AD CN-0017 Interfacing the adl5371 i/q modulator to the ad9779a dual-channel, 1 gsps high speed dac Datasheet

Circuit Note
CN-0017
Circuit Designs Using Analog Devices Products
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Devices Connected/Referenced
AD9779A
Dual 16-Bit, 1 GSPS DAC
ADL5371
500 MHz to 1500 MHz I/Q Modulator
Interfacing the ADL5371 I/Q Modulator to the AD9779A
Dual-Channel, 1 GSPS High Speed DAC
CIRCUIT FUNCTION AND BENEFITS
This circuit provides a simple, elegant interface between the
ADL5371 I/Q modulator and the AD9779A high speed DAC.
The ADL5371 and the AD9779A are well-matched devices
because they have the same bias levels and similarly high
signal-to-noise ratios (SNR). The matched bias levels of 500 mV
allow for a “glueless” interface—there is no requirement for a
level shifting network that would add noise and insertion loss
along with extra components. The addition of the swinglimiting resistors (RSLI, RSLQ) allows the DAC swing to be
scaled appropriately without loss of resolution or of the 0.5 V
bias level. The high SNR of each device preserves a high SNR
through the circuit.
CIRCUIT DESCRIPTION
The ADL5371 is designed to interface with minimal
components to members of Analog Devices family of
TxDAC® converters (AD97xx). The baseband inputs of the
ADL5371 require a dc common-mode bias voltage of 500 mV.
With each AD9779A output swinging from 0 mA to 20 mA,
a single 50 Ω resistor to ground from each of the DAC outputs
provides the desired 500 mV dc bias. With just the four 50 Ω
resistors in place, the voltage swing on each pin is 1 V p-p.
This results in a differential voltage swing of 2 V p-p on each
input pair.
By adding resistors RSLI and RSLQ to the interface, the output
swing of the DAC can be reduced without any loss of DAC
resolution. The resistor is placed as a shunt between each side of
the differential pair, as shown in Figure 1. It has the effect of
reducing the ac swing without changing the dc bias already
established by the 50 Ω resistors and the DAC output current.
The value of this ac swing-limiting resistor is chosen based on
the desired ac voltage swing. Figure 2 shows the relationship
between the swing-limiting resistor and the peak-to-peak ac
swing that it produces when 50 Ω bias-setting resistors are used.
Note that all Analog Devices I/Q modulators present a relatively
high input impedance on their baseband inputs (typically >1 kΩ).
As a result, the input impedance of the I/Q modulator will have
no effect on the scaling of the DAC output signal.
2.0
19
OUT1_P
92
RBIN
50Ω
20
84
23
OUT2_N
OUT2_P
IBBP
1.6
RSLI
100Ω
OUT1_N
RBQN
50Ω
RBQP
50Ω
83
1.8
IBBN
QBBN
RSLQ
100Ω
1.4
1.2
1.0
0.8
0.6
0.4
0.2
24
QBBP
08210-001
RBIP
50Ω
ADL5371
Figure 1. Interface Between the AD9779A and ADL5371 with 50 Ω Resistors
to Ground to Establish the 500 mV DC Bias for the ADL5371 Baseband Inputs
(Simplified Schematic)
0
10
100
1k
RL (Ω)
10k
08210-002
93
DIFFERENTIAL SWING (V p-p)
AD9779A
Figure 2. Relationship Between the AC Swing-Limiting Resistor and the
Peak-to-Peak Voltage Swing with 50 Ω Bias-Setting Resistors
Rev. A
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CN-0017
Circuit Note
It is generally necessary to low-pass filter the DAC outputs to
remove image frequencies when driving a modulator. The
above interface lends itself well to the introduction of such a
filter. The filter can be inserted between the dc bias setting
resistors and the ac swing-limiting resistor. Doing so establishes
the input and output impedances for the filter.
