NXP BTA201-800B 1 a three-quadrant triacs high commutation Datasheet

BTA201 series B, E and ER
1 A Three-quadrant triacs high commutation
Rev. 04 — 4 February 2008
Product data sheet
1. Product profile
1.1 General description
Passivated, guaranteed commutation triacs in a plastic package. The ‘sensitive gate’ E
and ER series are intended for interfacing with low power drivers, including
microcontrollers. The high commutation B series are designed to commutate the full RMS
current at the maximum junction temperature without the aid of a snubber.
1.2 Features
n Suitable for interfacing with low power
drivers, including microcontrollers
n Reverse pinning option (ER type)
1.3 Applications
n Motor controls
n Solenoid drivers
1.4 Quick reference data
n
n
n
n
ITSM ≤ 12.5 A
IT(RMS) ≤ 1 A
VDRM ≤ 600 V (BTA201-600B/E)
VDRM ≤ 800 V (BTA201-800B/E/ER)
n
n
n
n
IGT ≤ 50 mA (BTA201-600B/800B)
IGT ≤ 10 mA (BTA201-600E/800E/ER)
IGT ≥ 5 mA (BTA201-600B/800B)
IGT ≥ 1 mA (BTA201-600E/800E/ER)
2. Pinning information
Table 1.
Pinning
Pin
Description
Simplified outline
Graphic symbol
B and E series
1
main terminal 2 (T2)
2
gate (G)
T2
3
main terminal 1 (T1)
sym051
G
ER series
1
main terminal 1 (T1)
2
gate (G)
3
main terminal 2 (T2)
T1
321
SOT54 (TO-92)
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
3. Ordering information
Table 2.
Ordering information
Type number
BTA201-600B
Package
Name
Description
Version
TO-92
plastic single-ended leaded (through hole) package; 3 leads
SOT54
BTA201-600E
BTA201-800B
BTA201-800E
BTA201-800ER
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDRM
repetitive peak off-state voltage
Conditions
Min
Max
Unit
BTA201-600B
[1]
-
600
V
BTA201-600E
[1]
-
600
V
BTA201-800B
-
800
V
BTA201-800E
-
800
V
BTA201-800ER
-
800
V
-
1
A
t = 20 ms
-
12.5
A
t = 16.7 ms
IT(RMS)
RMS on-state current
full sine wave; Tlead ≤ 54.3 °C; see
Figure 4 and 5
ITSM
non-repetitive peak on-state current
full sine wave; Tj = 25 °C prior to
surge; see Figure 2 and 3
-
13.7
A
I2t
I2t for fusing
tp = 10 ms
-
0.78
A2s
dIT/dt
rate of rise of on-state current
ITM = 1.5 A; IG = 0.2 A;
dIG/dt = 0.2 A/µs
-
100
A/µs
IGM
peak gate current
-
2
A
PGM
peak gate power
-
5
W
PG(AV)
average gate power
-
0.1
W
Tstg
storage temperature
−40
+150
°C
Tj
junction temperature
-
125
°C
[1]
over any 20 ms period
Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 6 A/µs.
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
2 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
001aag957
1.5
α
Ptot
(W)
α = 180°
α
1.0
120°
90°
60°
30°
0.5
0
0
0.2
0.4
0.6
0.8
1.0
1.2
IT(RMS) (A)
α = conduction angle
Fig 1.
Total power dissipation as a function of RMS on-state current; maximum values
001aag959
16
ITSM
(A)
12
8
ITSM
IT
4
t
T
Tj(init) = 25 °C max
0
1
102
10
103
number of cycles (n)
f = 50 Hz
Fig 2.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
3 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
003aaa955
103
ITSM
IT
ITSM
(A)
t
tp
Tj(init) = 25 °C max
102
(1)
10
10−5
10−4
10−3
10−2
10−1
tp (s)
tp ≤ 20 ms
(1) dIT/dt limit
Fig 3.
Non-repetitive peak on-state current as a function of pulse width; maximum values
001aag961
3
IT(RMS)
(A)
001aag960
1.2
IT(RMS)
(A)
1.0
54.3 °C
0.8
2
0.6
0.4
1
0.2
0
10−2
10−1
0
−50
1
10
surge duration (s)
0
50
100
150
Tlead (°C)
f = 50 Hz; Tlead ≤ 54.3 °C
Fig 4.
RMS on-state current as a function of surge
duration; maximum values
Fig 5.
RMS on-state current as a function of lead
temperature; maximum values
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
4 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
5. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Rth(j-lead)
Rth(j-a)
Conditions
Min
Typ
Max
Unit
thermal resistance from junction to full cycle; see Figure 6
lead
half cycle; see Figure 6
-
-
60
K/W
-
-
80
K/W
thermal resistance from junction to printed-circuit board
ambient
mounted; lead
length = 4 mm
-
150
-
K/W
001aag962
102
Zth(j-lead)
(K/W)
10
(1)
(2)
1
10−1
10−2
10−5
10−4
10−3
10−2
10−1
1
10
tp (s)
(1) Unidirectional
(2) Bidirectional
Fig 6.
Transient thermal impedance from junction to lead as a function of pulse width
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
5 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
6. Static characteristics
Table 5.
