Cypress CY28411ZXC-1 Clock generator for intel alviso chipset Datasheet

CY28411-1
Clock Generator for Intel Alviso Chipset
Features
• 33-MHz PCI clock
• Low-voltage frequency select input
• Compliant to Intel CK410M
• I2C support with readback capabilities
• Supports Intel Pentium-M CPU
• Ideal Lexmark Spread Spectrum profile for maximum
electromagnetic interference (EMI) reduction
• Selectable CPU frequencies
• Differential CPU clock pairs
• 3.3V power supply
• 100-MHz differential SRC clocks
• 56-pin SSOP and TSSOP packages
• 96-MHz differential dot clock
• 48-MHz USB clocks
CPU
SRC
PCI
REF
DOT96
USB_48
x2 / x3
x7 / x8
x6
x1
x1
x1
Block Diagram
XIN
XOUT
CPU_STP#
PCI_STP#
XTAL
OSC
PLL1
Pin Configuration
VDD_REF
REF
PLL Ref Freq
Divider
Network
FS_[C:A]
VTT_PWRGD#
IREF
PD
PLL2
SDATA
SCLK
I2C
Logic
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
CY28411-1
VDD_PCI
VSS_PCI
PCI3
VDD_CPU
PCI4
CPUT[0:1], CPUC[0:1],
CPU(T/C)2_ITP]
PCI5
VDD_SRC
VSS_PCI
SRCT[0:6], SRCC[0:6]
VDD_PCI
PCIF0/ITP_EN
PCIF1
VTT_PWRGD#/PD
VDD_PCI
VDD_48
PCI[2:5]
USB_48/FS_A
VDD_PCIF
VSS_48
PCIF[0:1]
DOT96T
DOT96C
VDD_48 MHz
FS_B/TEST_MODE
DOT96T
SRCT0
DOT96C
SRCC0
USB_48
SRCT1
SRCC1
VDD_SRC
SRCT2
SRCC2
SRCT3
SRCC3
SRC4_SATAT
SRC4_SATAC
VDD_SRC
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
PCI2
PCI_STP#
CPU_STP#
FS_C/TEST_SEL
REF
VSS_REF
XIN
XOUT
VDD_REF
SDATA
SCLK
VSS_CPU
CPUT0
CPUC0
VDD_CPU
CPUT1
CPUC1
IREF
VSSA
VDDA
CPUT2_ITP/SRCT7
CPUC2_ITP/SRCC7
VDD_SRC
SRCT6
SRCC6
SRCT5
SRCC5
VSS_SRC
56 SSOP/TSSOP
Cypress Semiconductor Corporation
Document #: 38-07694 Rev. *B
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised March 10, 2005
CY28411-1
Pin Definitions
Pin No.
Name
Type
Description
I, PU
3.3V LVTTL input for CPU_STP# active low.
54
CPU_STP#
44,43,41,40
CPUT/C
O, DIF Differential CPU clock outputs.
36,35
CPUT2_ITP/SRCT7,
CPUC2_ITP/SRCC7
O, DIF Selectable differential CPU or SRC clock output.
ITP_EN = 0 @ VTT_PWRGD# assertion = SRC7
ITP_EN = 1 @ VTT_PWRGD# assertion = CPU2
14,15
DOT96T, DOT96C
O, DIF Fixed 96-MHz clock output.
12
FS_A/USB_48
I/O, SE 3.3V-tolerant input for CPU frequency selection/fixed 48-MHz clock output.
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
16
FS_B/TEST_MODE
I
3.3V-tolerant input for CPU frequency selection. Selects Ref/N or Hi-Z when
in test mode
0 = Hi-Z, 1 = Ref/N
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
53
FS_C/TEST_SEL
I
3.3V-tolerant input for CPU frequency selection. Selects test mode if pulled
to VIMFS_C when VTT_PWRGD# is asserted low.
Refer to DC Electrical Specifications table for VILFS_C,VIMFS_C,VIHFS_C specifications.
