both at the same time and the same rate;
or
4) Enable neither.
Table 3 lists the periodic interrupt rates and the squarewave frequencies that can be chosen with the RS bits.
These four read/write bits are not affected by RESET.
____________________________________________________________________
RTCs with Constant-Voltage Trickle Charger
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
SET
PIE
AIE
UIE
SQWE
DM
24/12
DSE
Bit 7: SET. When the SET bit is 0, the update transfer
functions normally by advancing the counts once per
second. When the SET bit is written to 1, any update
transfer is inhibited, and the program can initialize the
time and calendar bytes without an update occurring in
the midst of initializing. Read cycles can be executed in
a similar manner. SET is a read/write bit and is not
affected by RESET or internal functions of the
DS12R885.
Bit 6: Periodic Interrupt Enable (PIE). The PIE bit is a
read/write bit that allows the periodic interrupt flag (PF) bit
in Register C to drive the IRQ pin low. When the PIE bit is
set to 1, periodic interrupts are generated by driving the
IRQ pin low at a rate specified by the RS3–RS0 bits of
Register A. A 0 in the PIE bit blocks the IRQ output from
being driven by a periodic interrupt, but the PF bit is still
set at the periodic rate. PIE is not modified by any internal
DS12R885 functions, but is cleared to 0 on RESET.
Bit 5: Alarm Interrupt Enable (AIE). This bit is a
read/write bit that, when set to 1, permits the alarm flag
(AF) bit in Register C to assert IRQ. An alarm interrupt
occurs for each second that the three time bytes equal
the three alarm bytes, including a don’t-care alarm
code of binary 11XXXXXX. The AF bit does not initiate
the IRQ signal when the AIE bit is set to 0. The internal
functions of the DS12R885 do not affect the AIE bit, but
is cleared to 0 on RESET.
Bit 4: Update-Ended Interrupt Enable (UIE). This bit is
a read/write bit that enables the update-end flag (UF)
bit in Register C to assert IRQ. The RESET pin going
low or the SET bit going high clears the UIE bit. UIE is
not modified by any internal DS12R885 functions, but is
cleared to 0 on RESET.
Bit 3: Square-Wave Enable (SQWE). When this bit is
set to 1, a square-wave signal at the frequency set by
the rate-selection bits RS3–RS0 is driven out on the
SQW pin. When the SQWE bit is set to 0, the SQW pin
is held low. SQWE is a read/write bit and is cleared by
RESET. SQWE is low if disabled, and is high impedance when VCC is below VPF. SQWE is cleared to 0 on
RESET.
Bit 2: Data Mode (DM). This bit indicates whether time
and calendar information is in binary or BCD format.
The DM bit is set by the program to the appropriate format and can be read as required. This bit is not modified by internal functions or RESET. A 1 in DM signifies
binary data, while a 0 in DM specifies BCD data.
Bit 1: 24/12. The 24/12 control bit establishes the format of the hours byte. A 1 indicates the 24-hour mode
and a 0 indicates the 12-hour mode. This bit is
read/write and is not affected by internal functions or
RESET.
Bit 0: Daylight Saving Enable (DSE). This bit is a
read/write bit that enables two daylight saving adjustments when DSE is set to 1. On the first Sunday in
April, the time increments from 1:59:59 AM to 3:00:00
AM. On the last Sunday in October when the time first
reaches 1:59:59 AM, it changes to 1:00:00 AM. When
DSE is enabled, the internal logic tests for the first/last
Sunday condition at midnight. If the DSE bit is not set
when the test occurs, the daylight saving function does
not operate correctly. These adjustments do not occur
when the DSE bit is 0. This bit is not affected by internal
functions or RESET.
____________________________________________________________________
17
DS12R885/DS12CR887/DS12R887
Control Register B
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
Control Register C
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
IRQF
PF
AF
UF
0
0
0
0
Bit 7: Interrupt Request Flag (IRQF). This bit is set to
1 when any of the following are true:
PF = PIE = 1
AF = AIE = 1
UF = UIE = 1
Any time the IRQF bit is 1, the IRQ pin is driven low.
This bit can be cleared by reading Register C or with a
RESET.
Bit 6: Periodic Interrupt Flag (PF). This bit is readonly and is set to 1 when an edge is detected on the
selected tap of the divider chain. The RS3 through RS0
bits establish the periodic rate. PF is set to 1 independent of the state of the PIE bit. When both PF and PIE
are 1s, the IRQ signal is active and sets the IRQF bit.
