BSI Very Low Power/Voltage CMOS SRAM 256K x 16 or 512K x 8 bit switchable BS616LV4020 FEATURES DESCRIPTION • Very low operation voltage : 2.7 ~ 3.6V • Very low power consumption : Vcc = 3.0V C-grade: 20mA (Max.) operating current I-grade : 25mA (Max.) operating current 0.5uA (Typ.) CMOS standby current • High speed access time : -70 70ns (Max.) at Vcc=3.0V -10 100ns (Max.) at Vcc=3.0V •Automatic power down when chip is deselected • Three state outputs and TTL compatible • Fully static operation • Data retention supply voltage as low as 1.5V • Easy expansion with CE1, CE2 and OE options • I/O Configuration x8/x16 selectable by CIO, LB and UB pin The BS616LV4020 is a high performance, very low power CMOS Static Random Access Memory organized as 262,144 words by 16 bits or 524,288 bytes by 8 bits selectable by CIO pin and operates from a wide range of 2.7V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.5uA and maximum access time of 70/100ns in 3V operation. Easy memory expansion is provided by active HIGH chip enable2(CE2), active LOW chip enable1(CE1), active LOW output enable(OE) and three-state output drivers. The BS616LV4020 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS616LV4020 is available in DICE form and 48-pin BGA type. PRODUCT FAMILY PRODUCT FAMILY BS616LV4020DC BS616LV4020AC BS616LV4020BC BS616LV4020DI BS616LV4020AI BS616LV4020BI OPERATING TEMPERATURE Vcc RANGE POWER DISSIPATION STANDBY Operating SPEED (ns) (ICCSB1, Max) (ICC, Max) Vcc=3.0V Vcc=3.0V Vcc=3.0V O O 2.7V ~ 3.6V 70 / 100 8uA 20mA O O 2.7V ~ 3.6V 70 / 100 12uA 25mA +0 C to +70 C -40 C to +85 C PIN CONFIGURATION PKG TYPE DICE BGA-48-0608 BGA-48-0810 DICE BGA-48-0608 BGA-48-0810 BLOCK DIAGRAM A15 A14 A13 A12 Address A11 A10 Input A9 A8 A17 A7 A6 Buffer 22 2048 Row Memory Array Decoder 2048 x 2048 2048 16(8) D0 . . . . . . . . Data Input Buffer 16(8) Write Driver 16(8) 16(8) Column I/O Sense Amp 128(256) Data Output Buffer D15 Column Decoder CE1 CE2 WE OE UB LB CIO 14(16) Control Address Input Buffer A16 A0 A1 A2 A3 A4 A5 (SAE) Vdd Vss Brilliance Semiconductor Inc. reserves the right to modify document contents without notice. R0201-BS616LV4020 1 Revision 2.3 April 2002 BSI BS616LV4020 PIN DESCRIPTIONS Name Function A0-A17 Address Input These 18 address inputs select one of the 262,144 x 16-bit words in the RAM. SAE Address Input This address input incorporates with the above 18 address input select one of the 524,288 x 8-bit bytes in the RAM if the CIO is LOW. Don't use when CIO is HIGH. CIO x8/x16 select input This input selects the organization of the SRAM. 262,144 x 16-bit words configuration is selected if CIO is HIGH. 524,288 x 8-bit bytes configuration is selected if CIO is LOW. CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when WE Write Enable Input The write enable input is active LOW and controls read and write operations. With the data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. OE Output Enable Input The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. LB and UB Data Byte Control Input Lower byte and upper byte data input/output control pins. The chipis deselected when both LB and UB pins are HIGH. DQ0 - DQ15 Data Input/Output Ports These 16 bi-directional ports are used to read data from or write data into the RAM. Vcc Power Supply Gnd Ground R0201-BS616LV4020 2 Revision 2.3 April 2002 BSI BS616LV4020 TRUTH TABLE MODE CE1 CE2 H X Fully Standby Output Disable X L L H OE WE CIO X X X H H X LB UB SAE D0~7 D8~15 VCC Current X X X X X High-Z High-Z ICCSB, ICCSB1 X X X High-Z High-Z ICC L H Dout High-Z H L High-Z Dout L L Dout Dout L H Din X H L X Din L L Din Din Read from SRAM L H L H H ( WORD mode ) X ICC Write to SRAM L H X L H ( WORD mode ) X ICC Read from SRAM L H L H L X X A-1 Dout High-Z ICC L H X L L X X A-1 Din X ICC ( BYTE Mode ) Write to SRAM ( BYTE Mode ) ABSOLUTE MAXIMUM RATINGS(1) SYMBOL PARAMETER with OPERATING RANGE RATING UNITS -0.5 to Vcc+0.5 V V TERM Terminal Voltage Respect to GND TBIAS Temperature Under Bias -40 to +125 O TSTG Storage Temperature -60 to +150 O PT Power Dissipation 1.0 W IOUT DC Output Current 20 mA C RANGE AMBIENT TEMPERATURE Vcc Commercial 0 O C to +70 O C 2.7V ~ 3.6V Industrial O -40 C to +85 C 2.7V ~ 3.6V C CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz) SYMBOL 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. R0201-BS616LV4020 O 3 CIN CDQ PARAMETER Input Capacitance Input/Output Capacitance CONDITIONS MAX. UNIT VIN=0V 6 pF VI/O=0V 8 pF 1. This parameter is guaranteed and not tested. Revision 2.3 April 2002 BSI BS616LV4020 DC ELECTRICAL CHARACTERISTICS (TA = 0oC to +70oC) PARAMETER NAME PARAMETER TEST CONDITIONS MIN. TYP.(1) MAX. UNITS VIH Guaranteed Input Low Voltage (2) Guaranteed Input High Voltage (2) I IL Input Leakage Current Vcc = Max, VIN = 0V to Vcc -- -- 1 uA I OL Output Leakage Current Vcc = Max, CE1 = VIH or CE2=VIL or OE = VIH, VI/O = 0V to Vcc -- -- 1 uA V OL Output Low Voltage Vcc = Max, I OL= 2mA Vcc=3V -- -- 0.4 V VOH Output High Voltage Vcc = Min, IOH = -1mA Vcc=3V 2.4 -- -- V I CC Operating Power Supply Current Vcc = Max, CE1= VIL , CE2=V IH IDQ = 0mA, F = Fmax (3) Vcc=3V -- -- 20 mA I CCSB Standby Current -TTL Vcc = Max, CE1 = VIH or CE2=VIL IDQ = 0mA Vcc=3V -- -- 1 mA I CCSB1 Standby Current -CMOS Vcc = Max, CE1ЊVcc-0.2V or CE2Љ0.2V ;VIN Њ Vcc - 0.2V or VINЉ0.2V Vcc=3V -- 0.5 8 uA VIL Vcc=3V -0.5 -- 0.8 V Vcc=3V 2.0 -- Vcc+0.2 V 1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/tRC . R0201-BS616LV4020 4 Revision 2.3 April 2002 BSI BS616LV4020 DATA RETENTION CHARACTERISTICS ( TA = 0 to + 70oC ) SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. (1) MAX. UNITS VDR Vcc for Data Retention CE1 Њ Vcc - 0.2V or CE2 Љ 0.2V ; VIN Њ Vcc - 0.2V or VIN Љ 0.2V 1.5 -- -- V ICCDR Data Retention Current CE1 Њ Vcc - 0.2V or CE2 Љ 0.2V VIN Њ Vcc - 0.2V or VIN Љ 0.2V -- 0.3 2 uA tCDR Chip Deselect to Data Retention Time 0 -- -- ns TRC (2) -- -- ns See Retention Waveform tR Operation Recovery Time 1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled ) Data Retention Mode Vcc VDR Њ 1.5V Vcc CE1 Vcc tR t CDR CE1 Њ Vcc - 0.2V VIH VIH LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled ) Data Retention Mode Vcc VDR Њ 1.5V Vcc CE2 R0201-BS616LV4020 VIL Vcc tR t CDR CE2 Љ 0.2V 5 VIL Revision 2.3 April 2002 BSI BS616LV4020 AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level KEY TO SWITCHING WAVEFORMS Vcc/0V 5ns WAVEFORM 0.5Vcc AC TEST LOADS AND WAVEFORMS 1269 Ω 3.3V 1269 Ω 3.3V OUTPUT OUTPUT 100PF INCLUDING JIG AND SCOPE 1404 Ω 1404 Ω FIGURE 1A FIGURE 1B THEVENIN EQUIVALENT 667 Ω OUTPUT OUTPUTS MUST BE STEADY MUST BE STEADY MAY CHANGE FROM H TO L WILL BE CHANGE FROM H TO L MAY CHANGE FROM L TO H WILL BE CHANGE FROM L TO H , 5PF INCLUDING JIG AND SCOPE INPUTS DON T CARE: ANY CHANGE PERMITTED CHANGE : STATE UNKNOWN DOES NOT APPLY CENTER LINE IS HIGH IMPEDANCE ”OFF ”STATE 1.73V ALL INPUT PULSES Vcc GND 10% → 90% 90% ← → 10% ← 5ns FIGURE 2 AC ELECTRICAL CHARACTERISTICS (TA = 0oC to +70oC , Vcc=3.0V) READ CYCLE JEDEC PARAMETER NAME tAVAX tAVQV tE1LQV tE2LQV tBA tGLQV tE1LQX tBE tGLQX tE1HQZ tBDO tGHQZ tAXQX PARAMETER NAME tRC tAA tACS1 tACS2 tBA(1) tOE tCLZ tBE tOLZ tCHZ tBDO tOHZ tOH DESCRIPTION Read Cycle Time Address Access Time Chip Select Access Time (CE1) (CE2) Chip Select Access Time Data Byte Control Access Time (LB,UB) Output Enable to Output Valid Chip Select to Output Low Z (CE2,CE1) Data Byte Control to Output Low Z (LB,UB) Output Enable to Output in Low Z Chip Deselect to Output in High Z (CE2,CE1) Data Byte Control to Output High Z (LB,UB) Output Disable to Output in High Z Output Disable to Output