Mitsubishi CM200TL-24NF Igbt modules high power switching use Datasheet

MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
CM200TL-24NF
¡IC ................................................................... 200A
¡VCES ......................................................... 1200V
¡Insulated Type
¡6-elements in a pack
APPLICATION
AC drive inverters & Servo controls, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
135
(6.05)
(6.05)
110 ±0.5
17.5
10.5
26
26
11.7
10.5
18.7
V
W
B
(6.05)
U
18
(13)
10.5
10.5
CN
25
110
20
(6.05)
10.5
(13)
11
6-M5 NUTS
4
LABEL
+1
25
UP
13
30.5
46.3
VP
24.1–0.5
WP
1
(SCREWING DEPTH)
13.75
26.5
4-φ5.5
MOUNTING HOLES
1
16.5
P
48.75
B
1
78 ±0.5
20
10.5
A
8
N
1
Housing Type of A and B
(J.S.T.Mfg.Co.Ltd)
A = B8P-VH-FB-B, B = B2P-VH-FB-B
P
B
CN-7
CN-8
N
NC
NC
NC
UP-1
UP-2
VP-1
VP-2
CN-5
CN-6
WP-1
WP-2
W
V
U
CN-3
CN-4
CN-1
CN-2
CIRCUIT DIAGRAM
Feb. 2009
1
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
Symbol
VCES
VGES
IC
ICM
IE (Note 1)
IEM (Note 1)
PC (Note 3)
Tj
Tstg
Viso
—
—
—
Parameter
Collector-emitter voltage
Gate-emitter voltage
Collector current
Emitter current
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Torque strength
Weight
Conditions
G-E Short
C-E Short
DC, TC = 72°C*1
Pulse
Ratings
1200
±20
200
400
200
400
1160
–40 ~ +150
–40 ~ +125
2500
2.5 ~ 3.5
2.5 ~ 3.5
750
(Note 2)
Pulse
TC = 25°C
(Note 2)
Terminals to base plate, f = 60Hz, AC 1 minute
Main terminals M5 screw
Mounting M5 screw
Typical value
Unit
V
V
A
A
A
A
W
°C
°C
Vrms
N•m
N•m
g
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol
Parameter
Test conditions
Limits
Typ.
—
Max.
1
Unit
ICES
Collector cutoff current
VCE = VCES, VGE = 0V
Min.
—
VGE(th)
Gate-emitter threshold voltage
IC = 20mA, VCE = 10V
6
7
8
V
IGES
Gate leakage current
±VGE = VGES, VCE = 0V
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.6
—
2.1
2.4
—
—
—
1000
—
—
—
—
—
9
—
—
—
0.051
—
0.5
3.1
—
35
3
0.68
—
130
70
400
350
150
—
3.8
0.11
0.17
µA
VCE(sat)
Collector-emitter saturation voltage
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (Note 1)
Qrr (Note 1)
VEC(Note 1)
Rth(j-c)Q
Rth(j-c)R
Rth(c-f)
RG
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Thermal resistance
Contact thermal resistance
Tj = 25°C
Tj = 125°C
IC = 200A, VGE = 15V
VCE = 10V
VGE = 0V
VCC = 600V, IC = 200A, VGE = 15V
VCC = 600V, IC = 200A
VGE = ±15V
RG = 1.6Ω, Inductive load
IE = 200A
IE = 200A, VGE = 0V
IGBT part (1/6 module)*1
FWDi part (1/6 module)*1
Case to heat sink, Thermal compound Applied (1/6 module)*2
External gate resistance
—
21
mA
V
nF
nF
nF
nC
ns
ns
ns
ns
ns
µC
V
K/W
K/W
K/W
Ω
*1 : Case temperature (Tc) measured point is just under the chips.
If you use this value, Rth(f-a) should be measured just under the chips.
*2 : Typical value is measured by using thermally conductive grease of λ = 0.9[W/(m • K)].