This bit can be cleared by reading Register C or with a
RESET.
Bit 5: Alarm Interrupt Flag (AF). A 1 in the AF bit indicates that the current time has matched the alarm time.
If the AIE bit is also 1, the IRQ pin goes low and a 1
appears in the IRQF bit. This bit can be cleared by
reading Register C or with a RESET.
Bit 4: Update-Ended Interrupt Flag (UF). This bit is
set after each update cycle. When the UIE bit is set to
1, the 1 in UF causes the IRQF bit to be a 1, which
asserts the IRQ pin. This bit can be cleared by reading
Register C or with a RESET.
Bits 3 to 0: Unused. These bits are unused in Register
C. These bits always read 0 and cannot be written.
Control Register D
BIT 7
VRT
BIT 6
0
BIT 5
0
BIT 4
0
Bit 7: Valid RAM and Time (VRT). This bit indicates
the condition of the battery connected to the VBACKUP
pin. This bit is not writeable and should always be 1
when read. If a 0 is ever present, an exhausted internal
lithium energy source is indicated and both the contents of the RTC data and RAM data are questionable.
This bit is unaffected by RESET.
18
BIT 3
0
BIT 2
0
BIT 1
0
BIT 0
0
Bits 6 to 0: Unused. The remaining bits of Register D
are not usable. They cannot be written and they always
read 0.
____________________________________________________________________
RTCs with Constant-Voltage Trickle Charger
The 114 general-purpose NV RAM bytes are not dedicated to any special function within the DS12R885.
They can be used by the processor program as
battery-backed memory and are fully available during
the update cycle.
Interrupts
The DS12R885 includes three separate, fully automatic
sources of interrupt for a processor. The alarm interrupt
can be programmed to occur at rates from once per
second to once per day. The periodic interrupt can be
selected for rates from 500ms to 122µs. The updateended interrupt can be used to indicate to the program
that an update cycle is complete. Each of these independent interrupt conditions is described in greater
detail in other sections of this text.
The processor program can select which interrupts, if
any, are to be used. Three bits in Register B enable the
interrupts. Writing a logic 1 to an interrupt-enable bit
permits that interrupt to be initiated when the event
occurs. A 0 in an interrupt-enable bit prohibits the IRQ
pin from being asserted from that interrupt condition. If
an interrupt flag is already set when an interrupt is
enabled, IRQ is immediately set at an active level,
although the interrupt initiating the event may have
occurred earlier. As a result, there are cases where the
program should clear such earlier initiated interrupts
before first enabling new interrupts.
When an interrupt event occurs, the relating flag bit is
set to logic 1 in Register C. These flag bits are set independent of the state of the corresponding enable bit in
Register B. The flag bit can be used in a polling mode
without enabling the corresponding enable bits. The
interrupt flag bit is a status bit that software can interrogate as necessary. When a flag is set, an indication is
given to software that an interrupt event has occurred
since the flag bit was last read; however, care should
be taken when using the flag bits as they are cleared
each time Register C is read. Double latching is included with Register C so that bits that are set remain stable throughout the read cycle. All bits that are set (high)
are cleared when read, and new interrupts that are
pending during the read cycle are held until after the
cycle is completed. One, two, or three bits can be set
when reading Register C. Each used flag bit should be
examined when Register C is read to ensure that no
interrupts are lost.
The second flag bit method is used with fully enabled
interrupts. When an interrupt flag bit is set and the corresponding interrupt-enable bit is also set, the IRQ pin
is asserted low. IRQ is asserted as long as at least one
of the three interrupt sources has its flag and enable
bits set. The IRQF bit in Register C is a 1 whenever the
IRQ pin is driven low. Determination that the RTC initiated an interrupt is accomplished by reading Register C.
A logic 1 in bit 7 (IRQF bit) indicates that one or more
interrupts have been initiated by the DS12R885. The
act of reading Register C clears all active flag bits and
the IRQF bit.
Oscillator Control Bits
When the DS12R887 and DS12CR887 are shipped
from the factory, the internal oscillator is turned off. This
feature prevents the lithium energy cell from being
used until it is installed in a system.
A pattern of 010 in bits 4 to 6 of Register A turns the
oscillator on and enables the countdown chain. A pattern of 11x (DV2 = 1, DV1 = 1, DV0 = X) turns the oscillator on, but holds the countdown chain of the oscillator
in reset. All other combinations of bits 4 to 6 keep the
oscillator off.
