SAMWHA CB2012UA101 Ultra power line sery Datasheet

DPS-081104
CHIP BEADS
Ultra Power Line Series
v Features
v Dimensions
(unit : mm)
B
• High Current characteristics
• Low Rdc characteristics
T
• Good reliability (Monolithic structure)
L
• Magnetically shielded
W
• Fast mounting speed
• RoHS compliant
v Applications
• PDP/LCD Monitor, Digital TV/VCR etc.
v General Code
1
2
3
4
5
6
CB
2012
U
A
300
T
1
2
3
4
5
6
Series Code
CB : Chip Ferrite Beads
Dimension Code
The first two digits : length(mm)
The last two digits : width(mm)
Application Code
G : Signal Line
P : High Current Line
U : Ultra High Current Line
Material Code
A: General Frequency
K,J: Medium Frequency
M: High Frequency
V: Very High Frequency
Impedance Value Code
The first two digits represents significant
The last digit is the number of zeros following
ex) 300 = 30 (Ω)
Packaging Code
T : Reel paper packaging
E : Reel embossed tape packaging
Size
L
W
T
B
1005
1.0±0.10
0.5±0.10
0.5±0.10
0.25±0.1
1608
1.6±0.15
0.8±0.15
0.8±0.15
0.3±0.2
2012
2.0±0.20
1.25±0.2
0.85±0.2
0.5±0.3
3216
3.2±0.20
1.6±0.20
1.1±0.20
0.5±0.3
4516
4.5±0.25
1.6±0.20
1.3±0.20
0.5±0.3
4532
4.5±0.25
3.2±0.25
1.5±0.25
0.5±0.3
v Temperature Range
• Operating Temp. -55 ~ +125℃
• Storage Temp. -10 ~ +40 ℃
v Typical Material Characteristics
High μ
Low μ
(Low RXCP)
(High RXCP)
V
M
J,K
A
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Ultra Power Line
v 1608~4532 SIZE
Impedance
(Ω) ±25%
DC Resistance
(Ω) max.
Rated Current
(mA) max.
CB1608UA101
100
0.030
4000
CB1608UK500
50
0.025
4000
CB1608UK600
60
0.030
4000
CB2012UA300
30
0.010
5000
CB2012UA600
60
0.015
5000
CB2012UA101
100
0.020
4000
CB2012UA121
120
0.030
4000
CB2012UK121
120
0.030
4000
CB2012UJ121
120
0.030
4000
CB2012UM121
120
0.030
4000
CB3216UA121
120
0.020
6000
CB3216UM600
60
0.010
6000
CB3216UM121
120
0.200
6000
CB4516UM600
60
0.010
6000
CB4532UK121
120
0.030
6000
CB4532UK401
400
0.045
4000
Test Frequency
(MHz)
100
※ Measuring Equipment
-. Z : HP4291B / E4991A
CHIP BEAD, Ultra Power Line Series
Samwha P/N
-. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Ultra Power Line
v 1608~4532 SIZE
CB 1608 UK 500
CB 1608 UK 600
100
100
Z
Impedance [ O ]
R
50
X
25
0
R
75
50
25
X
0
10
100
1000
1
Frequency [MHz]
Impedance [Ohm]
Impedance [Ohm]
Z
30
R
0
X
1
10
100
60
30
X
0
1000
R
90
1
10
Impedance [ Ω ]
Impedance [ O ]
R
100
X
100
80
X
1
Impedance [ Ω ]
Impedance [ O ]
X
100
1000
CB 4532 UK 121
280
1000
Frequency [MHz]
Z
120
R
80
X
40
0
10
100
Z
R
1
10
CB 3216 UM 121
160
90
0
1000
Frequency[MHz]
Z
45
100
40
1000
CB 3216 UA 121
135
10
Frequency [MHz]
R
Frequency [MHz]
180
1
120
0
10
0
1000
X
50
Z
Z
1
R
100
CB 2012 UM 121
160
150
0
Z
150
Frequency [MHz]
CB 2012 UJ 121
50
100
CB 2012 UK 121
200
Z
Frequency [MHz]
200
1000
CB 2012 UA 101
120
45
15
100
CHIP BEAD, Ultra Power Line Series
CB 2012 UA 300
60
10
Frequency [MHz]
Impedance [Ohm]
1
Impedance [ O ]
Impedance [ O ]
Z
75
1
10
100
1000
210
R
140
X
70
0
1
10
100
1000
Frequency [MHz]
Frequency[MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Requirements
Test Conditions
Operating
temperature range
- 55 ℃ ~ + 125 ℃
-
Storage
temperature range
40 ℃ max., 70% RH max.
at packing condition
More than 90% of the terminal electrode shall be
covered with new solder
Resistance to
soldering heat
1. No damage such as cracks should be
caused in chip element
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than ±30 %
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 270 ± 10 ℃
Soldering time : 10 ± 0.5 sec.
