Rohm BU45L472 Counter timer built-in cmos voltage detector ic Datasheet

Datasheet
Voltage Detector IC Series
Counter Timer Built-in
CMOS Voltage Detector IC
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
Key Specifications
Detection voltage:
●General Description
ROHM’s BU45xxxxx and BU46xxxxx series are highly
accurate, low current consumption voltage detector IC
series. Because the counter timer delay circuit is built-in,
an external capacitor for the delay time setting is
unnecessary. Two output types are available (Nch open
drain and CMOS output) and detection voltages range
from 2.3V to 4.8V in increments of 0.1V with fixed delay
time of 200ms and 400ms, that may be selected
according to application.
●Features
Counter Timer Built-in
No delay time setting capacitor required
Low current consumption
Two output types (Nch open drain and CMOS output)
Package SSOP3 is similar to SOT-23-3 (JEDEC)
2.3V to 4.8V (Typ.)
0.1V steps
High accuracy detection voltage:
±1.0%
Low current consumption:
2.3µA (Typ.)
Operating temperature range:
-40°C to +105°C
Two internal, fixed delay time:
200ms
400ms
●Package
SSOP3
2.92mm x 2.80mm x 1.25mm
●Applications
Circuits using microcontrollers or logic circuits that require
a reset
●Typical Application Circuit
V DD1
V DD1
V DD2
RL
BU45 x x x xx
R ST
Micro
controller
BD46 xx x xx
R ST
CL
CL
(Noise-filtering
Capacitor)
(Noise-filtering
Capacitor)
GND
Micro
controller
GND
(Open Drain Output Type)
BU45xxxxx series
(CMOS Output Type)
BU46xxxxx series
●Pin Descriptions
●Connection Diagram
BU45KxxxG / BU46KxxxG
SSOP3
GND
VDD
3
3
GND
2
VOUT
BU45Kxxx
xxxG
xxx
BU46Kxxx
xxxG
xxx
Symbol
Function
1
GND
GND
2
VOUT
Reset Output
3
VDD
Power Supply Voltage
BU45LxxxG / BU46LxxxG
TOP VIEW
1
PIN No.
1
2
VOUT
VDD
BU45Lxxx
xxxG
xxx
BU46Lxxx
xxxG
xxx
PIN No.
Symbol
Function
1
VOUT
Reset Output
2
VDD
Power Supply Voltage
3
GND
GND
○Product structure:Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays.
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TSZ02201-0R7R0G300130-1-2
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Ordering Information
B
U
Part
Number
x
x
Output Type
45 : Open Drain
46 : CMOS
x
x
Package 1
x
Reset Voltage Value
23 : 2.3V
0.1V step
48 : 4.8V
x
x
-
Counter Timer
Package 2
Delay Time Settings
2 : 200ms
4 : 400ms
T
L
Packaging and
forming specification
TL : Embossed tape
and reel
Package 1 Package 2 Package name
K
G
SSOP3 (1pin GND)
L
G
SSOP3 (3pin GND)
●Lineup
Table 1. Open Drain Output Type
Counter Timer Delay Time Settings
1-Pin GND
200ms
Detection
Part
Marking
Voltage
Number
BU45K482
4.8V
bH
BU45K472
4.7V
bG
BU45K462
4.6V
bF
BU45K452
4.5V
bE
BU45K442
4.4V
bD
BU45K432
4.3V
bC
BU45K422
4.2V
bB
BU45K412
4.1V
bA
BU45K402
4.0V
aY
BU45K392
3.9V
aX
BU45K382
3.8V
aW
BU45K372
3.7V
aT
BU45K362
3.6V
aS
BU45K352
3.5V
aR
BU45K342
3.4V
aP
BU45K332
3.3V
aN
BU45K322
3.2V
aM
BU45K312
3.1V
aK
BU45K302
3.0V
aH
BU45K292
2.9V
aG
BU45K282
2.8V
aF
BU45K272
2.7V
aE
BU45K262
2.6V
aD
BU45K252
2.5V
aC
BU45K242
2.4V
aB
BU45K232
2.3V
aA
3-Pin GND
400ms
Marking
eF
eE
eD
eC
eB
eA
dY
dX
dW
dT
dS
dR
dP
dN
dM
dK
dH
dG
dF
dE
dD
dC
dB
dA
cY
cX
200ms
Part
Number
BU45K484
BU45K474
BU45K464
