BVLED BVZ

Bright View Electronics
BVZ-925GN4
Ϯ Description
This revolutionary package design allows the lighting designer to reduce the number of
LEDs required and provide a more uniform and unique illuminated appearance than with
other LED solutions. This is possible through the efficient optical package design and high
current capabilities.
The low profile package can be easily coupled with reflectors or lenses to efficiently
distribute light and provide the desired lit appearance. This product family employs the
world's brightest red, red orange, amber, blue, cyan, and green LED materials, which
allow designers to match the color of many lighting applications like vehicle signal lamps,
specialty lighting, and electronic signs.
• Dice Material GaN Green
• Light ColorΚ Green Color
• Lens ColorΚ Water Transparent
Ϯ Features
•
•
•
•
•
•
•
High Luminance
Uniform Color
Low Power Consumption
Low Thermal Resistance
Low Profile
Packaged in tubes for use with automatic insertion equipment
Pb -free/ RoHS compliant
Ϯ Applications
•
•
•
•
•
•
Sign and channel letter
Cove lighting
IR-free decoration lighting
Automotive exterior ( stop-tail-turn, CHMSL, mirror side repeat )
Edge-lit signs ( exit, point of sale )
Advertisement and entertainment
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Bright View Electronics
BVZ-925GN4
Ϯ Outline DimensionsΚ ( mm )
Tolerance : ± 0.25 mm
CATHODE
7.62±0.5
ANODE
7.62±0.5
R9.4
3.50±0.5
2.5
5.4
5.0
0.4
5.08±0.3
1.55
0.76
5.08
Ϯ Part Numbering SystemΚ
B V Z - 9 2 5 G N 4
Colloid Code
Dice Code / Color Code
Outline Package Code
Product Code
Ϯ Sub Part Numbering :
Please also refer to the label on product bags and cartons.
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Bright View Electronics
BVZ-925GN4
Ϯ Absolute Maximum Ratings at Ta = 25 к
symbol
UNIT
MAX.
PD
Power Dissipation
120
mW
IF
Continuous Forward Current
30
mA
Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width IFP
100
mA
R
V
Reverse Voltage
5
V
Derating Linear From 25к
0.4
mA/к
o
Ё30 to Ѐ 80
Operating Temperature Range
C
Topr
o
Ё40 to Ѐ 100
Storage Temperature Range
C
Tstg
o
C
Tj
LED Junction Temperature
125
100 oC for 30 sec.
Soldering Preheat Temperature
Lead Solder Temperature ( 1.5mm Below Seating Plane )
260 oC for 5 sec. 1 time.
Tsld
PARAMETER
Ϯ Electro-Optical Characteristicsat at Ta = 25 к
PARAMETER----
SYMBOL
TEST
CONDITION
Forward Voltage
VF
Reverse Current
MIN.
VALUES
TYP.
MAX.
IF=30mA
壇
3.4
4
V
IR
VR= 5V
壇
壇
10
A
Peak Emission Wavelength
p
IF=30mA
壇
520
壇
nm
Dominant Wavelength
d
IF=30mA
壇
525
壇
nm
Viewing Angle
2 1/2
IF=30mA
壇
100
壇
Deg.
Luminous Intensity / Total Flux
IV/V
壇
0.3
壇
cd/lm
Thermal Resistance
R j-pin
壇
125
壇
к/W
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UNIT
Bright View Electronics
BVZ-925GN4
Ϯ Bin Grade Limits ( I F = 30 mA* ) Luminous Intensity / lm
Bin
Min.
ˠ˴̋ˁ
˚
˛
˜
3.6
4.7
4.7
6.0
6.0
7.8
J
7.8
10.0
˞
10.0
13.0
L
13.0
16.8
ToleranceΚ² 15%
Ϯ Bin Grade Limits ( I F = 30 mA* ) Dominant Wavelength / nm
Bin
Min.
Max.
PG
518
521
PH
521
524
PI
524
527
PJ
527
530
PK
530
533
PL
533
536
Please contact our sales department for more information
Ϯ Bin Grade Limits ( I F = 30 mA* ) Forward Voltage
Bin
Min.
Max.
