CATALYST CAT4134HV2-GT2

CAT4134
500mA Dual Channel Movie/Flash LED
Driver
DESCRIPTION
FEATURES
„
„
„
„
„
„
„
„
„
„
„
The CAT4134 is a high power, dual channel boost
converter which provides two matched LED currents.
Output current levels are controlled by one of two
resistors RSET or RFLASH. When the FLASH input pin
is low (movie mode), RSET sets the current. When
FLASH is high (flash mode), the resistor RFLASH sets
the LED current. Each channel drives two or three white
LEDs in series and provides a regulated current to
control their brightness. Input supply down to 3V is
supported, making the device ideal for Li-Ion battery
applications.
Dual Mode (Movie or Flash) operation
Independent Movie/Flash LED current control
Can drive 2, 3, 4 or 6 LEDs
High LED Current (250mA max per channel)
Power efficiency up to 85%
Dual frequency mode 1.2MHz and 900kHz
Soft-start inrush current
Adjustable overvoltage protection
Thermal shutdown protection
Operating temperature range -40ºC to +85ºC
12-pad TDFN 3mm x 3mm package
High frequency low noise operation allows the device to
be used with small external inductors and ceramic
capacitors while still maintaining excellent efficiency.
When not in use the device can be placed into a “zero”
quiescent mode via the shutdown pin.
APPLICATIONS
„
„
„
„
„
Camera flash
Flash light
High-power white LEDs
Digital still cameras
Color LCD backlighting
In addition to soft-start control and current limiting, the
CAT4134 include thermal shutdown protection. A
dedicated overvoltage pin (OVP) allows the user to limit
the maximum LED supply voltage. The device is
packaged in the 12-pad TDFN 3mm x 3mm.
ORDERING INFORMATION
Quantity Package
Part Number
Package per Reel Marking
CAT4134HV2-T2
TDFN-12 (1)
2,000
HAAS
(2)
CAT4134HV2-GT2 TDFN-12
2,000
HAAU
For Ordering Information details, see page 12.
Notes: (1) Matte-Tin Plated Finish (RoHS-compliant).
(2) NiPdAu Plated Finish (RoHS-compliant).
TYPICAL APPLICATION CIRCUIT
PIN CONFIGURATION
12-Pad TDFN 3mm x 3mm
Top View
FLASH
EN
1
2
PGND
3
AGND
4
LED2
5
LED1
12 OVP
6
22µH
C1
3V to 4.2V
10µF
11 SW
TAB is GND
VIN
8
RSET
7
EN
OFF ON
RFLASH
R1
1MΩ
FLASH
LED1
RFLASH
LED2
OVP
RSET
18kΩ
20kΩ
Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
10µF
CAT4134
RSET
RFLASH
VOUT
C2
SW
VIN
10 SW
9
D
L
VIN
1
R2
AGND
PGND
L = Sumida CDRH3D16-220
D = Central CMDSH05-4 (500mA)
C2 = 10µF (rated 16V)
100kΩ
Doc. No. MD-5021 Rev. B
CAT4134
ABSOLUTE MAXIMUM RATINGS
Parameters
SW voltage
VIN voltage
EN, FLASH, RSET, RFLASH voltage
LED1, LED2 voltage
Output Current per Channel
Storage Temperature Range
Junction Temperature Range
Lead Temperature
ESD Rating – Human Body Model (HBM)
Ratings
20
8
VIN + 0.6V
8
300
-65 to +160
-40 to +125
300
2000
Units
V
V
V
V
mA
°C
°C
°C
V
Range
2.8 to 4.2
-40 to +85
25 to 250
5 to 50
Units
V
°C
mA
mA
RECOMMENDED OPERATING CONDITIONS
Parameter
VIN
Ambient Temperature Range
Flash mode current per channel
Movie mode current per channel
ELECTRICAL OPERATING CHARACTERISTICS
Over recommended operating conditions unless specified otherwise.
VIN = 3.6V, EN = VIN and at ambient temperature of 25ºC.
