Rohm BU6568GVW-E2 Camera image processors compatible with jpeg image Datasheet

For Home Electronics and Security Devices Camera Image Processor Series
Camera Image Processors
Compatible with JPEG Image
BU6566GVW, BU6568GV
No.09061JET02
●Description
BU6566GVW/BU6568GV is a camera image processor compatible with standard JPEG.
Pin-to-Pin compatibility enable support for both standard and high-resolution cameras.
●Features
1) Built-in Camera Module Interface
VGA size (640×480)/BU6566GVW, SXGA size (1280×1024)/BU6568GV for input of image data up to 15 fps (zooming
function is available).
Input data format for YUV=4:2:2, RGB=4:4:4.
Filter processing (image processing) to input images (2 gradations / gray scale / sepia / emboss / edge enhancement/
negative).
Multi-step size reduction down to 1/8 (BU6566GVW), 1/16 (BU6568GV) in X- and Y-direction possible.
Cutting out into an arbitrary size after resizing.
D range enlargement processing of Y (brightness) available in YUV color space to cut images.
Cut images to be stored into an arbitrary position in frame memory in YUV=4:2:2 format.
2-line serial interface built in for camera module control.
2) Built-in frame memory / JPEG code memory
Image frame memory built in (80KB for storing 1 frame of 176x232 @16 bits/pixel).
Display area settable to an arbitrary LCD size.
Data to be stored into image frame memory in YUV=4:2:2 format.
Mask data to be stored into mask frame memory in 1bit/2pixels in YUV=4:2:2 format.
An arbitrary position of frame memory to be updated to camera image according to mask memory.
Image frame memory accessible from HOST CPU (access available both in RGB and YUV).
Rectangular writing function and rectangular reading function for transparent color to image frame memory.
Frame memory usable as JPEG code memory (80KB) to store JPEG compressed images.
Frame memory usable as a ring buffer for JPEG code of 80KB or more.
3) Built-in LCD controller interface
Built-in input/output interface to LCD controller
For display colors of 262144 colors / 65536 colors / 4096 colors.
Up to 2 LCD module controllers controllable.
Arbitrary rectangular selection in frame memory to be transferred to LCD controller.
4) Built-in JPEG CODEC
ISO/IEC10918 conforming base line method.
・Compression
For YUV=4:2:2 only.
Quantization table selectable from 20 built-in tables.
・Decompression
For YUV=4:4:4, 4:2:2(horizontal sub-sampling:BU6566GVW),
4:2:0, 4:1:1(horizontal sub-sampling:BU6566GVW), and gray scale.
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© 2009 ROHM Co., Ltd. All rights reserved.
1/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
5) Built-in HOST CPU interface
For 8-bit/16-bit bus interface in parallel interface.
Read/ write access to frame memory.
Read/ write access to internal registers (Indirect access with a index register as the address).
Read/ write access to the LCD controller: Parallel/Serial (Direct access available via the LCD interface).
6) Extended overlay function
Supporting overlay of icon-data/font-data of up to two points during LCD data transfer.
Both icon-data and font-data corresponding to 65536 display colors. Possible to setting transparent colors.
7) LED interface, GIO function
Built-in PWM output of 4 systems for 3 color LED controls and white LED control.
7 GIO's in total available for the GIO function.
8) Clock generation, power management function
Oscillation circuit configuration by XIN and XOUT terminals, or clock input from XIN terminal available.
Built-in PLL in BU6568GV.
Clock control of IC inside in unit of block (suspend mode available).
9) Key interfaces built in
3 systems of key interfaces built in. Interruption to be generated at key input.
Useable for removing software chattering.
*Data is prepared separately about each register setup. Please refer to the Development Scheme on page 14.
System 1 (VDDIO1)
P3-P4(D15-14),P6-P11(D13-8),
P14-P18(D7-0),P23(A2),
P28-P31(A1,CSB,WRB,RDB),
P97-P98(XOUT,XIN),P33(INT*1)
System 2 (VDDIO2)
P34-P44(CAMVS, CAMHS, CAMD0-3, GIO2, CAMD4-7), P46(CAMCKI), P48(CAMCKO),
P53-P65(SDA, SDC, LEDCNT, PWM1-3, VD, LCDCS1B, LCDCS2B, KEY0, LCDWRB,
LCDRDB, LCDA0)
P67-P69(LCDD0-2), P71-P72(LCDD3-4)
P78-P87(LCDD5-7, TEST, X16_8, LCDD8-12), P89-P94(KEY1, LCDD13-15,
RESETB, PWM0)
*1; P33 (INT) terminal is the power source system of VDDIO2 in BU6568GV.
●Application
Security camera, Intercom with camera, Drive recorder, and Web camera etc.
●Lineup
Power source
Parameter
voltage
Camera
Host CPU
LCD
IO1:HOSTI/F
interface
interface
interface
Codec
[Image]
Multimedia
interface
Package
IO2:Camera, LCD
Supported up to
BU6566GVW
1.45-1.55V(VDDCore)
1.70-3.15V(VDDIO1)
BU6568GV
2.70-3.15V(VDDIO2)
0.3M pixels.
(640×480)
Supported up to
1.3M pixels.
0.3M pixels JPEG Codec
8bit/16bit bus
80
systems
CPU Interface
Supported up to
QCIF+(232×176)
Motion-JPEG
1.3M pixels JPEG Codec
Motion-JPEG
(1280×1024)
SBGA099W070
SBGA099T070
*Although QCIF+ is 220x176 pixels, it is supported to 232x176 pixels by effective use of memory in ROHM products.
