UMS CHE1270A-98F/00 12-40ghz wide band detector Datasheet

CHE1270a
RoHS COMPLIANT
12-40GHz Wide Band Detector
GaAs Monolithic Microwave IC
Description
The CHE1270a is a detector that integrates a
matched detection diode (Vdet). A reference
diode is also available to be used in
differential mode (Vref).
RF IN
Matching
It is designed for a wide range of applications
where an accurate transmitted power control
is required, typically commercial
communication systems.
The circuit is manufactured with a Schottky
diode MMIC process, 1µm gate length, via
holes through the substrate and air bridges.
Vdet
Vref
DC
It is available in chip form.
Transmitted power detection (mV)
10000
■ Wide frequency range 12-40GHz
■ 30dB dynamic range
■ ESD protected
■ Chip size: 1.41 x 0.89 x 0.1mm
■ BCB layer protection
Vdetect= Vref-Vdet (mV)
Main Features
12 GHz
17GHz
22GHz
32GHz
37GHz
40GHz
27GHz
1000
100
10
1
-20 -18 -16 -14 -12 -10 -8
-6
Main Characteristics
-4
-2
0
2
4
6
8
10 12 14 16 18
Input power (dBm)
Tamb = +25°C, Vdc = +4.5V
Symbol
Parameter
Min
Typ
12
Max
Unit
40
GHz
F
Frequency range
Dr
Dynamic range
30
dB
RL
Return Loss
-10
dB
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Ref. : DSCHE1270a8205 - 25 Jun 08
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United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHE1270a
12-40GHz Detector
Electrical Characteristics (1)
Tamb = +25°C, Vdc = +4.5V
Symbol
Parameter
Min
F
Frequency range
Dr
Dynamic range (for Input Power detection)
IPd
Input Power detection
Typ
Max
Unit
40
GHz
12
30
-15
Vdetect Voltage detection Vref – Vdet
dB
15
dBm
10
to
2000
mV
Return Loss (12 – 14.5GHz)
-8
dB
Return Loss (15 – 40GHz)
-10
dB
Vdc
Bias voltage
4.5
V
Idc
Bias current
70
µA
from IPd_min to IPd_max
RL
(1) These values are representative of on-wafer measurements that are made without bonding wires
at the RF ports but with 27kΩ resistor in parallel on pads Vdet and Vref.
Absolute Maximum Ratings (1)
Tamb = +25°C
Symbol
Vdc
IPd_max
Parameter
Values
Unit
Bias voltage
6
V
Maximum Input power
18
dBm
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to +125
°C
(1) Operation of this device above anyone of these paramaters may cause permanent damage.
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CHE1270a
12-40GHz Detector
Typical on-wafer measurements results
Tamb = +25°C, Vdc = +4.5V, 27k Ω resistor in parallel on pads Vdet and Vref
Return Loss versus frequency
0
-2
-4
Return Loss (dB)
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44
Freq (GHz)
Transmitted power detection versus Input power
Vdetect= Vref-Vdet (mV)
10000
12 GHz
17GHz
22GHz
32GHz
37GHz
40GHz
27GHz
1000
100
10
1
-20 -18 -16 -14 -12 -10 -8
-6
-4
-2
0
2
Input power (dBm)
Ref. : DSCHE1270a8205 - 25 Jun 08
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4
6
8
10 12 14 16 18
CHE1270a
12-40GHz Detector
Transmitted power detection versus frequency @ -15dBm Input power
40
Vdetect= Vref-Vdet (mV)
35
30
25
20
15
10
5
0
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
Freq (GHz)
Transmitted power detection versus frequency @ +15dBm Input power
2000
1900
Vdetect= Vref-Vdet (mV)
1800
1700
1600
1500
1400
1300
1200
1100
1000
12
14
16
18
20
22
24
26
28
Freq (GHz)
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30
32
34
36
38
40
CHE1270a
12-40GHz Detector
Chip Assembly and Mechanical Data
DC Pads Size: 100/100 µm, Chip thickness: 100 µm
Note: Supply feed might be capacitively bypassed. 25µm diameter gold wire is to be prefered.
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CHE1270a
12-40GHz Detector
Notes
RF IN
Matching
27kΩ
Ω
Vdet
27kΩ
Ω
Vref
DC
Recommended external resistors assembly
27kΩ resistors in parallel with Vdet and Vref pads are recommended to provide the best
behaviour in the whole operating temperature range.
As the voltage detection is the difference between Vref and Vdet, the external resistor value
should be identical on these two ports.
For information, a variation of 3% leads around 1mV variation of detected voltage.
Due to ESD protection circuits on RF input, an external capacitance might be requested to
isolate the product from external voltage that could be present on the RF access.
ESD protections are also implemented on Vdet and Vref accesses.
Due to the BCB coating on the chip, qualification domain implies the chip must be glued.
Ordering Information
Chip form:
CHE1270a-98F/00
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United Monolithic
Semiconductors S.A.S
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