28
2.8
3.0
30
3.0
3.2
32
3.2
3.4
34
3.4
3.6
36
3.6
3.8
38
3.8
4.0
40
4.0
4.2
Please contact our sales department for more information
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Bright View Electronics
BVZ-925GN4
Ϯ Characteristics Data
GaN Green LED
TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES
FIG. 2 Relative Total Flux vs. Forward Current
( Ta = 25 °C )
FIG. 1 Forward Current vs. Forward Voltage
( Ta = 25 °C )
3.0
2.5
Relative Intensity
Forward Current ( mA )
100
90
80
70
60
50
40
30
20
10
0
2.0
1.5
1.0
0.5
0
2.2
2.8
3.4
4.0
Forward Voltage Vf ( V )
4.6
FIG. 3 Relative Voltage vs. Temperature
Relative Total Flux @ 30mA
Forward Voltage @ 30mA
1.0
0.9
0.8
-50
-25
0
25
50
75
100 125
2.0
1.5
1.0
0.5
0
-50
0
25
50
75
100 125
FIG. 6 Maximum Forward Current
IF-DC Forward Current ( mA )
Forward Intensity @ 30mA
-25
Ambient Temperature Ta ( °C )
1.0
0.5
˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ
70
2.5
FIG. 5 Relative Intensity vs. Wavelength ( p )
( Ta = 25 °C )
500
550
Wavelength ( nm )
20 30 40 50 60
Forward Current If ( mA )
3.0
Ambient Temperature Ta ( °C )
0
450
10
FIG. 4 Relative Intensity vs. Temperature
1.2
1.1
0
600
vs. Temperature
40
30
20
10
0
0
ˣ˴˺˸ˍˈʳ̂˹ʳ˄˄
20
40
60
80
100
Ambient Temperature Ta ( °C )
120
˩˸̅̆˼̂́ˀ˕
Bright View Electronics
BVZ-925GN4
Ϯ Radiation CharacteristicΚ
40°
30°
20°
10°
Ta=25к
0°
1.0
50°
0.8
0.6
60°
0.4
70°
0.2
80°
0
90°
100°
1.0
0.8
˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ
0.6
0.4
0°
20°
ˣ˴˺˸ˍˉʳ̂˹ʳ˄˄
40°
60°
80°
100°
120°
˩˸̅̆˼̂́ˀ˕
Bright View Electronics
BVZ-925GN4
Ϯ Packaging :
!Ϯ Package Carrier Tape Dimensions :
48.5
0.97
Front
Gap
:___________ L/N :________
BV P/N
BIN :______ Q'ty :______ QA :
Side
1.27
Tube
Dimension(cm): 1.27* 0.97* 48.5
60PCS / Tube
!Ϯ Package Reel Dimensions :
13.5
BOX
Dimension(cm): 10.5 * 13.5 * 50.5
100 Tubes / Box
50.5
Box : 6,000PCS
Bright View
3
Electronics Co.,Ltd.
BVZ-9XXXXX
PART NO.:
LOT NO.:
GRADE:
Q'ty
X-
pcs
QA
10.5
X: Bin grade
: Wavelength
: Vf
TYPE
Q'TY
N,W
G,W
C.NO
ʳʳʳ
PCS
KGS
KGS
ʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳ
30
52
RE
CARTON
Dimension(cm): 23*30*52
23
ITEM NO.
DEVICE:
Q'TY
N. W.:
G. W.:
Y
PCS.
KGS.
KGS.
4 Boxes / Carton
Total : 24,000PCS
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Bright View Electronics
BVZ-925GN4
Ϯ Reliability Test Items and Conditions
(1)TEST ITEMS AND RESULTS
Standard
Test Conditions
Test Method
JEITA ED-4701 Tsld=260к ̈́ 6к, 5sec.
300 302
1.6mm from the base of the stopper
(Pre-treatment 30к,70%,168hrs.)
JEITA ED-4701 Tsld=235 ± 5к, 5sec.
300 303
(using flux)
0к ~ 100к
30min. 30min.
JEITA ED-4701 -40к ~ 25к ~ 100к ~ 25к
100 105
30min. 5min. 30min. 5min.