BU45K454
BU45K444
BU45K434
BU45K424
BU45K414
BU45K404
BU45K394
BU45K384
BU45K374
BU45K364
BU45K354
BU45K344
BU45K334
BU45K324
BU45K314
BU45K304
BU45K294
BU45K284
BU45K274
BU45K264
BU45K254
BU45K244
BU45K234
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Marking
hD
hC
hB
hA
gY
gX
gW
gT
gS
gR
gP
gN
gM
gK
gH
gG
gF
gE
gD
gC
gB
gA
fY
fX
fW
fT
400ms
Part
Number
BU45L482
BU45L472
BU45L462
BU45L452
BU45L442
BU45L432
BU45L422
BU45L412
BU45L402
BU45L392
BU45L382
BU45L372
BU45L362
BU45L352
BU45L342
BU45L332
BU45L322
BU45L312
BU45L302
BU45L292
BU45L282
BU45L272
BU45L262
BU45L252
BU45L242
BU45L232
Marking
nB
nA
mY
mX
mW
mT
mS
mR
mP
mN
mM
mK
mH
mG
mF
mE
mD
mC
mB
mA
kY
kX
kW
kT
kS
kR
Part
Number
BU45L484
BU45L474
BU45L464
BU45L454
BU45L444
BU45L434
BU45L424
BU45L414
BU45L404
BU45L394
BU45L384
BU45L374
BU45L364
BU45L354
BU45L344
BU45L334
BU45L324
BU45L314
BU45L304
BU45L294
BU45L284
BU45L274
BU45L264
BU45L254
BU45L244
BU45L234
TSZ02201-0R7R0G300130-1-2
17.May.2013 Rev.003
Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Lineup - Continued
Table 2. CMOS Output Type
Counter Timer Delay Time Settings
1-Pin GND
200ms
Detection
Part
Marking
Voltage
Number
BU46K482
4.8V
cW
BU46K472
4.7V
cT
BU46K462
4.6V
cS
BU46K452
4.5V
cR
BU46K442
4.4V
cP
BU46K432
4.3V
cN
BU46K422
4.2V
cM
BU46K412
4.1V
cK
BU46K402
4.0V
cH
BU46K392
3.9V
cG
BU46K382
3.8V
cF
BU46K372
3.7V
cE
BU46K362
3.6V
cD
BU46K352
3.5V
cC
BU46K342
3.4V
cB
BU46K332
3.3V
cA
BU46K322
3.2V
bY
BU46K312
3.1V
bX
BU46K302
3.0V
bW
BU46K292
2.9V
bT
BU46K282
2.8V
bS
BU46K272
2.7V
bR
BU46K262
2.6V
bP
BU46K252
2.5V
bN
BU46K242
2.4V
bM
BU46K232
2.3V
bK
3-Pin GND
400ms
Marking
fS
fR
fP
fN
fM
fK
fH
fG
fF
fE
fD
fC
fB
fA
eY
eX
eW
eT
eS
eR
eP
eN
eM
eK
eH
eG
Part
Number
BU46K484
BU46K474
BU46K464
BU46K454
BU46K444
BU46K434
BU46K424
BU46K414
BU46K404
BU46K394
BU46K384
BU46K374
BU46K364
BU46K354
BU46K344
BU46K334
BU46K324
BU46K314
BU46K304
BU46K294
BU46K284
BU46K274
BU46K264
BU46K254
BU46K244
BU46K234
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200ms
Marking
kP
kN
kM
kK
kH
kG
kF
kE
kD
kC
kB
kA
hY
hX
hW
hT
hS
hR
hP
hN
hM
hK
hH
hG
hF
hE
400ms
Part
Number
BU46L482
BU46L472
BU46L462
BU46L452
BU46L442
BU46L432
BU46L422
BU46L412
BU46L402
BU46L392
BU46L382
BU46L372
BU46L362
BU46L352
BU46L342
BU46L332
BU46L322
BU46L312
BU46L302
BU46L292
BU46L282
BU46L272
BU46L262
BU46L252
BU46L242
BU46L232
Marking
pM
pK
pH
pG
pF
pE
pD
pC
pB
pA
nY
nX
nW
nT
nS
nR
nP
nN
nM
nK
nH
nG
nF
nE
nD
nC
Part
Number
BU46L484
BU46L474
BU46L464
BU46L454
BU46L444
BU46L434
BU46L424
BU46L414
BU46L404
BU46L394
BU46L384
BU46L374
BU46L364
BU45L354
BU46L344
BU46L334
BU46L324
BU46L314
BU46L304
BU46L294
BU46L284
BU46L274
BU46L264
BU46L254
BU46L244
BU46L234
TSZ02201-0R7R0G300130-1-2
17.May.2013 Rev.003
Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
Absolute maximum ratings (Ta=25°C)
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
Output Current
*1 *2
Power Dissipation
Operating Temperature
Ambient Storage Temperature
Symbol
VDD-GND
VOUT
Io
Pd
Topr
Tstg
Limit
-0.3 to +6.0
GND-0.3 to +6.0
GND-0.3 to VDD+0.3
70
700
-40 to +105
-55 to +125
Unit
V
V
mA
mW
°C
°C
*1 Use above Ta=25°C results in a 7.0mW loss per degree.
