Infineon BSC0901NSI Material content data sheet Datasheet

Material Content Data Sheet
Sales Product Name
BSC0901NSI
Issued
MA#
MA001025842
Package
PG-TDSON-8-6
14. August 2015
Weight*
118.48 mg
Construction Element
Material Group
Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
chip
leadframe
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
iron
phosphorus
copper
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
0.629
0.53
0.038
0.03
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.53
5310
5310
319
0.011
0.01
37.762
31.87
31.91
318720
96
319135
0.045
0.04
0.04
380
380
0.088
0.07
739
6.215
5.25
37.464
31.62
36.94
316209
369403
1.470
1.24
1.24
12406
12406
0.166
0.14
0.14
1397
1397
0.023
0.02
0.019
0.02
0.895
0.76
0.011
0.01
0.003
0.00
11.320
9.55
0.022
0.02
0.007
0.01
22.292
18.81
52455
198
158
0.80
7550
29
9.56
95545
2.
3.
57
18.84
188148
Sum in total: 100.00
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Infineon Technologies AG
Address
81726 München
Internet
www.infineon.com
95670
188
Important Remarks:
1.
7906
96
188393
1000000
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