LSTD BT800 Dual-mode usb hci module Datasheet

A
Datasheet
BT800
Bluetooth v4.0 Dual-Mode USB HCI Module
Version 2.1
BT800
Datasheet
REVISION HISTORY
Version
1.0
1.1
Date
04 Sept 2013
23 Sept 2013
1.2
07 Oct 2013
1.3
04 Feb 2014
1.4
05 Feb 2014
1.5
16 July 2014
1.6
1.7
1.8
1.9
1.10
1.11
03 Dec 2014
25 March 2015
28 April 2015
10 Aug 2015
08 Sept 2015
15 Dec 2015
2.0
06 July 2016
2.1
31 Aug 2016
Embedded Wireless Solutions Support Center:
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www.lairdtech.com/bluetooth
Notes
Initial Release
Updated Regulatory/Certification section
Update BT SIG Approvals section
Edited text in Low-voltage VDD_RADIO Linear
Regulator section
Added a SPI note where applicable:
Note: The purpose of the SPI interface is to access
the module’s inner settings such as selecting
different WLAN CO-EXIST scheme…
Updated the Bluetooth SIG Approvals section.
Updated Pin Definitions with “If Unconnected”
information.
Updated the Power Control and Regulation section.
Updated document links
Removed MIC certification references
Added Tape/Reel packaging information
Added MIC certification references
Replaced tray image with new one
Changed from HIG to Datasheet
Updates to Power Control and Regulation section
Updated Declaration of Conformity
2
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Approver
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Sue White
Sue White
Jonathan Kaye
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Andrew Chen
Sue White
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BT800
Datasheet
CONTENTS
1
2
3
4
5
6
7
8
8.1.
8.2.
8.3.
8.4.
8.5.
8.6.
8.7.
8.8.
8.9.
8.10.
8.11.
8.12.
9
9.1.
9.2.
9.3.
9.4.
10
11
12
12.1.
13
13.1.
13.2.
13.3.
14
15
16
17
18
18.1.
19
Scope ..............................................................................................................................................................4
Operational Description .................................................................................................................................4
Block Diagram and Descriptions .....................................................................................................................5
Specifications ..................................................................................................................................................6
Pin Definitions ................................................................................................................................................7
DC Electrical Characteristics ...........................................................................................................................8
RF Characteristics ........................................................................................................................................ 10
Interface ...................................................................................................................................................... 11
PIO ............................................................................................................................................................... 11
WLAN Coexistence Interface ....................................................................................................................... 11
USB Interface ............................................................................................................................................... 11
PCM Interface .............................................................................................................................................. 12
GCI Interface ................................................................................................................................................ 14
Slots and Sample Formats ........................................................................................................................... 14
PCM Timing Information............................................................................................................................... 15
PCM Slave Timing ........................................................................................................................................ 17
PCM Slave Mode Timing Parameters .......................................................................................................... 17
PCM_CLK and PCM_SYNC Generation ........................................................................................................ 18
PCM Configuration ...................................................................................................................................... 19
Digital Audio Interface (I²S) ......................................................................................................................... 19
Power Control and Regulation .................................................................................................................... 22
USB Linear Regulator ................................................................................................................................... 22
High-voltage Linear Regulator ..................................................................................................................... 22
Voltage Regulator Enable and Reset ........................................................................................................... 23
Power Sequencing ....................................................................................................................................... 23
Antenna Performance ................................................................................................................................. 24
Mechanical Dimensions and Land Pattern .................................................................................................. 26
Implementation Note .................................................................................................................................. 27
PCB Layout on Host PCB .............................................................................................................................. 27
Application Note for Surface Mount Modules ............................................................................................ 29
Introduction ................................................................................................................................................. 29
Shipping ....................................................................................................................................................... 29
Reflow Parameters ...................................................................................................................................... 31
Japan (MIC) Regulatory ............................................................................................................................... 33
FCC and IC Regulatory ................................................................................................................................. 33
European Union Regulatory ........................................................................................................................ 36
Ordering Information .................................................................................................................................. 37
Bluetooth SIG Approvals.............................................................................................................................. 37
Application Note: Subsystem Combinations ............................................................................................... 37
Additional Assistance................................................................................................................................... 38
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BT800
Datasheet
1 SCOPE
This document describes key hardware aspects of the Laird BT800 Bluetooth HCI/HID module. This document is
intended to assist device manufacturers and related parties with the integration of this module into their host
devices. Data in this document are drawn from a number of sources including data sheets for the CSR8510.
Because the BT800 is currently in development stage, this document is preliminary and the information in this
document is subject to change. Please contact Laird Technologies or visit the Laird website at
www.Lairdtech.com to obtain the most recent version of this document.
2 OPERATIONAL DESCRIPTION
The BT800 series of USB HCI devices are designed to meet the needs of OEMs adding robust
Bluetooth connectivity and using embedded Bluetooth stacks within these products.
Leveraging the market-leading CSR8510 chipset, the BT800 series provides exceptionally
low power consumption with outstanding range. Supporting the latest Bluetooth v4.0
Specification with EDR (Enhanced Data Rate), the Laird BT800 series enables OEMs to
accelerate their development time for leveraging either Classic Bluetooth or Bluetooth Low
Energy (BLE) into their operating system based devices.
With a tiny footprint as small as 8.5 x 13 mm, yet output power at 8 dBm, these modules
are ideal for applications where designers need high performance in minimal size. For
maximum flexibility in systems integration, the modules are designed to support a full
speed USB interface plus GPIO and additionally I2S and PCM audio interfaces.
BT800 module
BT820 USB dongle
These modules present an HCI interface and have native support for Windows and Linux Bluetooth software
stacks. All BT800 series devices are fully qualified as Bluetooth Controller Subsystem products. This also allows
designers to integrate their existing pre-approved Bluetooth Host and Profile subsystem stacks to gain a
Bluetooth END product approval for their products.
The BT800 series is engineered to provide excellent RF performance with integrated antenna and additional
band pass filters. It further reduces regulatory and testing requirements for OEMs and ensures a hassle free
development cycle. As an additional benefit of the BT800 series, Laird has implemented CSR’s HID (Human
Interface Device) Proxy Mode enabling out of the box HID connectivity for pointing devices and / or keyboard
functionality, requiring zero host device software or configuration.
A fully featured, low-cost developer’s kit is available for prototyping, debug, and integration testing of the BT800
series modules and further reduces risk and time in development cycles.
Features and Benefits











