Catalyst CAT93C86XIT3 16k-bit microwire serial eeprom Datasheet

H
EE
GEN FR
ALO
CAT93C86 (Die Rev. C)
16K-Bit Microwire Serial EEPROM
LE
A D F R E ETM
FEATURES
■ High speed operation: 3MHz
■ Sequential read
■ Low power CMOS technology
■ Program enable (PE) pin
■ 1.8 to 5.5 volt operation
■ 1,000,000 Program/erase cycles
■ Selectable x8 or x16 memory organization
■ 100 year data retention
■ Self-timed write cycle with auto-clear
■ Commercial, industrial and automotive
temperature ranges
■ Hardware and software write protection
■ RoHS-compliant packages
■ Power-up inadvertant write protection
DESCRIPTION
The CAT93C86 is a 16K-bit Serial EEPROM memory
device which is configured as either registers of 16 bits
(ORG pin at VCC) or 8 bits (ORG pin at GND). Each
register can be written (or read) serially by using the
DI (or DO) pin. The CAT93C86 is manufactured using
Catalyst’s advanced CMOS EEPROM floating gate
technology. The device is designed to endure 1,000,000
program/erase cycles and has a data retention of 100
years. The device is available in 8-pin DIP, 8-pin SOIC
and 8-pad TDFN packages.
PIN CONFIGURATION
FUNCTIONAL SYMBOL
CS
SK
DI
DO
1
2
3
4
8
7
6
5
VCC
SOIC Package (W)
DIP Package (L)
VCC
PE
ORG
GND
1
2
3
4
PE
VCC
CS
SK
8
7
6
5
ORG
GND
DO
DI
ORG
DI
CS
DO
SK
PE
SOIC Package (V)
CS
SK
DI
DO
1
2
3
4
8
7
6
5
SOIC Package (X)
VCC
PE
ORG
GND
CS
SK
DI
DO
1
2
3
4
8
7
6
5
PE
ORG
GND
TDFN Package (ZD4)
CS
SK
DI
DO
1
8
2
7
3
6
4
5
VCC
PE
ORG
GND
Top View
For Ordering Information details, see page 12.
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
GND
VCC
PIN FUNCTIONS
Pin Name
Function
CS
Chip Select
SK
Clock Input
DI
Serial Data Input
DO
Serial Data Output
VCC
Power Supply
GND
Ground
ORG
Memory Organization
PE
Program Enable
Note: When the ORG pin is connected to VCC, the x16 organization is selected. When it is connected to ground, the x8 pin is
selected. If the ORG pin is left unconnected, then an internal pullup
device will select the x16 organization.
Doc. No. 1091, Rev. O
CAT93C86
ABSOLUTE MAXIMUM RATINGS*
*COMMENT
Temperature Under Bias .................. -55°C to +125°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of
the device at these or any other conditions outside of those
listed in the operational sections of this specification is not
implied. Exposure to any absolute maximum rating for
extended periods may affect device performance and
reliability.
Storage Temperature ........................ -65°C to +150°C
Voltage on any Pin with
Respect to Ground(1) ............. -2.0V to +VCC +2.0V
VCC with Respect to Ground ................ -2.0V to +7.0V
Package Power Dissipation
Capability (TA = 25°C) ................................... 1.0W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current(2) ........................ 100 mA
RELIABILITY CHARACTERISTICS
Symbol
Parameter
Reference Test Method
Min
NEND(3)
Endurance
MIL-STD-883, Test Method 1033
1,000,000
Typ
Max
Cycles/Byte
Units
TDR(3)
Data Retention
MIL-STD-883, Test Method 1008
100
Years
VZAP(3)
ESD Susceptibility
MIL-STD-883, Test Method 3015
2000
Volts
ILTH(3)(4)
Latch-Up
JEDEC Standard 17
100
mA
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +5.5V, unless otherwise specified.
