Central CMLT5088EM Surface mount silicon dual, matched npn transistor Datasheet

CMLT5088EM
SURFACE MOUNT SILICON
DUAL, MATCHED
NPN TRANSISTOR
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DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMLT5088EM
consists of two individual, isolated 5088E NPN silicon
transistors with matched VBE(ON) characteristics.
This device is designed for applications requiring high
gain and low noise.
MARKING CODE: 88M
SOT-563 CASE
FEATURES:
• Transistor pair matched for VBE(ON)
• Device is Halogen Free by design
MAXIMUM RATINGS: (TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
SYMBOL
VCBO
VCEO
VEBO
IC
PD
TJ, Tstg
ΘJA
ELECTRICAL CHARACTERISTICS PER TRANSISTOR:
SYMBOL
TEST CONDITIONS
ICBO
VCB=20V
IEBO
VEB=3.0V
BVCBO
IC=100μA
BVCEO
IC=1.0mA
BVEBO
IE=100μA
VCE(SAT)
IC=10mA, IB=1.0mA
VCE(SAT)
IC=100mA, IB=10mA
VBE(SAT)
IC=10mA, IB=1.0mA
hFE
VCE=5.0V, IC=0.1mA
hFE
VCE=5.0V, IC=1.0mA
hFE
VCE=5.0V, IC=10mA
hFE
VCE=5.0V, IC=100mA
fT
VCE=5.0V, IC=500μA, f=20MHz
Cob
VCB=5.0V, IE=0, f=1.0MHz
Cib
VBE=0.5V, IC=0, f=1.0MHz
hfe
VCE=5.0V, IC=1.0mA, f=1.0kHz
NF
VCE=5.0V, IC=100μA, RS=10kΩ
f=10Hz to 15.7kHz
MATCHING CHARACTERISTICS:
SYMBOL
TEST CONDITIONS
|VBE1-VBE2|
VCE=5.0V, IC=1.0μA
|VBE1-VBE2|
VCE=5.0V, IC=5.0μA
|VBE1-VBE2|
VCE=5.0V, IC=10μA
|VBE1-VBE2|
VCE=5.0V, IC=100μA
50
50
5.0
100
350
-65 to +150
357
(TA=25°C unless otherwise noted)
MIN
TYP
MAX
50
50
50
135
50
65
5.0
8.7
45
100
110
400
700
800
300
430
900
300
435
300
430
50
125
100
4.0
15
350
1400
3.0
MIN
MAX
10
10
10
10
UNITS
V
V
V
mA
mW
°C
°C/W
UNITS
nA
nA
V
V
V
mV
mV
mV
MHz
pF
pF
dB
UNITS
mV
mV
mV
mV
R3 (29-June 2015)
CMLT5088EM
SURFACE MOUNT SILICON
DUAL, MATCHED
NPN TRANSISTOR
SOT-563 CASE - MECHANICAL OUTLINE
PIN CONFIGURATION
LEAD CODE:
1) Emitter Q1
2) Base Q1
3) Collector Q2
4) Emitter Q2
5) Base Q2
6) Collector Q1
MARKING CODE: 88M
R3 (29-June 2015)
w w w. c e n t r a l s e m i . c o m
CMLT5088EM
SURFACE MOUNT SILICON
DUAL, MATCHED
NPN TRANSISTOR
SERVICES
• Bonded Inventory
• Custom Electrical Screening
• Custom Electrical Characteristic Curves
• SPICE Models
• Custom Packaging
• Package Base Options
• Custom Device Development / Multi Discrete Modules (MDM™)
• Bare Die Available for Hybrid Applications
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R3 (29-June 2015)
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