TI CD4077BME4 Cmos quad exclusive-or and exclusive-nor gate Datasheet

[ /Title
(CD40
70B,
CD407
7B)
/Subject
(CMO
S Quad
ExclusiveOR
and
ExclusiveNOR
Gate)
/Autho
r ()
/Keywords
(Harris
Semiconductor,
CD400
0,
metal
gate,
CMOS
, pdip,
cerdip,
mil,
CD4070B,
CD4077B
Data sheet acquired from Harris Semiconductor
SCHS055E
CMOS Quad Exclusive-OR
and Exclusive-NOR Gate
January 1998 - Revised September 2003
Features
Ordering Information
• High-Voltage Types (20V Rating)
PART NUMBER
• CD4070B - Quad Exclusive-OR Gate
TEMP. RANGE
(oC)
PACKAGE
• CD4077B - Quad Exclusive-NOR Gate
CD4070BE
-55 to 125
14 Ld PDIP
• Medium Speed Operation
- tPHL, tPLH = 65ns (Typ) at VDD = 10V, CL = 50pF
CD4070BF3A
-55 to 125
14 Ld CERDIP
• 100% Tested for Quiescent Current at 20V
CD4070BM
-55 to 125
14 Ld SOIC
• Standardized Symmetrical Output Characteristics
CD4070BMT
-55 to 125
14 Ld SOIC
• 5V, 10V and 15V Parametric Ratings
CD4070BM96
-55 to 125
14 Ld SOIC
• Maximum Input Current of 1µA at 18V Over Full
Package Temperature Range
- 100nA at 18V and 25oC
CD4070BNSR
-55 to 125
14 Ld SOP
CD4070BPW
-55 to 125
14 Ld TSSOP
• Noise Margin (Over Full Package Temperature Range)
- 1V at VDD = 5V, 2V at VDD = 10V, 2.5V at VDD = 15V
CD4070BPWR
-55 to 125
14 Ld TSSOP
CD4077BE
-55 to 125
14 Ld PDIP
CD4077BF3A
-55 to 125
14 Ld CERDIP
CD4077BM
-55 to 125
14 Ld SOIC
CD4077BMT
-55 to 125
14 Ld SOIC
CD4077BM96
-55 to 125
14 Ld SOIC
CD4077BNSR
-55 to 125
14 Ld SOP
CD4077BPW
-55 to 125
14 Ld TSSOP
CD4077BPWR
-55 to 125
14 Ld TSSOP
• Meets All Requirements of JEDEC Standard No. 13B,
“Standard Specifications for Description of ‘B’ Series
CMOS Devices
Applications
• Logical Comparators
• Adders/Subtractors
• Parity Generators and Checkers
Description
The Harris CD4070B contains four independent ExclusiveOR gates. The Harris CD4077B contains four independent
Exclusive-NOR gates.
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
The CD4070B and CD4077B provide the system designer
with a means for direct implementation of the Exclusive-OR
and Exclusive-NOR functions, respectively.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD4070B, CD4077B
Pinouts
CD4070B
(PDIP, CERDIP, SOIC, SOP, TSSOP)
TOP VIEW
CD4077B
(PDIP, CERDIP, SOIC, SOP, TSSOP)
TOP VIEW
A 1
14 VDD
A 1
14 VDD
B 2
13 H
B 2
13 H
J=A⊕B 3
12 G
J=A⊕B 3
12 G
K=C⊕D 4
11 M = G ⊕ H
K=C⊕D 4
11 M = G ⊕ H
C 5
10 L = E ⊕ F
C 5
10 L = E ⊕ F
D 6
9 F
D 6
9 F
VSS 7
8 E
VSS 7
8 E
Functional Diagrams
CD4070B
A
J=A⊕B
K=C⊕D
M=G⊕ H
L=E⊕F
VSS = 7
VDD = 14
B
C
D
E
F
G
H
1
CD4077B
3
2
5
9
12
13
B
J =A
4
6
8
A
J
10
11
K=C
K
L
⊕B
⊕D
⊕H
=E⊕F
C
D
M=G
E
L
F
G
M
H
2
1
3
2
5
4
6
8
9
12
13
10
11
J
K
L
M
CD4070B, CD4077B
VDD
VDD
VDD
p
VDD
B†
p
2(5,9,12)
n
p
1(6,8,13)
n
p
n
J
p
n
3(4,10,11)
n
VDD
n
p
p
J
VDD
p
VSS
†
n
VSS
VDD
A†
2(5,9,12)
n
VSS
p
B†
p
A†
p
1(6,8,13)
n
n
VSS
VSS
†
INPUTS PROTECTED
BY CMOS PROTECTION
NETWORK
3(4,10,11)
n
VSS
VDD
INPUTS PROTECTED
BY CMOS PROTECTION
NETWORK
VSS
VSS
FIGURE 1. SCHEMATIC DIAGRAM FOR CD4070B
(1 OF 4 IDENTICAL GATES)
FIGURE 2. SCHEMATIC DIAGRAM FOR CD4077B
(1 OF 4 IDENTICAL GATES)
CD4070B TRUTH TABLE (1 OF 4 GATES)
CD4077B TRUTH TABLE (1 OF 4 GATES)
A
B
J
A
B
J
0
0
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
0
1
1
0
1
1
1
NOTE:
1 = High Level
0 = Low Level
J=A⊕B
NOTE:
1 = High Level
0 = Low Level
J=A⊕B
3
CD4070B, CD4077B
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage Range (VDD) . . . . . . . . . . . . . . . . . -0.5V to 20V
Input Voltage Range, All Inputs . . . . . . . . . . . . . . -0.5V to VDD 0.5V
DC Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .± 10mA
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 113oC/W
Maximum Junction Temperature (Hermetic Package or Die) . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range (Typical) . . . . . . . . . . . . . . . . . . . . 3V to 18V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
LIMITS AT INDICATED TEMPERATURES (oC)
CONDITIONS
PARAMETER
Quiescent Device Current
IDD Max
Output Low (Sink) Current
IOL Min
Output High (Source) Current
IOH Min
Output Voltage: Low Level,
VOL Max
Output Voltage: High Level,
VOH Min
Input Low Voltage,
VIL Max
Input High Voltage,
VIH Min
Input Current, IIN Max
25
VO
(V)
VIN
(V)
VDD
(V)
-55
-40
85
125
MIN
TYP
MAX
UNITS
-
0, 5
5
0.25
0.25
7.5
7.5
-
0.01
0.25
µA
-
0, 10
10
0.5
0.5
15
15
-
0.01
0.5
µA
-
0, 15
15
1
1
30
30
-
0.01
1
µA
-
0, 20
20
5
5
150
150
-
0.02
5
µA
0.4
0, 5
5
0.64
0.61
0.42
0.36
0.51
1
-
mA
0.5
0, 10
10
1.6
1.5
1.1
0.9
1.3
2.6
-
mA
1.5
0, 15
15
4.2
4
2.8
2.4
3.4
