TOSHIBA CLH07

CLH07
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CLH07
○ Switching Mode Power Supply Applications
Unit: mm
②
•
Forward voltage: VFM = 1.8 V (Max.)
•
Average forward current: IF (AV) = 5.0 A
•
Repetitive peak reverse voltage: VRRM = 400 V
•
Surface-mount package
“L−FLAT” (Toshiba package name)
①
Characteristic
Symbol
Rating
Unit
Repetitive peak reverse voltage
VRRM
400
V
Average forward current
IF(AV)
5.0
A
Peak one cycle surge forward current
(non-repetitive)
IFSM
50 (50 Hz)
A
Tj
−40~150
°C
Tstg
−40~150
°C
Junction temperature
Storage temperature range
Note 1: Tℓ = 92°C
Rectangular waveform: (α = 180°)
3 .2±0.2
Absolute Maximum Ratings (Ta = 25°C)
①①
ANODE
アノード
② カソード
② CATHODE
JEDEC
⎯
JEITA
⎯
TOSHIBA
3-4F1A
Note 2: Using continuously under heavy loads (e.g. the application of
Weight: 0.15 g (typ.)
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristic
Peak forward voltage
Repetitive peak reverse current
Symbol
Test Condition
Min
Typ.
Max
Unit
VFM (1)
IFM = 1.0 A (pulse test)
⎯
0.98
⎯
VFM (2)
IFM = 3.0 A (pulse test)
⎯
1.23
⎯
VFM (3)
IFM = 5.0 A (pulse test)
⎯
1.40
1.80
VRRM = 400 V (pulse test)
⎯
⎯
10
μA
IRRM
V
Reverse recovery time
trr
IF = 2A, di/dt = −50 A/μs
⎯
⎯
35
ns
Forward recovery time
tfr
IF = 1.0 A
⎯
⎯
100
ns
⎯
⎯
100
°C/W
⎯
⎯
5
°C/W
Thermal resistance
(junction to ambient)
Rth (j-a)
Device mounted on a glass-epoxy
board (board size: 50 mm x 50 mm)
(board thickness: 1.6 t) (soldering land)
Cathode: 5.7 mm x 6.2 mm,
Anode :4.5 mm x 3.4 mm
Thermal resistance
(junction to ambient)
Rth (j-ℓ)
⎯
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CLH07
Marking
Abbreviation Code
H07
Part No.
CLH07
Standard Soldering Pad
Unit: mm
2.9
2.5
5.9
1.8
2.6
4.8
Handling Precautions
1)
The absolute maximum rating denotes the absolute maximum ratings, which are rated values that must not
be exceeded during operation, even for an instant. The following are the general derating methods that we
recommend for designing a circuit incorporating this device:
VRRM: Use this rating with reference to (1) above. The VRRM has a temperature coefficient of 0.1%/°C.
Take this temperature coefficient into account when designing a device at low temperature.
IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum
rating of IF(AV) and that Tj be below 120°C .When using this device, take the margin into
consideration by using an allowable Ta (max)-IF (AV) curve.
IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only, When using a
device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only, When using
the device, design the circuit board and the soldering land size to match the appropriate thermal
resistance value.
Tj:
Derate this rating when using the device to ensure high reliability. We recommend that the device be
used at a Tj of below 120°C.
2) The thermal resistance between junction and ambient varies depending on the mounting condition of the See.
When using the device, design the circuit board and the soldering land size to match the appropriate thermal
resistance value.
3)
See the Rectifiers databook for further information.
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2006-11-08
CLH07
iF – vF
Average forward power dissipation
PF (AV) (W)
iF (A)
Tj = 150°C
Instantaneous forward current
10
75°C
1
25°C
0.1
Pulse test
0.01
0.0
0.4
0.8
1.2
1.6
2.0
2.4
Instantaneous forward voltage
vF
10
8
120°
2.8 3.0
0° α
2
0
(V)
2
4
Average forward current
Maximum allowable ambient temperature
Ta max (°C)
120
100
60
180°
Rectangular
waveform
40
0° α 360°
20
0
0
α
Conduction angle
2
4
Average forward current
6
IF (AV)
8
(A)
Ta max – IF (AV)
140
120°
360°
α
Conduction angle
140
α = 60°
Rectangular
waveform
4
Tℓ max – IF (AV)
80
180°
α = 60°
6
0
160
6
IF (AV)
8
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(board thickness:1.6 t)
(soldering land)
Cathode 5.7 mm × 6.2 mm
Anode 4.5 mm × 3.4 mm
120
100
80
α = 60°
60
Rectangular
waveform
120°
40
180°
0° α 360°
20
α
Conduction angle
0
0
(A)
2
4
Average forward current
8
6
IF (AV)
(A)
rth (j-a) – t
1000
500
300
Transient thermal impedance
rth (j-a) (°C/W)
Maximum allowable lead temperature
Tℓ max (°C)
PF (AV) – IF (AV)
12
100
100
50
30
10
5
3
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(board thickness:1.6 t)
(soldering land)
Cathode 5.7 mm × 6.2 mm
Anode 4.5 mm × 3.4 mm
1
0.5
0.3
0.1
0.001
0.003
0.01
0.03
0.1
0.3
Time
1
3
t
3
10
30
100
300
1000
(s)
2006-11-08
CLH07
Surge forward current
Cj – V R
(Typ.)
(non-repetitive)
1000
60
f = 1 MHz
(pF)
100
10
1
1
Ta = 25°C
f = 50 Hz
50
40
Peak surge forward current
Cj
Junction capacitance
IFSM (A)
Ta = 25°C
3
5
10
Reverse voltage
30
50
100
30
20
10
0
1
VR (V)
3
5
10
30
50
100
Number of cycles
4
2006-11-08
CLH07
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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