1/4 Structure Silicon Monolithic Integrated Circuit Product Name IrDA Controller LSI built-in Ir remote control Model name BU92747KV Outer Dimension Figure 1 Outer Dimensions Features ・Data transfer speed (bps) IrDA SIR: 2.4kbps, 9.6kbps, 19.2kbps, 38.4kbps, 57.6kbps and 115.2kbps IrDA MIR: 0.576Mbps, 1.152Mbps IrDA FIR: 4Mbps IrSimple ・Interface 16-bit data bus , Address A0-3 ・Built-in 2560 × 2byte FIFO buffer (for transmission and reception) ・Accessible as a memory device connected to the bus ・Power down mode setting possible for transmission and reception ・Input clock of 48MHz for external input clock and crystal input clock ・Ir remote control function Serial 2-lines SDA, and SCL *This LSI chip is not subject to radiation-proof design. ●Absolute Maximum Rating Ta=25°C unless otherwise stated Item Symbol Minimum Maximum Unit 2.5 4.5 4.5 VIO1, 2+0.3 900 85 125 V V V V mW °C °C *1 Supply voltage VDD -0.3 Interface supply voltage1*1 VIO1 -0.3 *1 Interface supply voltage2 VIO2 -0.3 Input voltage*1 VIN -0.3 Power dissipation*2 Pd Operating temperature range TOPR -40 Storage temperature range TSTG -55 *1 It applies to all pins based on the GND pin. *2 Reduced by 9.0mW for each increase in Ta of 1℃ over 25℃ (mounted on 70.0mm × 70.0mm × 1.6mm Glass-epoxy PCB) ●Operation Range Item Symbol Minimum Standard Supply voltage VDD 1.62 1.8 Interface supply voltage1 VIO1 1.62 1.8 Interface supply voltage2*3 VIO2 1.62 1.8 *3 VIO2 is connected with XIN/CLK48M, XOUT, PWDN, NIRQ and RESET. Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. REV. A Maximum 1.98 3.6 3.6 Unit V V V 2/4 ●Electrical Characteristics (DC Characteristics) Ta=25°C, VDD=1.8V, VIO1=1.8V, VIO2=1.8V and GND=0V unless otherwise stated Standard value Item Symbol Unit MIN TYP MAX Dissipation current 1 IDD1 0.1 10 µA Dissipation current 2 IDD2 10 30 mA Digital high-level input voltage VIH 0.75 × VIO V Digital low-level input voltage VIL 0.25 × VIO V 10 µA Digital high-level input current IIH 100 µA Digital low-level input current IIL 10 µA Digital high-level output voltage VOH VIO-0.6 - - V Digital low-level output voltage VOL - - 0.6 V Remarks For input with no output load = 0V For XIN = 48MHz Input voltage level 1.8V Input voltage level 1.8V TEST1-3 Input voltage level GND INTR, D0-15, IrDAPWDOWN, IrTX, IrRC, NIRQ, CTLA IOH=-1mA INTR, D0-15, IrDAPWDOWN, IrTX, IrRC, SDA, NIRQ, CTLA IOL=1mA ●Pin Description Pin name I/O Condition of after reset IrRX EXTIR I I - IrTX O L D0-15 A0-3 I/O I Input - CS I - RD WR I I - INTR O H RESET I - PWDN I - IrRC O L CTLA SCL SDA O I I/O L Input NIRQ O H XIN/CLK48M I O I - O H - - XOUT TEST1-3 IrDA PWDOWN VDD VIO1 VIO2 GND Pin Function IrDA Receive Input Pin Signal Input Pin in SM2="H" (Input Signal is outputted to IrTX or IrRC) IrDA and remote control Transmission Output Pin Transmission IrDA when RC_EN= "L" Transmission remote control when RC_EN="H", RC_MODE="H" Data I/O Pin Address Input Pin Chip Select Pin. Low (L) Active The read/write signal goes “Active” in a Low period. Read Signal Input Pin. Low (L) Active Write Signal Input Pin. Low (L) Active CPU Interrupt Request Output Pin (IrDA controller) The signal goes “Low” when an interrupt condition takes place. Reset Input Pin. Low (L) Active The signal causes the internal register settings, etc. to be initialized. Power Down Mode Setting. Low (L) Active When set to Low (L), this signal causes the wait status and sets the low dissipation current mode. After the power down mode is removed, RESET=L must set to Low until crystal clock oscillation becomes stable (about 2 or 3 ms). After that RESET must set to High. Take it into consideration that this period depends on the crystal in use. Remote control transmission Output pin Transmission remote control when RC_EN= "H", RC_MODE= "L" Control Signal Output Pin Serial clock Serial data I/O Pin CPU Interrupt Request Output Pin (Ir remote control) The signal goes “Low” when an interrupt condition takes place. Crystal IN / External CLK Input Crystal OUT (N.C when external input clock is used) Test pins (These pins must be GND during normal operation.) IrDA module control signal output pin These pins must be OPEN for IrDA modules having no power-down pin. Power supply pin Interface power supply voltage1 Interface power supply voltage2 Ground pin REV. A Circuit Diagram B B A C B B B B A B B A A F G A E E D A - 3/4 ●Equivalent Circuit Diagram PWDN XIN A B D C XOUT E F G ●Outer Dimensions Figure1 Outer Dimensions(VQFP48) U92747KV Lot No. (unit : mm) Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name 1 2 3 4 5 6 7 8 9 10 11 12 PWDN RESET NIRQ VIO2 TEST2 A3 VIO1 TEST1 A2 A1 D11 VDD 13 14 15 16 17 18 19 20 21 22 23 24 GND D5 A0 D4 D10 D9 D3 D15 D2 D8 D1 D7 25 26 27 28 29 30 31 32 33 34 35 36 D0 D6 D14 D12 D13 INTR CS TEST3 RD VIO1 WR VDD 37 38 39 40 41 42 43 44 45 46 47 48 GND IrRX EXTIR IrTX REV. A IrDAPWDOWN CTLA IrRC (NC) SCL SDA XOUT XIN 4/4 ●Notes for use (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Mutual impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible .Use a capacitor to keep ripple to a minimum. (3) GND potential Ensure a minimum GND pin potential in all operating conditions. (4) Short circuit mode between terminals and wrong mounting In order to mount the IC on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can destroy the IC. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the IC can destroy (5) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (6) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. (7) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (8) When power is first supplied the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow instantaneously. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. (9) For ICs with more than one power, it is possible than rush current many flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of wiring. REV. A Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 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