STMicroelectronics BTB25-600BW 25a triac Datasheet

BTA24, BTB24, BTA25, BTA26
and T25 series
Snuberrless™ and Standard
25 A Triacs
Main features
A2
Symbol
Value
Unit
IT(RMS)
25
A
VDRM/VRRM
600 and 800
V
IGT (Q1)
35 to 50
mA
G
A1
A2
A1
A2
G
Description
A1
A2
G
TO-220AB Insulated
(BTA24)
Available either in through-hole or surface-mount
packages, the BTA24, BTB24, BTA25, BTA26
and T25 triac series is suitable for general
purpose AC switching. They can be used as an
ON/OFF function in applications such as static
relays, heating regulation, induction motor starting
circuits... or for phase control operation in light
dimmers, motor speed controllers, ...
TO-220AB
(BTB24)
A1
G
A2
A1
A2
RD91
(BTA25)
The snubberless versions (BTA/BTB...W and T25
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances. By using an internal ceramic pad,
the BTA series provides voltage insulated tab
(rated at 2500VRMS) complying with UL standards
(File ref.: E81734).
G
TOP3 Insulated
(BTA26)
A2
A1 A2
G
D2PAK
(T25-G)
Order codes
Part Number
Marking
BTA24-xxxxxRG
BTB24-xxxxxRG
BTA25-xxxxxRG
See Table 6 on page 6
BTA26-xxxxxRG
T25xx-xxxG
T25xx-xxxG-TR
TM: Snubberless is a trademark of STMicroelectronics
July 2006
Rev 9
1/12
www.st.com
12
Characteristics
BTA24, BTB24, BTA25, BTA26 and T25 series
1
Characteristics
Table 1.
Absolute maximum ratings
Symbol
IT(RMS)
ITSM
I ²t
dI/dt
VDSM/VRSM
IGM
PG(AV)
Tstg
Tj
Table 2.
Parameter
Tc = 90° C
TO-220AB Ins.
Tc = 75° C
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25° C)
F = 50 Hz
t = 20 ms
250
F = 60 Hz
t = 16.7 ms
260
I²t Value for fusing
tp = 10 ms
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns
F = 120 Hz
Non repetitive surge peak off-state
voltage
Peak gate current
A
340
A ²s
Tj = 125° C
50
A/µs
tp = 10 ms
Tj = 25° C
VDSM/VRSM
+ 100
V
tp = 20 µs
Tj = 125° C
4
A
Tj = 125° C
1
W
- 40 to + 150
- 40 to + 125
°C
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless™ and
Logic Level (3 quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W
Test Conditions
VD = 12 V RL = 33 Ω
VD = VDRM RL = 3.3 kΩ
Tj = 125° C
IH(2)
IT = 500 mA
IL
IG = 1.2 IGT
Unit
T2535
CW
BW
35
35
50
I - II - III
MAX.
I - II - III
MAX.
1.3
V
I - II - III
MIN.
0.2
V
MAX.
50
50
75
70
70
80
80
80
100
MAX.
II
mA
mA
mA
VD = 67 %VDRM gate open
Tj = 125° C
MIN.
500
500
1000
V/µs
Without snubber
Tj = 125° C
MIN.
13
13
22
A/ms
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
2/12
BTA/BTB
Quadrant
I - III
(dI/dt)c (2)
A
RD91 /
TOP3 Ins.
RMS on-state current (full sine wave)
VGD
dV/dt (2)
25
Tc = 100° C
T25
VGT
Unit
D2PAK /
TO-220AB
Symbol
IGT(1)
Value
BTA24, BTB24, BTA25, BTA26 and T25 series
Table 3.
Characteristics
Electrical characteristics (Tj = 25° C, unless otherwise specified),
Standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B
Symbol
IGT (1)
Test Conditions
VD = 12 V
Quadrant
RL = 33 Ω
VGT
VGD
VD = VDRM RL = 3.3 kΩ Tj = 125° C
IH(2))
IT = 500 mA
IL
IG = 1.2 IGT
(dV/dt)c
(2)
Unit
I - II - III - IV
MAX.
50
100
mA
ALL
MAX.
1.3
V
ALL
MIN.
0.2
V
MAX.
80
mA
I - III - IV
dV/dt(2)
Value
70
MAX.
II
mA
160
VD = 67 %VDRM gate open
Tj = 125° C
MIN.
500
V/µs
(dI/dt)c = 13.3 A/ms
Tj = 125° C
MIN.
10
V/µs
Value
Unit
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
Table 4.
Static characteristics
Symbol
Test Conditions
VT (1)
ITM = 35 A
Vt0 (1)
Rd
(1)
IDRM
IRRM
tp = 380 µs
Tj = 25° C
MAX.
1.55
V
Threshold voltage
Tj = 125° C
MAX.
0.85
V
Dynamic resistance
Tj = 125° C
MAX.
16
mΩ
5
µA
3
mA
Tj = 25° C
VDRM = VRRM
MAX.
