FAIRCHILD FDG6304

July 1999
FDG6304P
Dual P-Channel, Digital FET
General Description
Features
-25 V, -0.41 A continuous, -1.5 A peak.
RDS(ON) = 1.1 Ω @ VGS= -4.5 V,
RDS(ON) = 1.5 Ω @ VGS= -2.7 V.
These dual P-Channel logic level enhancement mode
field effect transistors are produced using Fairchild's
proprietary, high cell density, DMOS technology. This
very high density process is especially tailored to
minimize on-state resistance. This device has been
designed especially for low voltage applications as a
replacement for bipolar digital transistors and small
signal MOSFETs.
Very low level gate drive requirements allowing direct
operation in 3 V circuits (VGS(th) < 1.5 V).
Gate-Source Zener for ESD ruggedness
(>6kV Human Body Model).
Compact industry standard SC70-6 surface
mount package.
SuperSOTTM-6
SOT-23
SC70-6
D1
G2
SO-8
SuperSOTTM-8
SOT-223
S2
.04
S1
SC70-6
G1
D2
1 or 4 *
6 or 3
2 or 5
5 or 2
3 or 6
4 or 1
*
*The pinouts are symmetrical; pin 1 and 4 are interchangeable.
Units inside the carrier can be of either orientation and will not affect the functionality of the device.
Absolute Maximum Ratings
TA = 25°C unless otherwise noted
Symbol
Parameter
FDG6304P
Units
VDSS
Drain-Source Voltage
-25
V
VGSS
Gate-Source Voltage
-8
V
ID
Drain/Output Current
- Continuous
-0.41
A
- Pulsed
-1.5
PD
Maximum Power Dissipation
TJ,TSTG
Operating and Storage Temperature Range
ESD
Electrostatic Discharge Rating MIL-STD-883D
Human Body Model (100 pF / 1500 Ω)
(Note 1)
0.3
W
-55 to 150
°C
6.0
kV
415
°C/W
THERMAL CHARACTERISTICS
RθJA
Thermal Resistance, Junction-to-Ambient
(Note 1)
FDG6304P Rev.E1
Electrical Characteristics (TA = 25 OC unless otherwise noted)
Symbol
Parameter
Conditions
Min
-25
Typ
Max
Units
OFF CHARACTERISTICS
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = -250 µA
∆BVDSS/∆TJ
Breakdown Voltage Temp. Coefficient
ID = -250 µA, Referenced to 25oC
IDSS
Zero Gate Voltage Drain Current
VDS = -20 V, VGS = 0 V
V
TJ = 55°C
IGSS
Gate - Body Leakage Current
mV / oC
-22
VGS = -8 V, VDS = 0 V
-1
µA
-10
µA
-100
nA
ON CHARACTERISTICS (Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = -250 µA
∆VGS(th)/∆TJ
Gate Threshold Voltage Temp.Coefficient
ID = -250 µA, Referenced to 25oC
-0.65
RDS(ON)
Static Drain-Source On-Resistance
VGS = -4.5 V, ID = -0.41 A
-0.82
-1.5
TJ =125°C
VGS = -2.7 V, ID = -0.25 A
V
mV / oC
2
0.85
1.1
1.2
1.9
1.15
1.5
-1.5
Ω
ID(ON)
On-State Drain Current
VGS = -4.5 V, VDS = -5 V
A
gFS
Forward Transconductance
VDS = -5 V, ID = -0.41 A
0.9
S
VDS = 10 V, VGS = 0 V,
f = 1.0 MHz
62
pF
34
pF
10
pF
DYNAMIC CHARACTERISTICS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS (Note 2)
tD(on)
Turn - On Delay Time
tr
Turn - On Rise Time
tD(off)
Turn - Off Delay Time
tf
Turn - Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDD = -5 V, ID = -0.5 A,
VGS = -4.5 V, RGEN = 6 Ω
VDS = -5 V, ID = -0.41 A,
VGS = -4.5 V
7
15
ns
8
16
ns
55
80
ns
35
60
ns
1.1
1.5
nC
0.31
nC
0.29
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
IS
Maximum Continuous Source Current
VSD
Drain-Source Diode Forward Voltage
VGS = 0 V, IS = -0.25 A (Note 2)
-0.85
-0.25
A
-1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed
by design while RθCA is determined by the user's board design. RθJA = 415OC/W on minimum pad mounting on FR-4 board in still air.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDG6304P Rev.E1
Typical Electrical Characteristics
2.5
VGS =-4.5V -3.0V
-2.7V
R DS(ON), NORMALIZED
-2.5V
0.9
0.6
-2.0V
0.3
-1.5V
DRAIN-SOURCE ON-RESISTANCE
-ID , DRAIN-SOURCE CURRENT (A)
1.2
VGS = -2.0V
2
-2.5V
1.5
-2.7V
-3.0V
-3.5V
-4.5V
1
0.5
0
0
1
2
3
0
4
0.2
0.4
Figure 1. On-Region Characteristics.