Symbol Parameter
IQ
Quiescent Current
(not switching)
Conditions
VLED1 > 0.5V, VLED2 > 0.5V
ISD
Shutdown Current
EN = 0V
ISW
Switch Current Limit
Movie Mode (FLASH = Low)
Flash Mode (FLASH = High)
RSW
Switch Resistance
ISW = 1000mA
Switch Leakage Current
Switch Off, VSW = 5V
FOSC
Oscillator Frequency
Movie Mode
Flash Mode
VOVP
OVP pin threshold
ILK
η
Efficiency
Min
0.5
1.7
Typ
100
Max
250
1
µA
1
2
A
0.3
0.5
Ω
5
µA
1.2
0.9
1.10
VOUT = 10V, Load = 200mA
Unit
µA
1.20
MHz
1.30
V
85
%
TSD
Thermal Shutdown
150
ºC
THYST
Thermal Hysteresis
20
ºC
VUVLO
Undervoltage Lock Out
(UVLO) Threshold
Disabled when VIN < VUVLO
1.9
2.2
V
0.7
0.7
1.5
V
10
40
µA
EN LOGIC CONTROL INPUT
VSDHI
VSDLO
Logic High Threshold
Logic Low Threshold
EN > VSDHI Enables Device
ISDBIAS
Input Bias current
EN = 3V
Doc. No. MD-5021 Rev. B
2
0.4
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
CAT4134
ELECTRICAL OPERATING CHARACTERISTICS (continued)
Over recommended operating conditions unless specified otherwise.
VIN = 3.6V, EN = VIN and at ambient temperature of 25ºC.
Symbol Parameter
VRSET
RSET pin voltage
Conditions
22kΩ < RSET < 200kΩ
Min
1.10
Typ
1.20
Max
1.30
Unit
V
VRFLASH
RFLASH pin voltage
22kΩ < RFLASH < 200kΩ
1.10
1.20
1.30
V
LED1, LED2 Pin Voltage
(whichever is the lower)
Both Flash and Movie Mode
(lower voltage pin is regulated)
RSET = 21.6kΩ
RFLASH = 43.2kΩ
RFLASH = 21.6kΩ
In Movie mode
In Flash mode
VLED
400
mV
20
50
100
mA
ILED
Programmed LED Current
ILED-RAN
LED Current Adjust Range
per LED output
ILED-ACC
LED Current Accuracy
±5
%
ILED-DEV
LED Current Matching
±5
%
5
25
50
200
mA
FLASH CONTROL LOGIC INPUT
VFHI
VFLO
Logic High Threshold
Logic Low Threshold
IINPUT
Input Bias current
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
FLASH > VFHI Flash Enabled
FLASH = 3V
3
0.4
0.7
0.7
1.5
V
10
40
µA
Doc. No. MD-5021 Rev. B
CAT4134
TYPICAL CHARACTERISTICS
VIN = 3.6V, FLASH = VIN, CIN = 4.7µF, COUT = 10µF, L = 22µH with 2 LEDs at 100mA, TAMB = 25ºC, unless
otherwise specified.
LED Current Regulation (200mA load, Flash)
LED Current Regulation (100mA load)
2.0
LED CURRENT CHANGE [%]
LED CURRENT CHANGE [%]
2.0
1.5
1.0
1 LED
0.5
0.0
2 LEDs
-0.5
-1.0
-1.5
-2.0
2.5
3.0
3.5
4.0
1.5
1.0
0.5
0.0
2 LEDs
-0.5
-1.0
-1.5
-2.0
2.5
4.5
Current Gain vs. RFLASH
4.0
4.5
LED Current Regulation (100mA load, Flash)
2.0
1900
LED CURRENT CHANGE [%]
CURRENT GAIN (Iout / Iflash) .
