Toshiba CRZ15 Zener diode silicon epitaxial type Datasheet

CRY62~CRZ47
TOSHIBA Zener Diode
Silicon Epitaxial Type
CRY62~CRZ47
Applications:
Communication, Control and
Unit: mm
削除: Automation
Measurement Equipment
Constant Voltage Regulation
Transient Suppressors
z Average power dissipation: P = 0.7 W
z Zener voltage: VZ = 6.2~47 V
z Suitable for compact assembly due to small surface-mount package
“S−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Power dissipation
P
700
mW
Junction temperature
Tj
−40 ~ 150
°C
Tstg
−40 ~ 150
°C
Storage temperature range
削除: Use in
JEDEC
―
JEITA
―
Note: Using continuously under heavy loads (e.g. the application of high
TOSHIBA
3-2A1A
temperature/current/voltage and the significant change in
Weight: 0.013 g (typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
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2006-11-09
CRY62~CRZ47
Electrical Characteristics (Ta = 25°C)
Zener
Impedance
Zener Voltage
Product
No.
VZ
(V)
Measurement
Current
IZ
(mA)
rd
(Ω)
Min
Typ.
Max
CRY62
5.6
6.2
6.8
10
60
CRY68
6.2
6.8
7.4
10
60
CRY75
6.8
7.5
8.3
10
CRY82
7.4
8.2
9.0
CRY91
8.2
9.1
10.0
CRZ10
9.0
10.0
11.0
Max
Measurement
Current
IZ
(mA)
Temperature
Coefficient
of Zener
Voltage
αT
(mV / °C)
Forward
Voltage
VF
(V)
Measure
-ment
Current
IF
(A)
Reverse
Current
IR
(μA)
Max
Measurement
Voltage
VR
(V)
Typ.
Max
Max
10
2
3
1.0
0.2
10
3.0
10
3
4
1.0
0.2
10
3.0
30
10
4
5
1.0
0.2
10
4.5
10
30
10
4
6
1.0
0.2
10
4.9
10
30
10
5
8
1.0
0.2
10
5.5
10
30
10
6
9
1.0
0.2
10
6.0
CRZ11
9.9
11.0
12.1
10
30
10
7
11
1.0
0.2
10
7.0
CRZ12
10.8
12.0
13.2
10
30
10
8
13
1.0
0.2
10
8.0
CRZ13
11.7
13.0
14.3
10
30
10
9
14
1.0
0.2
10
9.0
CRZ15
13.5
15.0
16.5
10
30
10
11
17
1.0
0.2
10
10.0
CRZ16
14.4
16.0
17.6
10
30
10
12
19
1.0
0.2
10
11.0
CRZ18
16.2
18.0
19.8
10
30
10
14
23
1.0
0.2
10
13.0
CRZ20
18.0
20.0
22.0
10
30
10
16
26
1.0
0.2
10
14.0
CRZ22
19.8
22.0
24.2
10
30
10
18
28
1.0
0.2
10
16.0
CRZ24
21.6
24.0
26.4
10
30
10
20
32
1.0
0.2
10
17.0
CRZ27
24.3
27.0
29.7
10
30
10
23
36
1.0
0.2
10
19.0
CRZ30
27.0
30.0
33.0
10
30
10
25
40
1.0
0.2
10
21.0
CRZ33
29.7
33.0
36.3
10
30
10
26
41
1.0
0.2
10
26.4
CRZ36
32.4
36.0
39.6
9
30
9
28
45
1.0
0.2
10
28.8
CRZ39
35.1
39.0
42.9
8
35
8
30
48
1.0
0.2
10
31.2
CRZ43
38.7
43.0
47.3
7
40
7
33
53
1.0
0.2
10
34.4
CRZ47
42.3
47.0
51.7
6
65
6
38
60
1.0
0.2
10
37.6
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2006-11-09
CRY62~CRZ47
Marking
Abbreviation Code
Part No.
6□2
CRY62
6□8
CRY68
7□5
CRY75
8□2
CRY82
9□1
CRY91
□10
CRZ10
□11
CRZ11
□12
CRZ12
□13
CRZ13
□15
CRZ15
□16
CRZ16
□18
CRZ18
□20
CRZ20
□22
CRZ22
□24
CRZ24
□27
CRZ27
□30
CRZ30
□33
CRZ33
□36
CRZ36
□39
CRZ39
□43
CRZ43
□47
CRZ47
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
P:
We recommend that the worst case power dissipation be no greater than 50% of the absolute
maximum rating of power dissipation. Carry out adequate heat design.
PRSM:
We recommend that a device be used within the recommended area in the figure, PRSM-tw.
Tj:
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a Tj of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
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2006-11-09
CRY62~CRZ47
Ta max – P
140
Maximum allowable ambient
temperature Ta max (°C)
PRSM – tW
Device mounted on a glass-epoxy
board
Soldering land: 6 mm × 6 mm
120
100
80
60
40
20
1000
Non-repetitive peak reverse
power dissipation PRSM (W)
160
300
tW
Rectangular pulse
Ta = 25°C
100
Recommended
50
30
10
5
3
0.01
0
0
0.2
0.4
0.6
Power dissipation
0.8
P
0.03
1.0
0.1
0.3
Pulse width
(W)
αT – VZ
1
tW
3
10
(ms)
αT – VZ
(typ.)
(typ.)
40
25
CRY62~CRZ27
CRZ30~CRZ47
Temperature coefficient of
zenner voltage αT (mV/°C)
Temperature coefficient of
zenner voltage αT (mV/°C)
PRSM
500
20
15
10
5
0
0
4
8
12
16
Zenner voltage
20
VZ
24
35
30
25
26
28
(V)
30
34
38
Zenner voltage
42
VZ
46
50
(V)
rth (j-a) – t
Transient thermal impedance
rth (j-a) (°C/W)
10000
(1) Device mounted on a ceramic board
Soldering land: 2 mm × 2 mm
1000
(2) Device mounted on a glass-epoxy board
Soldering land: 6 mm × 6 mm
削除: n
100
(2)
(1)
10
1
0.001
0.01
0.1
Time
1
t
10
100
(s)
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2006-11-09
CRY62~CRZ47
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
5
2006-11-09
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