Static characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
IGT
IL
gate trigger current
latching current
Conditions
BTA201-600B
BTA201-800B
BTA201-600E
BTA201-800E
BTA201-800ER
Unit
Min
Typ
Max
Min
Typ
Max
T2+ G+
5
-
50
1
-
10
mA
T2+ G−
5
-
50
1
-
10
mA
T2− G−
5
-
50
1
-
10
mA
T2+ G+
-
-
30
-
-
12
mA
T2+ G−
-
-
50
-
-
20
mA
T2− G−
-
-
30
-
-
12
mA
VD = 12 V; IT = 0.1 A; see Figure 8
VD = 12 V; IGT = 0.1 A; see Figure 10
IH
holding current
VD = 12 V; IGT = 0.1 A; see Figure 11
-
-
30
-
-
12
mA
VT
on-state voltage
IT = 1.4 A; see Figure 9
-
1.2
1.5
-
1.2
1.5
V
VGT
gate trigger voltage
ID
off-state current
VD = 12 V; IT = 0.1 A; see Figure 7
-
0.7
1.5
-
0.7
1.5
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C
0.2
0.3
-
0.2
0.3
-
V
VD = VDRM(max); Tj = 125 °C
-
0.1
0.5
-
0.1
0.5
mA
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
6 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
7. Dynamic characteristics
Table 6.
Dynamic characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Min
Typ
Max
dVD/dt
rate of rise of
off-state voltage
VDM = 67 % VDRM(max);
Tj = 125 °C; exponential
waveform; gate open
circuit
1000
-
-
600
-
-
V/µs
dIcom/dt
rate of change of
commutating
current
VDM = 400 V; Tj = 125 °C;
dVcom/dt = 20 V/µs; gate
open circuit
12
-
-
2.5
-
-
A/ms
VDM = 400 V; Tj = 125 °C;
dVcom/dt = 10 V/µs; gate
open circuit
16
-
-
3.5
-
-
A/ms
ITM = 20 A;
VD = VDRM(max);
IG = 0.1 A;
dIG/dt = 5 A/µs
-
2
-
-
2
-
µs
gate-controlled
turn-on time
tgt
BTA201-600B
BTA201-800B
BTA201-600E
BTA201-800E
BTA201-800ER
001aab101
1.6
003aaa959
3
VGT
IGT
VGT(25°C)
IGT(25°C)
1.2
2
Unit
(1)
(2)
(3)
0.8
1
(3)
(2)
(1)
0.4
−50
0
50
100
0
−50
150
Tj (°C)
0
50
100
Tj (°C)
150
(1) T2− G−
(2) T2+ G−
(3) T2+ G+
Fig 7.
Normalized gate trigger voltage as a function
of junction temperature
Fig 8.
Normalized gate trigger current as a function
of junction temperature
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
7 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
003aaa960
2
001aab100
3
IT
(A)
IL
IL(25°C)
1.6
2
1.2
(1)
(2)
0.8
(3)
1
0.4
0
0
0.4
0.8
1.2
1.6
2
0
−50
0
50
100
150
Tj (°C)
VT (V)
Vo = 1.02 V; Rs = 0.358 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9.
On-state current as a function of on-state
voltage
001aab099
3
Fig 10. Normalized latching current as a function of
junction temperature
IH
dVD/dt
IH(25°C)
(V/µs)
2
003aab834
104
103
(1)
(2)
1
0
−50
102
0
50
100
150
10
0
50
Tj (°C)
100
Tj °C
150
Gate open circuit
(1) BTA201 series B
(2) BTA201 series E and ER
Fig 11. Normalized holding current as a function of
junction temperature
Fig 12. Critical rate of rise of off-state voltage as a
function of junction temperature; minimum
values
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
8 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
8. Package outline
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
e1
2
D
e
3
b1
L1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b1
c
D
d
E
mm
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
e
2.54
e1
L
L1(1)
1.27
14.5
12.7
2.5
max.
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
REFERENCES
IEC
SOT54
JEDEC
JEITA
TO-92
SC-43A
EUROPEAN
PROJECTION
ISSUE DATE
04-06-28
04-11-16
Fig 13. Package outline SOT54 (TO-92)
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
9 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
BTA201_SER_B_E_ER_4
20080204
Product data sheet
-
Modifications:
BTA201_SER_B_E_ER_3
Modifications:
BTA201_SER_B_E_ER_2
Modifications:
BTA201_SER_B_E_ER_1
(9397 750 15154)
•
•
•
•
Figure 3: Changed figure.
Section 1.4 “Quick reference data” on page 1: Updated with minimum IGT values added.
Table 3 “Limiting values” on page 2: I2t condition, tp; symbol update.
Table 5 “Static characteristics” on page 6: Minimum IGT values added.
20070910
Product data sheet
-
BTA201_SER_B_E_ER_2
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Descriptive titles have been corrected.
Table 3 “Limiting values” on page 2: dIT/dt uprated.
Table 6 “Dynamic characteristics” on page 7: dVD/dt uprated.
Figure 12 “Critical rate of rise of off-state voltage as a function of junction temperature;
minimum values” on page 8: graph updated.
20060113
•
•
•
Product data sheet
-
BTA201_SER_B_E_ER_1
Figure 4: Figure note corrected
Table 6 “Dynamic characteristics” on page 7: Units corrected
Figure 12: Figure title corrected
20050825
Product data sheet
BTA201_SER_B_E_ER_4
Product data sheet
BTA201_SER_B_E_ER_3
-
-
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
10 of 12
BTA201 series B, E and ER
NXP Semiconductors
1 A Three-quadrant triacs high commutation
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BTA201_SER_B_E_ER_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 4 February 2008
11 of 12
NXP Semiconductors
BTA201 series B, E and ER
1 A Three-quadrant triacs high commutation
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 February 2008
Document identifier: BTA201_SER_B_E_ER_4
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