3.5
INPUT VOLTAGE [V]
INPUT VOLTAGE [V]
2 LEDs
VIN= 3.6V
1850
1800
1750
1700
1650
1600
0
50
100
150
Rflash [kohm]
1.5
0.5
0.0
-0.5
-1.0
-1.5
-2.0
2.5
3.5
4.0
4.5
Efficiency vs. Input Voltage (Flash mode)
80
80
EFFICIENCY (%) .
90
70
VIN = 3.6V
2 LEDs
50
3.0
INPUT VOLTAGE [V]
90
60
2 LEDs at 100mA
1.0
200
Efficiency vs. Output Current (Flash mode)
EFFICIENCY (%) .
3.0
70
60
2 LEDs at 100mA
50
40
40
0
50
100
150
200
2.5
250
Doc. No. MD-5021 Rev. B
3.0
3.5
4.0
4.5
5.0
INPUT VOLTAGE [V]
TOTAL LED CURRENT [mA]
4
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
CAT4134
TYPICAL CHARACTERISTICS
VIN = 3.6V, FLASH = VIN, CIN = 4.7µF, COUT = 10µF, L = 22µH with 2 LEDs at 100mA, TAMB = 25ºC, unless
otherwise specified.
Power-up Transient (2 LEDs at 200mA)
Power-up Transient (2 LEDs at 200mA)
Power-up Transient (2 LEDs at 200mA)
Power-up Transient (2 LEDs at 200mA)
Switching Waveform in Flash mode (2 LEDs)
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
5
Doc. No. MD-5021 Rev. B
CAT4134
TYPICAL CHARACTERISTICS
VIN = 3.6V, CIN = 4.7µF, COUT = 10µF, L = 22µH with 2 LEDs at 100mA, TAMB = 25ºC, unless otherwise specified.
Enable Flash waveform
Switching Frequency vs. Supply Voltage
CLOCK FREQUENCY [kHz]
1300
1200
Movie mode
20mA per LED
1100
1000
Flash mode
50mA per LED
900
800
2.5
3.0
3.5
4.0
4.5
INPUT VOLTAGE [V]
Doc. No. MD-5021 Rev. B
6
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
CAT4134
PIN DESCRIPTION
Pin #
Name
Function
1
FLASH
Logic input, set high to select the flash mode.
2
EN
3
PGND
Power ground reference.
4
AGND
Analog ground reference.
5
LED2
LED channel 2, connected to the LED cathode.*
6
LED1
LED channel 1, connected to the LED cathode.*
7
RFLASH
Resistor connection to set Flash mode LED current.
8
RSET
Resistor connection to set Movie mode LED current.
9
VIN
Power supply input.
10,11
SW
Drain connection of low resistance power MOSFET.
12
OVP
Over Voltage Protection comparator input
Enable control logic input (Active High).
* LED1 or LED2 pin should not be left floating.
PIN FUNCTION
VIN is the supply voltage input. The device is
compatible with supply voltages down to 2.8V and up to
4.2V. Internal under-voltage lockout (UVLO) circuitry
will automatically prevent the device from operating
whenever the supply falls below 1.9V. For operation up
to maximum rated loads a bypass ceramic capacitor of
10µF is recommended between the VIN and GND pins
near the device.
SW pin is the drain terminal of the internal low
resistance power switch. The inductor and the Schottky
diode anode should be connected to the SW pin.
Traces going to the SW pin should be as short as
possible with minimum loop area. This pin contains
over-voltage circuitry which becomes active above 18V.
In the event of an “open-LED” fault condition, the
device will enter a low power mode and the SW pin will
be clamped to approximately 21V.
EN is the enable logic input (active high). When the pin
voltage is taken below 0.4V, the device enters
shutdown mode, drawing nearly zero current. At pin
voltages greater than 1.4V, the device is fully enabled.
LED1, LED2 provide the internal regulated current for
each of the LED cathodes. These pins enter a high
impedance zero current state whenever the device is
placed in shutdown mode. In applications with only one
string of LEDs, the two LED pins should be tied
together. LED pins should not be left floating.
