PHILIPS BLF7G20LS-140P Power ldmos transistor Datasheet

BLF7G20LS-140P
Power LDMOS transistor
Rev. 2 — 17 August 2010
Product data sheet
1. Product profile
1.1 General description
140 W LDMOS power transistor for base station applications at frequencies from
1800 MHz to 2000 MHz.
Table 1.
Typical performance
Typical RF performance at Tcase = 25 °C in a common source class-AB production test circuit.
Mode of operation
f
IDq
VDS
PL(AV)
Gp
ηD
ACPR400k
ACPR600k
EVMrms
(MHz)
(mA)
(V)
(W)
(dB)
(%)
(dBc)
(dBc)
(%)
CW
1805 to 1880
850
28
125
17
54
-
-
-
GSM EDGE
1805 to 1880
850
28
60
17.5
41
−61
−75
2.7
1.2 Features and benefits
„
„
„
„
„
„
„
„
„
Excellent ruggedness
High efficiency
Low Rth providing excellent thermal stability
Designed for broadband operation (1800 MHz to 2000 MHz)
Lower output capacitance for improved performance in Doherty applications
Designed for low memory effects providing excellent pre-distortability
Internally matched for ease of use
Integrated ESD protection
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
„ RF power amplifiers for base stations and multi carrier applications in the 1800 MHz to
2000 MHz frequency range
BLF7G20LS-140P
NXP Semiconductors
Power LDMOS transistor
2. Pinning information
Table 2.
Pinning
Pin
Description
1
drain1
2
drain2
3
gate1
4
gate2
5
Simplified outline
1
Graphic symbol
1
2
5
3
5
[1]
source
3
4
4
2
sym117
[1]
Connected to flange.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name Description
BLF7G20LS-140P -
Version
earless flanged LDMOST ceramic package; 4 leads
SOT1121B
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDS
Conditions
Min
Max
Unit
drain-source voltage
-
65
V
VGS
gate-source voltage
−0.5
+13
V
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
200
°C
5. Thermal characteristics
Table 5.
BLF7G20LS-140P
Product data sheet
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Rth(j-c)
thermal resistance from junction to case
Tcase = 80 °C; PL = 100 W
0.41 K/W
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Unit
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6. Characteristics
Table 6.
Characteristics
Tj = 25 °C; per section unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
Max Unit
V(BR)DSS drain-source breakdown voltage
VGS = 0 V; ID = 0.9 mA
65
-
-
V
VGS(th)
gate-source threshold voltage
VDS = 10 V; ID = 90 mA
1.5
1.9
2.3
V
IDSS
drain leakage current
VGS = 0 V; VDS = 28 V
-
-
2
μA
IDSX
drain cut-off current
VGS = VGS(th) + 3.75 V;
VDS = 10 V
14
-
-
A
IGSS
gate leakage current
VGS = 11 V; VDS = 0 V
-
-
200
nA
gfs
forward transconductance
VDS = 10 V; ID = 2.5 A
-
6.45
-
S
RDS(on)
drain-source on-state resistance
VGS = VGS(th) + 3.75 V;
ID = 3.15 A
-
0.15
-
Ω
7. Test information
Table 7.
Application information
f = 1805 MHz and 1880 MHz; RF performance at VDS = 28 V; IDq = 850 mA; Tcase = 25 °C;
2 sections combined unless otherwise specified; in a class-AB production test circuit.
Symbol
Parameter
Conditions
Min Typ
Max
Unit
Mode of operation: GSM EDGE; PL(AV) = 60 W
Gp
power gain
16.3 17.5
-
dB
RLin
input return loss
-
−15
−8
dB
ηD
drain efficiency
37
41
-
%
ACPR400k adjacent channel power ratio (400 kHz)
-
−61
−56.5 dBc
ACPR600k adjacent channel power ratio (600 kHz)
-
−75
−69.5 dBc
EVMrms
RMS EDGE signal distortion error
-
2.7
4.0
%
EVMM
peak EDGE signal distortion error
-
8.5
12.5
%
Mode of operation: CW; PL(AV) = 125 W
Gp
power gain
16
17
-
dB
ηD
drain efficiency
48
54
-
%
7.1 Ruggedness in class-AB operation
The BLF7G20LS-140P is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V;
IDq = 850 mA; PL = 140 W (CW); f = 1805 MHz.
BLF7G20LS-140P
Product data sheet
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Rev. 2 — 17 August 2010
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Power LDMOS transistor
7.2 One-tone CW
001aam399
20
Gp
(dB)
19
70
ηD
(%)
60
Gp
18
17
50
40
ηD
16
30
15
20
14
10
13
0
30
60
90
120
0
150
180
PL (W)
VDS = 28 V; IDq = 850 mA; f = 1880 MHz.
Fig 1.