*2 When mounted on ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board).
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter
Operating Voltage Range
Symbol
VOPL
Condition
VOL≤0.4V, RL=470kΩ, Ta=25~105°C
VOL≤0.4V, RL=470kΩ, Ta=-40~25°C
*1
VDD=H L, RL=470kΩ
Ta=25°C
VDET=2.5V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=25°C
VDET=3.0V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Detection Voltage
VDET
Ta=25°C
VDET=3.3V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=25°C
VDET=4.2V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=25°C
VDET=4.8V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Detection Voltage
Temperature coefficient
VDET/∆T -40°C~105°C
Min.
0.6
0.9
VDET(T)
×0.99
2.475
2.418
2.404
2.970
2.901
2.885
3.267
3.191
3.173
4.158
4.061
4.039
4.752
4.641
4.616
-
‘High’ Output
Delay time
tPLH
Circuit Current when ON
Circuit Current when OFF
IDD1
IDD2
VDET(T)
×0.03
120
Ta=25°C
95
Ta=-40°C
to
85°C
BU4XXXX2G
CL=100pF,
85
Ta=85°C to 105°C
RL=100kΩ
*1,*2,* 3
240
Ta=25°C
190
BU4XXXX4G Ta=-40°C to 85°C
170
Ta=85°C to 105°C
0.60
VDD=VDET-0.2V, VDET=2.3V~4.8V
1.10
VDD=VDET+1.0V, VDET=2.3V~4.8V
‘High’ Output Voltage (Pch)
VOH
VDD=5.0V, ISOURCE= 6.8mA, VDET(4.3V to 4.8V)
‘Low’Output Voltage (Nch)
VOL
Hysteresis Voltage
Leak Current when OFF
∆VDET
Ileak
VDD=L H L, RL=470kΩ
Limit
Typ.
-
Unit
2.5
3.0
3.3
4.2
4.8
-
Max.
6.0
6.0
VDET(T)
×1.01
2.525
2.584
2.597
3.030
3.100
3.117
3.333
3.410
3.428
4.242
4.341
4.364
4.848
4.961
4.987
±50
±360
VDET(T)
×0.05
200
400
2.30
2.80
VDET(T)
×0.08
280
460
235
560
920
470
7.00
8.00
ms
-
V
VDET(T)
VDD-0.5
V
V
ppm/°C
V
µA
µA
VDD=1.2V, ISINK = 2.0mA
-
-
0.3
V
VDD=2.4V, ISINK = 8.5mA, VDET(2.7V to 4.8V)
-
-
0.3
V
-
-
1.0
µA
*1
VDD=VDS=6.0V
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)
RL :Pull-up resistor to be connected between VOUT and power supply.
CL :Capacitor to be connected between VOUT and GND.
*1 Guarantee is Ta=25°C.
*2 tPLH:VDD=(VDET(T)-0.5V) (VDET(T)+0.5V)
*3 tPLH:VDD=Please set up the rise up time between VDD=VOPL VDET more than 10µs.
