Toshiba CMZB82 Communication, control and measurement equipment constant voltage regulation Datasheet

CMZB68~CMZB390
TOSHIBA Zener Diode
Silicon Junction
CMZB68~CMZB390
○ Communication, Control and
Measurement Equipment
○ Constant Voltage Regulation
0.65 ± 0.2
Unit: mm
•
Zener voltage: VZ = 68 to 390 V
•
Suitable for high-density board assembly due to the use of a small
surface-mount package, M−FLATTM
Absolute Maximum Ratings (Ta = 25°C)
①
0.16
0.65 ± 0.2
Power dissipation: P = 1.0 W
4.7 ± 0.2
•
3.8 ± 0.1
②
1.75 ± 0.1
Rating
Power dissipation
P
Junction temperature
Tj
150
°C
Tstg
−55 to 150
°C
Storage temperature range
Note :
1.0 (Note 1)
Unit
+ 0.2
2.4 − 0.1
W
0.98 ± 0.1
Symbol
0 ~ 0.1
Characteristics
① ANODE
② CATHODE
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
JEDEC
―
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
JEITA
―
operating temperature / current / voltage, etc.) are within the
TOSHIBA
3-4E1A
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the
Weight: 0.023 g (typ.)
Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and
estimated failure rate, etc).
Note 1: Ta = 40°C
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Land pattern: 6 mm × 6 mm
Board thickness: 1.6 mm
Land pattern dimensions for reference only
2.1
Unit: mm
1.4
3.0
1.4
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CMZB68~CMZB390
Electrical Characteristics (Ta = 25°C)
Zener Voltage
Vz (V)
Type
Measurement
Current
IZ (mA)
Dynamic
Resistance
rd (Ω)
Measurement
Current
Max
IZ (mA)
Min
Typ.
Max
CMZB68
61.2
68
74.8
4
120
CMZB75
67.5
75
82.5
4
CMZB82
73.8
82
90.2
CMZB100
90
100
CMZB110
99
110
CMZB150
135
CMZB180
Temperature
Coefficient
Forward Voltage
VF (V)
αT (mV/°C)
Measurement
Current
IF (A)
Reverse Current
IR (μA)
Max
Measurement
Voltage
VR (V)
Typ.
Max
Max
4
57
90
1.2
0.2
10
54.4
150
4
66
104
1.2
0.2
10
60
3
170
3
71
113
1.2
0.2
10
65.6
110
3
300
3
87
138
1.2
0.2
10
80
121
3
300
3
96
152
1.2
0.2
10
88
150
165
2
450
2
136
210
1.2
0.2
10
120
162
180
198
1.5
500
1.5
161
254
1.2
0.2
10
144
CMZB200
180
200
220
1.5
500
1.5
170
269
1.2
0.2
10
160
CMZB220
198
220
242
0.5
5000
0.5
200
309
1.2
0.2
10
176
CMZB240
216
240
264
0.5
5000
0.5
215
343
1.2
0.2
10
192
CMZB270
243
270
297
0.5
5000
0.5
243
385
1.2
0.2
10
216
CMZB300
270
300
330
0.5
5000
0.5
270
428
1.2
0.2
10
240
CMZB330
297
330
363
0.5
5000
0.5
296
473
1.2
0.2
10
264
CMZB390
351
390
429
0.5
10000
0.5
350
555
1.2
0.2
10
312
Marking
Abbreviation Code
Part No.
Abbreviation Code
Part No.
B68
CMZB68
B2A
CMZB200
B75
CMZB75
B2C
CMZB220
B82
CMZB82
B2E
CMZB240
B1A
CMZB100
B2H
CMZB270
B1B
CMZB110
B3A
CMZB300
B1F
CMZB150
B3D
CMZB330
B1J
CMZB180
B3K
CMZB390
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CMZB68~CMZB390
Handling Precaution
1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even
for a moment. Do not exceed any of these ratings. The following are the general derating methods that we
recommend when you design a circuit with a device.
P:
We recommend that the worst case power dissipation be no greater than 50% of the
absolute maximum rating of power dissipation. Carry out adequate heat design.
PRSM:
We recommend that a device be used within the recommended area in the figure,
PRSM-tw.
Tj:
Derate this rating when using a device in order to ensure high reliability.
We recommend that the device be used at Tj of below 120°C.
2)
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a land pattern to match the appropriate thermal resistance
value.
3)
Please refer to the Rectifiers databook for further information.
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CMZB68~CMZB390
αT – V Z
Ta max – P
(typ.)
400
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Land pattern: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
350
Temperature coefficient of
Zener voltage αT (mV/°C)
Maximum allowable temperature
Ta max (°C)
160
120
80
40
300
250
200
150
100
50
0
0
0.2
0.4
0.6
0.8
Power dissipation P
1.0
0
1.2
0
50
100
150
200
250
Zener voltage
(W)
VZ
300
350
400
(V)
PRSM – tW (reference value)
1000
tW
Ta = 25°C
Rectangular pulse
100
10
Recommended
0.1
1
Pulse width
10
tW
(ms)
rth (j-a) – t
1000
Transient thermal impedance
rth (j-a) (°C/W)
Non-repetitive peak reverse
Power dissipation PRSM (W)
PRSM
Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Land pattern: 2.1 mm × 1.4 mm
Board thickness: 1.6 mm
100
10
1
0.1
0.001
Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Land pattern: 6.0 mm × 6.0 mm
Board thickness: 1.6 mm
Device mounted on a ceramic board:
Board size: 50 mm × 50 mm
Land pattern: 2.0 mm × 2.0 mm
Board thickness: 0.64 mm
0.01
0.1
1
10
100
1000
Time t (s)
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2011-06-20
CMZB68~CMZB390
RESTRICTIONS ON PRODUCT USE
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5
2011-06-20
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