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
2/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
●Absolute maximum ratings
Parameter
●Recommended operating range
(Ta=25℃)
Symbol
Rating
Unit
VDDIO1
-0.3~+4.2
V
VDDIO2
-0.3~+4.2
V
VDD
-0.3~+2.1
V
Other terminals
-
-0.3~VDDIO+0.3
V
Storage
temperature range
Tstg
-40~+150
℃
Power dissipation
PD
410
mW
Applied power
source voltage 1
Applied power
source voltage 2
Applied power
source voltage 3
Parameter
Symbol
Rating
Unit
VDDIO1
1.70~3.15(Typ:1.80V)
V
VDDIO2
2.70~3.15(Typ:2.85V)
V
VDD
1.45~1.55(Typ:1.50V)
V
Input voltage range
VIN
0~VDDIO
V
Operating
temperature range
Topr
-30~+85
℃
Applied power
source voltage 1
Applied power
source voltage 2
Applied power
source voltage 3
*Please supply power source in order of VDD→VDDIO1→VDDIO2.
*In the case exceeding 25ºC, 4.1mW should be reduced at the rating 1ºC.
●Electric characteristics
(Unless otherwise specified, Ta=25℃,VDD=1.50V,VDDIO=2.85V, fin=30.0MHz,fSYS=30.0MHz/BU6566GVW
fin=13.0MHz ,fSYS=52.0MHz (using PLL)/BU6568GV)
Limits
Parameter
Symbol
Unit
Condition
MIN.
TYP.
MAX.
BU6566GVW XIN
30.0
Input frequency
fIN
MHz
/30.0
BU6568GV
XIN (Duty 50±5%), at PLL OFF
BU6566GVW
Internal
30.0
fSYS
MHz
Internal SCLK frequency
operating frequency
/52.0
BU6568GV
BU6566GVW At camera ON, LCD display ON
Operating
6.4
IDD
mA
consumption current
/15
BU6568GV
At viewer operating
BU6566GVW
Static consumption
50
IDDst
μA
At suspend mode setting
current
/100
BU6568GV
Input "H" current 1
IIH1
-10
-
10
μA
VIH=VDDIO
Input "H" current 2
IIH2
25
50
100
μA
Pull-Down terminal, VIH=VDDIO
Input "H" current 3
IIH3
-10
-
10
μA
Pull-Up terminal, VIH=VDDIO
Input "L" current 1
IIL1
-10
-
10
μA
VIL=GND
Input "L" current 2
IIL2
-10
-
10
μA
Pull-Down terminal, VIL=GND
Input "L" current 3
IIL3
-80
VIH1
Input "L" voltage 1
VIL1
-0.3
-
Pull-Up terminal, VIL=GND
Normal input (including input mode of I/O
terminal)
Normal input (including input mode of I/O
terminal)
Input "H" voltage 2
VIH2
VDDIO
×0.85
-
Input "L" voltage 2
VIL2
-0.3
-
-25
VDDIO
+0.3
VDDIO
×0.2
VDDIO
+0.3
VDDIO
×0.15
μA
Input "H" voltage1
-160
VDDIO
×0.8
Hysteresis
width
Vhys
-
0.9
/0.6
-
V
Output "H" voltage 1
VOH1
VDDIO
-0.4
-
VDDIO
V
Output "L" voltage 1
VOL1
0.0
-
0.4
V
voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
-
V
V
V
Hysteresis input
V
Hysteresis input
3/16
BU6566GVW
BU6568GV
Hysteresis input
IOH1=-1.0mA(DC)
(Including output mode of I/O terminal)
IOL1=1.0mA(DC)
(Including output mode of I/O terminal)
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
●Block Diagram
HOST CPU
interface
LCD Control
display data
HOST CPU I/F
Register Array
LCD
Controller
I/F
YUV=4:2:2
RGB=5:6:5
RGB⇔YUV
Color space conversion
Camera
interface
YUV=4:2:2
Multi-step
zooming
YUV=4:4:4
MEMORY I/F
Image processing
(filtering)
JPEG
Codec
Cutting size
For LCD display
data
For JPEG
compression data
80KB
Brightness Component
Changing D-range
Frame buffer
camera image
storage status
interruption
YUV=4:2:2
Camera control
2-line type serial
2-line serial
control
General purpose
input / output
Clock control
Power down
control
KEY input
control
Interruption
to HOST CPU
: INT
PWM control
GIO
PWM control
XIN,XOUT
RESETB
●Recommended Application Circuit
CAMCKO
CAMVS
Camera
module
CAMD[7:0]
SDC
A2
A1
Host
D[15:0]
SDA
LCDA0
A2
MAIN LCD
LCDD[15:0]
A1
LCDWRB
D[15:0]
BU6566GVW
CPU
RESETB
CAMCKI
CAMHS
LCDCS1B
LCDCS2B
OE
RDB
WE
WRB
CS
CSB
/BU6568GV
VD
RESETB
PWM3
PWM2
PWM1
PWM0
SUB
LCD
LED driver
*Data is prepared separately about each register setup. Please refer to the Development Scheme on page 14.
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© 2009 ROHM Co., Ltd. All rights reserved.
4/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
●Terminal functions
PIN
No.
Land
No.
PIN Name
In
/Out
Active
Level
Init
Function explanation
1
A1
N.C.
-
-
-
-
2
B2
VDDIO1
-
PWR
-
D15/HOST_MODE
In/Out
DATA
IN *1
Switch parallel / Serial of HOST I/F (BU6566GVW
D15/EXGIO7
In/Out
DATA
IN *1
Host data bus bit 15
In/Out
DATA
IN *1
Host data bus bit 14
-
-
-
Digital I/O power source (system 1)
I/O type
I/O
type
BU6566GV
BU6568G
W
V
-
-
-
-
-
-
Function
division
F*3
-
-
H
HOST IF
F
H
-
-
-
3
B1
4
C2
D14/EXGIO6
5
C1
N.C.
