Toshiba CRG04 General-purpose rectifier application Datasheet

CRG04
TOSHIBA Rectifier Silicon Diffused Type
CRG04
General-Purpose Rectifier Applications
Unit: mm
•
Repetitive peak reverse voltage: VRRM = 600 V
•
Average forward current: IF (AV) = 1.0 A
•
Average forward voltage: VFM = 1.1V(Max)
•
Suitable for high-density board assembly due to the use of a small
surface-mount package, S−FLATTM
0.65 ± 0.2
2.6 ± 0.1
3.5 ± 0.2
Absolute Maximum Ratings (Ta = 25°C)
0.9 ± 0.1
Rating
Unit
Repetitive Peak Reverse Voltage
VRRM
600
V
Average Forward Current
IF (AV)
1.0(Note1)
A
IFSM
15.0 (50Hz)
A
Tj
−40 to 150
°C
Tstg
−40 to 150
°C
Peak One Cycle Surge Forward
Current (Non−Repetitive)
Junction Temperature
Storage Temperature Range
Note 1: Ta=66°C
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
board thickness: 0.64 mm
Half-sine waveform: α =180°
①
0.98 ± 0.1
Symbol
0.16
+ 0.2
1.6 − 0.1
0 ~ 0.1
Characteristics
0.65 ± 0.2
②
① ANODE
② CATHODE
JEDEC
―
JEITA
―
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Thermal resistance
Symbol
Test Condition
Min
Typ.
Max
Unit
VFM(1)
IFM = 0.1 A (Pulse test)
⎯
0.84
⎯
V
VFM(2)
IFM = 0.7 A (Pulse test)
⎯
0.95
⎯
V
VFM(3)
IFM = 1.0 A (Pulse test)
⎯
0.98
1.1
V
VRRM = 600 V (Pulse test)
⎯
⎯
10
μA
⎯
⎯
65
IRRM
Rth (j-a)
Rth (j-ℓ)
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64 mm
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6 mm
―
1
°C/W
⎯
⎯
130
⎯
⎯
20
°C/W
2008-02-01
CRG04
Marking
Abbreviation Code
Part No.
G4
CRG04
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Handling Precaution
The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant. The
following are the general derating methods that we recommend when you design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum
rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device
at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the maximum rating of IF(AV). Carry out
adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an
allowable Ta max-IF (AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
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CRG04
PF (AV) – IF (AV)
iF – vF
10
Half-sine waveform
Average forward power dissipation
PF (AV) (W)
Pulse test
iF (A)
Instantaneous forward current
1.2
Tj = 150°C
1
75°C
25°C
0.1
0.01
0
0.4
0.8
1.2
1.6
0°
0.8
180°
Conduction angle 180°
0.6
0.4
0.2
0
0
2.0
Instantaneous forward voltage vF
1.0
0.2
0.4
(V)
Ta max – IF (AV)
0.8
1.0
IF (AV)
(A)
1.2
Ta max – IF (AV)
Device mounted on a glass-epoxy board
(Board size: 50mm x 50mm, Soldering land: 6mm x 6mm)
Device mounted on a ceramic board
(Board size: 50mm x 50mm, Soldering land: 2mm x 2mm)
160
160
Half-sine waveform
140
140
120
0°
100
180°
Conduction angle 180°
80
60
40
20
Maximum allowable temperature
Ta max (°C)
Maximum allowable temperature
Ta max (°C)
0.6
Average forward current
120
100
80
60
Half-sine waveform
40
0°
20
180°
Conduction angle 180°
0
0
0.2
0.4
0.6
Average forward current
0.8
1.0
IF (AV)
(A)
0
1.2
0
0.2
0.4
0.6
Average forward current
0.8
1.0
IF (AV)
(A)
1.2
Surge forward current
rth (j-a) – t
(non-repetitive)
10000
Ta = 25°C
f = 50 Hz
(1) Device mounted on a ceramic board:
Soldering land: 2 mm × 2 mm
Transient thermal impedance
rth (j-a) (°C/W)
Peak surge forward current
IFSM (A)
16
12
8
4
0
1
3
5
10
30
50
1000
(2) Device mounted on a glass-epoxy board:
Soldering land: 6 mm × 6 mm
100
(2)
(1)
10
1
0.001
100
Number of cycles
0.01
0.1
1
10
100
Time t (s)
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2008-02-01
CRG04
RESTRICTIONS ON PRODUCT USE
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
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injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
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information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
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2008-02-01
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