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Block Diagrams
VDD
Oscillator
VOUT
Circuit Counter
Timer
Vref
GND
Fig.1 BU45xxxxx Series
VDD
Oscillator
Circuit Counter
Timer
Vref
VOUT
GND
Fig.2 BU46xxxxx Series
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TSZ02201-0R7R0G300130-1-2
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Typical Performance Curves
16
6
CIRCUIT CURRENT:IDD[µA]
5
【BU45K232G】
"LOW" OUTPUT CURRENT:IOL[mA]
Ta=-40°C
Ta=105°C
4
3
2
Ta=25°C
Ta=-40°C
1
14
【BU45K232G】
12
10
8
Ta=25°C
6
Ta=105°C
4
2
0
0
0
1
2
3
4
5
6
0
7
2
3
4
5
6
VDD SUPPLY VOLTAGE:VDD[V]
DRAIN-SOURCE VOLTAGE:VDS[V]
Fig.3 Circuit Current
Fig.4 “Low” Output Current
VDD=1.2V
50
7
8
【BU45K232G】
【BU46K232G】
40
OUTPUT VOLTAGE:VOUT[V]
7
"HIGH" OUTPUT CURRENT:IOH(mA)
1
Ta=-40°C
30
Ta=25°C
20
Ta=105°C
10
Ta=25°C
6
Ta=-40°C
5
Ta=105°C
4
3
2
1
0
0
0
1
2
3
4
0
5
2
3
4
5
6
DRAIN-SOURCE VOLTAGE:VDS[V]
VDD SUPPLY VOLTAGE:VDD [V]
Fig.5 “HIGH” Output Current
VDD=6V
Fig.6 I/O Characteristics
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TSZ02201-0R7R0G300130-1-2
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Typical Performance Curves - Continued
3.0
2.6
CIRCUIT CURRENT WHEN ON : IDD1 [µA]
DETECTION VOLTAGE:VOUT[V]
[BU45K232G]
2.5
Low to high(V DET +∆V DET )
2.4
2.3
High to low(V DET )
2.2
2.1
2.8
【BU45K232G】
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
-40
-20
0
20
40
60
80
100
-40
-20
TEMPERATURE:Ta[°C]
20
40
60
80
100
TEMPERATURE:Ta[°C]
Fig.8 Circuit Current when ON
(VDD=VDET-0.2V)
VDD=2.1V
Fig.7 Detection Voltage
Release Voltage
0.6
3.5
【BU45K232G】
3.3
MINIMUM OPERATING VOLTAGE:V OPL [V]
CIRCUIT CURRENT WHEN OFF:I DD 2 [uA]
0
3.1
2.9
2.7
2.5
2.3
2.1
1.9
1.7
1.5
【BU45K232G】
0.5
0.4
0.3
0.2
0.1
0
-40
-20
0
20
40
60
80
100
TEMPERATURE:Ta[°C]
-20
0
20
40
60
80
100
TEMPERATURE:Ta[°C]
Fig.10 Operating Limit Voltage
Fig.9 Circuit Current when OFF
(VDD=VDET+1V)
VDD=3.3V
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TSZ02201-0R7R0G300130-1-2
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Typical Performance Curves - Continued
300
3
【BU45K232G】
【BU45K232G】
260
"LOW" DELAY TIME:TPHL[µs]
"HIGH" DELAY TIME:TPLH [ms]
280
240
220
200
180
160
140
120
100
2
1
0
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
TEMPERATURE:Ta[°C]
TEMPERATURE:Ta[°C]
Fig.11 Output Delay Time
“Low” ”High”
Fig.12 Output Delay Time
“High” ”Low”
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80
100
TSZ02201-0R7R0G300130-1-2
17.May.2013 Rev.003
Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Application Information
Explanation of Operation
For both the open drain type (Fig.13) and the CMOS output type (Fig.14), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU45xxxxx series uses an open drain
output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage
(VOUT) in this case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
R1
R1
Vref
Q2
Vref
Reset
VOUT
Oscillator
Oscillator
Circuit Counter
R2
R2
Timer
Reset
Circuit Counter
Timer
Q1
R3
Q1
R3
GND
VOUT
GND
Fig.13 (BU45xxxxx Type Internal Block Diagram)
Fig.14 (BU46xxxxx Type Internal Block Diagram)
Reference Data
Examples of Leading (tPLH) and Falling (tPHL) Output
tPLH[ms]
208
208
VDD=1.8V 2.8V
Part Number
BU45K232G
BU46K232G
tPHL[µs]
1.4
1.4
VDD=2.8V 1.8V
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveform
Example: The following shows the relationship between the input voltages VDD and the output voltage VOUT when the input
power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 13 and 14).
