CALMIRCO CSPESD303G 1,2 and 3-channel esd arrays in csp Datasheet

CSPESD301/302/303
1,2 and 3-Channel ESD Arrays in CSP
Features
Product Description
•
•
The CSPESD301/302/303 is a family of 1, 2, and 3channel ESD protection arrays, which integrate two,
three and four identical avalanche-style diodes. It is
intended that one of these diodes is connected to GND
and the other diodes provide ESD protection for up to 3
lines depending upon the configuration utilized. The
back-to-back diode connections provide ESD protection for nodes that have AC signals up to 5.9V peak.
These devices provide a very high level of protection
for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The diodes
are designed and characterized to safely dissipate
ESD strikes of ±15kV, well beyond the maximum
requirements of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices
protection against contact discharges at greater than
±30kV. The diodes also provide some EMI filtering,
when used in combination with a PCB trace or series
resistor.
•
•
•
•
•
•
1, 2 or 3 channels of ESD protection
±15kV ESD protection (IEC 61000-4-2, contact
discharge)
±30kV ESD protection (HBM)
Supports both AC and DC signal applications
Low leakage current (<100nA)
Chip Scale Package features extremely low lead
inductance for optimum ESD and filter performance
4 bump, 1.06 x 0.93mm footprint Chip Scale Package (CSP)
Lead-free version available
Applications
•
•
•
•
•
•
•
I/O port protection
EMI filtering for data ports
Cellphones, notebook computers, PDAs
Wireless Handsets
MP3 Players
Digital Still Cameras
Handheld PCs
These devices are particularly well suited for portable
electronics (e.g. cellular telephones, PDAs, notebook
computers) because of their small package format and
easy-to-use pin assignments.
The CSPESD301/2/3 is available in a space-saving,
low-profile, chip-scale package with optional lead-free
finishing.
Electrical Schematics
A2
B1
CSPESD301
A2
B1
B2
CSPESD302
A1
A2
B1
B2
CSPESD303
© 2003 California Micro Devices Corp. All rights reserved.
12/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
1
CSPESD301/302/303
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
(see note 2)
A1
A
B
n*
A2
A1
B2
B1
Orientation
Marking
* See ordering information for
appropriate part marking.
CSPESD301/302/303
4-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
3) All 4 bumps are always present. Unused bumps are electrically unconnected.
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish 2
Standard Finish
Ordering Part
Bumps
Package
Number1
4
CSP
4
CSP
4
CSP
Ordering Part
Part Marking
Number1
CSPESD301
F
CSPESD301G
F
CSPESD302
G
CSPESD302G
G
CSPESD303
H
CSPESD303G
H
Part Marking
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/10/03
CSPESD301/302/303
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-65 to +150
°C
200
mW
RATING
UNITS
-40 to +85
°C
DC Package Power Rating
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
PARAMETER
CONDITIONS
MIN
VSO
Diode Stand-off Voltage
IDIODE = ±10µA
±5.9
ILEAK
Diode Leakage Current
VIN=3.3V
VSIG
Small Signal Clamp Voltage
Positive Clamp
Negative Clamp
IDIODE = 10mA
IDIODE = -10mA
VESD
VCL
RD
C
TYP
Notes 2, 3 and 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Between adjacent bumps
Between diagonal bumps
Notes 2, 3 and 4
Dynamic Resistance
Between adjacent bumps
Between diagonal bumps
Notes 2, 3 and 4
Capacitance
At 0VDC, 1MHz, 30mVAC
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to
another diode, one at a time.
Note 3: Unused pins are left open.
Note 4: These parameters are guaranteed by design and characterization.
UNITS
V
6.0
-9.2
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
MAX
7.6
-7.6
100
nA
9.2
-6.0
V
V
±30
kV
±15
kV
19.5
19.9
V
V
0.85
1.10
Ω
Ω
27
pF
I
IESD
slope = 1/R
D
10mA
10µA
ILEAK
3.3V
VSO
VSIG
VCL
V
Figure 1. Parameter Legend
© 2003 California Micro Devices Corp. All rights reserved.
12/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
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CSPESD301/302/303
Performance Information
Figure 2. Typical EMI Filter Performance (0VDC, 50 Ohm Environment)
Figure 3. Typical Capacitance VS. Input Voltage (normalized to 0Vdc)
© 2003 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/10/03
CSPESD301/302/303
Performance Information (cont’d)
I (µA)
8
6
4
2
-8
-6
-4
-2
2
4
6
8
V (V)
-2
-4
-6
-8
Figure 4. Low Current I-V Curve
High Current I-V Characteristic - Pads A1 to A2
2.0
1.5
Current [A]
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-12 -11 -10 -9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10 11 12
Voltage [V]
Figure 5. High Current I-V Curve
© 2003 California Micro Devices Corp. All rights reserved.
12/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
CSPESD301/302/303
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/10/03
CSPESD301/302/303
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CSPESD301/302/303 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are
shown below. For complete information on CSP packaging, see the California Micro Devices CSP Package
Information document.
BOTTOM VIEW
SIDE
VIEW
A1
C1
PACKAGE DIMENSIONS
Custom CSP
Bumps
A
4
Millimeters
1
Inches
Min
Nom
Max
A1
0.881
0.925
0.971
0.0347 0.0365 0.0382
A2
1.015
1.060
1.105
0.0400 0.0417 0.0435
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.495
0.500
0.505
0.0195 0.0197 0.0199
C1
0.163
0.213
0.263
0.0064 0.0084 0.0104
C2
0.230
0.280
0.330
0.0091 0.0110 0.0130
D1
0.561
0.605
0.649
0.0221 0.0238 0.0255
D2
0.355
0.380
0.405
0.0140 0.0150 0.0159
# per tape and
reel
Min
2
C2
Dim
B
A2
Package
B2
B1
Nom
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Max
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPESD301/302/303 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CSPESD301
CSPESD302
CSPESD303
1.06 X 0.93 X 0.6
1.14 X 1.00 X 0.70
8mm
178mm (7")
3500
4mm
4mm
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 9. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
12/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
7
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