6
D3
D13/EXGIO5
In/Out
DATA
IN *1
Host data bus bit 13
HOST IF
F
H
7
D2
D12/EXGIO4
In/Out
DATA
IN *1
Host data bus bit 12
HOST IF
F
H
8
D1
D11/EXGIO3
In/Out
DATA
IN *1
Host data bus bit 11
HOST IF
F
H
9
E1
D10/EXGIO2
In/Out
DATA
IN *1
Host data bus bit 10
HOST IF
F
H
10
E2
D9/EXGIO1
In/Out
DATA
IN *1
Host data bus bit 9
HOST IF
F
H
11
E3
D8/EXGIO0
In/Out
DATA
IN *1
Host data bus bit 8
HOST IF
F
H
12
E4
GND
-
GND
-
Common ground
-
-
-
13
F5
VDD
-
PWR
-
Digital core power source
-
-
-
14
F4
D7
In/Out
DATA
IN *1
Host data bus bit 7
HOST IF
E
G
15
F3
D6
In/Out
DATA
IN *1
Host data bus bit 6
HOST IF
E
G
16
F2
D5
In/Out
DATA
IN *1
Host data bus bit 5
HOST IF
E
G
17
F1
D4
In/Out
DATA
IN *1
Host data bus bit 4
HOST IF
E
G
18
G1
D3
In/Out
DATA
IN *1
Host data bus bit 3
HOST IF
E
G
19
G2
D2
In/Out
DATA
IN *1
Host data bus bit 2
HOST IF
E
G
E
-
-
G
E
-
-
G
20
G3
D1/SIF_RD
In/Out
DATA
IN *1
D1
In/Out
DATA
IN *1
D0/SIF/WD
In/Out
DATA
IN *1
D0
In/Out
DATA
IN *1
-
-
-
A2
In
DATA
- *2
G4
GND
-
GND
-
H3
N.C.
-
-
-
26
K1
N.C.
-
-
-
27
J2
VDDIO1
-
PWR
-
21
H1
22
H2
N.C.
23
J1
24
25
28
K2
A1/SIF_CD
J3
DATA
-
CSB/SIF_CS1
In
In
DATA
-
In
Low
Low
WRB
In
Low
RDB
In
Low
-*2
J4
N.C.
-
-
-
33
K4
INT
Out
Low
34
K5
CAMVS
In
35
J5
CAMHS
In
*
*
*
36
H5
CAMD0
In
37
G5
CAMD1
38
F6
39
G6
40
H6
32
Host data bus bit 0
Serial data from HOST to BU6566GVW
HOST IF
Host data bus bit 0
-
-
-
-
HOST IF
A
A
-
-
-
-
-
-
-
-
-
-
-
A
-
-
A
A
-
-
K
C
-
Host data bus bit 2
Common ground
Digital I/O power source (system 1)
Host address bus bit 1 signal
HOST IF
Host address bus bit 1
HOST IF
Write enable signal
Low
H4
Host data bus bit 1
Chip select signal
In
31
HOST IF
Chip select signal
WRB/SIF_SCK
K3
Serial data from BU6566GVW to HOST
Chip select signal in HOST serial I/F(BU6566GVW only)
CSB
30
Host data bus bit 1
Command / data identification in HOST serial I/F(BU6566GVW
A1
29
In
-
HOST IF
Serial clock in HOST serial I/F(BU6566GVW only)
HOST IF
Write enable signal
-
K
HOST IF
C
K
-
-
-
Interruption signal
HOST IF
D
D
-
Camera vertical timing signal (pull down at CAMOFF)
CAMERA
B
B
-
Camera horizontal timing signal (pull down at CAMOFF)
CAMERA
B
B
DATA
-
Camera data input bit0 (pull down at CAMOFF)
CAMERA
B
B
In
DATA
-
Camera data input bit1 (pull down at CAMOFF)
CAMERA
B
B
CAMD2
In
DATA
-
Camera data input bit2 (pull down at CAMOFF)
CAMERA
B
B
CAMD3
GIO2
/ KEY2
In
DATA
Camera data input bit3 (pull down at CAMOFF)
CAMERA
B
B
In/Out
DATA
Out/Lo
w
General purpose I/O2
/ Key input2 (pull down for register control)
SYSTEM
H
H
Read enable signal
-
41
J6
CAMD4
In
DATA
-
Camera data input bit4 (pull down at CAMOFF)
CAMERA
B
B
42
K6
CAMD5
In
DATA
-
Camera data input bit5 (pull down at CAMOFF)
CAMERA
B
B
43
K7
CAMD6
In
DATA
-
Camera data input bit6 (pull down at CAMOFF)
CAMERA
B
B
44
J7
CAMD7
In
DATA
-
Camera data input bit7 (pull down at CAMOFF)
CAMERA
B
B
45
H7
VDDIO2
-
PWR
-
Digital I/O power source (system 2)
-
-
-
46
K8
CAMCKI
In
CLK
-
Camera clock input (pull down at CAMOFF)
CAMERA
B
B
47
J8
N.C.
48
K9
CAMCKO
-
-
-
Out
CLK
Low
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© 2009 ROHM Co., Ltd. All rights reserved.
Camera clock output
5/16
-
-
-
CAMERA
D
D
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
PIN
No.
Land
No.
49
G7
50
In
/Out
Active
Level
Init
GND
-
GND
-
N.C.
-
-
-
-
PIN Name
Function explanation
Common ground
Function
division
I/O type
I/O
BU6566GV
BU6568G
-
-
-
-
-
-
-
-
-
-
-
-
J
J
51
K10
N.C.