Symbol
Parameter
Test Conditions
ICC1
Power Supply Current
(Write)
ICC2
Min
Typ
Max
Units
fSK = 1MHz
VCC = 5.0V
3
mA
Power Supply Current
(Read)
fSK = 1MHz
VCC = 5.0V
500
µA
ISB1
Power Supply Current
(Standby) (x8 Mode)
CS = 0V
ORG=GND
10
µA
ISB2
Power Supply Current
(Standby) (x16Mode)
CS=0V
ORG=Float or VCC
10
µA
ILI
Input Leakage Current
VIN = 0V to VCC
1
µA
ILO
Output Leakage Current
(Including ORG pin)
VOUT = 0V to VCC,
CS = 0V
1
µA
VIL1
Input Low Voltage
4.5V ≤ VCC < 5.5V
-0.1
0.8
V
VIH1
Input High Voltage
4.5V ≤ VCC < 5.5V
2
VCC + 1
V
VIL2
Input Low Voltage
1.8V ≤ VCC < 4.5V
0
VCC x 0.2
V
VIH2
Input High Voltage
1.8V ≤ VCC < 4.5V
VCC x 0.7
VCC+1
V
VOL1
Output Low Voltage
4.5V ≤ VCC < 5.5V
IOL = 2.1mA
0.4
V
VOH1
Output High Voltage
4.5V ≤ VCC < 5.5V
IOH = -400µA
VOL2
Output Low Voltage
1.8V ≤ VCC < 4.5V
IOL = 1mA
VOH2
Output High Voltage
1.8V ≤ VCC < 4.5V
IOH = -100µA
0
2.4
V
0.2
VCC - 0.2
V
V
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
Doc. No. 1091, Rev. O
2
CAT93C86
PIN CAPACITANCE
Symbol
COUT
Test
Conditions
Output Capacitance (DO)
Input Capacitance (CS, SK, DI, ORG)
(1)
CIN(1)
Min
Typ
Max
Units
VOUT=0V
5
pF
VIN=0V
5
pF
INSTRUCTION SET
Address
Data
Instruction
Start
Bit
Opcode
x8
x16
READ
1
10
A10-A0
A9-A0
Read Address AN– A0
ERASE
1
11
A10-A0
A9-A0
Clear Address AN– A0
WRITE
1
01
A10-A0
A9-A0
EWEN
1
00
11XXXXXXXXX
11XXXXXXXX
Write Enable
EWDS
1
00
00XXXXXXXXX
00XXXXXXXX
Write Disable
ERAL
1
00
10XXXXXXXXX
10XXXXXXXX
Clear All Addresses
WRAL
1
00
01XXXXXXXXX
01XXXXXXXX
x8
x16
D7-D0
Comments
D15-D0 Write Address AN– A0
D7-D0
D15-D0 Write All Addresses
A.C. CHARACTERISTICS
Limits
VCC =
1.8V-5.5V
Test
Conditions
Min
Max
VCC =
2.5V-5.5V
Min
Max
VCC =
4.5V-5.5V
Symbol
Parameter
Min
Max
Units
tCSS
CS Setup Time
200
100
50
ns
tCSH
CS Hold Time
0
0
0
ns
tDIS
DI Setup Time
200
100
50
ns
tDIH
DI Hold Time
200
100
50
ns
tPD1
Output Delay to 1
tPD0
Output Delay to 0
tHZ(1)
Output Delay to High-Z
tEW
Program/Erase Pulse Width
tCSMIN
Minimum CS Low Time
1
0.5
0.15
µs
tSKHI
Minimum SK High Time
1
0.5
0.15
µs
tSKLOW
Minimum SK Low Time
1
0.5
0.15
µs
tSV
Output Delay to Status Valid
SKMAX
Maximum Clock Frequency
1
0.5
0.15
µs
CL = 100pF
1
0.5
0.15
µs
(3)
400
200
100
ns
5
5
5
ms
1
DC
3
500
0.5
DC
1000
DC
0.1
µs
3000
kHz
Doc. No. 1091, Rev. O
CAT93C86
POWER-UP TIMING (1)(2)
Symbol
tPUR
tPUW
Parameter
Power-up to Read Operation
Power-up to Write Operation
A.C. TEST CONDITIONS
Input Rise and Fall Times
Input Pulse Voltages
Timing Reference Voltages
Input Pulse Voltages
Timing Reference Voltages
Max
1
1
≤ 50ns
0.4V to 2.4V
0.8V, 2.0V
0.2VCC to 0.7VCC
0.5VCC
Units
ms
ms
4.5V ≤ VCC ≤ 5.5V
4.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 4.5V
1.8V ≤ VCC ≤ 4.5V
NOTE:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
(2) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
(3) The input levels and timing reference points are shown in “AC Test Conditions” table.