A simulated filter example is shown in Figure 3 with a third-order
elliptical filter with a 3 dB frequency of 3 MHz. Matching input
and output impedances makes the filter design easier, so the
shunt resistor chosen is 100 Ω, producing an ac swing of 1 V p-p
differential for a 0 mA to 20 mA DAC full-scale output current.
In a practical application, the use of standard value components,
along with the input impedance of the I/Q modulator (2900 kΩ
in parallel with a few picofarads of input capacitance), will slightly
change the frequency response of this circuit.
93
19
OUT1_P
RBIP
50Ω
RBIN
92 50Ω
1.1nF
C1I
1.1nF
C2I
OUT1_N
LNI
2.7nH
LNQ
2.7nH
84
23
OUT2_N
RBQN
50Ω
RBQP
83 50Ω
1.1nF
C1Q
1.1nF
C2Q
LEARN MORE
MT-016 Tutorial, Basic DAC Architectures III: Segmented DACs.
Analog Devices.
IBBN
MT-017 Tutorial, Oversampling Interpolating DACs. Analog
Devices.
MT-031 Tutorial, Grounding Data Converters and Solving the
Mystery of 'AGND' and 'DGND'. Analog Devices.
QBBN
RSLQ
100Ω
24
OUT2_P
IBBP
RSLI
100Ω
20
The interface described here can be used to interface
any TxDAC converter with ground referenced 0 mA to 20 mA
output currents to any I/Q modulator with a 0.5 V input bias
level. For zero-IF applications, the AD9783 dual DAC provides
an LVDS interface, while the CMOS-driven AD9788 dual DAC
can generate a fine resolution complex IF input to the I/Q
modulator. The ADL5370/ADL5371/ADL5372/ADL5373/
ADL5374 family of I/Q modulators provides narrow-band
operation with high output 1 dB compression point and OIP3,
whereas the ADL5375 provides broadband high performance
operation from 400 MHz to 6 GHz. The ADL5385 I/Q modulator uses a 2 × LO and operates from 50 MHz to 2.2 GHz.
AN-772 Application Note, A Design and Manufacturing Guide
for the Lead Frame Chip Scale Package (LFCSP). Analog
Devices.
ADL5371
LPI
2.7nH
MT-080 Tutorial, Mixers and Modulators. Analog Devices.
QBBP
LPQ
2.7nH
08210-003
AD9779A
COMMON VARIATIONS
Figure 3. DAC Modulator Interface with 3 MHz Third-Order, Low-Pass Filter
(Calculated Component Values)
All the power supply pins of the ADL5371 must be connected to
the same 5 V source. Adjacent pins of the same name can be
tied together and decoupled to a large area ground plane with a
0.1 µF capacitor. These capacitors should be located as close as
possible to the device. The power supply can range between
4.75 V and 5.25 V.
The COM1 pin, COM2 pin, COM3 pin, and COM4 pin should
be tied to the same ground plane through low impedance paths.
The exposed paddle on the underside of the package should
also be soldered to a low thermal and electrical impedance
ground plane. If the ground plane spans multiple layers on the
circuit board, they should be stitched together with nine vias
under the exposed paddle. The AN-772 application note
discusses the thermal and electrical grounding of the
LFCSP_VQ in greater detail.
MT-101 Tutorial, Decoupling Techniques. Analog Devices.
Zumbahlen, Hank. 2006. Basic Linear Design. Analog Devices.
ISBN 0915550281. Chapters 4 and 11. Also available as
Linear Circuit Design Handbook. Elsevier-Newnes, 2008,
ISBN 0750687037, Chapters 4 and 11.
Data Sheets
AD9779A Data Sheet.
ADL5371 Data Sheet.
REVISION HISTORY
5/09—Rev. 0 to Rev. A
Updated Format .................................................................. Universal
10/08—Revision 0: Initial Version
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CN08210-0-5/09(A)
Rev. A | Page 2 of 2
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