-
-
-
52
J9
VDD
-
PWR
-
53
J10
SDA
In/Out
DATA
Out/Lo
Serial control input / output
CAMERA
54
H9
SDC
In/Out
CLK
Out/Lo
Serial clock output
CAMERA
J
J
55
H10
LEDCNT/GIO1
In/Out
*
In *5
LED PWM control signal / General purpose input1
SYSTEM
H
H
Digital core power source
56
G8
PWM1/GIO3
In/Out
-
In *5
LED PWM control signal1/ General purpose input3
SYSTEM
H
H
57
G9
PWM2/GIO4
In/Out
-
In *5
LED PWM control signal2/ General purpose input4
SYSTEM
H
H
58
G10
PWM3/GIO5
In/Out
-
In *5
LED PWM control signal3/ General purpose input5
SYSTEM
H
H
59
F10
VD/GIO6
In/Out
*
In *5
LCD controller vertical synchronization signal/ general purpose
LCD IF
H
H
60
F9
LCDCS1B
Out
Low
-
LCD controller chip select 1
LCD IF
D
D
61
F8
LCDCS2B
Out
Low
High
LCD controller chip select 2
LCD IF
D
D
62
F7
KEY0
In
*
-
KEY input
SYSTEM
H*6
H*6
63
E6
LCDWRB
Out
Low
-
LCD controller write enable signal
LCD IF
G*4
G*4
64
E7
LCDRDB
Out
Low
-
LCD controller read enable signal
LCD IF
G*4
G*4
65
E8
LCDA0
Out
*
-
LCD controller command parameter identification signal
LCD IF
G*4
G*4
66
E9
VDDIO2
-
PWR
-
Digital IO power source (system 2)
-
-
-
67
E10
LCDD0
In/Out
DATA
Out/Lo
LCD controller data bus bit 0
LCD IF
H
H
68
D10
LCDD1
In/Out
DATA
Out/Lo
LCD controller data bus bit 1
LCD IF
H
H
69
D9
LCDD2
In/Out
DATA
Out/Lo
LCD controller data bus bit 2
LCD IF
H
H
70
D8
N.C.
-
-
-
-
-
-
71
C10
LCDD3
In/Out
DATA
Out/Lo
LCD controller data bus bit 3
LCD IF
H
H
72
C9
LCDD4
In/Out
DATA
Out/Lo
LCD controller data bus bit 4
LCD IF
H
H
73
B10
N.C.
-
-
-
-
-
-
74
D7
GND
-
GND
-
-
-
-
75
C8
N.C.
-
-
-
-
-
-
-
76
A10
N.C.
-
-
-
-
-
-
-
77
B9
VDD
-
PWR
-
-
-
-
78
A9
LCDD5
In/Out
DATA
Out/Lo
LCD controller data bus bit 5
LCD IF
H
H
79
B8
LCDD6
In/Out
DATA
Out/Lo
LCD controller data bus bit 6
/ SCL
In/Out
DATA
Out/Lo
LCD clock of serial transmission (BU6566GVW
LCD IF
H
H
H
H
80
A8
LCDD7
In/Out
DATA
Out/Lo
LCD controller data bus bit 7
H
H
/ SI
In/Out
DATA
Out/Lo
LCD data of serial transmission (BU6566GVW only)
H
H
81
C7
TEST
In
Low
-
Test mode terminal (Connect with GND)
SYSTEM
B
B
82
B7
X16_8
In
-
-
Host data bus 16-bit / 8-bit selection
SYSTEM
A
A
83
A7
LCDD8
In/Out
DATA
Out/Lo
LCD controller data bus bit 8
LCD IF
H
H
84
A6
LCDD9
In/Out
DATA
Out/Lo
LCD controller data bus bit 9
LCD IF
H
H
85
B6
LCDD10
In/Out
DATA
Out/Lo
LCD controller data bus bit 10
LCD IF
H
H
86
C6
LCDD11
In/Out
DATA
Out/Lo
LCD controller data bus bit 11
LCD IF
H
H
87
D6
LCDD12
In/Out
DATA
Out/Lo
LCD controller data bus bit 12
LCD IF
H
H
88
E5
N.C.
-
-
-
-
-
-
89
D5
KEY1
In
-
-
SYSTEM
H*6
H*6
90
C5
LCDD13
In/Out
DATA
Out/Lo
LCD controller data bus bit 13
LCD IF
H
H
91
B5
LCDD14
In/Out
DATA
Out/Lo
LCD controller data bus bit 14
LCD IF
H
H
92
A5
LCDD15
In/Out
DATA
Out/Lo
LCD controller data bus bit 15
LCD IF
H
H
93
A4
RESETB
In
Low
-
System reset signal
SYSTEM
C
K
94
B4
PWM0/GIO0
In/Out
DATA
In *5
LED PWM control signal0/ General purpose input /
SYSTEM
H
H
95
C4
VDDIO1
-
PWR
-
-
-
-
96
A3
N.C.
-
-
-
-
-
-
-
97
B3
XOUT
Out
CLK
High
Clock output (always HIGH output at setting of external input)
SYSTEM
I
I
98
A2
XIN
In
CLK
-
Clock input *7
SYSTEM
C,I
K,I
99
D4
GND
-
GND
-
Common ground
-
-
-
100
C3
N.C.
-
-
-
-
-
-
-
Common ground
Digital core power source
Key input
Digital IO power source (system 1)
-
LCD IF
*"*" in Active Level column means active level can be changed by setting of register. Moreover, Init is a pin state at the time of reset release.
*1: Under the condition of RESETB="L" or CSB= "H".
*2: Please connect A2 and RDB to GND when to use Host serial I/F.
*3: Pull down only except for a test mode.
*4: Input only except for a test mode.
*5: Pull down while RESETB=’L’(initial state).
*6: Output only except for a test mode.
*7: The crystal oscillation circuit does not include a return resistance, so it is needed to examine an external circuit including return resistance.
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6/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
●Equivalent Circuit Structures of input / output pins.
