TI1 CD4011A Cmos nand gate Datasheet

Data sheet acquired from Harris Semiconductor
SCHS313
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Status (1)
Package
Type
Package
Drawing
CD4011AD3
ACTIVE
CDIP SB
JD
14
CD4023AFB
OBSOLETE
CDIP
J
14
JM38510/05001BCA
ACTIVE
CDIP
J
14
TBD
A42
JM38510/05003BCA
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
M/05003BCA
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
Orderable Device
Pins Package Eco Plan (2)
Qty
1
TBD
TBD
1
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
Call TI
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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