Tj = 125° C
1. for both polarities of A2 referenced to A1.
Table 5.
Thermal resistance
Symbol
Rth(j-c)
Parameter
Junction to case (AC)
(1)
Rth(j-a)
Junction to ambient
S = 1 cm²
Value
D2PAK / TO-220AB
0.8
RD91 (Insulated) / TOP3 Insulated
1.1
TO-220AB Insulated
1.7
D2PAK
45
TOP3 Insulated
50
TO-220AB / TO-220AB Insulated
60
Unit
° C/W
° C/W
1. S = Copper surface under tab.
3/12
Characteristics
Figure 1.
BTA24, BTB24, BTA25, BTA26 and T25 series
Maximum power dissipation versus Figure 2.
RMS on-state current (full cycle)
P(W)
RMS on-state current versus case
temperature (full cycle)
IT(RMS)(A)
30
30
25
25
BTB / T25
BTA24
20
20
15
15
10
10
BTA25 / BTA26
5
5
TC(°C)
IT(RMS)(A)
0
0
0
5
10
15
20
0
25
25
D2PAK RMS on-state current versus Figure 4.
ambient temperature (printed
circuit board FR4, copper
thickness: 35µm) (full cycle)
Figure 3.
IT(RMS)(A)
50
75
100
125
Relative variation of thermal
impedance versus pulse
duration
K=[Zth/Rth]
4.0
1E+0
D2PAK
3.5
Zth(j-c)
(S=1cm2)
3.0
Zth(j-a)
BTA / BTB24 / T25
1E-1
2.5
2.0
1.5
1E-2
Zth(j-a)
BTA26
1.0
0.5
tp(s)
Tamb(°C)
1E-3
0.0
0
25
Figure 5.
50
75
100
1E-3
125
On-state characteristics
(maximum values)
Figure 6.
ITM(A)
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Surge peak on-state current
versus number of cycles
ITSM(A)
300
300
Tj max.
Vto = 0.85V
Rd = 16 mΩ
100
Tj = Tj max.
250
t=20ms
One cycle
200
Non repetitive
Tj initial=25°C
150
10
Repetitive
TC=75°C
Tj = 25°C.
100
50
1
0.5
4/12
Number of cycles
VTM(V)
1.0
1.5
2.0
2.5
0
3.0
3.5
4.0
4.5
1
10
100
1000
BTA24, BTB24, BTA25, BTA26 and T25 series
Figure 7.
Characteristics
Non-repetitive surge peak on-state Figure 8.
current for a sinusoidal pulse with
width tp < 10 ms and corresponding
value of I2t
2
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2
ITSM(A), I t (A s)
2.5
3000
Tj initial=25°C
dI/dt limitation:
50A/µs
2.0
IGT
1000
1.5
ITSM
I2t
IH & IL
1.0
0.5
Tj(°C)
tp(ms)
0.0
100
0.01
0.10
Figure 9.
1.00
-40
10.00
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
-20
0
20
40
60
80
100
120
140
Figure 10. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
6
2.4
2.2
5
2.0
1.8
4
1.6
T2535/CW/BW
1.4
3
B
1.2
2
1.0
0.8
1
0.6
(dV/dt)c (V/µs)
Tj(°C)
0.4
0
0.1
1.0
10.0
100.0
0
25
50
75
100
125
Figure 11. D2PAK Thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
Rth(j-a)(°C/W)
80
70
D2PAK
60
50
40
30
20
10
S(cm²)
0
0
4
8
12
16
20
24
28
32
36
40
5/12
Ordering information scheme
2
BTA24, BTB24, BTA25, BTA26 and T25 series
Ordering information scheme
Figure 12. BTA and BTB series
BT A 24 - 600 BW RG
Triac series
Insulation
A = insulated
B = non insulated
Current
24 = 25A in TO-220AB
25 = 25A in RD91
26 = 25A in TOP3
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard
CW = 35mA Snubberless
BW = 50mA Snubberless
Packing mode
RG = Tube
Figure 13. T25 series
T 25 35 - 600 G (-TR)
Triac series
Current
25 = 25A
Sensitivity
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
G = D2PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Table 6.
Product Selector
Voltage (xxx)
Part Numbers
Sensitivity
Type
Package
X
50 mA
Standard
TO-220AB
X
X
50 mA
Snubberless
TO-220AB
X
X
35 mA
Snubberless
TO-220AB
BTA25-xxxBRG
X
X
50 mA
Standard
RD91
BTA25-xxxBWRG
X
X
50 mA
Snubberless
RD91
BTA25-xxxCWRG
X
X
35 mA
Snubberless
RD91
BTA26-xxxBRG
X
X
50 mA
Standard
TOP3 Ins.
BTA26-xxxBWRG
X
X
50 mA
Snubberless
TOP3 Ins.
BTA26-xxxCWRG
X
X
35 mA
Snubberless
TOP3 Ins.