Square-Wave Output Selection
Thirteen of the 15 divider taps are made available to a 1of-16 multiplexer, as shown in the functional diagram.
The square-wave and periodic-interrupt generators
share the output of the multiplexer. The RS0–RS3 bits in
Register A establish the output frequency of the multiplexer (see Table 3). Once the frequency is selected, the
output of the SQW pin can be turned on and off under
program control with the square-wave enable bit, SQWE.
Periodic Interrupt Selection
The periodic interrupt causes the IRQ pin to go to an
active state from once every 500ms to once every
122µs. This function is separate from the alarm interrupt, which can be output from once per second to
once per day. The periodic interrupt rate is selected
using the same Register A bits that select the squarewave frequency (Table 3). Changing the Register A bits
affects the square-wave frequency and the periodicinterrupt output. However, each function has a separate
enable bit in Register B. The SQWE bit controls the
square-wave output. Similarly, the PIE bit in Register B
enables the periodic interrupt. The periodic interrupt
can be used with software counters to measure inputs,
create output intervals, or await the next needed software function.
____________________________________________________________________
19
DS12R885/DS12CR887/DS12R887
Nonvolatile RAM (NV RAM)
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
Table 3. Periodic Interrupt Rate and
Square-Wave Output Frequency
SELECT BITS
REGISTER A
tPI PERIODIC
INTERRUPT
RATE
SQW OUTPUT
FREQUENCY
RS3
RS2
RS1
RS0
0
0
0
0
None
None
0
0
0
1
3.90625ms
256Hz
0
0
1
0
7.8125ms
128Hz
0
0
1
1
122.070µs
8.192kHz
0
1
0
0
244.141µs
4.096kHz
0
1
0
1
488.281µs
2.048kHz
0
1
1
0
976.5625µs
1.024kHz
0
1
1
1
1.953125ms
512Hz
1
0
0
0
3.90625ms
256Hz
1
0
0
1
7.8125ms
128Hz
1
0
1
0
15.625ms
64Hz
1
0
1
1
31.25ms
32Hz
1
1
0
0
62.5ms
16Hz
1
1
0
1
125ms
8Hz
1
1
1
0
250ms
4Hz
1
1
1
1
500ms
2Hz
Update Cycle
The DS12R885 executes an update cycle once per
second regardless of the SET bit in Register B. When
the SET bit in Register B is set to 1, the user copy of the
double-buffered time, calendar, and alarm bytes is
frozen and does not update as the time increments.
However, the time countdown chain continues to
update the internal copy of the buffer. This feature
allows time to maintain accuracy independent of reading or writing the time, calendar, and alarm buffers, and
also guarantees that time and calendar information is
consistent. The update cycle also compares each
alarm byte with the corresponding time byte and issues
an alarm if a match or if a don’t-care code is present in
all three positions.
There are three methods that can handle RTC access
that avoid any possibility of accessing inconsistent time
and calendar data. The first method uses the updateended interrupt. If enabled, an interrupt occurs after
every update cycle that indicates over 999ms is available to read valid time and date information. If this
interrupt is used, the IRQF bit in Register C should be
cleared before leaving the interrupt routine.
A second method uses the update-in-progress bit (UIP)
in Register A to determine if the update cycle is in
progress. The UIP bit pulses once per second. After
the UIP bit goes high, the update transfer occurs 244µs
later. If a low is read on the UIP bit, the user has at least
244µs before the time/calendar data is changed.
Therefore, the user should avoid interrupt service routines that would cause the time needed to read valid
time/calendar data to exceed 244µs.
The third method uses a periodic interrupt to determine if
an update cycle is in progress. The UIP bit in Register A
is set high between the setting of the PF bit in Register C
(Figure 3). Periodic interrupts that occur at a rate greater
than tBUC allow valid time and date information to be
reached at each occurrence of the periodic interrupt.
The reads should be complete within one (tPI/2 + tBUC)
to ensure that data is not read during the update cycle.