DEVICE OPERATION
Enabled mode. For Write Enable and Write Disable
instruction PE=don’t care.
The CAT93C86 is a 16,384-bit nonvolatile memory
intended for use with industry standard microprocessors. The CAT93C86 can be organized as either registers of 16 bits or 8 bits. When organized as X16, seven
13-bit instructions control the reading, writing and erase
operations of the device. When organized as X8, seven
14-bit instructions control the reading, writing and erase
operations of the device. The CAT93C86 operates on
a single power supply and will generate on chip, the high
voltage required during any write operation.
Read
Upon receiving a READ command and an address
(clocked into the DI pin), the DO pin of the CAT93C86 will
come out of the high impedance state and, after sending
an initial dummy zero bit, will begin shifting out the data
addressed (MSB first). The output data bits will toggle on
the rising edge of the SK clock and are stable after the
specified time delay (tPD0 or tPD1).
Instructions, addresses, and write data are clocked into
the DI pin on the rising edge of the clock (SK). The DO
pin is normally in a high impedance state except when
reading data from the device, or when checking the
ready/busy status after a write operation.
After the initial data word has been shifted out and CS
remains asserted with the SK clock continuing to toggle,
the device will automatically increment to the next address
and shift out the next data word in a sequential READ
mode. As long as CS is continuously asserted and SK
continues to toggle, the device will keep incrementing to
the next address automatically until it reaches to the end
of the address space, then loops back to address 0. In
the sequential READ mode, only the initial data word is
preceeded by a dummy zero bit. All subsequent data
words will follow without a dummy zero bit.
The ready/busy status can be determined after the start
of a write operation by selecting the device (CS high) and
polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that
the device is ready for the next instruction. If necessary,
the DO pin may be placed back into a high impedance
state during chip select by shifting a dummy “1” into the
DI pin. The DO pin will enter the high impedance state on
the falling edge of the clock (SK). Placing the DO pin into
the high impedance state is recommended in applications where the DI pin and the DO pin are to be tied
together to form a common DI/O pin.
Write
After receiving a WRITE command, address and the
data, the CS (Chip Select) pin must be deselected for a
minimum of tCSMIN. The falling edge of CS will start the
self clocking clear and data store cycle of the memory
location specified in the instruction. The clocking of the
SK pin is not necessary after the device has entered the
self clocking mode. The ready/busy status of the
CAT93C86 can be determined by selecting the device
and polling the DO pin. Since this device features AutoClear before write, it is NOT necessary to erase a
memory location before it is written into.
The format for all instructions sent to the device is a
logical "1" start bit, a 2-bit (or 4-bit) opcode, 10-bit
address (an additional bit when organized X8) and for
write operations a 16-bit data field (8-bit for X8
organizations).
Note: The Write, Erase, Write all and Erase all instructions
require PE=1. If PE is left floating, 93C86 is in Program
Doc. No. 1091, Rev. O
4
CAT93C86
Figure 1. Sychronous Data Timing
tSKLOW
tSKHI
tCSH
SK
tDIS
tDIH
VALID
DI
VALID
tCSS
CS
tDIS
tPD0,tPD1
DO
tCSMIN
DATA VALID
Figure 2. Read Instruction Timing
SK
1
1
1
1
1
AN
AN–1
1
1
1
1
1
1
1
1
1
1
CS
Don't Care
DI
1
1
A0
0
HIGH-Z
DO
Dummy 0
D15 . . . D0
or
D7 . . . D0
Address + 1
D15 . . . D0
or
D 7 . . . D0
Address + 2
D15 . . . D0
or
D 7 . . . D0
Address + n
D15 . . .
or
D7 . . .