Type
Equivalent circuit structure
VDDIO
Type
Equivalent circuit structure
VDDIO
VDDIO
Internal signal
VDDIO
A
B
To internal
GND
GND
To internal
GND
Input terminal
GND
GND
PULL-DOWN Input terminal
VDDIO
VDDIO
To internal
C
VDDIO
D
Internal signal
Internal signal
GND
GND
Hysteresis input terminal with SUSPEND
GND
Output terminal
VDDIO
VDDIO
Internal signal
Internal signal
To internal
To internal
VDDIO
VDDIO
E
VDDIO
VDDIO
F
Internal signal
Internal signal
GND
Internal signal
GND
Internal signal
GND
GND
Internal signal
GND
GND
I/O terminal with SUSPEND
GND
Internal signal
PULL-DOWN I/O terminal with SUSPEND
Internal signal
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
To
internal
To
internal
Internal signal
H
G
GND
Internal signal
GND
Internal signal
Internal signal
GND
Internal signal
GND
Internal signal
GND
I/O terminal
Internal signal
Internal signal
GND
GND
PULL-DOWN I/O terminal
VDDIO
Internal signal
VDDIO
VDDIO
XIN
VDDIO
Internal signal
VDDIO
VDDIO
VDDIO
To
Internal
GND
I
VDDIO
XOUT
Internal signal
J
GND
GND
To internal
Internal signal
GND
GND
Clock input terminaD
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Internal signal
PULL-UP I/O terminal
GND
7/16
GND Internal signal
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
Type
Equivalent circuit structure
Type
Equivalent circuit structure
VDDIO
VDDIO
K
Internal signal
L
To internal
To internal
GND
GND
GND
Hysterisisinput terminal (only for BU6568GV)
PULL-DOWN Hysterisisinput terminal (only for BU6568GV)
VDDIO
VDDIO
Internal signal
Internal signal
M
GND
Internal signal
GND
Pull-up 3-state output terminal (only for BU6568GV)
●Terminal Layout
K
46
CAMCKI
48
CAMCKO
26
NC
28
A1
30
WRB
33
INT
34
CAMVS
42
CAMD5
43
CAMD6
23
A2
27
VDDIO1
29
CSB
32
NC
35
CAMHS
41
CAMD4
44
CAMD7
47
NC
52
VDD
53
SDA
21
D0
22
NC
25
NC
31
RDB
36
CAMD0
40
GIO2
45
VDDIO2
50
NC
54
SDC
55
LEDCNT
18
D3
19
D2
20
D1
24
GND
37
CAMD1
39
CAMD3
49
GND
56
PWM1
57
PWM2
58
PWM3
17
D4
16
D5
15
D6
14
D7
13
VDD
38
CAMD2
62
KEY0
61
LCDCS2B
9
D10
10
D9
11
D8
12
GND
88
NC
63
LCDWRB
64
LCDRDB
65
LCDA0
66
VDDIO2
67
LCDD0
8
D11
7
D12
6
D13
99
GND
89
KEY1
87
LCDD12
74
GND
70
NC
69
LCDD2
68
LCDD1
4
D14
100
NC
95
VDDIO1
90
LCDD13
86
LCDD11
81
TEST
75
NC
72
LCDD4
71
LCDD3
3
D15
2
VDDIO1
97
XOUT
94
PWM0
91
LCDD14
85
LCDD10
82
X16_8
79
LCDD6
77
VDD
73
NC
1
NC
98
XIN
96
NC
93
RESETB
92
LCDD15
84
LCDD9
83
LCDD8
80
LCDD7
78
LCDD5
76
NC
J
H
51
NC
G
F
60
LCDCS1B
59
VD
E
D
C
B
A
1pin marker (Top View)
corner.
1
2
3
4
5
6
7
8
9
10
(Bottom View)
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© 2009 ROHM Co., Ltd. All rights reserved.
8/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
●Timing Chart
1. HOST interface timing
1.1 System timing
Table 1.1-1
Symbol
BU6566GVW timing conditions (system)
Details
MIN.
TYP.
MAX.
Unit
tXIN
Clock input cycle
33.0
-
-
ns
DutyXIN
Clock duty
45.0
50.0
55.0
%
tSCLK
System clock cycle
33.0
-
-
ns
DutySCLK
System clock duty
33.3
50.0
66.7
%
tCAMCKO
Camera clock output cycle
33.0
-
-
ns
DutyCAMCKO
Camera clock output duty
33.3
50.0
66.7
%
tCAMCKI
Camera clock input cycle
66.0
-
-
ns
DutyCAMCKI
Camera clock input duty
40.0
50.0
60.0
%
tRESETB
RESETB "L" pulse width
1.0
-
-
us
Conditions
"H" width / cycle
"H" width / cycle
“"H" width / cycle
"H" width / cycle
*Regulation all at threshold of VDDIO×1/2
Table 1.1-2
Symbol
BU6568GV timing conditions (system)
Details
MIN.
TYP.
MAX.
Unit
tXIN
Clock input cycle
33.0
-
-
ns
DutyXIN
Clock duty
45.0
50.0
55.0
%
tSCLK
System clock cycle
19.2
-
-
ns
DutySCLK
System clock duty
33.3
50.0
66.7
%
tCAMCKO
Camera clock output cycle
19.2
-
-
ns
DutyCAMCKO
Camera clock output duty
45.0
50.0
55.0
%
tCAMCKI
Camera clock input cycle
19.2
-
-
ns
DutyCAMCKI
Camera clock input duty
45.0
50.0
55.0
%
tRESETB
RESETB "L" pulse width
1.0
-
-
us
Conditions
"H" width / cycle
"H" width / cycle
"H" width / cycle
"H" width / cycle
*Regulation all at threshold of VDDIO×1/2
1.2 Register (including RAM via register) write timing.
tWC
tAS
tAH
Address Input
A2,A1
tCS
CSB(WRB)
tCH
WRB(CSB)
tWW
tWAIT
RDB
tDS
D[15:0]
Write
Table 1.2-1
tDH
Data
BU6566GVW timing conditions(RAM, register write cycle)
Symbol
Details
MIN.