39
IREF
I
A precision resistor is attached to this pin, which is connected to the internal
current reference.
56,3,4,5
PCI
O, SE 33-MHz clocks.
55
PCI_STP#
I, PU
8
PCIF0/ITP_EN
I/O, SE 33-MHz clock/CPU2 select (sampled on the VTT_PWRGD# assertion).
1 = CPU2_ITP, 0 = SRC7
9
PCIF1
O, SE 33-MHz clocks.
52
REF
O, SE Reference clock. 3.3V 14.318-MHz clock output.
46
SCLK
I
47
SDATA
I/O
26,27
SRC4_SATAT,
SRC4_SATAC
24,25,22,23, SRCT/C
19,20,17,18,
33,32,31,30
11
3.3V LVTTL input for PCI_STP# active low.
SMBus-compatible SCLOCK.
SMBus-compatible SDATA.
O, DIF Differential serial reference clock. Recommended output for SATA.
O, DIF Differential serial reference clocks.
VDD_48
PWR
3.3V power supply for outputs.
42
VDD_CPU
PWR
3.3V power supply for outputs.
1,7
VDD_PCI
PWR
3.3V power supply for outputs.
48
VDD_REF
PWR
3.3V power supply for outputs.
21,28,34
VDD_SRC
PWR
3.3V power supply for outputs.
37
VDDA
PWR
3.3V power supply for PLL.
13
VSS_48
GND
Ground for outputs.
45
VSS_CPU
GND
Ground for outputs.
2,6
VSS_PCI
GND
Ground for outputs.
51
VSS_REF
GND
Ground for outputs.
29
VSS_SRC
GND
Ground for outputs.
38
VSSA
GND
Ground for PLL.
10
VTT_PWRGD#/PD
I, PU
3.3V LVTTL input is a level sensitive strobe used to latch the USB_48/FS_A,
FS_B, FS_C/TEST_SEL and PCIF0/ITP_EN inputs. After VTT_PWRGD#
(active low) assertion, this pin becomes a real-time input for asserting power
down (active high).
50
XIN
49
XOUT
Document #: 38-07694 Rev. *B
I
14.318-MHz crystal input.
O, SE 14.318-MHz crystal output.
Page 2 of 19
CY28411-1
Frequency Select Pins (FS_A, FS_B and FS_C)
Host clock frequency selection is achieved by applying the
appropriate logic levels to FS_A, FS_B, FS_C inputs prior to
VTT_PWRGD# assertion (as seen by the clock synthesizer).
Upon VTT_PWRGD# being sampled low by the clock chip
(indicating processor VTT voltage is stable), the clock chip
samples the FS_A, FS_B and FS_C input values. For all logic
levels of FS_A, FS_B and FS_C, VTT_PWRGD# employs a
one-shot functionality in that once a valid low on
VTT_PWRGD# has been sampled, all further VTT_PWRGD#,
FS_A, FS_B and FS_C transitions will be ignored, except in
test mode.
Table 1. Frequency Select Table FS_A, FS_B and FS_C
FS_C
FS_B
FS_A
CPU
SRC
PCIF/PCI
REF0
DOT96
USB
MID
0
1
100 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
133 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
0
1
0
1
1
0
1
0
200 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
0
0
266 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
RESERVED
MID
0
0
MID
1
0
RESERVED
MID
1
1
1
0
x
Hi-Z
1
1
0
1
1
1
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
REF/2
REF/8
REF/24
REF
REF
REF
REF/2
REF/8
REF/24
REF
REF
REF
Serial Data Interface
Data Protocol
To enhance the flexibility and function of the clock synthesizer,
a two-signal serial interface is provided. Through the Serial
Data Interface, various device functions, such as individual
clock output buffers, can be individually enabled or disabled.
The registers associated with the Serial Data Interface
initializes to their default setting upon power-up, and therefore
use of this interface is optional. Clock device register changes
are normally made upon system initialization, if any are
required. The interface cannot be used during system
operation for power management functions.