Figure 3. Write Instruction Timing
SK
tCSMIN
AN
DI
1
0
AN-1
A0
DN
D0
1
tSV
DO
STANDBY
STATUS
VERIFY
CS
tHZ
BUSY
HIGH-Z
READY
HIGH-Z
tEW
5
Doc. No. 1091, Rev. O
CAT93C86
Erase
Erase All
Upon receiving an ERASE command and address, the
CS (Chip Select) pin must be deasserted for a minimum
of tCSMIN. The falling edge of CS will start the self clocking
clear cycle of the selected memory location. The clocking
of the SK pin is not necessary after the device has
entered the self clocking mode. The ready/busy status of
the CAT93C86 can be determined by selecting the
device and polling the DO pin. Once cleared, the content
of a cleared location returns to a logical “1” state.
Upon receiving an ERAL command, the CS (Chip Select)
pin must be deselected for a minimum of tCSMIN. The
falling edge of CS will start the self clocking clear cycle
of all memory locations in the device. The clocking of the
SK pin is not necessary after the device has entered the
self clocking mode. The ready/busy status of the
CAT93C86 can be determined by selecting the device
and polling the DO pin. Once cleared, the contents of all
memory bits return to a logical “1” state.
Erase/Write Enable and Disable
Write All
The CAT93C86 powers up in the write disable state. Any
writing after power-up or after an EWDS (write disable)
instruction must first be preceded by the EWEN (write
enable) instruction. Once the write instruction is enabled,
it will remain enabled until power to the device is removed,
or the EWDS instruction is sent. The EWDS instruction
can be used to disable all CAT93C86 write and clear
instructions, and will prevent any accidental writing or
clearing of the device. Data can be read normally from
the device regardless of the write enable/disable status.
Upon receiving a WRAL command and data, the CS
(Chip Select) pin must be deselected for a minimum of
tCSMIN. The falling edge of CS will start the self clocking
data write to all memory locations in the device. The
clocking of the SK pin is not necessary after the device
has entered the self clocking mode. The ready/busy
status of the CAT93C86 can be determined by selecting
the device and polling the DO pin. It is not necessary for
all memory locations to be cleared before the WRAL
command is executed.
Figure 4. Erase Instruction Timing
SK
STATUS VERIFY
CS
AN
DI
1
1
tCS
A0
AN-1
STANDBY
1
tSV
tHZ
HIGH-Z
DO
BUSY
READY
HIGH-Z
tEW
Doc. No. 1091, Rev. O
6
CAT93C86
Figure 5. EWEN/EWDS Instruction Timing
SK
STANDBY
CS
DI
1
0
0
*
* ENABLE=11
DISABLE=00
Figure 6. ERAL Instruction Timing
SK
CS
STATUS VERIFY
STANDBY
tCS
DI
1
0
0
0
1
tSV
tHZ
HIGH-Z
DO
BUSY
READY
HIGH-Z
tEW
Figure 7. WRAL Instruction Timing
SK
CS
STATUS VERIFY
STANDBY
tCSMIN
DI
1
0
0
0
DN
1
D0
tSV
tHZ
DO
BUSY
READY
HIGH-Z
tEW
7
Doc. No. 1091, Rev. O
CAT93C86
8-LEAD 300 MIL WIDE PLASTIC DIP (L)
E1
E
D
A2
A
A1
L
e
eB
b2
b
SYMBOL
A
A1
A2
b
b2
D
E
E1
e
eB
L
MIN
NOM
MAX
4.57
0.38
3.05
0.36
1.14
9.02
7.62
6.17
7.87
2.79
0.46
7.87
6.35
2.54 BSC
3.81
0.56
1.52
10.16
8.26
7.49
9.65
3.81
8-Lead_DIP_(300).eps
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC Standard MS001.
3. Dimensioning and tolerancing per ANSI Y14.5M-1982
Doc. No. 1091, Rev. O
8
CAT93C86
8-LEAD 150 MIL WIDE SOIC (V, W)
E1
E
h x 45
D
C
A
θ1
e
A1
L
b
SYMBOL
MIN
A1
A
b
C
D
E
E1
e
h
L
θ1
0.10
1.35
0.33
0.19
4.80
5.80
3.80
NOM
MAX
0.25
1.75
0.51
0.25
5.00
6.20
4.00
1.27 BSC
0.25
0.40
0°
0.50
1.27
8°
24C16_8-LEAD_SOIC.eps
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC specification MS-012.
