RSG CX1CSM3 530 khz to 2.1 mhz low profile, miniature surface mount quartz crystal Datasheet

CX1SM CRYSTAL
530 kHz to 2.1 MHz
Low Profile, Miniature Surface Mount Quartz Crystal
™
DESCRIPTION
The CX1SM quartz crystals are leadless devices designed
for surface mounting on printed circuit boards or hybrid
substrates. They are hermetically sealed in a rugged,
miniature ceramic package. The CX1SM crystal is
manufactured using the STATEK-developed photolithographic process, and was designed utilizing the
experience acquired by producing millions of crystals for
industrial, commercial, military and medical applications.
Maximum process temperature should not exceed 260OC.
actual size
side view
Glass Lid Shown
PACKAGE DIMENSIONS
FEATURES
Extensional mode
D
Ideal for use with microprocessors
Designed for low power applications
A
Compatible with hybrid or PC board packaging
TOP
BOTTOM
Low aging
E
D
Full military testing available
Ideal for battery operated applications
EQUIVALENT CIRCUIT
L1
C1
C
TYP.
C0
1
E
B
Designed and manufactured in the USA
R1
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
2
DIM
inches
mm
inches
mm
A
0.315
8.00
0.330
8.38
B
0.140
3.56
0.155
3.94
C
-
-
D
0.045
1.14
0.055
1.40
E
0.060
1.52
0.070
1.78
DIM “C”
SUGGESTED LAND PATTERN
0.070 (1.78)
MAX.
GLASS LID
see below
CERAMIC LID
MAX
inches
mm
inches
mm
SM1
0.065
1.65
0.070
1.78
SM2
0.067
1.70
0.072
1.83
SM3
0.070
1.78
0.075
1.90
0.160 (4.06)
inches (mm)
0.270 (6.86)
IS O
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
YS
90
01
ERT
T E M C IFIC T
A
N
IO
S
10129 - Rev B
TYPICAL APPLICATION
FOR A PIERCE OSCILLATOR
SPECIFICATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
Parameters
Fundamental
Overtone
Frequency Range, (Hz)
555 k 614 k 1.0 M 1.4 M1.8432 M 2.1M
Motional Resistance,R1(Ω)
600
275
500
Motional Capacitance,C1 (fF)
2.5
3.6
2.0
Quality Factor, Q (k)
Shunt Capacitance,C0 (pF)
170
260
1.2
1.3
Motional Resistance,R1 MAX
Calibration Tolerance*
775
300
475
1.5
2.8
2.6
190
100
110
70
1.1
1.0
1.3
1.3
3 kΩ
+
_
500 ppm (0.05%)
+
_
1000 ppm (0.1%)
+
_
10000 ppm (1.0%)
3 µW MAX
Drive Level
Load Capacitance**
7 pF
Turning Point (T0)**
35OC
Temperature Coefficient (k) -0.035 ppm/OC2
Note: Frequency f at temperature T is related to frequency f0
2
at turning point temperature T0 by: f-f0 =
k(T-T0)
f0
Function Mode
Aging, first year
Shock, survival
Vibration, survival
Operating Temp. Range
Storage Temp. Range
Max Process Temperature
Extensional
5 ppm MAX
750 g peak, 0.3 ms, 1/2 sine
10 g RMS, 20-1,000 Hz random
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
-55OC to +125OC
260OC for 20 sec.
The low profile CX miniature surface mount crystal is ideal
for small, high density, battery operated portable products.
The CX crystal designed in a Pierce oscillator (single
inverter) circuit provides very low current consumption and
high stability. A conventional CMOS Pierce oscillator circuit
is shown below. The crystal is effectively inductive and in a
PI-network circuit with CD and CG provides the additional
phase shift necessary to sustain oscillation. The oscillation
frequency (f0) is 15 to 250 ppm above the crystal’s series
resonant frequency (fS).
Drive Level
RA is used to limit the crystal’s drive level by forming a
voltage divider between RA and CD. RA also stabilizes the
oscillator against changes in the amplifiers output
resistance (R0). RA should be increased for higher voltage
operation.
Load Capacitance
The CX crystal calibration tolerance is influenced by the
effective circuit capacitances, specified as the load
capacitance (CL). CL is approximately equal to:
CL =
CD x CG
CD + CG
NOTE: CD and CG include stray layout to ground and CS
is the stray shunt capacitance between the crystal
terminal. In practice, the effective value of CL will be less
than that calculated from CD, CG and CS values because
of the effect of the amplifier output resistance. CS should
be minimized.
The oscillation frequency (f0) is approximately equal to:
[
f0 = fS 1 +
*Tighter tolerances available.
** Other values available.
Where f
S
C1
C0
TERMINATIONS
Designation
SM1
SM2
SM3
Termination
Gold Plated
Solder Plated
Solder Dipped
(1)
+ CS
C1
2(C0 + CL)
]
(2)
= Series resonant frequency of the crystal
= Motional Capacitance
= Shunt Capacitance
CONVENTIONAL CMOS
PIERCE OSCILLATOR CIRCUIT
Rf
PACKAGING OPTIONS
CX1SM
BUFFER
- Tray Pack
- Tape and Reel
(Reference tape and reel data sheet 10109)
AMPLIFIER
HOW TO ORDER CX1SM CRYSTALS
CX1
S
C
SM1
Blank = Glass Lid
C = Ceramic Lid
Frequency
K = kHz
M = MHz
500
OSC
Freq (fO )
/ M
Operating Temp. Range:
C = -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
Calibration
S = Customer Specified
Tolerance
@ 25OC
(in ppm)
CG
CX1
XTAL
CD
10129 - Rev B
IS O
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
YS
90
01
ERT
T E M C IFIC T
A
N
IO
S
“S” if special or
custom design.
Blank if Std.
SM1 = Gold Plated
SM2 = Solder Plated
SM3 = Solder Dipped
1.0M,
RA
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