CMH01
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH01
Switching Mode Power Supply Applications
Unit: mm
•
Repetitive peak reverse voltage: VRRM = 200 V
•
•
•
•
Average forward current: IF (AV) = 3.0 A
Low forward voltage: VFM=0.98 V (Max) @ IFM = 3.0 A
Very Fast Reverse-Recovery Time: trr =35ns(Max)
Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Repetitive peak reverse voltage
VRRM
Average forward current
IF (AV)
Peak one cycle surge forward current
(non-repetitive)
Note 1: Tℓ＝96°C
Note2:
Unit
200
V
3.0 (Note 1)
A
IFSM
40 (50 Hz)
A
Tj
−40 to 150
°C
Tstg
−40 to 150
°C
Junction temperature
Storage temperature range
Rating
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
glass-epoxy board thickness:0.64 mm
JEDEC
―
JEITA
―
Using continuously under heavy loads (e.g. the application of
TOSHIBA
3-4E1A
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
Weight: 0.023 g (typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Symbol
Min
Typ.
Max
VFM (1)
IFM = 0.1 A (pulse test)
⎯
0.64
⎯
VFM (2)
IFM = 1.0 A (pulse test)
⎯
0.80
⎯
VFM (3)
Peak repetitive reverse current
Test Condition
IRRM
IFM = 3.0 A (pulse test)
⎯
0.90
0.98
VRRM = 200 V (pulse test)
⎯
⎯
10
Unit
V
μA
Reverse recovery time
trr
IF = 1 A, di/dt = −30 A/μs
⎯
⎯
35
ns
Forward recovery time
tfr
IF = 1 A
⎯
⎯
100
ns
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
⎯
⎯
60
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
⎯
⎯
135
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 mm)
⎯
⎯
210
⎯
⎯
16
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Rth (j-a)
⎯
Rth (j-ℓ)
°C/W
°C/W
Start of commercial production
2002-12
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CMH01
Marking
Abbreviation Code
Part No.
H1
CMH01
Standard Soldering Pad
2.1
Unit: mm
1.4
3.0
1.4
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend when you
design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a
device at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of I F(AV).
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using
an allowable Tamax-I F(AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 120°C under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
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CMH01
iF – vF
PF (AV) – IF (AV)
100
3.2
Rectangular
Waveform
iF
Instantaneous forward current
10
150°C
75°C
Tj = 25°C
1
0.1
0.01
0.2
0.6
0.4
0.8
1.0
2.8
Average forward power dissipation
PF (AV) (W)
(A)
Pulse test
1.2
1.4
Instantaneous forward voltage vF
2.4
0°
2.0
180°
360°
1.6
1.2
0.8
0.4
0
0
1.6
0.8
0.4
(V)
140
Maximum allowable ambient temperature
Ta max (°C)
140
120
100
80
Rectangular
Waveform
40
20
0
0
180°
360°
0.4
0.8
1.2
1.6
Average forward current
2.0
2.4
IF (AV)
2.8
3.2
(A)
Ta max – IF (AV)
160
2.4
IF (AV)
2.8
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
120
100
80
Rectangular
Waveform
60
40
0°
20
180°
360°
0
0
3.2
0.8
0.4
(A)
1.2
1.6
2.0
Average forward current
2.4
IF (AV)
2.8
3.2
(A)
rth (j-a) – t
1000
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 mm
500
Transient thermal impedance
rth (j-a) (°C/W)
Maximum allowable lead temperature
Tℓ max (°C)
Tℓ max – IF (AV)
0°
2.0
1.6
Average forward current
160
60
1.2
300
100
50
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
30
10
5
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
3
1
0.001
0.003
0.01
0.03
0.1
0.3
1
3
10
30
100
300
1000
Time t (s)
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CMH01
Surge forward current
Cj – V R
(Typ.)
(non-repetitive)
50
100
IFSM (A)
f = 1 MHz
50
30
Peak surge forward current
Junction capacitance
Cj
(pF)
Ta = 25°C
10
5
3
1
1
10
Reverse voltage
f = 50 Hz
40
30
20
10
0
1
100
VR
Ta = 25°C
(V)
10
100
Number of cycles
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CMH01
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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