Application Areas
Bluetooth v4.0 - Dual mode (Classic Bluetooth and BLE)
Compact footprint
2-wire and 3-wire Wi-Fi coexistence scheme
High antenna radiation gain and efficiency
Good interference rejection for multi-com system (GSM/WCDMA)
Class 1 output – 8 dBm
USB, GPIO, I2S, and PCM
Industrial Temperature Range
64 k EEPROM support for HID Proxy mode
Bluetooth Controller subsystem
FCC, IC, MIC, and CE approvals
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
4
© Copyright 2016 Laird. All Rights Reserved








Medical devices
ePOS terminals
Barcode scanners
Industrial Cable Replacement
M2M Connectivity
Automotive Diagnostic
Equipment
Personal Digital Assistants (PDA)
Bluetooth HID device (keyboard,
mouse, joystick)
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BT800
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3 BLOCK DIAGRAM AND DESCRIPTIONS
Figure 1: BT800 module block diagram
CS8510A10
(Main chip)
The BT800 is based on CSR8510A10 dual mode chip. The chip is a single-chip radio with onchip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides SPI/PCM and USB interfaces. Up to four general purpose I/Os are available for
general use such as Wi-Fi coexistence or general indicators.
Note:
The purpose of the SPI interface is to access the module’s inner settings such as
selecting different WLAN CO-EXIST scheme and enabling HID proxy mode. The SPI
interface can also be used to put the module in RF test mode. You cannot use the
module over the SPI interface for normal operation as the main host interface.
Antenna
Band Pass
Filter
BT800 – The antenna is a ceramic monopole chip antenna.
The band pass filter filters the out-of-band emissions from the transmitter to meet the
specific regulations for type approvals of various countries.
EEPROM
There are 64 k bits EEPROM embedded on the BT800 module which can be used to store
customizable parameters, such as maximum TX power, PCM configuration, USB product ID,
USB vendor ID, and USB product description. With that, the BT800 module can support
HID/HCI Proxy mode.
The embedded 26 MHz crystal is used for generating the clock for the entire module.
Crystal
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BT800
Datasheet
4 SPECIFICATIONS
Table 1: BT800 specifications
Categories
Wireless
Specification
Host Interface
Operational Modes
EEPROM
Coexistence
Feature
Implementation
Bluetooth®
V4.0 Dual Mode
Frequency
Maximum Transmit
Power
2.402 - 2.480 GHz
Class 1
+8 dBm from antenna
Receive Sensitivity
Range
-89 dBm
Circa 100 meters
Data Rates
USB
GPIO
Operating
Storage
Lead Free
Warranty
Up to 3 Mbps (over-the-air)
Full Speed USB 2.0
Four configurable lines
(1.8V/3.3V configurable by VDD_PADS)
Host Controller Interface over USB
Human Interface Device
64 K bits
Three-wire CSR schemes supported
(Unity-3; Unity-3e, and Unity+)
5V +/-10%
Note: See Implementation Note for details on different DC
power selections on the BT800.
Idle Mode ~5 mA
File Transfer ~58 mA
Multilayer ceramic antenna with up to 41% efficiency.
8.5 x 13 x 1.6 mm (BT800 - Module)
16 x 43 x 11 (BT820 – USB Dongle)
-30C to +85C
-40C to +85C
Lead-free and RoHS compliant
1-Year Warranty
Bluetooth®
FCC / IC / CE
Controller Subsystem Approved
All BT800 series
HCI
HID Proxy Mode
2-wire
802.11 (Wi-Fi)
Supply
Supply Voltage
Power
Consumption
Antenna Option
Physical
Environmental
Miscellaneous
Approvals
Current
Internal
Dimensions
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BT800
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5 PIN DEFINITIONS
Table 2: BT800 pin definitions
Supply
Domain
Description
If Unused
SPI_PCM#_SEL
Input with weak
internal pulldown
VDD_PADS
High switches SPI/PCM lines to SPI,
Low switches SPI/PCM lines to
PCM/PIO
*See Note 1.
NC
2
VDD_HOST
Power supply
(3.1V-3.6V)
USB system positive supply
N/A
3
GND
GND
-
Ground
GND
4
USB+
Bidirectional
VDD_HOST
USB data plus with selectable
internal 1.5kΩ pull-up resistor
NC
5
USB-
Bidirectional
VDD_HOST
6
GND
GND
-
Ground
GND
7
VREG_IN_USB
Power supply
Analogue
regulator input
Input to USB regulator. Connect to
external USB bus supply (USB_VBUS)
N/A
Take high to enable internal
regulators. Also acts as active low
reset. Maximum voltage is
VDD_PADS.
Note: USB regulator is always
enabled and not controlled by this
pin.
NC
#
Pin Name
I/O
1
NC
8
VREG_EN_RST#
Input with strong
internal pulldown
9
VREG_IN_HV
Analogue
regulator input /
output
3.3V
Input to internal high-voltage
regulator to 1.8V regulator, 3.3V
output from USB regulator.
N/A
10
VREG_OUT_HV
Analogue
regulator input /
output
1.8V
Output from internal high-voltage to
1.8V regulator. Input to second stage
internal regulators.
N/A
11
GND
GND
-
Ground
GND
12
GND
GND
-
Ground
GND
13
GND
GND
-
Ground
GND
14
GND
GND
-
Ground
GND
15
GND
GND
-
Ground
GND
16
GND
GND
-
Ground
GND
17
NC
-
-
This pin is reserved for future use.
No connection.
-
18
GND
GND
-
Ground
GND
19
PCM_SYNC/
SPI_CS#/
PIO23
Bidirectional, tristate, with weak
internal pulldown
VDD_PADS
PCM synchronous data sync SPI chip
select, active low Programmable
input/output line
*See Note 1.
NC
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VDD_PADS