Note 1. IE, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Feb. 2009
2
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
350
13
12
250
200
11
150
100
10
50
9
0
2
4
6
8
4
VGE = 15V
3
2
1
Tj = 25°C
Tj = 125°C
0
10
0
50 100 150 200 250 300 350 400
COLLECTOR-EMITTER VOLTAGE VCE (V)
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
10
103
Tj = 25°C
EMITTER CURRENT IE (A)
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
Tj = 25°C
15
300
0
CAPACITANCE Cies, Coes, Cres (nF)
VGE =
20V
8
6
4
IC = 400A
IC = 200A
2
IC = 80A
0
6
8
10
12
14
16
18
7
5
3
2
102
7
5
3
2
101
20
2
3
4
5
CAPACITANCE–VCE
CHARACTERISTICS
(TYPICAL)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
103
7
5
3
2
7
5
3
2
Cies
101
Coes
100
7
5
3
2
1
0
EMITTER-COLLECTOR VOLTAGE VEC (V)
102
7
5
3
2
Tj = 25°C
Tj = 125°C
GATE-EMITTER VOLTAGE VGE (V)
SWITCHING TIME (ns)
COLLECTOR CURRENT IC (A)
400
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
OUTPUT CHARACTERISTICS
(TYPICAL)
Cres
VGE = 0V
10–1 –1
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
102
td(on)
7
5
3
2
tr
Conditions:
VCC = 600V
VGE = ±15V
RG = 1.6Ω
Tj = 125°C
Inductive load
101
7
5
3
2
100 1
10
COLLECTOR-EMITTER VOLTAGE VCE (V)
td(off)
tf
2
3
5 7 102
2
3
5 7 103
COLLECTOR CURRENT IC (A)
Feb. 2009
3
MITSUBISHI IGBT MODULES
CM200TL-24NF
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Zth (j–c) (ratio)
7
5
3
Irr
2
trr
102
7
5
Conditions:
VCC = 600V
VGE = ±15V
RG = 1.6Ω
Tj = 25°C
Inductive load
3
2
101 1
10
2
3
5 7 102
2
3
5 7 103
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101
100
Single Pulse,
7
5
TC = 25°C
3
Under the chip
2
10–1
7
5
3
2
IGBT part:
10–2 Per unit base =
7
5 Rth(j–c) = 0.11K/W
FWDi part:
3
Per unit base =
2
Rth(j–c) = 0.17K/W
–3
10
10–2
7
5
3
2
10–3
10–5 2 3 5 710–4 2 3 5 7 10–3
EMITTER CURRENT IE (A)
TIME (s)
SWITCHING LOSS vs.
COLLECTOR CURRENT
(TYPICAL)
SWITCHING LOSS vs.
GATE RESISTANCE
(TYPICAL)
7
Conditions:
VCC = 600V
5 VGE = ±15V
3 RG = 1.6Ω
Tj = 125°C
2
Inductive load
C snubber at bus
101
SWITCHING LOSS (mJ/pulse)
102
7
Esw(off)
Esw(on)
7
5
3
2
2
3
5 7 102
2
3
Esw(on)
5
3
Esw(off)
2
101
5
3
2
100 0
10
5 7 103
Conditions:
VCC = 600V
VGE = ±15V
IC = 200A
Tj = 125°C
Inductive load
C snubber at bus
7
2
3
5 7 101
2
3
5 7 102
COLLECTOR CURRENT IC (A)
GATE RESISTANCE RG (Ω)
RECOVERY LOSS vs. IE
(TYPICAL)
RECOVERY LOSS vs.
GATE RESISTANCE
(TYPICAL)
102
102
7
7
5
3
Err
2
101
Conditions:
VCC = 600V
VGE = ±15V
RG = 1.6Ω
Tj = 125°C
Inductive load
C snubber at bus
7
5
3
2
100 1
10
10–1
7
5
3
2
102
100 1
10
RECOVERY LOSS (mJ/pulse)
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT part & FWDi part)
REVERSE RECOVERY CHARACTERISTICS
OF FREE-WHEEL DIODE
(TYPICAL)
103
RECOVERY LOSS (mJ/pulse)
SWITCHING LOSS (mJ/pulse)
REVERSE RECOVERY TIME trr (ns)
REVERSE RECOVERY CURRENT lrr (A)
HIGH POWER SWITCHING USE
2
3
5 7 102
2
3
5
3
2
101
7
5
3
2
100 0
10
5 7 103
EMITTER CURRENT IE (A)
Err
Conditions:
VCC = 600V
VGE = ±15V
IE = 200A
Tj = 125°C
Inductive load
C snubber at bus
2
3
5 7 101
2
3
5 7 102
GATE RESISTANCE RG (Ω)
Feb. 2009
4
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
GATE CHARGE
CHARACTERISTICS
(TYPICAL)
GATE-EMITTER VOLTAGE VGE (V)
20
IC = 200A
VCC = 400V
16
VCC = 600V
12
8
4
0
0
200 400 600 800 1000 1200 1400
GATE CHARGE QG (nC)
Feb. 2009
5
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