More than 50% of the terminal electrode
shall be covered with new solder
ST ≥
Reflow soldering
ST
1
CT
2
CT
Preheat temperature : 150 ℃
Preheat time : 60 sec.
Solder temperature : 245 ± 5 ℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
High temperature
resistance
Temperature : 125 ± 3 ℃
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
High temperature
load resistance
Temperature : 125 ± 3 ℃
Applied current : rated current
Time : 1000 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
1. No mechanical damage
2. Impedance shall not change more than ±30 %
CHIP BEAD, Reliability & Test Condition
Solderability
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 245 ± 5 ℃
Soldering time : 10 ± 1 sec.
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Humidity
resistance
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Requirements
Test Conditions
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Applied current : rated current
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Humidity load
resistance
1. No mechanical damage
2. Impedance shall not change more than ±30 %
Temperature : -55 ± 3 ℃
Time : 1000 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Thermal shock
1. -55 ± 3℃ for 30 minutes
2.125 ± 3 ℃ for 30 minutes
3. repeat 100 cycle
Vibration
Frequency : 10 ~ 55 Hz
Amplitude : 1.5 mm
Direction : X, Y, Z
Sweep time : 2 hours for each axis
Drop
Drop 10 times on a concrete floor
from a height of 100 cm
W
No mechanical damage
Flexure strength
ITEM
1005
1608
2012
3216
4516
4532
A
(mm)
0.7
1.0
1.0
1.3
1.5
1.5
B
(mm)
0.5
0.8
1.0
1.5
3.6
3.6
C
(mm)
0.7
1.3
1.3
3.0
3.0
3.8
W
(kgf)
0.7
2.0
4.0
5.0
5.0
5.0
R0.5
C
A
50
B
CHIP BEAD, Reliability & Test Condition
Low temperature
resistance
A
20
W
Bending strength
R340
The terminal electrode shall be neither break off
nor the chip damage
2 mm
Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Standard Quantity
Size
Q’TY(PCS)
1005
10,000
1608
4,000
2012
4,000
3216
3,000
4516
2,000
4532
1,000
Remarks
0.85 T size
(Unit:mm)
A
B
C
Φ178±2
Φ50 min.
Φ13±0.5
D
E
W
4±0.8
2±0.2
9±1.5
CHIP BEAD, Packaging
v Reel Dimension
v Leader & Blank Portion
(Unit:mm)
Blank
Chips
350±50 mm
Blank
Leader
350±50 mm
150 min
60 Pitch
60 Pitch
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Taping Dimensions (Paper tape)
T
A
B
S
P
(Unit:mm)
A
±0.1
B
±0.1
P
±0.1
S
±0.1
T
(Max.)
1005
1.15
0.65
2.0
1.0
0.8
1608
1.80
1.00
4.0
2.0
1.1
2012
2.30
1.55
4.0
2.0
1.1
v Taping Dimensions (Emboss tape)
CHIP BEAD, Packaging
Type
(Unit:mm)
Type
A
±0.1
B
±0.1
C
±0.1
D
±0.1
2012
2.25
1.45
1.50
0.23
3216
3.50
1.85
1.25
0.23
4516
4.90
1.90
1.35
0.30
4532
4.85
3.60
1.40
0.30
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Soldering Profile
v Reflow Soldering
Pre - heating
Soldering
Cooling
245±5℃
230
180
150
10 sec. max.
30~60 sec.
60 sec. min.
v Flow Soldering
Pre - heating
Soldering
Cooling
250±5℃
250
180
150
60 sec. min.
10 sec. max.
CHIP BEAD, Soldering Profile
60~120 sec.
60 sec. min.
v Manual Soldering
300
Soldering Iron : 30W max.
Diameter of soldering iron : 1.2 mm max.
Tc
2 sec. max.
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
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