TYP.
MAX.
Unit
tWC
Write cycle time
70
-
-
ns
tAS
Address setup time before WRB(CSB) falling
-5
-
-
ns
tAH
Address hold time after WRB(CSB) rising
-1
-
-
ns
tCS
CSB(WRB) input setup time before WRB(CSB) falling
0
-
-
ns
tCH
CSB(WRB) input hold time after WRB(CSB) rising
0
-
-
ns
tWW
WRB(CSB) active time width
40
-
-
ns
tWAIT
Wait time from WRB(CSB) rising to the next WRB(CSB) or to RDB falling
30
-
-
ns
tDS
Data setup time before WRB(CSB) rising
35
-
-
ns
tDH
Data hold time after WRB(CSB) rising
-1
-
-
ns
*Regulation all at threshold of VDDIO1×1/2 (VDD=1.50V,VDDIO=2.85V,GND=0.0V,Ta=25ºC)
*It is possible to use it with either CSB or WRB active. However, either of them must do LOW pulse operation.
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9/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
Table 1.2-2
BU6568GV timing conditions(RAM, register write cycle)
Symbol
Details
MIN.
TYP.
MAX
Unit
tWC
Write cycle time
55
-
-
ns
tAS
Address setup time before WRB(CSB) falling
-4
-
-
ns
tAH
Address hold time after WRB(CSB) rising
0
-
-
ns
tCS
CSB(WRB) input setup time before WRB(CSB) falling
0
-
-
ns
tCH
CSB(WRB) input hold time after WRB(CSB) rising
0
-
-
ns
tWW
WRB(CSB) active time width
40
-
-
ns
tWAIT
Wait time from WRB(CSB) rising to the next WRB(CSB) or to RDB falling
15
-
-
ns
tDS
Data setup time before WRB(CSB) rising
30
-
-
ns
tDH
Data hold time after WRB(CSB) rising
0
-
-
ns
*Regulation all at threshold of VDDIO1×1/2 (VDD=1.50V,VDDIO=2.85V,GND=0.0V,Ta=25ºC)
*It is possible to use it with either CSB or WRB active. However, either of them must do LOW pulse operation.
1.3 Register (including RAM via register) read timing.
tRC
A2,A1
tAS
tAH
CSB(RDB)
Address Input
tRD
tCS
tCH
WRB
RDB(CSB)
tWAIT
D[15:0]
tROE
tROD
Read Data
Table 1.3-1
BU6566GVW timing conditions (RAM, register read cycle)
Symbol
Details
MIN.
TYP.
MAX.
Unit
100
-
-
ns
Address setup time before RDB(CSB) falling
-5
-
-
ns
Address hold time after RDB(CSB) rising
-1
-
-
ns
tCS
CSB(RDB) input setup time before RDB(CSB) falling
0
-
-
ns
tCH
CSB(RDB) input hold time after RDB(CSB) rising
0
-
-
ns
tRD
Access time after RDB(CSB) falling
-
-
70
ns
tWAIT
Wait time from RDB(CSB) rising to the next RDB(CSB) falling or to WRB falling
30
-
-
ns
tROE,tROD
Data output enable time after RDB(CSB) falling, Data output disable time after RDB(CSB) rising
-
-
15
ns
tRC
Read cycle time
tAS
tAH
*Regulation all at threshold of VDDIO1×1/2 (VDD=1.50V,VDDIO=2.85V,GND=0.0V,Ta=25ºC)
*It is possible to use it with either CSB or RDB active. However, either of them must do LOW pulse operation.
Table 1.3-2
BU6568GV timing conditions (RAM, register read cycle)
Symbol
Details
MIN.
TYP.
MAX.
Unit
74.5
-
-
ns
tRC
Read cycle time
tAS
Address setup time before RDB(CSB) falling
-4
-
-
ns
tAH
Address hold time after RDB(CSB) rising
0
-
-
ns
tCS
CSB(RDB) input setup time before RDB(CSB) falling
0
-
-
ns
tCH
CSB(RDB) input hold time after RDB(CSB) rising
0
-
-
ns
tRD
Access time after RDB(CSB) falling
-
-
70
ns
tWAIT
Wait time from RDB(CSB) rising to the next RDB(CSB) falling or to WRB falling
30
-
-
ns
tROE,tROD
Data output enable time after RDB(CSB) falling, Data output disable time after RDB(CSB) rising
8
-
-
ns
*Regulation all at threshold of VDDIO1×1/2 (VDD=1.50V,VDDIO=2.85V,GND=0.0V,Ta=25ºC)
*It is possible to use it with either CSB or RDB active. However, either of them must do LOW pulse operation.
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10/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
2.
Camera Module Interface Timing
2.1. System clock and camera clock
External input clock (XIN) may be divided set and supplied as CAMCKO clock to camera module.
The relation of data synchronization clock CAMCKI clock from camera and system clock SCLK must be set so as to meet the
following formula.
fSCLK  2 × fCAMCKI
……(2.1-1)
fSCLK
System clock frequency
fCAMCKI
Camera clock frequency input to CAMCKI terminal
Moreover, [Camera timing 1] or [Camera timing 2] shown below must be satisfied.
[Camera timing1] (In the case when CAMCKI signal is as asynchronous as CAMCKO)
tCAMCKIH > tSCLK + 1ns and tCAMCKIL > tSCLK + 1ns ……(2.1-2)
tCAMCKIH
CAMCKI High interval
tCAMCKIL
CAMCKI Low interval
[Camera timing 2] (In the case when CAMCKI signal is as synchronous as CAMCKO)
total delay + margin ( 10ns) < tSCLK
……(2.1-3)
total delay
delay from CAMCKO change point to CAMCKI change point
The clock relation in fSCLK = fCAMCKO = 2 × fCAMCKI is shown in Figure.2.1-1.