Address Change BS616LV4020-70 BS616LV4020-10 MIN. TYP. MAX. MIN. TYP. MAX. 70 100 70 70 70 35 35 10 10 10 0 0 0 10 35 35 30 100 100 100 50 50 15 15 15 0 0 0 15 40 40 35 UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns NOTE : 1. tBA is 35ns/50ns (@speed=70ns/100ns) with address toggle . tBA is 70ns/100ns (@speed=70ns/100ns) without address toggle . R0201-BS616LV4020 6 Revision 2.3 April 2002 BSI BS616LV4020 SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE1 (1,2,4) t RC ADDRESS t t t OH AA OH D OUT READ CYCLE2 (1,3,4) CE2 t ACS2 t ACS1 CE1 t (5) t (5) CLZ CHZ D OUT READ CYCLE3 (1,4) t RC ADDRESS t AA OE t CE2 CE1 t t t ACS2 t OLZ t OE t ACS1 (5) CLZ OHZ OH (5) (1,5) t CHZ t BDO LB,UB t BE t BA D OUT NOTES: 1. WE is high for read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2 = VIH. 3. Address valid prior to or coincident with CE1 transition low and CE2 transition high. 4. OE = VIL . 5. Transition is measured ± 500mV from steady state with CL = 30pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. R0201-BS616LV4020 7 Revision 2.3 April 2002 BSI BS616LV4020 AC ELECTRICAL CHARACTERISTICS (TA = 0oC to +70oC , Vcc=3.0V) WRITE CYCLE JEDEC PARAMETER NAME PARAMETER NAME tAVAX tE1LWH tAVWL tAVWH tWLWH tWHAX tBW tWLQZ tDVWH tWHDX tGHQZ tWHQX tWC tCW tAS tAW tWP tWR tBW (1) tWHZ tDW tDH tOHZ tOW BS616LV4020-70 DESCRIPTION MIN. TYP. 70 70 0 70 35 0 30 0 30 0 0 5 Write Cycle Time Chip Select to End of Write Address Set up Time Address Valid to End of Write Write Pulse Width (CE2, CE1, WE) Write Recovery Time Data Byte Control to End of Write (LB,UB) Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active BS616LV4020-10 MAX. MIN. 100 100 0 100 50 0 40 0 40 0 0 10 30 30 TYP. UNIT MAX. 40 40 ns ns ns ns ns ns ns ns ns ns ns ns NOTE : 1. tBW is 30ns/40ns (@speed=70ns/100ns) with address toggle . tBW is 70ns/100ns (@speed=70ns/100ns) without address toggle . SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE1 (1) t WC ADDRESS (3) t WR OE CE2 (5) (11) t CW (5) CE1 t BW (5) LB,UB t AW WE (3) t WP t AS (2) (4,10) t OHZ D OUT t DH t DW D IN R0201-BS616LV4020 8 Revision 2.3 April 2002 BSI BS616LV4020 WRITE CYCLE2 (1,6) t WC ADDRESS CE2 (11) t (5) CE1 t BW (5) LB,UB t WE CW AW t t WP WR (3) (2) t DH t AS (4,10) t WHZ D OUT (7) (8) t DW t DH (8,9) D IN NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE2, CE1 and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE2 going low, or CE1 or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE2 high transition or CE1 low transition or LB,UB low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE2 is high or CE1 is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured± 500mV from steady state with CL = 30pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE2 going high or CE1 going low to the end of write. R0201-BS616LV4020 9 Revision 2.3 April 2002 BSI BS616LV4020 ORDERING INFORMATION BS616LV4020 X X -- Y Y SPEED 70: 70ns 10: 100ns GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE A :BGA - 48 PIN(6x8mm) B :BGA - 48 PIN(8x10mm) D :DICE PACKAGE DIMENSIONS NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 1.4 Max. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. BALL PITCH e = 0.75 D E N D1 E1 8.0 6.0 48 5.25 3.75 E1 e D1 VIEW A 48 mini-BGA (6 x 8mm) R0201-BS616LV4020 10 Revision 2.3 April 2002 BSI BS616LV4020 1.4 Max. 0.25̈́ 0.05 PACKAGE DIMENSIONS (continued) NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. SIDE VIEW D 0.1 D1 N D E D1 E1 e 48 10.0 8.0 5.25 3.75 0.75 0.35̈́ 0.05 E 0.1 E1 e SOLDER BALL VIEW A 48 mini-BGA (8 x 10mm) R0201-BS616LV4020 11 Revision 2.3 April 2002 BSI BS616LV4020 REVISION HISTORY Revision Description Date 2.2 2001 Data Sheet release Apr. 15, 2001 2.3 Modify some AC parameters April,11,2002 R0201-BS616LV4020 12 Note Revision 2.3 April 2002