One-tone CW power gain and drain efficiency as function of load power;
typical values
7.3 Two-tone CW
001aam400
19
Gp
(dB)
18.5
60
ηD
(%)
50
001aam401
0
IMD
(dBc)
−10
IMD3
−20
18
40
Gp
17.5
30
−30
IMD5
−40
IMD7
ηD
17
20
16.5
10
−50
−60
16
0
20
40
60
80
0
100
PL (W)
−70
−80
VDS = 28 V; IDq = 850 mA; f1 = 1879.95 MHz;
f2 = 1880.05 MHz.
Fig 2.
Two-tone CW power gain and drain efficiency
as function of load power; typical values
BLF7G20LS-140P
Product data sheet
0
20
40
60
80
100
PL (W)
VDS = 28 V; IDq = 850 mA; f1 = 1879.95 MHz;
f2 = 1880.05 MHz.
Fig 3.
Two-tone CW intermodulation distortion as a
function of load power; typical values
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Power LDMOS transistor
7.4 GSM EDGE
001aam402
19
Gp
(dB)
18.5
001aam403
−45
ACPR
(dBc)
−50
60
ηD
(%)
50
−55
18
40
−60
Gp
17.5
30
ACPR400k
−65
17
20
ηD
−70
ACPR600k
16.5
10
16
0
20
40
60
80
−75
−80
0
100
PL (W)
VDS = 28 V; IDq = 850 mA; f = 1880 MHz.
Fig 4.
0
20
40
60
80
100
PL (W)
VDS = 28 V; IDq = 850 mA; f = 1880 MHz.
GSM EDGE power gain and drain efficiency as
function of load power; typical values
Fig 5.
GSM EDGE ACPR at 400 kHz and at 600 kHz as
function of load power; typical values
001aam404
50
EVM
(%)
40
30
EVMM
20
EVMrms
10
0
0
20
40
60
80
100
PL (W)
VDS = 28 V; IDq = 850 mA; f = 1880 MHz.
Fig 6.
BLF7G20LS-140P
Product data sheet
GSM-EDGE RMS EVM and peak EVM as function of load power; typical values
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7.5 Single carrier IS-95
Single carrier IS-95 with pilot, paging, sync and 6 traffic channels (Walsh codes 8 - 13).
PAR = 9.7 dB at 0.01 % probability on the CCDF. Channel bandwidth is 1.2288 MHz.
001aam405
19
ηD
(%)
Gp
(dB)
001aam406
−30
40
ACPR
(dBc)
ACPR885k
−40
30
18.5
Gp
−50
20
18
ACPR1980k
ηD
−60
10
17.5
17
0
10
20
−70
−80
0
40
30
0
10
20
PL (W)
40
PL (W)
VDS = 28 V; IDq = 1080 mA; f = 1880 MHz.
Fig 7.
30
VDS = 28 V; IDq = 1080 mA; f = 1880 MHz.
Single carrier IS-95 power gain and drain
efficiency as function of load power;
typical values
Fig 8.
Single carrier IS-95 ACPR at 885 kHz and at
1980 kHz as function of load power;
typical values
001aam407
11
PAR
10
9
8
7
6
5
0
10
20
30
40
PL (W)
VDS = 28 V; IDq = 1080 mA; f = 1880 MHz.
Fig 9.
BLF7G20LS-140P
Product data sheet
Single carrier IS-95 peak-to-average power ratio as a function of load power;
typical values
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Power LDMOS transistor
7.6 Single carrier W-CDMA
3GPP; test model 1; 64 DPCH; PAR = 7.2 dB at 0.01 % probability on CCDF.
Channel bandwidth is 3.84 MHz.
001aam408
19.5
Gp
(dB)
19
18.5
001aam409
−20
60
ηD
(%)
50
ACPR
(dBc)
ACPR5M
−30
40
−40
Gp
18
ACPR10M
30
ηD
−50
17.5
20
17
10
16.5
0
20
40
60
80
−60
−70
0
100
PL (W)
VDS = 28 V; IDq = 1080 mA; f = 1880 MHz.
0
15
30
45
60
75
90
PL (W)
VDS = 28 V; IDq = 1080 mA; f = 1880 MHz.
Fig 10. Single carrier W-CDMA power gain and drain
efficiency as function of load power;
typical values
Fig 11. Single carrier W-CDMA ACPR at 5 MHz and at
10 MHz as function of load power;
typical values
7.7 Test circuit
Table 8.
List of components
For test circuit see Figure 12.
BLF7G20LS-140P
Product data sheet
Component
Description
Value
C1, C2, C3
multilayer ceramic chip capacitor
24 pF
[1]
C4, C5
multilayer ceramic chip capacitor
4.7 μF
[2]
C6, C7, C8
multilayer ceramic chip capacitor
11 pF
[3]
C9, C10
multilayer ceramic chip capacitor
10 μF
[2]
C11
electrolytic capacitor
470 μF; 63 V
R1, R2
SMD resistor
12 Ω
[1]
American Technical Ceramics type 100A or capacitor of same quality.