The clock driver serial protocol accepts byte write, byte read,
block write, and block read operations from the controller. For
block write/read operation, the bytes must be accessed in
sequential order from lowest to highest byte (most significant
bit first) with the ability to stop after any complete byte has
been transferred. For byte write and byte read operations, the
system controller can access individually indexed bytes. The
offset of the indexed byte is encoded in the command code,
as described in Table 2.
The block write and block read protocol is outlined in Table 3
while Table 4 outlines the corresponding byte write and byte
read protocol. The slave receiver address is 11010010 (D2h).
Table 2. Command Code Definition
Bit
7
(6:0)
Description
0 = Block read or block write operation, 1 = Byte read or byte write operation
Byte offset for byte read or byte write operation. For block read or block write operations, these bits should be
'0000000'
Table 3. Block Read and Block Write Protocol
Block Write Protocol
Bit
1
8:2
Description
Start
Slave address – 7 bits
9
Write
10
18:11
19
27:20
Block Read Protocol
Bit
1
8:2
Description
Start
Slave address – 7 bits
9
Write
Acknowledge from slave
10
Acknowledge from slave
Command Code – 8 bits
18:11
Command Code – 8 bits
Acknowledge from slave
19
Acknowledge from slave
Byte Count – 8 bits
(Skip this step if I2C_EN bit set)
20
Repeat start
Document #: 38-07694 Rev. *B
Page 3 of 19
CY28411-1
Table 3. Block Read and Block Write Protocol (continued)
Block Write Protocol
Bit
28
36:29
37
45:38
Description
Acknowledge from slave
Block Read Protocol
Bit
27:21
Description
Slave address – 7 bits
Data byte 1 – 8 bits
28
Read = 1
Acknowledge from slave
29
Acknowledge from slave
Data byte 2 – 8 bits
37:30
46
Acknowledge from slave
....
Data Byte /Slave Acknowledges
....
Data Byte N –8 bits
38
46:39
47
....
Acknowledge from slave
....
Stop
55:48
Byte Count from slave – 8 bits
Acknowledge
Data byte 1 from slave – 8 bits
Acknowledge
Data byte 2 from slave – 8 bits
56
Acknowledge
....
Data bytes from slave / Acknowledge
....
Data Byte N from slave – 8 bits
....
NOT Acknowledge
....
Stop
Table 4. Byte Read and Byte Write Protocol
Byte Write Protocol
Bit
1
8:2
Description
Start
Byte Read Protocol
Bit
1
Slave address – 7 bits
8:2
Slave address – 7 bits
9
Write
10
Acknowledge from slave
10
Acknowledge from slave
18:11
Command Code – 8 bits
18:11
Command Code – 8 bits
Acknowledge from slave
19
Acknowledge from slave
Data byte – 8 bits
20
Repeated start
19
27:20
9
Description
Start
28
Acknowledge from slave
29
Stop
27:21
Write
Slave address – 7 bits
28
Read
29
Acknowledge from slave
37:30
Data from slave – 8 bits
38
NOT Acknowledge
39
Stop
Control Registers
Byte 0:Control Register 0
Bit
@Pup
Name
7
1
CPUT2_ITP/SRCT7
CPUC2_ITP/SRCC7
6
1
SRC[T/C]6
SRC[T/C]6 Output Enable
0 = Disable (Hi-Z), 1 = Enable
5
1
SRC[T/C]5
SRC[T/C]5 Output Enable
0 = Disable (Hi-Z), 1 = Enable
4
1
SRC[T/C]4
SRC[T/C]4 Output Enable
0 = Disable (Hi-Z), 1 = Enable
3
1
SRC[T/C]3
SRC[T/C]3 Output Enable
0 = Disable (Hi-Z), 1 = Enable
Document #: 38-07694 Rev. *B
Description
CPU[T/C]2_ITP/SRC[T/C]7 Output Enable