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BT800
Datasheet
Supply
Domain
Description
If Unused
VDD_PADS
PCM synchronous data clock
SPI clock
Programmable input/output line
*See Note 1.
NC
VDD_PADS
PCM synchronous data input
SPI data input
Programmable input/output line
*See Note 1.
NC
Output, tri-state,
with weak
internal pulldown
VDD_PADS
PCM synchronous data output
SPI data output
Programmable input/output line
*See Note 1.
NC
23
PIO0/
WLAN_ACTIVE
Bidirectional, tristate, with weak
internal pulldown
VDD_PADS
Programmable input/output line
NC
24
GND
GND
-
Ground
GND
25
PIO1/
BT_PIRORITY
Bidirectional, tristate, with weak
internal pulldown
VDD_PADS
Programmable input/output line
NC
26
PIO2/
BT_ACTIVE
Bidirectional, tristate, with weak
internal pulldown
VDD_PADS
Programmable input/output line
NC
27
VDD_PADS
Power supply
(1.7V-3.6V)
Positive supply for digital I/O pads
N/A
Bidirectional, tristate, with weak
internal pulldown
VDD_PADS
Programmable input/output line
NC
#
Pin Name
I/O
20
PCM_CLK/
SPI_CLK/
PIO24
Bidirectional, tristate, with weak
internal pulldown
21
PCM_IN/
SPI_MOSI/
PIO21
Input, tri-state,
with weak
internal pulldown
22
PCM_OUT/
SPI_MISO/
PIO22
28
PIO5
Pin Definition Note:
Note 1
The purpose of the SPI interface is to access the module’s inner settings such as selecting different
WLAN CO-EXIST scheme and enabling HID proxy mode. The SPI interface can also be used to put the
module in RF test mode. You cannot use the module over the SPI interface for normal operation as
the main host interface.
6 DC ELECTRICAL CHARACTERISTICS
Table 3: Absolute maximum ratings
Rating
Storage temperature
VREG_IN_USB
VREG_IN_HV
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Min
-40
-0.2
-0.2
Max
+85
5.75
4.9
8
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Unit
⁰C
V
V
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Datasheet
Rating
VDD_HOST
VDD_PADS
Other terminal voltages
Min
-0.2
-0.2
VSS - 0.4V
Max
3.7
3.7
VDD + 0.4 V
Unit
V
V
V
Rating
Min
Max
Unit
Operating temperature
VREG_IN_USB
-30
4.5
+85
5.5
⁰C
V
VREG_IN_HV
VDD_HOST
3.1
3.1
3.6
3.6
V
V
VDD_PADS
1.7
3.6
V
Table 4: Recommended operating conditions
Table 5: USB Linear Regulator
Rating
Input voltage (VREG_IN_USB)
Output voltage (VREG_IN_HV)
Output current
Min
4.5
3.2
-
Typ
5.0
3.3
-
Max
5.5
3.4
150
Unit
V
V
mA
Min
3.1
1.75
Typ
3.3
1.85
Max
3.6
1.95
Unit
V
V
200
0.4
ppm/⁰C
Table 6: High-voltage Linear Regulator
Normal Operation
Input voltage (VREG_IN_HV)
Output voltage (VREG_OUT_HV)
Temperature coefficient
-200
Output noise
(frequency range 100Hz to100kHz)
Settling time (settling time
within 10% of final value)
Output current
Quiescent current
30
40
(excluding load, load <1mA)
Low-power Mode
Quiescent current
(excluding load, load <100µA)
14
5
mV rms
µs
100
60
mA
18
23
µA
Typ
Max
Unit
-
0.4
V
-
VDD +
0.4
V
µA
Table 7: Digital I/O Characteristics
Normal Operation
VIL input logic level low
VIH input logic level high
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Min
Input Voltage
-0.4
0.7 x
VDD
Output Voltage
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Datasheet
Normal Operation
VOL output logic level low,
IOL = 4.0 mA
VOH output logic level high,
IOL = 4.0 mA
Strong pull-up
Strong pull-down
Weak pull-up
Weak pull-down
CI input capacitance
Min
Typ
Max
Unit
-
-
0.4
V
0.75 x
VDD
-
-
V
-10
150
-0.33
5.0
5.0
µA
µA
µA
µA
pF
Input and Tristate Currents
-150
-40
10
40
-5
-1.0
0.33
1.0
1.0
-
Table 8: Current Consumption
Normal Operation
Idle
USB Suspend
Inquiry
File Transfer
LE Connected (Master)
LE Scan (Master)
Peak (8 dBm)
AVG
5
200
51
58
73
73
74
48
Unit
mA
µA
mA
mA
mA
mA
7 RF CHARACTERISTICS
Table 9: Receiver characteristics
RF Characteristics, VDD = 3.3V @ room
temperature unless otherwise specified
Maximum RF Transmit Power
RF power variation over temperature range
RF power variation over supply voltage
range
RF power variation over BT band
RF power control range
20 dB band width for modulated carrier
F = F0 ± 2MHz
ACP
F = F0 ± 3MHz
F = F0 > 3MHz
Drift rate
ΔF1avg
Min
Max
10
0.2
2
-21
8
10
165
168
0.9
ΔF1max
ΔF2avg / ΔF1avg
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Typ.
8
1.5
10
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BT. Spec.
20
-
Unit
dBm
dB
-
dB
1000
-20
-40
-40
+/-25
140<175
140<175
>=0.8
dB
dBm
kHz
kHz
kHz
kHz
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Table 10: BDR and EDR receiver sensitivity
RF Characteristics, VDD = 3.3V @ room temp.
Packet Type
Min
Typ
Max
BT. Spec.
Unit
-70
dBm
dBm
DH1
DH3
-89
-89
DH5
2-DH5
3-DH5
-89
-92
-85
dBm
dBm
dBm
Sensitivity variation over BT band
All
2
dB
Sensitivity variation over temperature range
All
TBD
dB
Sensitivity for 0.1% BER
8 INTERFACE
8.1.
PIO
See the Device Terminal Functions section for the list of supplies to the PIOs (Programmable I/O ports).
PIO lines are configured through software to have either weak or strong pull-ups or pull-downs. All PIO lines are
configured as inputs with weak pull-downs at reset and have additional individual bus-keeper configuration.
8.2.
WLAN Coexistence Interface
Dedicated hardware is provided to implement a variety of WLAN coexistence schemes. There is support for:




Channel skipping AFH
Priority signaling
Channel signaling
Host passing of channel instructions
The BT800 supports the WLAN coexistence schemes:



Unity-3
Unity-3e
Unity+
For more information see BT800 WLAN Coexistence Schemes and LED Indication.
8.3.
USB Interface
BT800 has a full-speed (12 Mbps) USB interface for communicating with other compatible digital devices. The
USB interface on the BT800 acts as a USB peripheral, responding to requests from a master host controller.
BT800 supports the Universal Serial Bus Specification (USB v2.0 Specification) and USB Battery Charging
Specification, available from http://www.usb.org. For more information on how to integrate the USB interface
on BT800, see Figure 19 located in the following section: USB Dongle Design Example Using BT800.
As well as describing USB basics and architecture, the application note describes:




Power distribution for high and low bus-powered configurations
Power distribution for self-powered configuration, which includes USB VBUS monitoring
USB enumeration
Electrical design guidelines for power supply and data lines, as well as PCB tracks and effects of ferrite
beads
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BT800
Datasheet











8.4.
USB suspend modes and Bluetooth low-power modes
Global suspend
Selective suspend, includes remote wake
Wake on Bluetooth, includes permitted devices and set-up prior to selective suspend
Suspend mode current draw
PIO status in suspend mode
Resume, detach, and wake PIOs
Battery charging from USB: dead battery provision, charge currents, charging in suspend modes and USB
VBUS voltage consideration
USB termination when interface is not in use
Internal modules, certification and non-specification compliant operation
PCM Interface
The audio PCM interface on the BT800 supports:











Continuous transmission and reception of PCM encoded audio data over Bluetooth.
Processor overhead reduction through hardware support for continual transmission and reception of PCM
data.
A bidirectional digital audio interface that routes directly into the baseband layer of the firmware. It does
not pass through the HCI protocol layer.
Hardware on the BT800 for sending data to and from a SCO connection.
Up to three SCO connections on the PCM interface at any one time.
PCM interface master, generating PCM_SYNC and PCM_CLK.
PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.
Various clock formats including:
– Long Frame Sync
– Short Frame Sync
GCI timing environments.
13-bit or 16-bit linear, 8-bit µ-law, or A-law companded sample formats.
Receives and transmits on any selection of three of the first four slots following PCM_SYNC.
The PCM configuration options are enabled by setting PSKEY_PCM_CONFIG32.
8.4.1. PCM Interface Master/Slave
When configured as the master of the PCM interface, the BT800 generates PCM_CLK and PCM_SYNC.
Figure 2: PCM Interface Master
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Figure 3: PCM Interface Slave
8.4.2. Long Frame Sync
Figure 4: Long Frame Sync (shown with 8-bit Companded Sample)
Long Frame Sync is the name given to a clocking format that controls the transfer of PCM data words or
samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When the
BT800 is configured as PCM master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is eight bits long.
When the BT800 is configured as PCM Slave, PCM_SYNC is from one cycle PCM_CLK to half the PCM_SYNC rate.
BT800 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT is
configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.
8.4.3. Short Frame Sync
In Short Frame Sync, the falling edge of PCM_SYNC indicates the start of the PCM word. PCM_SYNC is always
one clock cycle long.
Figure 5: Short Frame Sync (Shown with 16-bit Sample)
As with Long Frame Sync, BT800 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on
the rising edge. PCM_OUT is configurable as high impedance on the falling edge of PCM_CLK in the LSB position
or on the rising edge.
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8.4.4. Multi-Slot Operation
More than 1 SCO connection over the PCM interface is supported using multiple slots. Up to 3 SCO connections
are carried over any of the first 4 slots.
Figure 6: Multi-slot operation with 2 Slots and 8-bit companded samples
8.5.
GCI Interface
BT800 is compatible with the GCI, a standard synchronous 2B+D ISDN timing interface. The two 64 kbps B
channels are accessed when this mode is configured.
Figure 7: Multi-slot operation
The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8 kHz.
8.6.
Slots and Sample Formats
BT800 receives and transmits on any selection of the first four slots following each sync pulse. Slot durations are
either 8 or 16 clock cycles:


8 clock cycles for 8-bit sample formats.
16 clock cycles for 8-bit, 13-bit, or 16-bit sample formats.
BT800 supports:




13-bit linear, 16-bit linear and 8-bit µ-law or A-law sample formats
A sample rate of 8 ksps
Little or big endian bit order
For 16-bit slots, the three or eight unused bits in each slot are filled with sign extension, padded with zeros
or a programmable 3-bit audio attenuation compatible with some codecs.
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Figure 8: 16-bit slot length and sample formats
8.7.
PCM Timing Information
Table 11: PCM Timing information
Symbol
Parameter
4MHz DDS generation.
Frequency selection is
programmable.
Min
Typ
128
Max
Unit
-
256
512
-
kHz
2.9
-
-
kHz
-
8
-
kHz
ns
ns
fmclk
PCM_CLK frequency
-
48MHz DDS generation.
Frequency selection is
programmable.
PCM_SYNC frequency for SCO connection
tmclkh (a)
tmclkl (a)
PCM_CLK high
PCM_CLK low
4MHz DDS generation
4MHz DDS generation
980
730
-
-
-
PCM_CLK jitter
48MHz DDS generation
-
-
21
-
-
20
ns
pkpk
ns
-
-
40.83
ns
-
-
20
ns
tdmclksynch
tdmclkpout
Delay time from
4MHz DDS generation
PCM_CLK high to
48MHz DDS generation
PCM_SYNC high
Delay time from PCM_CLK high to valid PCM_OUT
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Symbol
tdmclklsyncl
Parameter
Delay time from
PCM_CLK low to
PCM_SYNC low (long
frame sync only)
4MHz DDS generation
Min
-
Typ
-
48MHz DDS generation
-
-
Max
20
40.83
Unit
ns
ns
(a) Assumes normal system clock operation. Figures vary during low-power modes, when system clock speeds are reduced.
Table 12: PCM Master mode timing parameters
Symbol
tdmclkhsyncl
tdmclklpoutz
tdmclkhpoutz
tsupinclkl
thpinclkl
Parameter
Delay time from
4MHz DDS generation
PCM_CLK high to
48MHz DDS generation
PCM_SYNC low
Delay time from PCM_CLK low to PCM_OUT
high impedance
Delay time from PCM_CLK high to PCM_OUT
high impedance
Set-up time for PCM_IN valid to PCM_CLK low
Hold time for PCM_CLK low to PCM_IN invalid
Min
20
0
Typ
-
Max
20
40.83
20
20
-
Unit
ns
ns
ns
ns
ns
ns
Figure 9: PCM Master timing long frame sync
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Figure 10: PCM Master timing short frame sync
8.8.
PCM Slave Timing
Symbol
fsclk
fsclk
tsclkl
tsclkh
8.9.
Parameter
PCM clock frequency (Slave mode: input)
PCM clock frequency (GCI mode)
PCM_CLK low time
PCM_CLK high time
Min
64
128
200
200
Typ
-
Max
2048
4096
-
Unit
kHz
kHz
ns
ns
PCM Slave Mode Timing Parameters
Symbol
thsclksynch
Parameter
Hold time from PCM_CLK low to PCM_SYNC high
tsusclksynch
Set-up time for PCM_SYNC high to PCM_CLK low
Delay time from PCM_SYNC or PCM_CLK, whichever is
later, to valid PCM_OUT data (long frame sync only)
tdpout
tdsclkhpout
tdpoutz
tsupinsclkl
thpinsclkl
Delay time from CLK high to PCM_OUT valid data
Delay time from PCM_SYNC or PCM_CLK low, whichever
is later, to PCM_OUT data line high impedance
Set-up time for PCM_IN valid to CLK low
Hold time for PCM_CLK low to PCM_IN invalid
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Min
2
Typ
-
Max
-
Unit
ns
20
-
-
ns
-
-
15
ns
-
-
15
ns
-
-
20
ns
20
2
-
-
ns
ns
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Figure 11: PCM Slave timing long frame sync
Figure 12: PCM Slave timing short frame sync
8.10. PCM_CLK and PCM_SYNC Generation
BT800 has two methods of generating PCM_CLK and PCM_SYNC in master mode:


Generating these signals by DDS from BT800internal 4MHz clock. Using this mode limits PCM_CLK to 128,
256 or 512 kHz and PCM_SYNC to 8 kHz.
Generating these signals by DDS from an internal 48MHz clock, which enables a greater range of
frequencies to be generated with low jitter but consumes more power. To select this second method set bit
48M_PCM_CLK_GEN_EN in PSKEY_PCM_CONFIG32. When in this mode and with long frame sync, the
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length of PCM_SYNC is either 8 or 16 cycles of PCM_CLK, determined by LONG_LENGTH_SYNC_EN in
PSKEY_PCM_CONFIG32.
Equation Error! No text of specified style in document..1 describes PCM_CLK frequency when generated from
the internal 48MHz clock:
Equation Error! No text of specified style in document..1: PCM_CLK frequency generated using the internal 48MHz clock
Set the frequency of PCM_SYNC relative to PCM_CLK using Equation Error! No text of specified style in
document..2:
Equation Error! No text of specified style in document..2: PCM_SYNC frequency relative to PCM_CLK
CNT_RATE, CNT_LIMIT and SYNC_LIMIT are set using PSKEY_PCM_LOW_JITTER_CONFIG. As an example, to
generate PCM_CLK at 512kHz with PCM_SYNC at 8kHz, set SKEY_PCM_LOW_JITTER_CONFIG to 0x08080177.
8.11. PCM Configuration
Configure the PCM by using PSKEY_PCM_CONFIG32 and PSKEY_PCM_LOW_JITTER_CONFIG (See your PSKey
file). The default for PSKEY_PCM_CONFIG32 is 0x00800000 (for example: first slot following sync is active, 13-bit
linear voice format, long frame sync and interface master generating 256kHz PCM_CLK from 4MHz internal clock
with no tri-state of PCM_OUT).
8.12. Digital Audio Interface (I²S)
The digital audio interface supports the industry standard formats for I²S, left-justified or right-justified. The
interface shares the same pins as the PCM interface, which means each audio bus is mutually exclusive in its
usage. Table 13 lists these alternative functions. Figure 11 shows the timing diagram.
Table 13: Alternative functions of the digital audio bus interface on the PCM interface.
PCM Interface
PCM_OUT
PCM_IN
PCM_SYNC
PCM_CLK
I²S Interface
SD_OUT
SD_IN
WS
SCK
Configure the digital audio interface using PSKEY_DIGITAL_AUDIO_CONFIG, see BlueCore Audio API Specification
and the PS Key file.
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Figure 13: PCM configuration
The internal representation of audio samples within BT800is 16-bit and data on SD_OUT is limited to 16-bit per
channel.
Table 14: Digital audio interface slave timing
Symbol
-
Parameter
SCK Frequency
WS Frequency
Min
-
Typ
-
Max
6.2
96
Unit
MHz
kHz
tch
tcl
SCK high time
SCK low time
80
80
-
-
ns
ns
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Table 15: I²S slave mode timing
Symbol
Parameter
Min
Typ
Max
Unit
tssu
tsh
WS valid to SCK high set-up time
SCK high to WS invalid hold time
20
2.5
-
-
ns
ns
topd
tisu
SCK low to SD_OUT valid delay time
SD_IN valid to SCK high set-up time
20
-
20
-
ns
ns
tih
SCK high to SD_IN invalid hold time
2.5
-
-
ns
Figure 14: Digital audio interface slave timing
Table 16: Digital audio interface master timing
Symbol
Parameter
-
SCK Frequency
WS Frequency
Min
Typ
Max
Unit
-
-
6.2
96
MHz
kHz
Table 17: I²S Master mode timing parameters, WS and SCK as outputs
Symbol
Parameter
tspd
SCK low to WS valid delay time
SCK low to SD_OUT valid delay
time
SD_IN valid to SCK high set-up
time
SCK high to SD_IN invalid hold
time
topd
tisu
tih
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Min
Typ
Max
Unit
-
-
39.27
ns
-
-
18.44
ns
18.44
-
-
ns
0
-
-
ns
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Figure 15: Digital audio interface master timing
9 POWER CONTROL AND REGULATION
See the Example Application Schematic (Figure 19) for the regulator configuration. BT800 contains three
regulators:


USB linear regulator, to generate the 3.3 V from the USB bus power and the input to the high-voltage linear
regulator.
High-voltage linear regulator, to generate the main 1.8 V from the USB linear regulator or an external 3.3 V.
This regulator then feeds the three low-voltage regulators:
–
–
–
9.1.
Low-voltage VDD_DIG linear regulator, a programmable low-voltage regulator to supply a 0.90 V
to1.25 V digital supply, VDD_DIG.
Low-voltage VDD_ANA linear regulator, to supply the radio supply, VDD_RADIO.
Low-voltage VDD_AUX linear regulator, to supply the auxiliary supply, VDD_AUX.
USB Linear Regulator
The integrated USB LDO linear regulator is available as a 3.3V supply rail (VREG_IN_HV) and is intended to
supply the USB interface and the high-voltage linear regulator. The input voltage range supplied at
VREG_IN_USB is between 4.25V and 5.75V. VREG_IN_HV serves as both the output for the USB linear regulator
and the input to the High-voltage linear regulator. The maximum current from this regulator is 150 mA, of which
50 mA is available for external use (for example, EEPROM/LED). This regulator is internally decoupled and no
external decoupling caps are required on the VREG_IN_HV pin, however in noisy environments, an output
capacitor of 1uF to 4.7uF (+/-20%) is suggested.
This regulator is enabled by default. If the USB linear regulator is not required, leave its input (VREG_IN_USB)
unconnected and connect 3.3V to VREG_IN_HV (if using the High-voltage linear regulator), VDD_HOST,
VDD_EN_RST#, and VDD_PADS (if using 3.3V I/O).
9.2.
High-voltage Linear Regulator
The integrated high-voltage linear regulator is available to power the main 1.8V supply rail including the three
internal low-voltage linear regulators VDD_DIG, VDD_ANA, and VDD_AUX. The input voltage range supplied at
VREG_IN_HV is between 2.3V and 4.8V. VREG_OUT_HV serves as both the output to the high-voltage linear
regulator and the input to the internal low voltage regulators. The maximum current from this regulator is 100
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mA; this regulator is not available for external use. This regulator is internally decoupled and no external
decoupling caps are required on the VREG_IN_HV pin, however in noisy environments, an output capacitor of
1uF to 4.7uF (+/-20%) is suggested.
If this regulator is not required, and the USB linear regulator is not used then leave VREG_IN_HV unconnected
and connect 1.8V to VREG_OUT_HV.
9.3.
Voltage Regulator Enable and Reset
A single pin, VREG_EN_RST#, controls both the regulator enables and the digital reset function. All the regulators
are enabled, except the USB linear regulator, by taking the VREG_EN_RST# pin above 1 volt. Software also
controls the regulators. The VREG_EN_RST# pin is connected internally to the reset function and is powered
from VDD_HOST, so do not apply voltages above VDD_HOST to the VREG_EN_RST# pin. The REG_EN_RST# pin is
pulled down internally before the software starts. The VREG_EN_RST# pin is an active low reset. Assert the reset
signal for a period >5 ms to ensure a full reset.
Note:
The regulator enables are released as soon as VREG_EN_RST# is low, so the regulators shut down.
Therefore do not take VREG_EN_RST# low for less than 5 ms, as a full reset is not guaranteed.
Other reset sources are:


Power-on reset
Via a software-configured watchdog timer
A warm reset function is also available under software control. After a warm reset the RAM data
remains available.
9.4.
Power Sequencing
CSR recommends that all power supplies are powered at the same time. The order of powering the supplies
relative to the I/O supply, VDD_PADS to VDD_HOST, is not important. If the I/O supply is powered before
VDD_DIG, all digital I/Os are weak pull-downs regardless of the reset state.
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10 ANTENNA PERFORMANCE
Figure 16 illustrates antenna performance.
Figure 16: BT800 gain table
Figure 17: Network analyzer output
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11 MECHANICAL DIMENSIONS AND LAND PATTERN
11.1. BT800 Mechanical Drawing
Note:
Dimensions are in millimetres.
Tolerances:
.xx
±0.03 mm
.x
±1.3 mm
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12 IMPLEMENTATION NOTE
12.1. PCB Layout on Host PCB
Checklist (for PCB):





MUST locate the BT800 module close to the edge of PCB.
Use solid GND plane on inner layer (for best EMC and RF performance).
Place GND vias close to module GND pads as possible
Route traces to avoid noise being picked up on VCC supply.
Antenna Keep-out area:
– Ensure there is no copper in the antenna keep-out area on any layers of the host PCB.
– Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.
– For best antenna performance, place the BT800 module on the edge of the host PCB, preferably in the
corner with the antenna facing the corner.
– A different host PCB thickness dielectric will have small effect on antenna.
Figure 18: Recommend Antenna keep-out area (in White) used on the BT800
12.1.1. Antenna Keep-out and Proximity to Metal or Plastic
Checklist (for metal /plastic enclosure):




Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm
top/bottom and 30 mm left or right.
Metal close to the BT800 chip monopole antenna (bottom, top, left, right, any direction) will have
degradation on the antenna performance. The amount of degradation is entirely system dependent which
means some testing by customers is required (in their host application).
Any metal closer than 20 mm starts to significantly degrade performance (S11, gain, radiation efficiency).
It is best that the customer tests the range with mock-up (or actual prototype) of the product to assess
effects of enclosure height (and material whether metal or plastic).
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1.1.1 USB Dongle Design Example Using BT800
Figure 19: USB dongle design schematic
Figure 20: BT820 USB dongle, containing embedded BT800
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12.1.2. DC Power Supply Options for Using the BT800 Module


Using USB bus power (5V±10%)
Apply USB bus power (5V ±10%) directly to the Pin-7 (VREG_IN_USB) and pull-high on Pin-8
(VREG_EN_RST#) to turn on the internal regulator. The BT800 module generates 3.3 V/1.8 V output on Pin9 (VREG_IN_HV)/Pin-10 (VREG_OUT_HV) that can supply to the other DC pin of the board.
Using DC power 3.3 V
Leave the Pin-7 (VREG_IN_USB) no connection, power the on Pin-9 (VREG_IN_HV) with 3.3 V and pull-high
on Pin-8 (VREG_EN_RST#) to turn on the internal regulator. The BT800 module generates 1.8 V output on
Pin-10 (VREG_OUT_HV) which can supply to the other DC pin of the board.
13 APPLICATION NOTE FOR SURFACE MOUNT MODULES
13.1. Introduction
Laird surface mount modules are designed to conform to all major manufacturing guidelines. This application
note is intended to provide additional guidance beyond the information that is presented in the user manual.
This application note is considered a living document and is updated as new information is presented.
The modules are designed to meet the needs of a number of commercial and industrial applications. They are
easy to manufacture and they conform to current automated manufacturing processes.
13.2. Shipping
13.2.1. Tray Package
Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick
and place machines. Layouts of the trays are provided in Figure 21.
Figure 21: Shipping tray layout
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13.2.2. Tape and Reel Package Information
Note:
Ordering information for Tape and Reel packaging is an addition of T/R to the end of the full
module part number. For example, BT800 becomes BT800-xx-T/R.
Figure 22: Reel specifications
Figure 23: Tape specifications
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There are 2500 BT800 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (12,500
modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See following images
(Figures 24-32).
1.1.1.1 Packaging Process
Figure 24: BT800 packaging process
13.3. Reflow Parameters
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Laird’s surface mount modules conform
to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
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Figure Error! No text of specified style in document.-25: Recommended reflow temperature
Temperatures should not exceed the minimums or maximums presented in Table 18.
Table 18: Recommended maximum and minimum temperatures
Specification
Temperature Inc./Dec. Rate (max)
Temperature Decrease rate (goal)
Soak Temp Increase rate (goal)
Flux Soak Period (Min)
Value
1~3
2-4
.5 - 1
70
Unit
°C / Sec
°C / Sec
°C / Sec
Sec
Flux Soak Period (Max)
Flux Soak Temp (Min)
Flux Soak Temp (max)
Time Above Liquidous (max)
Time Above Liquidous (min)
Time In Target Reflow Range (goal)
Time At Absolute Peak (max)
Liquidous Temperature (SAC305)
Lower Target Reflow Temperature
Upper Target Reflow Temperature
120
150
190
70
50
30
5
218
240
250
Sec
°C
°C
Sec
Sec
Sec
Sec
°C
°C
°C
Absolute Peak Temperature
260
°C
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14 JAPAN (MIC) REGULATORY
The BT800 is approved for use in the Japanese market. The part numbers listed below hold WW type
certification. Refer to ARIB-STD-T66 for further guidance on OEM’s responsibilities.
Model
Product Name
Description
Certificate Number
BT800
BT v4.0 Dual Mode USB HCI Module
Mounted with chipset
antenna
003-150186
14.1. Antenna Information
The BT800 was tested with antennas listed below. The OEM can choose a different manufacturers antenna but
must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved for
use.
Item Part Number
1
AT3216-B2R7HAA_3216
Mfg.
Type
Gain (dBi)
ACX
Chip
0.5
15 FCC AND IC REGULATORY
Model
BT800
BT820
DVK-BT800
US/FCC
SQGBT800
SQGBT800
SQGBT800
CANADA/IC
3147A-BT800
3147A-BT800
3147A-BT800
The BT800 family has been designed to operate with the antenna listed below having a maximum gain of 0.5
dBi. The required antenna impedance is 50 ohms.
Item
1
Part Number
AT3216-B2R7HAA
Mfg.
ACX
Type
Ceramic
Gain (dBi)
0.5
15.1. Documentation Requirements
In order to ensure regulatory compliance, when integrating the BT800 into a host device, it is necessary to meet
the documentation requirements set forth by the applicable regulatory agencies. The following sections (FCC,
Industry Canada, and European Union) outline the information that may be included in the user’s guide and
external labels for the host devices into which the BT800 is integrated.
FCC
Note:
You must place “Contains FCC ID: SQG-BT800” on the host product in such a location that it can be
seen by an operator at the time of purchase.
User’s Guide Requirements
The BT800 complies with FCC Part 15 Rules for a Modular Approval. To leverage Laird’s grant, the conditions
below must be met for the host device into which the BT800 is integrated:

The transmitter module is not co-located with any other transmitter or antenna that is capable of
simultaneous operation.
Embedded Wireless Solutions Support Center:
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www.lairdtech.com/bluetooth
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BT800
Datasheet
As long as the conditions above are met, further transmitter testing is typically not required. However, the OEM
integrator is still responsible for testing its end-product for any additional compliance requirements required
with this module installed, such as (but not limited to) digital device emissions and PC peripheral requirements.
IMPORTANT:
In the event that the conditions above cannot be met (for example certain device configurations
or co-location with another transmitter), then the FCC authorization is no longer considered valid
and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC authorization.
When using Laird’s FCC grant for the BT800, the integrator must include specific information in
the user’s guide for the device into which the BT800 is integrated. The integrator must not
provide information to the end user regarding how to install or remove this RF module in the
user’s manual of the device into which the BT800 is integrated. The following FCC statements
must be added in their entirety and without modification into a prominent place in the user’s
guide for the device into which the BT800 is integrated:
IMPORTANT NOTE: To comply with FCC requirements, the BT800 must not be co-located or
operating in conjunction with any other antenna or transmitter.
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one of the following
measures:
1. Reorient or relocate the receiving antenna.
2. Increase the separation between the equipment and receiver.
3. Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
4. Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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BT800
Datasheet
IMPORTANT NOTE: FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment.
Industry Canada
Note:
You must place “Contains IC ID: 3147A-BT800” on the host product in such a location that it can be
seen by an operator at the time of purchase.
RF Radiation Hazard Warning
Using higher gain antennas and types of antennas not certified for use with this product is not allowed. The
device shall not be co-located with another transmitter.
Cet avertissement de sécurité est conforme aux limites d'exposition définies par la norme CNR-102 at relative
aux fréquences radio.
This radio transmitter (Contains IC ID: 3147A-BT800) has been approved by Industry Canada to operate with the
antenna types listed in table above with the maximum permissible gain and required antenna impedance for
each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum
gain indicated for that type, are strictly prohibited for use with this device.
Le présent émetteur radio (Contains IC ID: 3147A-BT800) a été approuvé par Industrie Canada pour fonctionner
avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour
chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain
maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and
maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically
radiated power (e.i.r.p.) is not more than that necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une
antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le
but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type
d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas
l'intensité nécessaire à l'établissement d'une communication satisfaisante.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following
two conditions: (1) this device may not cause interference, and (2) this device must accept any interference,
including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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Europe: +44-1628-858-940
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BT800
Datasheet
16 EUROPEAN UNION REGULATORY
The BT800 has been tested for compliance with relevant standards for the EU market. BT800 module was tested
with a 0.5 dBi chip antenna.
The OEM should consult with a qualified test house before entering their device into an EU member country to
make sure all regulatory requirements have been met for their complete device.
Reference the Declaration of Conformities listed below for a full list of the standards that the modules were
tested to. Test reports are available upon request.
16.1. EU Declarations of Conformity
Manufacturer:
Laird
Products:
BT800, BT810, BT820
1999/5/EC – R&TTE
2006/95/EC – Low Voltage directive (LVD)
2004/108/EC – Electromagnetic compatibility (EMC)
2014/30/EU – EMC
Annex IV
EU Directives:
Conformity Assessment:
Reference standards used for presumption of conformity:
Article Number
3.1a
3.1b
3.2
Requirement
2006/95/EC
Low voltage equipment safety
Reference standard(s)
EN 60950-1:2006 +A11:2009 +A1:2010 +A12:2011
+A2:2013
RF Exposure
EN 62311:2008
2004/108/EC
Protection requirements with
respect to electromagnetic
compatibility
1999/5/EC
Means of the efficient use of
the radio frequency spectrum
EN 301 489-1 v1.9.2 (2011-09)
EN 301 489-17 v2.2.1 (2012-09)
EN 300 328 v1.9.1 (2015-02)
Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and
that the above product to which this declaration relates is in conformity with all the applicable essential
requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose.
Laird
Place of Issue:
W66N220 Commerce Court, Cedarburg, WI 53012 USA
tel: +1-262-375-4400 fax: +1-262-364-2649
Date of Issue:
August 2016
Name of Authorized Person:
Thomas T Smith, Director of EMC Compliance
Signature of Authorized Person:
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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Europe: +44-1628-858-940
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BT800
Datasheet
17 ORDERING INFORMATION
Part Number
BT800
BT820
DVK-BT800
Description
BTv4.0 Dual Mode USB HCI Module
BTv4.0 Dual Mode USB Dongle
Development Kit for BT800 Module
17.1. General Comments
This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If
in doubt, ask.
18 BLUETOOTH SIG APPROVALS
18.1. Application Note: Subsystem Combinations
This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on
the Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to
create a complete Bluetooth End Product solution.
Subsystem listings referenced as an example:
Design Name
Owner
Declaration ID
Link to listing on the SIG website
BT800-SA
Laird
B021369
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=21369
Windows 8
(Host Subsystem)
Microsoft
Corporation
B012854
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=12854
Laird Customer Declaration ID Procedure
This procedure assumes that the member is simply combining two subsystems to create a new design, without
any modification to the existing, qualified subsystems. This is achieved by using the Listing interface on the
Bluetooth SIG website. Figure 26 shows the basic subsystem combination of a controller and host subsystem.
The Controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP
and any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a
Profile Subsystem.
The controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP
and any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a
Profile Subsystem.
Figure 26: Basic subsystem combination of a controller and host subsystem
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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The Qualification Process requires each company to registered as a member of the Bluetooth SIG –
http://www.bluetooth.org
The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new
qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on
your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees
For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG
document:
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486
To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm.
In step 1, select the option, Reference a Qualified Design and enter the Declaration IDs of each subsystem used
in the End Product design. You can then select your pre-paid Declaration ID from the drop down menu or go to
the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a
credit card, it will not be possible to proceed until the SIG invoice is paid.
Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help
document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC.
For further information please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates
19
ADDITIONAL ASSISTANCE
Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit
Support Centre: http://ews-support.lairdtech.com
Email: [email protected]
Phone:
Europe:
Hong Kong:
Web:
Americas: +1-800-492-2320
+44-1628-858-940
+852 2923 0610
http://www.lairdtech.com/bluetooth
© Copyright 2016 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and
reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests
with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to
the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or
any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the
Laird Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a tradename
herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird Technologies™, corresponding logos, and other marks are
trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any
Laird or any third party intellectual property right.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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© Copyright 2016 Laird. All Rights Reserved
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Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
BT800
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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