9
Doc. No. 1091, Rev. O
CAT93C86
8-LEAD 208 MIL SOIC (X)
E
b
D
c
A
θ1
e
A1
L
SYMBOL
MIN
A1
A
b
c
D
E
E1
e
L
θ1
0.05
NOM
MAX
0.25
2.03
0.48
0.25
5.33
8.26
5.38
0.36
0.19
5.13
7.75
5.13
1.27 BSC
0.51
0°
0.76
8°
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with EIAJ specification EDR-7320.
Doc. No. 1091, Rev. O
10
CAT93C86
8-PAD TDFN 3X3 PACKAGE (ZD4)
A
E
PIN 1
INDEX AREA
A1
D
D2
A2
A3
SYMBOL
MIN
NOM
MAX
A
A1
A2
A3
b
D
D2
E
E2
e
L
0.70
0.00
0.45
0.75
0.02
0.55
0.20 REF
0.30
3.00
2.30
3.00
1.50
0.65 TYP
0.30
0.80
0.05
0.65
0.25
2.90
2.20
2.90
1.40
0.20
E2
PIN 1 ID
0.35
3.10
2.40
3.10
1.60
L
e
b
0.40
3xe
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
TDFN 8-Lead 3x3.eps
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC specification MO-229C.
11
Doc. No. 1091, Rev. O
CAT93C86
ORDERING INFORMATION
Prefix
Device #
CAT
93C86
Company ID
Suffix
I
V
Product Number
93C86
L
V
W
X
ZD4
-1.8
Temperature Range
I = Industrial (-40°C - 85°C)
A = Automotive (-40°C - 105°C)
E = Extended (-40°C to + 125°C)
T3
(4)
Rev C
Die Revision
93C86: C
Operating Voltage
Blank (Vcc = 2.5V to 5.5V)
1.8 (Vcc = 1.8V to 5.5V)
Package
= PDIP
= SOIC, JEDEC
= SOIC, JEDEC
= SOIC, EIAJ(5)
= TDFN (3x3mm)
–G
Tape & Reel
T: Tape & Reel
2: 2000/Reel(5)
3: 3000/Reel
Lead Finish
Blank: Matte-Tin
G: NiPdAu
Notes:
(1) All packages are RoHS-compliant (Lead-free, Halogen-free).
(2) The standard finish is NiPdAu.
(3) The device used in the above example is a CAT93C86VI-1.8-GT3 (SOIC, Industrial Temperature, 1.8V to 5.5V Operating Voltage,
NiPdAu, Tape & Reel).
(4) Product die revision letter is marked on top of the package as a suffix to the production date code (e.g., AYWWE.) For additional
information, please contact your Catalyst sales office.
(5) For SOIC, EIAJ (X) package the standard lead finish is Matte-Tin. This package is available in 2000 pcs/reel, i.e. CAT93C86XI-T2.
(6) For additional package and temperature options, please contact your nearest Catalyst Semiconductor Sales office.
Doc. No. 1091, Rev. O
12
REVISION HISTORY
Date
Revision Comments
05/14/04
L
New Data Sheet Created From CAT93C46/56/57/66/86. Parts
CAT93C56, CAT93C56, CAT93C57, CAT93C66, CAT93C76 and
CAT93C86 have been separtated into single data sheets
Add Die Revision ID Letter
Update Features
Update Description
Update Pin Condition
Add Functional Diagram
Update Pin Function
Update D.C. Operating Characteristics
Update Pin Capacitance
Update Instruction Set
Update Device Operation
Update Ordering Information
08/10/04
M
Added TDFN Package pin out
9/3/04
N
minor changes
10/13/06
O
Update Features
Update Pin Configuration
Update Pin Functions
Update D.C. Operating Characteristics (VCC Range)
Update A.C. Characteristics (VCC Range)
Update Ordering Information
Copyrights, Trademarks and Patents
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Publication #:
Revison:
Issue date:
1091
O
10/13/06
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