Sony CXA2677GA Optical pickup chipset with cd/dvd recording photodetector ic (pdic) supports high-speed writing to both cd and dvd media Datasheet

Optical Pickup Chipset with CD/DVD Recording Photodetector IC (PDIC)
Supports High-Speed Writing to both CD and DVD Media
CXA2677GA
CXA2676GA
The signal processing required for DVD is far more complex than that for CD.
Sony has now developed an optical pickup chipset, the
CXA2677GA and CXA2676GA, that is appropriate for this
complex signal processing.
These devices adopt a newly-developed LGA type small
package and can contribute to the development of ultrathin pickups.
CXA2677GA
RF/Servo PDIC
■ Supports high-speed CD/DVD write operations
(CD-R: ×52-speed, DVD-R: ×8-speed)
■ WPP1 (A + B) and WPP2 (C + D) outputs, which are
optimal for DVD address bit detection
■ Band limiter function for write operations
■ Eight-section photodiode for DPP
■ 16-pin LGA COB small package
CXA2676GA
Laser front monitor PDIC
■ Two-channel structure (Vin1, Vin2)
■ Chip capacitors (1005) included
■ 8-pin LGA COB small package
CXA2677GA
The CXA2677GA is a photodetector IC
(PDIC) that was developed as the photodetector element for optical pickups used
in DVD ±R/RW drives. It features two
additional pins: WPP1 (A + B) and WPP2
(C + D). This allows the generation of the
WRF signal used in earlier (CXA2660N)
CD-R/RW systems with the WPP1 +
WPP2 signal and the detection of address
bit signal unique to DVD ±R/RW with the
WPP1 – WPP2 signal. Also, it adopts a
three-stage structure with a write mode
and two read modes with high gain and
V
O
I
C
Despite our busy schedule, we are
confident that we succeeded in responding to our customers’ input
to the greatest extent possible in
the development of these new
products. Even though the design
period was short, we put careful
detailed attention into every single
element in these products. We are
sure our customers will be fully satisfied. It’s good to be able to relax
again now that this project is done.
10
E
low gain mode settings.
The band limiter function used in write
mode provides an average value signal
with high precision.
CXA2676GA
The CXA2676GA adopts a two-channel
structure to allow the power of the CD
laser and the DVD laser to be set individually. It achieves fast response characteristics, namely a slew rate of 250 V/µs and a
settling time of 7 ns. These characteristics
are adequate to support write speeds of ×52
for CD-R and ×8 for DVD-R.
LGA COB (chip on board)
Small Package
To increase the number of pins while retaining the package dimensions (4.5 × 3.2
mm) of the earlier chip on board (COB)
package, Sony developed a new land grid
array (LGA) package that positions the
contacts in a two-dimensional array on the
reverse side of the package. This allows
these devices to provide increased functionality without increasing the mounting
area. This package is optimal for developing ultrathin pickups, that is, pickups
for use in 9.5 mm ultrathin drives.
×3
2
Vcc
High
A'
6 Vout
Ao
×3
3
Vc
A
6
Vcc
9
Vc
1
GND
B'
3 SW
Low
Bo
8
Vc
5
4
Vc
Vin1
4
Vin2
×3
Co 14
VR1
Photodiode
Vc
IVout
×3
Do 13
×3.5
Eo 15
■ Figure 1 CXA2676GA Block Diagram
Vc
Fo
×3.5
5
Vc
Go
Vin1 5
6
SW
3
4 Vin2
1 GND
Vcc 2
■ Figure 3
12
Vc 8
IVout
C
Vout
CXA2676GA Pin
Configuration
Do
Co
Eo
D
2
3
4
5
GND
Ho
Ao
Bo
Fo
11 RF+
Ao
Bo
Co
Do
E
16 RF–
Vcc
Vc
F
Vc
×3.5
Go 12
13
14
15
16
Vc SW RF+
9
10
11
Vcc WPP2 WPP1
6
7
8
■ Figure 4
Ao
Bo
Co
Do
RF–
1
10 SW
Vc
D'
7
Vc
7
B
C'
VR2
1
GND
×3
Vc
Ho
×3.5
2
Vc
G
H
B'
C'
Vc
8
WPP1
A'
D'
7
WPP2
■ Figure 2 CXA2677GA Block Diagram
CXA2677GA Pin
Configuration
120
35
120
120
35
D
C
A
B
120
H
G
F
150
φ0.7 mm
E
Photosensitive area position:
At the package center
Unit: µm
■ Figure 6 CXA2677GA Acceptance Pattern Dimensions
Bottom view
Top view
4.5 ±0.1
1.6
4.5 ±0.1
3.2 ±0.1
0.8
Acceptance area
Bottom view
0.8
Top view
D C
A B
F E
Back side contact
Substrate
(LGA)
■ Figure 7 CXA2676GA Package Dimensions
.5
φ0
16
–
0.8
LA
ND
Colorless transparent resin
Chip
1.25 ±0.1
1.25 ±0.1
Chip
0.8
Transparent resin
(includes scattering materials)
0.35 ±0.2
0.35 ±0.2
LA
ND
16
–
φ0
.5
H G
3.2 ±0.1
■ Figure 5 CXA2676GA Acceptance Pattern Dimensions
Unit: mm
Back side contact
Unit: mm
Substrate
(LGA)
■ Figure 8 CXA2677GA Package Dimensions
11
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