JEITA ED-4701 25к ~ 65к ~ -10к
200 203
90%RH 24hrs./1cycle
JEITA ED-4701 Load 5N (0.5kgf)
400 401
0̓ ~ 90° ~ 0° bend 2 times
JEITA ED-4701 Load 10N (1kgf)
400 401
10 ̈́ 1 sec.
JEITA ED-4701 Ta=100к
200 201
JEITA ED-4701 Ta=60к, RH=90%
100 103
JEITA ED-4701 Ta=-40к
200 202
Ta=25к, IF=30mA
TEST ITEM
Resistance to
Soldering Heat
Solderability
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
Terminal Strength
(bending test)
Terminal Strength
(pull test)
High Temperature Storage
Temperature Humidity Storage
Low Temperature Storage
Steady State Operating Life
Number of
Damaged
0/50
Note
1 times
1 time
over 95%
100 cycles
100 cycles
10 cycles
0/50
0/50
0/50
0/50
No
noticeable
0/50
No
noticeable
0/50
damage
damage
1000hrs.
0/50
1000hrs.
0/50
1000hrs.
0/50
1000hrs.
0/50
Steady State Operating Life of
High Humidity Heat
60к,RH=90%, IF=15mA
500hrs.
0/50
Steady State Operating Life of Low
Temperature
Ta=-30к, IF=30mA
1000hrs.
0/50
(2)CRITERIA FOR JUDGING DAMAGE
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Luminous Flux
ӥV
*)U.S.L.:Upper Standard Level
˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ
Test Conditions
IF=30mA
VR=5V
IF=30mA
Criteria for Judgement
Max
Min
U.S.L.*) x 1.1
壇
U.S.L.*) x 2.0
壇
L.S.L.**) x 0.7
壇
**)L.S.L.:Lower Standard Level
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Bright View Electronics
BVZ-925GN4
Ϯ Cautions :
(1) Storage ConditionsΚ
Ϡ The LEDs should be kept at 30к or less and 60% RH or less and should be used within a
year and should be soldered within 168 hours (7days) after opening the package.
(2) Heat Generation
Ϡ The thermal design of the end product is very important. It is necessary to avoid intense heat
generation and operate within the maximum ratings given in this specification.
Ϡ The operating current should be decided after considering the ambient maximum temperature
of LEDs.
(3) Cleaning
Ϡ Isopropyl alcohol is recommended to be used as a solvent for cleaning the LEDs.
Ϡ Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs
will occur.
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Bright View Electronics
BVZ-925GN4
(4) Soldering
Ϡ Bright View LEDs use a copper alloy lead frame which provides a high thermal conductivity.
Thermal stress such as soldering heat may reduce the reliability of the product; particular
caution should be used to avoid damage prior to and during soldering.
The recommended soldering conditions are listed in the following table.
Ϡ Although the recommended soldering conditions are specified in the below table, dip or
soldering at the lowest possible temperature is desirable.
Ϡ When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the LEDs.
Ϡ Solder the LED no closer than 1.6mm from the base of the stopper.
Ϡ Dip soldering and hand solding should not be done more than one time.
Ϡ A rapid-rate process is not recommended for cooling the LEDs down from the peak temperatur
Ϡ Cut the LED leadframes at room temperature. Cutting the leadframes at high temperature
may cause failure of the LEDs.
Ϡ Recommended soldering conditions
Dip Soldering
Hand Soldering
350к Max.
120к Max.
Pre-Heat
Temperature
Pre-Heat Time
Soldering Time
3 seconds Max.
60 seconds Max.
No closer than 1.6 mmSolder Bath Temperatu260к Max.
Position
from the base of the Dipping Time
5 seconds Max.
stopper.
No lower than 1.6 mm from the
Dipping Position
base of the stopper.
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Bright View Electronics
BVZ-925GN4
(5) Other
Ϡ Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the LEDs with matrix drive.
Ϡ The LED light output is strong enough to injure human eyes. Precaution must be taken to
prevent looking directly at the LEDs with unaided eyes for more than a few seconds
Ϡ The LEDs described here are intended to be used for ordinary electronic equipment, please
consult Bright View's sales department in advance for information on applications.
Ϡ The appearance and specifications of the product may be modified for improvement
without notice.
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