[2]
TDK or capacitor of same quality.
[3]
American Technical Ceramics type 100B or capacitor of same quality.
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Rev. 2 — 17 August 2010
Remarks
Philips 1206
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Power LDMOS transistor
C11
C4
C2
C9
C6
R1
C8
C1
BLF7G20L-140P OUTPUT REV 1
BLF7G20L-140P INPUT REV 1
R2
C5
C7
C3
C10
001aal830
Printed-Circuit Board (PCB): Taconic RF35; εr = 3.5 F/m; thickness = 0.76 mm; thickness copper plating = 35 μm.
See Table 8 for a list of components.
Fig 12. Component layout for class-AB production test circuit
7.8 Impedance information
Table 9.
Typical impedance
Typical values valid for both section in parallel unless otherwise specified.
f
ZS
ZL
MHz
Ω
Ω
1800
1.1 − j3.8
1.8 − j2.8
1840
1.3 − j3.7
1.7 − j2.6
1880
1.2 − j3.8
1.6 − j2.5
gate
drain
ZS
ZL
001aal831
Fig 13. Definition of transistor impedance
BLF7G20LS-140P
Product data sheet
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Power LDMOS transistor
8. Package outline
Earless flanged LDMOST ceramic package; 4 leads
SOT1121B
D
A
F
5
D1
D
U1
w2
H1
H
c
D
2
1
U2
E1
E
4
3
b
Q
w3
e
0
5
10 mm
scale
Dimensions
Unit(1)
mm
A
max 4.75
nom
min 3.45
b
c
D
D1
3.94
0.18 20.02 19.96
3.68
0.08 19.61 19.66
e
E
E1
F
H
H1
Q
U1
U2
w2
w3
9.53 9.53 1.14 19.94 12.83 1.70 20.70 9.91
8.89
0.51 0.25
9.27 9.27 0.89 18.92 12.57 1.45 20.45 9.65
max 0.187 0.155 0.007 0.788 0.786
0.375 0.375 0.045 0.785 0.505 0.067 0.815 0.39
inches nom
0.35
0.02 0.01
min 0.136 0.145 0.003 0.772 0.774
0.365 0.365 0.035 0.745 0.495 0.057 0.805 0.38
Note
1. millimeter dimensions are derived from the original inch dimensions.
2. dimension is measured 0.030 inch (0.76 mm) from the body.
Outline
version
References
IEC
JEDEC
JEITA
sot1121b_po
European
projection
Issue date
09-10-12
09-12-14
SOT1121B
Fig 14. Package outline SOT1121B
BLF7G20LS-140P
Product data sheet
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9. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CW
Continuous Wave
EDGE
Enhanced Data rates for GSM Evolution
ESD
ElectroStatic Discharge
GSM
Global System for Mobile communications
IS-95
Interim Standard 95
LDMOS
Laterally Diffused Metal Oxide Semiconductor
LDMOST
Laterally Diffused Metal Oxide Semiconductor Transistor
RF
Radio Frequency
SMD
Surface Mounted Device
VSWR
Voltage Standing Wave Ratio
W-CDMA
Wideband Code Division Multiple Access
10. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BLF7G20LS-140P v.2
20100817
Product data sheet
-
BLF7G20L-140P_
7G20LS-140P v.1
Modifications:
BLF7G20L-140P_7G20LS-140P v.1
BLF7G20LS-140P
Product data sheet
•
•
•
•
•
•
•
•
•
This document now only describes the BLF7G20LS-140P.
Table 1 on page 1: changed some values.
Table 4 on page 2: removed drain current specification.
Table 6 on page 3: added typical value for gfs.
Table 7 on page 3: changed some values.
Section 7.2 on page 4: updated the figures.
Section 7.3 on page 4: updated the figures.
Section 7.4 on page 5: updated the figures.
Section 7.5 on page 6: updated the figures.
20100421
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 August 2010
-
-
© NXP B.V. 2010. All rights reserved.
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11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
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customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
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Notwithstanding any damages that customer might incur for any reason
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malfunction of an NXP Semiconductors product can reasonably be expected
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Applications — Applications that are described herein for any of these
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
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may be subject to export control regulations. Export might require a prior
authorization from national authorities.
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Product data sheet
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
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NXP Semiconductors’ specifications such use shall be solely at customer’s
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liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
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product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ruggedness in class-AB operation . . . . . . . . . 3
One-tone CW . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Two-tone CW . . . . . . . . . . . . . . . . . . . . . . . . . . 4
GSM EDGE . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Single carrier IS-95 . . . . . . . . . . . . . . . . . . . . . . 6
Single carrier W-CDMA . . . . . . . . . . . . . . . . . . 7
Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Impedance information . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 17 August 2010
Document identifier: BLF7G20LS-140P
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