6.8
-
mA
4.6
0, 5
5
-0.64
-0.61
-0.42
-0.36
-0.51
-1
-
mA
2.5
0, 5
5
-2
-1.8
-1.3
-1.15
-1.6
-3.2
-
mA
9.5
0, 10
10
-1.6
-1.5
-1.1
-0.9
-1.3
-2.6
-
mA
13.5
0, 15
15
-4.2
-4
-2.8
-2.4
-3.4
-6.8
-
mA
-
0, 5
5
0.05
0.05
0.05
0.05
-
0
0.05
V
-
0, 10
10
0.05
0.05
0.05
0.05
-
0
0.05
V
-
0, 15
15
0.05
0.05
0.05
0.05
-
0
0.05
V
-
0, 5
5
4.95
4.95
4.95
4.95
4.95
5
-
V
-
0, 10
10
9.95
9.95
9.95
9.95
9.95
10
-
V
-
0, 15
15
14.95
14.95
14.95
14.95
14.95
15
-
V
0.5, 4.5
-
5
1.5
1.5
1.5
1.5
-
-
1.5
V
1, 9
-
10
3
3
3
3
-
-
3
V
1.5, 13.5
-
15
4
4
4
4
-
-
4
V
0.5, 4.5
-
5
3.5
3.5
3.5
3.5
3.5
-
-
V
1, 9
-
10
7
7
7
7
7
-
-
V
1.5, 13.5
-
15
11
11
11
11
11
-
-
V
-
0, 18
18
±0.1
±0.1
±1
±1
-
±10-5
±0.1
µA
4
CD4070B, CD4077B
AC Electrical Specifications
TA = 25oC, Input tr, tf = 20ns, CL = 50pF, RL = 200kΩ
TEST CONDITIONS
PARAMETER
Propagation Delay Time
Transition Time
SYMBOL
VDD (V)
TYP
MAX
UNITS
tPHL, tPLH
5
140
280
ns
10
65
130
ns
15
50
100
ns
5
100
200
ns
10
50
100
ns
15
40
80
ns
Any Input
5
7.5
pF
tTHL, tTLH
Input Capacitance
LIMITS ON ALL TYPES
CIN
TA = 25oC
IOL, OUTPUT LOW (SINK) CURRENT (mA)
GATE TO SOURCE VOLTAGE (VGS) = 15V
30
25
20
10V
15
10
5V
5
0
0
5
10
15
TA = 25oC
15
GATE TO SOURCE VOLTAGE (VGS) = 15V
12.5
10
10V
7.5
5
5V
2.5
0
0
5
VDS, DRAIN TO SOURCE VOLTAGE (V)
10
15
VDS, DRAIN TO SOURCE VOLTAGE (V)
FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
VDS, DRAIN TO SOURCE VOLTAGE (V)
VDS, DRAIN TO SOURCE VOLTAGE (V)
-15
-10
-5
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = -5V
0
0
-5
-10
-15
-10V
-20
-25
-15V
-30
IOH, OUTPUT HIGH (SOURCE) CURRENT (mA)
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
-15
-10
-5
0
0
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = -5V
-5
-10V
-15V
FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
-10
-15
FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
5
IOH, OUTPUT HIGH (SINK) CURRENT (mA)
IOL, OUTPUT LOW (SINK) CURRENT (mA)
Typical Performance Curves
(Continued)
tPHL, tPLH, PROPAGATION DELAY TIME (ns)
tTHL, tTLH, TRANSITION TIME (ns)
Typical Performance Curves
TA = 25oC
200
SUPPLY VOLTAGE (VDD) = 5V
150
100
10V
50
15V
0
0
20
40
60
80
100
TA = 25oC
300
200
SUPPLY VOLTAGE (VDD) = 5V
100
10V
15V
0
0
110
20
105
TA = 25oC
LOAD CAPACITANCE CL = 50pF
300
200
100
0
5
10
15
60
80
100
FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF LOAD CAPACITANCE
PD, POWER DISSIPATION (µW)
tPHL, tPLH, PROPAGATION DELAY TIME (ns)
FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
0
40
CL, LOAD CAPACITANCE (pF)
CL, LOAD CAPACITANCE (pF)
VDD, SUPPLY VOLTAGE (V)
FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF SUPPLY VOLTAGE
V
104
)=
15
D
E
AG
LT
O
YV
PL
103
102
(V D
P
SU
10
10V
CL = 50pF
10V
CL = 15pF
5V
1
10-1
10-1
20
TA = 25oC
1
102
103
10
fI, INPUT FREQUENCY (kHz)
104
FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF INPUT FREQUENCY
6
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD4070BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4070BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4070BF
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
1
TBD
A42
N / A for Pkg Type
TBD
Call TI
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
CD4070BF3A
ACTIVE
CDIP
J
14
CD4070BF3AS2534
OBSOLETE
CDIP
J
14
CD4070BM
ACTIVE
SOIC
D
14
CD4070BM96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BM96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BM96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BMG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BMT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BMTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BNSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BNSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BNSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BPWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4070BPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4077BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4077BF
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
CD4077BF3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
50
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD4077BM
ACTIVE
SOIC
D
14
CD4077BM96
ACTIVE
SOIC
D
CD4077BM96E4
ACTIVE
SOIC
CD4077BM96G4
ACTIVE
CD4077BME4
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BMG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BMT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BMTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BNSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BNSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BNSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BPWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4077BPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