T2535-xxxG
X
X
35 mA
Snubberless
D2PAK
600 V
800 V
BTA24-xxxBRG
X
BTA/BTB(1)24-xxxBWRG
BTA/BTB(1)24-xxxCWRG
1. BTB: non insulated TO-220AB package
6/12
BTA24, BTB24, BTA25, BTA26 and T25 series
3
Package information
Package information
Table 7.
D2PAK Package dimensions
DIMENSIONS
REF.
Millimeters
Min.
A
E
C2
L2
D
L
L3
A1
B2
R
C
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.30
4.60
0.169
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.25
C
0.45
0.60
0.017
0.024
C2
1.21
1.36
0.047
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28
0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
1.40
0.048 0.055
B
G
A2
2mm min.
FLAT ZONE
V2
R
V2
0.40
0°
0.016
8°
0°
8°
Figure 14. D2PAK Foot Print Dimensions (in millimeters)
16.90
10.30
5.08
1.30
8.90
3.70
7/12
Package information
Table 8.
BTA24, BTB24, BTA25, BTA26 and T25 series
RD91 Package dimensions
DIMENSIONS
REF.
Millimeters
Min.
A
A2
L1
L2
A1
B2
Min.
40.00
29.90
30.30
Max.
1.575
1.177
1.193
A2
22.00
0.867
B
27.00
1.063
B1
C
B1
C2
C1
A1
N1
N2
B
F
E3
I
A
8/12
Max.
Inches
13.50
16.50
0.531
0.650
B2
24.00
0.945
C
14.00
0.551
C1
3.50
0.138
C2
1.95
3.00
0.077
0.118
E3
0.70
0.90
0.027
0.035
F
4.00
4.50
0.157
0.177
I
11.20
13.60
0.441
0.535
L1
3.10
3.50
0.122
0.138
L2
1.70
1.90
0.067
0.075
N1
33°
43°
33°
43°
N2
28°
38°
28°
38°
BTA24, BTB24, BTA25, BTA26 and T25 series
Table 9.
Package information
TOP3 Insulated package dimensions
DIMENSIONS
REF.
Millimeters
Min.
H
R
A
B
ØL
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.4
4.6
0.173
0.181
B
1.45
1.55 0.057
0.061
C
14.35
15.60 0.565
0.614
D
0.5
0.7
0.020
0.028
E
2.7
2.9
0.106
0.114
F
15.8
16.5 0.622
0.650
G
20.4
21.1 0.815
0.831
H
15.1
15.5 0.594
0.610
J
5.4
5.65 0.213
0.222
K
3.4
3.65 0.134
0.144
ØL
4.08
4.17 0.161
0.164
P
1.20
1.40 0.047
0.055
K
F
P
G
C
J
J
D
E
R
4.60
0.181
9/12
Package information
Table 10.
BTA24, BTB24, BTA25, BTA26 and T25 series
TO-220AB (Insulated and non-insulated) Package dimensions
DIMENSIONS
REF.
Millimeters
Min.
A
15.20
a1
C
B
ØI
b2
Typ.
Max.
Inches
Min.
Typ.
15.90 0.598
3.75
Max.
0.625
0.147
a2
13.00
14.00 0.511
0.551
B
10.00
10.40 0.393
0.409
b1
0.61
0.88
0.024
0.034
b2
1.23
1.32
0.048
0.051
C
4.40
4.60
0.173
0.181
c1
0.49
0.70
0.019
0.027
c2
2.40
2.72
0.094
0.107
e
2.40
2.70
0.094
0.106
F
6.20
6.60
0.244
0.259
ØI
3.75
3.85
0.147
0.151
I4
15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
2.95
0.104
0.116
l2
1.14
1.70
0.044
0.066
l3
1.14
1.70
0.044
0.066
L
F
A
I4
l3
c2
a1
l2
a2
M
b1
c1
e
M
2.60
0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
10/12
BTA24, BTB24, BTA25, BTA26 and T25 series
4
Ordering information
Ordering information
Ordering type
Marking
Package
Weight
BTA/BTB24-xxxyyzRG
BTA/BTB24xxxyyz
TO-220AB
2.3 g
50
Tube
BTA25-xxxyyzRG
BTA25-xxxyyz
RD91
20 g
25
Bulk
BTA26-xxxyzRG
BTA26-xxxyyz
TOP3 Ins.
4.5 g
30
Tube
T2535-xxxG
T2535xxxG
D2PAK
50
Tube
1.5 g
1000
Tape and reel
T2535-xxxG-TR
T2535xxxG
Base qty Delivery mode
Note: xxx = voltage, yy = sensitivity, z = type
5
Revision History
Date
Revision
Description of Changes
Oct-2002
6A
13-Feb-2006
7
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
31-May-2006
8
Reformatted to current standard. Tc in figure 3 changed
to Tamb
31-Jul-2006
9
Typing error corrected on page 1 (BTB124 instead of
BTB24)
Previous update.
11/12
BTA24, BTB24, BTA25, BTA26 and T25 series
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