1 SECOND
UIP
tBUC
UF
tPI/2
PF
tPI
tBUC = DELAY TIME BEFORE UPDATE
CYCLE = 244μs
Figure 3. UIP and Periodic Interrupt Timing
20
____________________________________________________________________
tPI/2
RTCs with Constant-Voltage Trickle Charger
The EDIP and BGA packages contain a quartz tuningfork crystal. Pick-and-place equipment can be used,
but precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
The BGA package can be reflowed as long as the following conditions are met:
1. Preheating (below 160°C) is within 90 seconds.
2. Maximum time above 150°C is less than 180 seconds.
3. Maximum time above 170°C is less than 100 seconds.
4. Maximum time above 200°C is less than 60 seconds.
5. Maximum time above 220°C is less than 30 seconds.
6. Peak temperature is less than or equal to 230°C.
Exposure to reflow is limited to two times maximum.
Moisture-sensitive packages are shipped from the
factory dry-packed. Handling instructions listed on the
package label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020B standard
for Moisture-Sensitive Device (MSD) classifications.
The EDIP (DS12CR887) module can be successfully
processed through conventional wave-soldering techniques so long as temperature exposure to the lithium
energy source does not exceed +85°C. Post-solder
cleaning with water-washing techniques is acceptable,
provided that ultrasonic vibration is not used. Such
cleaning can damage the crystal.
Pin Configurations
TOP VIEW
MOT 1
24 VCC
MOT 1
24 VCC
X1 2
23 SQW
N.C. 2
23 SQW
X2 3
22 N.C.
N.C. 3
22 N.C.
AD0 4
21 RCLR
AD0 4
21 N.C.
AD1 5
20 VBACKUP
AD1 5
19 IRQ
AD2 6
AD3 7
18 RESET
AD3 7
18 RESET
AD4 8
17 DS
AD4 8
17 DS
AD5 9
16 GND
AD5 9
16 N.C.
AD6 10
15 R/W
AD6 10
15 R/W
AD7 11
14 AS
AD7 11
14 AS
GND 12
13 CS
GND 12
13 CS
AD2 6
DS12R885
SO (0.300")
20 N.C.
DS12CR887
19 IRQ
EDIP (0.700")
____________________________________________________________________
21
DS12R885/DS12CR887/DS12R887
Handling, PC Board Layout,
and Assembly
RTCs with Constant-Voltage Trickle Charger
DS12R885/DS12CR887/DS12R887
Pin Configurations (continued)
TOP VIEW
(BUMP SIDE DOWN)
A
DS
B
VCC
C
D
CS
E
AD7 GND AD6
DS12R887
AD5
PACKAGE
THETA-JA (°C/W)
THETA-JC (°C/W)
SO
105
22
Chip Information
F
1
RESET VCC R/W
Thermal Information
TRANSISTOR COUNT: 17,061
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
GND AD4
Package Information
2
N.C.
VCC
AS
IRQ
VCC SQW
AD3 GND AD2
3
AD1
GND AD0
4
RCLR VCC MOT
GND GND GND
VCC
VCC
VCC
GND GND GND
VCC
VCC
VCC
GND GND GND
VCC
VCC
VCC
GND GND GND
5
6
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
DOCUMENT NO.
24 SO
W24+1
21-0042
24 EDIP
MDP24+1
21-0241
48 BGA
V48-H1
21-0364
7
8
48 BGA
22
PACKAGE CODE
____________________________________________________________________
RTCs with Constant-Voltage Trickle Charger
PAGES
CHANGED
REVISION
NUMBER
REVISION
DATE
0
4/04
Initial release of DS12R885
—
1
4/04
Added DS12R887 and DS12CR887 to data sheet
All
2
12/04
Initial release of DS12R887
All
3
4/06
Corrected Intel Bus Write Timing, Intel Bus Read Timing, IRQ Release Delay Timing,
Power-Up/Down Timing, and Functional Diagram diagrams; added the EDIP paragraph
to the Handling, PC Board Layout, and Assembly section.
4
5/06
Changed pin 16 from N.C. to GND for the SO package.
5
2/07
Updated 114 bytes bullet in the Features section; updated the Ordering Information;
corrected the Intel Bus Write Timing diagram; added a note about how the missing
VBACKUP pin on the DS12CR887 and DS12R887 is internally connected to a lithium
cell; added the Package Information table.
6
4/10
Updated the storage temperature ranges, added the lead temperature, and updated the
soldering temperature for all packages in the Absolute Maximum Ratings; removed
the DS12R885 and DS12CR887 leaded parts from the Ordering Information table.
DESCRIPTION
5, 6, 7, 21
10, 21
1, 6, 11, 22
2, 22
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 23
© 2010 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
is a registered trademark of Maxim Integrated Products, Inc.
DS12R885/DS12CR887/DS12R887
Revision History