FLASH is the logic input (active high) used to control
Flash mode operation. When the pin voltage is taken
above 1.4V, the device transitions from Movie mode to
Flash mode. When the pin voltage is taken back below
0.4V, the device returns back to Movie mode operation.
OVP is the overvoltage protection input pin. When the
pin voltage exceeds the 1.2V overvoltage threshold
(VOVP), the driver stops switching. The output VOUT
then drops down. As soon as the OVP pin voltage falls
under the VOVP threshold, the part starts switching
again.
RSET, RFLASH pins allow to set the LED current
respectively in Movie and Flash mode. These pins,
regulated at 1.2V, must be connected to a pull-down
resistor tied to ground. The LED current is a function of
the resistor value.
TAB is the exposed pad underneath the package. For
best thermal performance, the tab should be soldered
to the PCB and connected to the ground plane.
GND is the ground reference for the driver. The pin
must be connected to the ground plane on the PCB.
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
7
Doc. No. MD-5021 Rev. B
CAT4134
DEVICE OPERATION
The device is powered from the input pin VIN. A
switching frequency of 1.2MHz is used in Movie mode,
when the FLASH input is low. Continuous LED current
up to 50mA is controlled by the RSET resistor. For
higher load current, the Flash mode is selected by
setting the FLASH input pin high. RFLASH now
controls the LED current. In flash mode, the driver
efficiency is kept high even under high load current by
using a lower switching frequency of 900kHz. In movie
mode, the higher frequency of 1.2MHz provides a lower
noise operation.
resistor ratio sets the maximum output voltage as
shown in the equation below:
R1/R2 = (VOUTMAX /1.2) - 1.2
VOUTMAX should always be higher than the total LED
forward voltage (ΣVf) plus 1.2V. Also VOUT must be
less than ΣVf + 8V.
ΣVf + 1.2V < VOUTMAX < ΣVf + 8V < 16V
If the overvoltage protection is not needed, then the
OVP pin should be connected to Ground. In that case,
the maximum voltage on the SW pin is set to 17V.
Overvoltage Protection (OVP)
To prevent the SW pin voltage from exceeding the
internal switch maximum voltage rating, an overvoltage
protection (OVP) function is supported. The OVP pin
allows to set the maximum operating voltage on the
output VOUT using external resistors R1 and R2. The
BLOCK DIAGRAM
VIN
VOUT
CIN
COUT
SW
VIN
Dual
Frecuency
PWM
Controller
EN
PGND
LED1
FLASH
OVP
RFLASH
RSET
R1
LED2
mux
Current
Setting
2 Current Sink
Regulators
R2
RFLASH
RSET
Doc. No. MD-5021 Rev. B
AGND
8
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
CAT4134
APPLICATION INFORMATION
The typical application for the CAT4134 is in a
camera-equipped cellular phone where the LEDs are
used for illumination in flash mode with short duration
high-current pulse and in movie mode with continuous
lighter load. In movie mode, the FLASH pin is set low.
Note:
Hot-plugging the LEDs while the output is fully charged is not
recommended. If the LEDs are disconnected, the device should first
be powered-down and the output discharged before reconnecting
the LEDs to the output and the LED pins.
TIMING DIAGRAM
EN
FLASH
LED1, LED2
Current
movie
mode
flash
mode
movie
mode
LED CURRENT SETTING
Flash Mode
Table 1. Resistor Selection in Movie and Flash Mode
The enable EN and FLASH logic input signals control
the LED current. When both the EN and FLASH
inputs are high, the driver is in flash or strobe mode.
In this mode, the LED1 and LED2 pin currents are set
by the resistor RFLASH and are regulated to 1800
times the current in the RFLASH resistor and follows
the equation:
Movie Mode
LED Current RSET
(mA)
(kΩ)
5
86.4
10
43.2
20
21.6
30
14.4
LED current = 1800 x 1.2V / RFLASH
Flash Mode
LED Current RFLASH
(mA)
(kΩ)
50
43.2
75
28.8
100
21.6
150
14.4
Movie Mode
Shutdown Mode
When the EN input is high and FLASH is low, the
driver is in movie mode. In this mode, the LED1 and
LED2 pin currents are set by the resistor RSET and
are regulated to 360 times the current in the RSET
resistor and follows the equation:
When the EN input is low, the driver is in shutdown
mode and there is no current flowing in either LED1 or
LED2 pins.