[fSCLK=fCAMCKO=2 × fCAMCKI]
internal SCLK
CAMCKO
CAMCKI
detect
detect
total delay
CAMCKI = "L"
CAMCKI = "H"
CAMCKO
BU6566GVW
CAMERA
total
delay
Module
/BU6568GV
CAMCKI
Figure .2.1-1 Relation between system clock and camera clock
2.2. Camera module interface timing
The timing of the camera image signal in camera I/F is shown in Table 2.2-1.
CAMVS
CAMHS
CAMD0
-CAMD7
CAMCKI
(CKPL=“0”)
CAMCKI
(CKPOL=“1”)
tCMS
Table
Symbol
2.2-1
tCMH
BU6566GVW/BU6568GV timing (camera data)
Details
MIN.
TYP.
MAX.
Unit
Remarks
tCMS
CAMCKI rising/falling camera set up time
1/5
-
-
ns
BU6566GVW/BU6568GV
tCMH
CAMCKI rising/falling camera hold time
1/5
-
-
ns
BU6566GVW/BU6568GV
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11/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
3.
LCD direct access
When to set up with A2="L", direct access to LCD module is set up, and HOST CPU signal penetrated to LCD signal.
CSB
LCDCSB
tCSr1
tCSf1
WRB
LCDWRB
tWRr1
tWRf1
RDB
tRDr1
LCDRDB
tRDf1
A1
tAD1
LCDA0
tAD2
tDTr1
D0~D15
tDTw1
LCDD0~LCDD15
Table 3-1
Symbol
BU6566GVW timing conditions(LCD direct access)
MIN.
TYP.
MAX.
Unit
tCSf1
Delay from CSB to LCDCSB falling
Details
3.5
-
12.0
ns
tCSr1
Delay from CSB to LCDCSB rising
2.1
-
9.3
ns
tWRf1
Delay from WRB to LCDWRB falling
3.0
-
11.2
ns
tWRr1
Delay from WRB to LCDWRB rising
2.0
-
9.2
ns
tRDf1
Delay from RDB to LCDRDB falling
3.0
-
11.8
ns
tRDr1
Delay from RDB to LCDRDB rising
2.0
-
9.1
ns
tAD1
Delay from A1 to LCDA0
1.8
-
9.6
ns
tDTw1
Delay from D0~D15 to LCDD0~LCDD15
7.4
-
22.3
ns
tDTr1
Delay from LCDD0~LCDD15 to D0~D15
3.0
-
13.35
ns
Table 3-2
Symbol
BU6568GV timing conditions(LCD direct access)
Details
MIN.
TYP.
MAX.
Unit
tCSf1
Delay from CSB to LCDCSB falling
3.0
-
12.0
ns
tCSr1
Delay from CSB to LCDCSB rising
2.5
-
10.0
ns
ns
tWRf1
Delay from WRB to LCDWRB falling
3.0
-
12.0
tWRr1
Delay from WRB to LCDWRB rising
2.5
-
10.0
ns
tRDf1
Delay from RDB to LCDRDB falling
3.0
-
12.0
ns
tRDr1
Delay from RDB to LCDRDB rising
2.5
-
10.0
ns
tAD1
Delay from A1 to LCDA0
2.5
-
10.0
ns
tAD2
Delay from A1 to LCDA0
6.0
24.0
ns
tDTw1
Delay from D0~D15 to LCDD0~LCDD15
4.0
-
16.0
ns
tDTr1
Delay from LCDD0~LCDD15 to D0~D15
4.0
-
16.0
ns
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12/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
4.
LCD transfer timing
Transfer timing to LCD is shown below.
Nwrb
RESO
Npix
Tseq
Th_rest
0
2
1
(WL+WH+2)×2
0
1
2
1
(WL+WH+2)×2
0
2
3
2
(WL+WH+max(WL,WH)+3)×2
abs(WL-WH)
3
1
1
(WL+WH+2)
0
4
2
1
(WL+WH+2)×2
0
5
3
1
(WL+WH+2)×3
0
6
3
1
(WL+WH+2)×3
0
7
2
1
(WL+WH+2)×2
0
*RESO(IDX:42h bit [2:0]) shows a color resolution setting of LCD.
*Nwrb, Npix, Tseq, and Th_rest are the parameters determined by RESO.
*WL, WH are the value of LCDWL, LCDWH of Register MLCDWAV (IDX:49h), respectively.
*max (WL, WH) shows the maximum of WL and WH.
*abs(WL-WH) shows the absolute value of (WL-WH).
TRN_CMD=1
Waveform at command transfer (TSCLK for all unit)
EXCMD=0
LCDCSB
4
EXCMD=1~7
Command
LCDCSB
WH+2
2
WH+3
LCDWRB
WL+1
LCDA0
1
2
WH+3
1
2
WH+2
LCDD0-15
1
TRN_CMD=0
Waveform at data transfer (TSCLK for all unit)
Nwrb=1
Tseq
Nwrb=2
Tseq
WH+1+Th_rest
WH+1
WH+1+Th_rest
LCDWRB
LCDWRB
WL+1
WL+1
Nwrb=3
WL+1
Tseq
WH+1
WH+1
WH+1+Th_rest
LCDWRB
WL+1
WL+1
WL+1
EXCMD=0
Data
LCDCSB
(Tseq/Npix)+5
WH+1
WH+2+Th_rest
LCDWRB
WL+1
LCDA0
1 (Tseq/Npix)+5
WH+2+Th_rest
LCDD0-15
WH+1+Th_rest
1 (Tseq/Npix)+5
1
EXCMD=1-7
Data
Command
LCDCSB
WH+2
2
LCDWRB
(Tseq/Npix)+WH+5
WH+1
1
LCDA0
1
2
(Tseq/Npix)+WH+4
1
2
(Tseq/Npix)+WH+5
LCDD0-15
WH+1
WH+2+Th_rest
WL+1
WH+2+Th_rest
WH+1+Th_rest
1
(Note1)In LCD_DELAY[1:0]( IDX:49h bit [9:8]) ="00", LCDA0 and LCDD change in LCDWRB falling, and are held to the next LCDWRB falling.
