Sony CXG1017N Gsm1800/1900 dpdt tx/rx antenna switch Datasheet

<For Europe and America>
CXG1017N
GSM1800/1900 DPDT TX/RX Antenna Switch
For the availability of this product, please contact the sales office.
Description
The CXG1017N is a high power DPDT switch
suitable for Digital Cellular applications. This device
is part of a growing family of MMIC Antenna switches
for digital cellular and cordless radios. It uses the
state-of-the-art Sony JFET process.
8 pin SSOP (Plastic)
Features
• Positive voltage supply only
• Low insertion loss, typically 0.7dB at 33dBm input
level
• Stable Characteristics over wide temperature range
• Fast switching-100ns Typical
• Low current consumption, 400µA typical at 5.5V
• 8 pin SSOP package (3.0 × 6.4mm)
ESD
As with other GaAs semiconductors, ESD precautions
must be adhered to.
Applications
• GSM1800 handportable
• GSM1900 handportable
• DECT basestation/handportable diversity antenna
switching
• Other digital cellular and wireless local loop
applications
Typical Application
Internal
Antenna
PA
TX IN
CXG1017N
RX OUT
LNA
External
Antenna
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E97756A79
<For Europe and America>
CXG1017N
Electrical Characteristics
Measurement Conditions, unless otherwise stated: Vctl (L) = 0V, Vctl (H) = 5.5V,
Pin = 33dBm GSM Burst (577µs pulse length with 8:1 Duty cycle), F = 1.75GHz. Temperature Range –25 to +75°C.
Parameter
Min.
Insertion loss
Isolation
14
Typ.
Max.
Unit
0.7
0.95
dB
16
dB
VSWR
1.5
Switching time
100
ns
Harmonic levels
–56
–50
dBc
Control currents
400
800
µA
P0.1dB
34.5
dBm
P0.3dB
35.5
dBm
P0.1dB for Vctl (H) = 4.5V
34
dBm
P0.1dB for Vctl (H) = 3.0V
29
dBm
Control Voltage Selection, Vctl (H)
The choice of control voltage will determine the compression characteristic of the switch and the generation of
harmonics. The table above indicates the sensitivity of P0.1dB to control voltage, whilst the graphs below
indicate the sensitivity of harmonic levels:
2nd Harmonic with Power/Control Volts
3nd Harmonic with Power/Control Volts
–20
–30
Vctl = 0/3V
Vctl = 0/4.5V
Vctl = 0/5.5V
–40
Harmonic level [dBc]
Harmonic level [dBc]
–20
–50
–30
–40
–50
Vctl = 0/3V
Vctl = 0/4.5V
Vctl = 0/5.5V
–60
–60
–70
–70
30
31
32
33
34
35
36
37
30
38
31
32
33
34
35
Input power [dBm]
Input power [dBm]
–2–
36
37
38
<For Europe and America>
Compression Characteristics
Measurement Conditions: Vctl (L) = 0V, Vctl (H) = 5.5V, GSM Burst, F = 1.75GHz
Temperature range –25 to +75°C.
Typical Characteristics over Temperature:
3.0
Insertion loss [dB]
2.5
–25°C
25°C
75°C
2.0
1.5
1.0
0.5
0
30
31
32
33
34
35
36
37
38
Input power [dBm]
Frequency Characteristics
Measurement Conditions: Vctl (L) = 0V, Vctl (H) = 5.5V, Pin = 0dBm CW, T = 25°C
Insertion Loss and Isolation vs. Frequency
0
0
–10
–2
–20
Isolation
–3
–30
–4
–40
–5
Isolation [dB]
Insertion loss [dB]
Insertion loss
–1
–50
0
1
2
3
Frequency [GHz]
–3–
CXG1017N
<For Europe and America>
CXG1017N
Schematic/Pinout
Pin No.