LED current = 360 x 1.2V / RSET
Table 1 lists the various LED currents and the associated resistor values in movie and flash modes.
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
9
Doc. No. MD-5021 Rev. B
CAT4134
TYPICAL APPLICATIONS
The CAT4134 can drive one or two strings of 2 to 3
LEDs in series resulting in combinations of 2, 3, 4, 6
LEDs.
For applications with 2 LEDs in series and VOUTMAX
at 10V, the ratio R1/R2 is 7.
For applications with 3 LEDs in series and VOUTMAX
at 13.5V, the ratio R1/R2 is 10.
The resistor ratio R1/R2 sets the maximum VOUT
during an open-LED fault condition and provides the
overvoltage protection.
2 LED Application
3 LED Application
4 LED Application
Doc. No. MD-5021 Rev. B
6 LED Application
10
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
CAT4134
PACKAGE OUTLINE DRAWINGS
TDFN 12-Pad 3mm x 3mm, (HV2) (1) (2)
D
A
e
b
L
E
E2
PIN#1 ID
PIN#1 INDEX AREA
A1
TOP VIEW
D2
SIDE VIEW
BOTTOM VIEW
A
A3
SYMBOL
MIN
NOM
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A3
0.178
0.203
0.228
b
0.18
0.23
0.30
D
2.90
3.00
3.10
D2
2.30
2.40
2.50
E
2.90
3.00
3.10
E2
1.55
1.70
1.75
e
FRONT VIEW
RECOMMENDED LAND PATTERN
R
e
M
N
0.45 BSC
L
0.30
0.40
0.50
M
0.25
0.30
0.35
N
0.60
0.70
0.80
P
2.70
3.00
3.10
R
A1
P
E2
2.25 TYP
D2
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC standard MO-229
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
11
Doc. No. MD-5021 Rev. B
CAT4134
EXAMPLE OF ORDERING INFORMATION (1)
Prefix
Device # Suffix
CAT
4134
HV2
Product
Number
Optional
Company ID
–
G
T2
Lead Finish
Blank: Matte-Tin
G: NiPdAu
Tape & Reel
T: Tape & Reel
2: 2,000/Reel
Package
HV2: TDFN
For Product Top Mark Codes, click here:
http://www.catsemi.com/techsupport/producttopmark.asp
Notes:
(1) All packages are RoHS-compliant (Lead-free, Halogen-free).
(2) The standard lead finish is NiPdAu.
(3) The device used in the above example is a CAT4134HV2-GT2 (TDFN, NiPdAu, Tape and Reel, 2,000/Reel).
(4) For additional package and temperature options, please contact your nearest Catalyst Semiconductor Sales office.
Doc. No. MD-5021 Rev. B
12
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
REVISION HISTORY
Date
18-Oct-06
13-May-08
Rev.
A
B
Reason
Initial Issue
Add TDFN in NiPdAu plated finish.
Update Package Outline Drawing.
Update Example of Ordering Information.
Add MD- to the document number.
Copyrights, Trademarks and Patents
© Catalyst Semiconductor, Inc.
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:
Adaptive Analog™, Beyond Memory™, DPP™, EZDim™, LDD™, MiniPot™, Quad-Mode™ and Quantum Charge Programmable™
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a situation where
personal injury or death may occur.
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled
"Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical
semiconductor applications and may not be complete.
Catalyst Semiconductor, Inc.
Corporate Headquarters
2975 Stender Way
Santa Clara, CA 95054
Phone: 408.542.1000
Fax:
408.542.1200
www.catsemi.com
Document No: MD-5021
Revision:
B
Issue date:
05/13/08