R DS(ON),ON-RESISTANCE(OHM)
R DS(ON) , NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
V GS = -4.5V
1.2
1.2
1
0.8
-25
0
25
50
75
100
125
150
I D = -0.2A
4
3
2
TJ = 125 ° C
1
25° C
0
1
TJ , JUNCTION TEMPERATURE (°C)
2
3
4
5
-VGS , GATE TO SOURCE VOLTAGE (V)
Figure 3. On-Resistance Variation
with Temperature.
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
1
-I S , REVERSE DRAIN CURRENT (A)
1
TJ = -55°C
VDS = -5V
25°C
-ID , DRAIN CURRENT (A)
1
5
I D = -0.41A
0.6
-50
0.8
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
1.6
1.4
0.6
-I D , DRAIN CURRENT (A)
-VDS , DRAIN-SOURCE VOLTAGE (V)
0.8
125°C
0.6
0.4
0.2
0
0.5
1
1.5
2
2.5
-VGS , GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics.
3
VGS = 0V
TJ = 125°C
0.1
25°C
0.01
-55°C
0.001
0.0001
0.2
0.4
0.6
0.8
1
1.2
-VSD , BODY DIODE FORWARD VOLTAGE (V)
Figure 6. Body Diode Forward Voltage
Variation with Source Current
and Temperature.
FDG6304P Rev.E1
Typical Electrical Characteristics
200
I D = -0.41A
VDS = -5V
-10V
4
80
CAPACITANCE (pF)
-V GS , GATE-SOURCE VOLTAGE (V)
5
-15V
3
2
Ciss
30
10
1
5
0.4
0.8
1.2
1.6
Crss
f = 1 MHz
V GS = 0 V
3
0.1
0
0
Coss
0.3
1
2
5
Figure 7. Gate Charge Characteristics.
25
Figure 8. Capacitance Characteristics.
50
3
1m
0.5
S
RD
(O
N)
LI
s
10
ms
T
MI
10
0m
s
1s
10
s
DC
0.1
VGS = -4.5V
SINGLE PULSE
RθJA = 415°C
A
TA = 25°C
0.05
0.01
0.1
0.2
0.5
SINGLE PULSE
R θJA=415°C/W
TA= 25°C
40
POWER (W)
1
30
20
10
1
2
5
10
25
0
0.0001
40
0.001
0.01
0.1
1
10
200
SINGLE PULSE TIME (SEC)
- V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum Power
Dissipation.
TRANSIENT THERMAL RESISTANCE
1
r(t), NORMALIZED EFFECTIVE
-I D , DRAIN CURRENT (A)
10
-VDS , DRAIN TO SOURCE VOLTAGE (V)
Q g , GATE CHARGE (nC)
0.5
D = 0.5
0.2
0.2
0.1
0.05
0.02
0.01
R θJA (t) = r(t) * R θJA
R θJA =415 °C/W
0.1
P(pk)
0.05
t1
0.02
0.01
t2
TJ - TA = P * R θJA (t)
Single Pulse
Duty Cycle, D = t 1/ t 2
0.005
0.002
0.0001
0.001
0.01
0.1
1
10
100
200
t 1, TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in note 1.
Transient thermalresponse will change depending on the circuit board design.