Port1
1
8
Port4
CTLA
2
7
CTLB
GND
3
6
GND
Port2
4
5
Port3
8pin SSOP (PLASTIC)
FUNCTION
1
RF PORT1
2
Ctl (A)
3
GROUND
4
RF PORT2
5
RF PORT3
6
GROUND
7
Ctl (B)
8
RF PORT4
Block Diagram/Truth Table
Port1
Port4
Port2
Port3
VCTLA
VCTLB
High
Low
Port1-Port2, Port3-Port4 ON
Port2-Port3, Port4-Port1 OFF
Low
High
Port2-Port3, Port4-Port1 ON
Port1-Port2, Port3-Port4 OFF
Note) Internal and External Antenna Connections should be
diagonally opposite (1-3, 2-4).
External Circuitry
C2
100pF
Port1
optional →
RRF
75kΩ
D1
C2
100pF
Port2
C2
100pF
C1
100pF
1
8
2
7
3
6
4
5
Port4
C1
100pF
D1 → optional
C2
100pF
Port3
RRF
75kΩ
When using the CXG1017N, the following external components should be used:
C1: This is used for signal line filtering 100pF is recommended.
C2: This is used for RF De-coupling and must be used in all applications. 100pF is recommended.
Rrf: This resistor is used to stabilize the dc operating point at high power levels. A value of 75kΩ is
recommended.
D1: 6.2V Zenor diodes may be incorporated at the Control lines, as indicated, in order to give improved
ESD performance if necessary.
–4–
<For Europe and America>
CXG1017N
ESD Precautions
As this is a GaAs MMIC, ESD precautions must be adhered to, as outlined in at standard Data Book.
Please contact Sony if detailed ESD performance data is required.
Configuration of External Logic Circuitry
For most portable appplicaitons, the following logic states are normally available.:
1. TX ON/OFF
2. RX ON/OFF
3. INT/EXT ANT.
A simple Logic circuit, using EXOR gates may be used to drive the CXG1017N. The following is a suggested
schematic:
TX ON/OFF
CTLA
A = TX ON/OFF
B = INT/EXT ANT
INT/EXT ANT
CTLB
RX ON/OFF
Absolute Maximum Ratings (Ta = 25°C)
• Control voltage
Vctl
7
• Operating temperature Topr
–30 to +85
• Storage temperature
Tstg
–65 to +150
• Input Power
Pin
37
Assumed
Port1 : INT ANT
Port2 : RX LNA
Port3 : EXT ANT
Port4 : TX PA
V
°C
°C
dBm
Tape and Reel Information
This device is available in Tape and Reel. Order CXG1017N-T4
Reel Quantity: 1000 pieces/reel
Reel Dimensions: 245mm. There are detailed on Page 1-112 of the package manual 93.
–5–
<For Europe and America>
CXG1017N
Sony GSM Lineup
32K × 8
CXK5T8257BTM
64K × 8
CXK5T8512TM
CXK5T81000ATM 128K × 8
64K × 16
CXK5T16100TM
MCU
SGM2016AM-21-T7
Flash
SRAM
64K × 16
90MHz
I
LNA
SAW
IT362/IT402
IT363/IT403
IT413
RX
PLL1
Q
Speech
Codec
AD
DSP
PLL2
CXA3021R
TX
I
Q
DA
CXG1037FN DCS1800
RX
SPDT Antenna Switches
HP ANT
CXG1028TM GSM 900/1800/1900
CXG1006N GSM1800/1900
CAR ANT
TX
CXG1017N GSM1800/1900
–6–
Sony IC
<For Europe and America>
Package Outline
CXG1017N
Unit: mm
8PIN SSOP (PLASTIC)
+ 0.2
1.25 – 0.1
∗3.0 ± 0.1
0.1
8
5
6.4 ± 0.2
∗4.4 ± 0.1
A
4
1
0.65
+ 0.08
0.24 – 0.07
0.25
0.13 M
(0.5)
0° to 10°
(0.15)
+ 0.025
0.17 – 0.015
+ 0.08
0.24 – 0.07
(0.22)
0.6 ± 0.15
0.1 ± 0.05
B
DETAIL A
DETAIL B
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SSOP-8P-L01
LEAD TREATMENT
SOLDER / PALLADIUM
PLATING
EIAJ CODE
SSOP008-P-0044
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.04g
JEDEC CODE
–7–
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