1
VDD
VDD
VDET+ΔVDET
VDET
0V
VOPL
⑤
VOH
tPLH
tPLH
VOUT
tPHL
VOL
tPHL
①
②
③
Fig.15
④
Timing Waveform
When the power supply is turned on, the output is unstable from
after over the operating limit voltage (VOPL) until tPHL. Therefore it is
possible that the reset signal is not outputted when the rise time of
VDD is faster than tPHL.
2 When V
DD is greater than VOPL but less than the reset release
voltage (VDET + ∆VDET), the output voltages will switch to Low.
3 If V
DD exceeds the reset release voltage (VDET + ∆VDET), the
counter timer start and VOUT switches from L to H.
4 If V
DD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply fluctuation,
VOUT switches to L (with a delay of tPHL).
5 The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not toggle with power
supply fluctuations within this hysteresis width, thus, preventing
malfunctions due to noise.
Timing may change depending on application and use. Please verify and confirm using practical applications.
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TSZ02201-0R7R0G300130-1-2
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Circuit Applications
1. Examples of a common power supply detection reset circuit.
VDD1
Application examples of BU45xxxxx series (Open Drain
output type) and BU46xxxxx series (CMOS output type)
are shown below.
VDD2
RL
BU45xxxxx
RST
Micro
controller
CASE1: Power supply of microcontroller (VDD2) differs
from the power supply of the reset detection (VDD1).
Use an open drain output Type (BU45xxxxx series)
device with a load resistance RL as shown Fig.16.
CL
(Noise-filtering
Capacitor)
GND
Fig.16 Open Drain Output Type
CASE2: Power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BU46xxxxx) device or an open
drain output type (BU45xxxxx) with pull up resistor
between the output and VDD1. (As shown Fig.17)
VDD1
BU46xxxxx
RST
Micro
controller
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform of
the rise and fall of the output voltage (VOUT).
CL
(Noise-filtering
Capacitor)
GND
Fig.17 CMOS Output Type
2. The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BU45xxxxx
BU45xxxxx
RST Micro
controller
GND
Fig. 18
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BU45xxxxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the
microcontroller (VDD3) as shown in Fig. 18. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is
possible.
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
Examples of the power supply with resistor dividers.
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow
may cause malfunction in the systems operation such as output oscillations, etc.
V1
R2
I1
VDD
BU45xxxxx
BU46xxxxx
R1
CIN
VOUT
CL
GND
Fig. 19
When an in-rush current (I1) flows into the circuit (Refer to Fig. 19) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
IDD
In-rush Current
0
VDD
VDET
Fig. 20 Current Consumption vs. Power Supply Voltage
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Datasheet
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
●Operational Notes
1) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
GND Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that
no pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4)
Bypass Capacitor for Noise Rejection
To help reject noise, put a 1uF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5)
Short Between Pins and Mounting Errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6)
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7)
The VDD line impedance might cause oscillation because of the detection current.
8)
A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9)
A VDD lower than the mininum input voltage puts the VOUT in high impedance state.
VOUT must be pulled up to VDD.
10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is
assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the
assumed leak resistance.
11) External parameters
The recommended parameter range for RL is 50kΩ to 470kΩ. There are many factors (board layout, etc) that can
affect characteristics. Please verify and confirm using practical applications.
12) Power on reset operation
Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.
13) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
14) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal logic may be unstable. Therefore, give special consideration to power coupling
capacitance, power wiring, width of GND wiring, and routing of connections.
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BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
Datasheet
●Physical Dimension, Tape and Reel Information
Package Name
SSOP3F
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BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series
Datasheet
●Revision History
Date
Revision
24.Jan.2013
13.Feb.2013
001
002
17.May.2013
003
Changes
New Release
Change max limit of IDD1 and IDD2.
Change max limit of IDD1 and IDD2.
Change min and max limits of TPLH. Add rows to the table of Electrical
Characteristics.
Change max limit of Leak Current when OFF
Modify the sentence structure in General Description and Operational Notes.
Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
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2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
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Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
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