FDG6304P Rev.E1
SC70-6 Tape and Reel Data and Package Dimensions
SC70-6 Packaging
Configuration: Figure 1.0
Packaging Description:
Customized Label
SC70-6 parts are shipped in tape. The carrier tape is
made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
3,000 units per 7" or 177cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 10,000 units per 13"
or 330cm diameter reel. This and some other options are
described in the Packaging Information table.
Antistatic Cover Tape
These full reels are individually barcode labeled and
placed inside a pizza box (illustrated in figure 1.0) made of
recyclable corrugated brown paper with a Fairchild logo
printing. One pizza box contains three reels maximum.
And these pizza boxes are placed inside a barcode
labeled shipping box which comes in different sizes
depending on the number of parts shipped.
F63TNR
Static Dissipative
Label
Embossed Carrier Tape
21
21
21
21
21
SC70-6 Packaging Information
Packaging Option
Packaging type
Standard
(no flow code)
TNR
Pin 1
D87Z
SC70-6 Unit Orientation
TNR
Qty per Reel/Tube/Bag
3,000
Reel Size
7" Dia
13"
184x187x47
343x343x64
Max qty per Box
9,000
30,000
Weight per unit (gm)
0.0055
0.0055
Weight per Reel (kg)
0.1140
0.3960
Box Dimension (mm)
10,000
343mm x 342mm x 64mm
Intermediate box for D87Z Option
F63TNR Barcode Label
Note/Comments
F63TNR
Label
F63TNR Label sample
184mm x 187mm x 47mm
Pizza Box for Standard Option
F63TNR
Label
LOT: CBVK741B019
QTY: 3000
FSID: FDG6302P
SPEC:
D/C1: D9842
D/C2:
QTY1:
QTY2:
SPEC REV:
CPN:
N/F: F
(F63TNR)3
SC70-6 Tape Leader and Trailer
Configuration: Figure 2.0
Carrier Tape
Cover Tape
Components
Trailer Tape
300mm minimum or
75 empty pockets
Leader Tape
500mm minimum or
125 empty pockets
August 1999, Rev. C
SC70-6 Tape and Reel Data and Package Dimensions, continued
SC70-6 Embossed Carrier Tape
Configuration: Figure 3.0
P0
D0
T
E1
F
K0
Wc
W
E2
B0
Tc
A0
D1
P1
User Direction of Feed
Dimensions are in millimeter
Pkg type
A0
B0
SC70-6
(8mm)
2.24
+/-0.10
2.34
+/-0.10
W
8.0
+/-0.3
D0
D1
E1
E2
1.55
+/-0.05
1.125
+/-0.125
1.75
+/-0.10
F
6.25
min
3.50
+/-0.05
P1
P0
4.0
+/-0.1
4.0
+/-0.1
K0
T
1.20
+/-0.10
0.255
+/-0.150
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
Wc
5.2
+/-0.3
0.06
+/-0.02
0.5mm
maximum
20 deg maximum
Typical
component
cavity
center line
B0
Tc
0.5mm
maximum
20 deg maximum component rotation
Typical
component
center line
Sketch A (Side or Front Sectional View)
A0
Component Rotation
Sketch C (Top View)
Component lateral movement
Sketch B (Top View)
SC70-6 Reel Configuration: Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A
Max
Dim A
max
See detail AA
Dim N
7" Diameter Option
B Min
Dim C
See detail AA
W3
13" Diameter Option
Dim D
min
W2 max Measured at Hub
DETAIL AA
Dimensions are in inches and millimeters
Tape Size
Reel
Option
Dim A
Dim B
8mm
7" Dia
7.00
177.8
0.059
1.5
0.512 +0.020/-0.008
13 +0.5/-0.2
Dim C
0.795
20.2
Dim D
2.165
55
Dim N
0.331 +0.059/-0.000
8.4 +1.5/0
Dim W1
Dim W2
0.567
14.4
0.311 – 0.429
7.9 – 10.9
Dim W3 (LSL-USL)
8mm
13" Dia
13.00
330
0.059
1.5
0.512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
4.00
100
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.311 – 0.429
7.9 – 10.9
July 1999, Rev. C
SC70-6 Tape and Reel Data and Package Dimensions, continued
SC70-6 (FS PKG Code 76)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.0055
September 1998, Rev. A1
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.