PHILIPS MX1011B200Y

DISCRETE SEMICONDUCTORS
DATA SHEET
MX1011B200Y
Microwave power transistor
Product specification
Supersedes data of January 1995
1997 Feb 18
Philips Semiconductors
Product specification
Microwave power transistor
FEATURES
• Suitable for short and medium
pulse applications up to 100 µs
pulse width, 10% duty factor
• Diffused emitter ballasting resistors
improve ruggedness
• Interdigitated emitter-base
structure provides high emitter
efficiency
MX1011B200Y
QUICK REFERENCE DATA
Microwave performance up to Tmb = 25 °C in a common base class C
narrowband amplifier.
MODE OF
OPERATION
CONDITIONS
tp = 10 µs; δ = 1%
Class C
f
(GHz)
VCC
(V)
PL
(W)
Gp
(dB)
ηC
(%)
1.09
50
200
≥7.5
≥45
PINNING - SOT439A
• Gold metallization with barrier
realizes very stable characteristics
and excellent lifetime
PIN
1
collector
• Multicell geometry improves power
sharing reduces thermal resistance
2
emitter
3
base connected to flange
DESCRIPTION
• Internal input and output
prematching networks allow an
easier design of circuits.
APPLICATIONS
Intended for use in common base
class C broadband pulsed power
amplifiers for IFF, TCAS and Mode S
applications in the 1030 MHz to
1090 MHz bandwidth. Also suitable
for medium pulse, heavy duty
operation within the 1030 MHz to
1150 MHz bandwidth.
1
ok, 4 columns
c
b
3
3
e
2
MAM045
Top view
DESCRIPTION
NPN silicon planar epitaxial
microwave power transistor in a
SOT439A metal ceramic flange
package, with base connected to
flange.
Fig.1 Simplified outline and symbol.
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1997 Feb 18
2
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
65
V
VCES
collector-emitter voltage
RBE = 0
−
65
V
VCEO
collector-emitter voltage
open base
−
15
V
VEBO
emitter-base voltage
open collector
−
3
V
ICM
peak collector current
tp = 10 µs; δ = 1%
−
11.5
A
Ptot
total power dissipation
Tmb < 75 °C; tp ≤ 10 µs; δ ≤ 1%
−
515
W
Tstg
storage temperature
−65
+200
°C
Tj
junction temperature
−
200
°C
Tsld
soldering temperature
−
235
°C
t ≤ 10 s; note 1
Note
1. Up to 0.2 mm from ceramic.
MLC465
600
handbook, halfpage
P tot
(W)
400
200
0
50
0
50
100
150
200
o
T mb ( C)
tp = 10 µs; δ = 1%.
Fig.2 Power derating curve.
1997 Feb 18
3
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
2.5
K/W
0.2
K/W
0.16
K/W
Tj = 120 °C
Rth j-mb
thermal resistance from junction to mounting base
Rth mb-h
thermal resistance from mounting base to heatsink note 1
Zth
thermal impedance from junction to heatsink
tp = 10 µs; δ = 1%;
notes 1 and 2
Notes
1. See “Mounting recommendations in the General part of handbook SC19a”.
2. Equivalent thermal impedance under pulsed microwave operating conditions.
CHARACTERISTICS
Tmb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
ICBO
collector cut-off current
IE = 0; VCB = 50 V
6
mA
ICES
collector cut-off current
VBE = 0; VCE = 50 V
6
mA
IEBO
emitter cut-off current
IC = 0; VEB = 1.5 V
1.5
mA
V(BR)CBO
collector-base breakdown voltage
IC = 40 mA
65
V
V(BR)CES
collector-emitter breakdown voltage
IC = 40 mA; VBE = 0
65
V
APPLICATION INFORMATION
Microwave performance up to Tmb = 25 °C in a common-base test circuit as shown in Fig.3.