JM38510/17203BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD4070BM96
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4070BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4070BPWR
TSSOP
PW
14
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
CD4077BM96
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4077BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4077BPWR
TSSOP
PW
14
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD4070BM96
SOIC
D
14
2500
346.0
346.0
33.0
CD4070BNSR
SO
NS
14
2000
346.0
346.0
33.0
CD4070BPWR
TSSOP
PW
14
2000
346.0
346.0
29.0
CD4077BM96
SOIC
D
14
2500
346.0
346.0
33.0
CD4077BNSR
SO
NS
14
2000
346.0
346.0
33.0
CD4077BPWR
TSSOP
PW
14
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
Samples
(Requires Login)
CD4070BE
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CD4070BEE4
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CD4070BF
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
CD4070BF3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
CD4070BF3AS2534
OBSOLETE
CDIP
J
14
TBD
Call TI
CD4070BM
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BM96
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BM96E4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BM96G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BME4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BMG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BMT
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BMTG4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BNSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BNSRE4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BNSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
(3)
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
Samples
(Requires Login)
CD4070BPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BPWRE4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4070BPWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BE
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CD4077BEE4
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CD4077BF
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
CD4077BF3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
CD4077BM
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BM96
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BM96E4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BM96G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BME4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BMG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BMT
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BMTG4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BNSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BNSRE4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 2
(3)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Jan-2012
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CD4077BNSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4077BPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
JM38510/17203BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
M38510/17203BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4070B, CD4070B-MIL, CD4077B, CD4077B-MIL :
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
• Catalog: CD4070B, CD4077B
• Military: CD4070B-MIL, CD4077B-MIL
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
CD4070BM96
SOIC
D
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
6.5
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.0
2.1
8.0
16.0
Q1
CD4070BMT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4070BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4070BPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4077BM96
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4077BMT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4077BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD4070BM96
SOIC
D
14
2500
367.0
367.0
38.0
CD4070BMT
SOIC
D
14
250
367.0
367.0
38.0
CD4070BNSR
SO
NS
14
2000
367.0
367.0
38.0
CD4070BPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
CD4077BM96
SOIC
D
14
2500
367.0
367.0
38.0
CD4077BMT
SOIC
D
14
250
367.0
367.0
38.0
CD4077BNSR
SO
NS
14
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
Similar pages