(Note2)Change of LCDWRB is late for LCDA0 and LCDD 15-0 according to a setup of LCD_DELAY [1:0] (at the time of output no-load).
Typ. delays 10ns in LCD_DELAY[1:0] ="01." 1tSCLK in LCD_DELAY[1:0] ="10”. 1tSCLK+Typ.10ns in LCD_DELAY[1:0] ="11”.
Figure 4-1
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MAIN LCD data transfer waveform(Unit:tSCLK)
13/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
● Development Scheme
This technical note is aimed at trying the connectivity in the hardware between customer’s system and our camera image
processor series.
We prepare various data and tools for every development STEP as follows other than this technical note, please contact
the sales staff in your duty also including the support system.
(1) Demonstration STEP
(You can try the standard image processing functions by the standard Demonstration kit at once.)
You can confirm the standard functions such as camera image preview, memory data display to LCD, camera image
composition JPEG compression/ expansion, frame composition, divided display, and LED lighting, and so forth on the
Demonstration board.
・Standard Demonstration board kit
◎Demonstration board
(LCD module provided by ROHM, Camera module provided by ROHM, Check board equipped with the camera
image processor, ARM-equipped controller board)
◎Demonstration board operation manual
◎Demonstration software
If the software for the trial board is installed in your Windows PC(Windows 2000/XP/ME/98), more detailed
setting is possible.
(Execution tools for the macro command, sample macro command file)
◎USB cable
(2) Confirmation STEP
(We will respond to customer’s camera module, LCD module, HOST CPU.)
・Specifications
We will provide specifications for camera image processor according to customer’s requirements.
・Function explanation
We will deliver you the function explanation describing detailed functions, register settings, external
interfaces, timing, and so forth of camera image processor according to your requests.
・Application note
We will deliver you the detailed explanation data on application development of camera image processor
according to your requests.
(3) System check STEP
(You can check the application operation as a system by the kit of system check tools and your
module(camera/LCD).)
ROHM creates the system check board using your camera/LCD module.
You can check the interface with your module and the application operation on the system check board using the
tools for user’s only.
・System check tools kit
・System check software (For Windows PC)
◎Reference C source code summarizing ARM –compatible application program interface(API)
◎The application software (API) as a reference C source code
◎The execution tools for the macro command (BU65XX_USB) for the check by your PC.
◎The macro command file for the check by your PC.
・System check document
◎System check board manual
◎BU65XX Demo_Board Application using API
◎Board circuit diagram
*You can check the detailed functions of the application operation by your PC using the macro command file.
(4)
Integrated check STEP with user’s system
(You can check the application operation as a system on your system check board using the integrated
check software.)
You can check the application operation on the sample LSI-equipped system check board by your camera / LCD
module using the integrated check software.
・On line Support;We will answer your questions about the software development.
How to use the macro command file, API file, and APL file.
Setting flow of the camera function (camera JPEG, preview, etc.)
Interface setting of the camera module, LCD module and the camera image processor.
Header analysis method oh JPEG decode, etc.
・On site Support;We will help you clarify the questions about the software development on site together on spot.
Check of the operation of each function and the basic operation at each register setting, etc. based on
the specification.
Explanation about the specific usage of the macro command file, API file and APL file and relative
questions.
How to develop the overlay or special functions, etc.
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
14/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
●Cautions on use
(1)Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode
exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures
including the use of fuses, etc.
(2)Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical
characteristics are guaranteed under the conditions of each parameter.
(3)Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4)Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the
same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For
the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5)GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6)Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break
down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal
and the power supply or the GND terminal, the ICs can break down.
(7)Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8)Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB
to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the
completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection
against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the
storage of the set PCB.
(9)Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than
the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals
when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input
terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10)Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern
from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the
wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay
attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11)External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation
in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
●Order Model Name Selection
B
U
ROHM model name
6
5
6
8
Product number
G V
E
2
Package type
Taping model name
GVW:SBGA099W070
E2: Embossed reel tape
GV:SBGA099T070
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
15/16
2009.04 - Rev.B
Technical Note
BU6566GVW, BU6568GV
● Tape and Reel information
SBGA099W070
<Tape and Reel information>
7.0±0.1
0.1 S
99- φ 0.33±0.05
φ 0.08 M S AB
P=0.65×9
0.65
0.08
0.9MAX
7.0 ± 0.1
1PIN MARK
Tape
Embossed carrier tape (with dry pack)
Quantity
1500pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.575±0.1
K
J
H
G
F
E
D
C
B
A
0.575± 0.1
0.65
B
P=0.65× 9
A
1 2 3 4 5 6 7 8 910
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SBGA099T070
<Tape and Reel information>
7.0 ± 0.1
7.0±0.1
0.1 S
P=0.65×9
0.65
Tape
Embossed carrier tape (with dry pack)
Quantity
1500pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.575±0.1
K
J
H
G
F
E
D
C
B
A
0.65
B
1 2 3 4 5 6 7 8 910
P=0.65× 9
A
0.575± 0.1
99- φ 0.33±0.05
φ 0.08 M S AB
0.23
1.2MAX
1PIN MARK
1pin
(Unit : mm)
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
Reel
16/16
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.04 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039A
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