MODE OF
OPERATION
CONDITIONS
tp = 10 µs; δ = 1%
tp = 0.5 µs; δ = 50%
Class C
tp = 112 µs; δ = 1%
tp = 6.6 µs; δ = 51%
tp = 3.3 µs; δ = 43%
tp = 32 µs; δ = 1%
1997 Feb 18
f
(GHz)
VCC
(V)
PL
(W)
Gp
(dB)
ηC
(%)
1.09
50
≥200
typ. 220
≥7.5
typ. 8.3
≥45
typ. 52
1.03 to 1.09
50
typ. 220
typ. 7.5
typ. 50
1.03 to 1.15
50
typ. 100
typ. 6
typ. 35
1.09
50
typ. 210
typ. 7.5
typ. 47
4
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
30
handbook, full pagewidth
30
19.0
3.0 5.0
3.0
6.0
4.0 2.3
11.5
2.7
40
9.5
1
2.5
40
2.8
0.64
0.64
8.0
9.5
10.0
C3
VCC
C4
C2
L1
L3
input
output
C1
L2
C5
MLC464
Dimensions in mm.
Substrate: Epsilam 10.
Thickness: 0.635 mm.
Permittivity: εr = 10.
Fig.3 Broadband test circuit.
1997 Feb 18
5
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
List of components (see Fig.3)
COMPONENT
DESCRIPTION
VALUE
ORDERING INFORMATION
C1
capacitor
100 pF
ATC 100A101kp50x
C2
tantalum capacitor
10 µF; 50 V
−
C3
electrolytic capacitor
63 V; 1000 µF
−
C4
feedthrough bypass capacitor
−
Erie1250-003
C5
variable gigatrim capacitor
0.8 to 8 pF
Tekelec 729-1
L1, L2
0.65 mm copper wire; total length = 26 mm;
height of loop = 10 mm
−
−
L3
0.85 mm silver wire; total length = 30 mm;
height of loop = 15 mm
−
−
MLC466
250
PL
(W)
MLC467
55
handbook, halfpage
handbook, halfpage
ηc
(%)
230
50
210
190
45
170
150
40
15
25
35
P i (W)
45
15
35
P i (W)
45
Class C pulse operation.
tp = 10 µs; δ = 1%; VCC = 50 V; f = 1.09 GHz.
In broadband test circuit as shown in Fig.3.
Class C pulse operation.
tp = 10 µs; δ = 1%; VCC = 50 V; f = 1.09 GHz.
In broadband test circuit as shown in Fig.3.
Fig.5
Fig.4 Load power as a function of input power.
1997 Feb 18
25
6
Collector efficiency as a function of input
power.
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
1
handbook, full pagewidth
0.5
2
0.2
Zi
+j
0.2
0
5
1.03 GHz
0.5
1.09 GHz
1.15 GHz
2
10
5
∞
10
–j
10
5
0.2
2
0.5
MLC468
1
VCC = 50 V; Zo = 10 Ω; Po = 240 W.
Fig.6 Input impedance as a function of frequency.
1
handbook, full pagewidth
0.5
2
0.2
5
10
+j
0
–j
0.2
0.5
2
5
∞
10
1.09 GHz
1.15 GHz
10
1.03 GHz
ZL
5
0.2
2
0.5
1
MLC469
VCC = 50 V; Zo = 50 Ω; Po = 240 W.
Fig.7 Optimum load impedance as a function of frequency.
1997 Feb 18
7
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
PACKAGE OUTLINE
12.85 max
handbook, full pagewidth
0.15 max
6
max
3.3
2.9
1.6 max
3
23 max
seating plane
3.7
max
2.7
min
1
9.85
max
3.3
2.7
min
2
MBC881
8.25
16.5
Dimensions in mm.
Torque on screws: max. 0.4 Nm.
Recommended screw: M3.
Recommended pitch for mounting screws: 19 mm.
Fig.8 SOT439A
1997 Feb 18
8
10.3
10.0
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Feb 18
9
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
NOTES
1997 Feb 18
10
Philips Semiconductors
Product specification
Microwave power transistor
MX1011B200Y
NOTES
1997 Feb 18
11
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© Philips Electronics N.V. 1997
SCA53
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Printed in The Netherlands
127121/00/02/pp12
Date of release: 1997 Feb 18
Document order number:
9397 750 01689