0 = Disable (Hi-Z), 1 = Enable
Page 4 of 19
CY28411-1
Byte 0:Control Register 0 (continued)
Bit
@Pup
Name
Description
2
1
SRC[T/C]2
SRC[T/C]2 Output Enable
0 = Disable (Hi-Z), 1 = Enable
1
1
SRC[T/C]1
SRC[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enable
0
1
SRC[T/C]0
SRC[T/C]0 Output Enable
0 = Disable (Hi-Z), 1 = Enable
Byte 1: Control Register 1
Bit
@Pup
Name
Description
7
1
PCIF0
6
1
DOT_96T/C
5
1
USB_48
4
1
REF
3
0
Reserved
Reserved
2
1
CPU[T/C]1
CPU[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
1
1
CPU[T/C]0
CPU[T/C]0 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
0
0
CPUT/C
SRCT/C
PCIF
PCI
PCIF0 Output Enable
0 = Disabled, 1 = Enabled
DOT_96 MHz Output Enable
0 = Disable (Hi-Z), 1 = Enabled
USB_48 MHz Output Enable
0 = Disabled, 1 = Enabled
REF Output Enable
0 = Disabled, 1 = Enabled
Spread Spectrum Enable
0 = Spread off, 1 = Spread on
Byte 2: Control Register 2
Bit
@Pup
Name
Description
7
1
PCI5
PCI5 Output Enable
0 = Disabled, 1 = Enabled
6
1
PCI4
PCI4 Output Enable
0 = Disabled, 1 = Enabled
5
1
PCI3
PCI3 Output Enable
0 = Disabled, 1 = Enabled
4
1
PCI2
PCI2 Output Enable
0 = Disabled, 1 = Enabled
3
1
Reserved
Reserved, Set = 1
2
1
Reserved
Reserved, Set = 1
1
1
Reserved
0
1
PCIF1
Reserved, Set = 1
PCIF1 Output Enable
0 = Disabled, 1 = Enabled
Byte 3: Control Register 3
Bit
@Pup
Name
Description
7
0
SRC7
Allow control of SRC[T/C]7 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
6
0
SRC6
Allow control of SRC[T/C]6 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
5
0
SRC5
Allow control of SRC[T/C]5 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
Document #: 38-07694 Rev. *B
Page 5 of 19
CY28411-1
Byte 3: Control Register 3 (continued)
Bit
@Pup
Name
Description
4
0
SRC4
Allow control of SRC[T/C]4 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
3
0
SRC3
Allow control of SRC[T/C]3 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
2
0
SRC2
Allow control of SRC[T/C]2 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
1
0
SRC1
Allow control of SRC[T/C]1 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
0
0
SRC0
Allow control of SRC[T/C]0 with assertion of PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
Byte 4: Control Register 4
Bit
@Pup
Name
Description
7
0
Reserved
Reserved, Set = 0
6
0
DOT96T/C
DOT_PWRDWN Drive Mode
0 = Driven in PWRDWN, 1 = Hi-Z
5
0
Reserved
Reserved, Set = 0
4
0
PCIF1
Allow control of PCIF1 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
3
0
PCIF0
Allow control of PCIF0 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
2
1
CPU[T/C]2
Allow control of CPU[T/C]2 with assertion of CPU_STP#
0 = Free running, 1 = Stopped with CPU_STP#
1
1
CPU[T/C]1
Allow control of CPU[T/C]1 with assertion of CPU_STP#
0 = Free running, 1 = Stopped with CPU_STP#
0
1
CPU[T/C]0
Allow control of CPU[T/C]0 with assertion of CPU_STP#
0 = Free running, 1 = Stopped with CPU_STP#
Byte 5: Control Register 5
Bit
@Pup
Name
Description
7
0
SRC[T/C][7:0]
SRC[T/C] Stop Drive Mode
0 = Driven when PCI_STP# asserted,1 = Hi-Z when PCI_STP# asserted
6
0
CPU[T/C]2
CPU[T/C]2 Stop Drive Mode
0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted
5
0
CPU[T/C]1
CPU[T/C]1 Stop Drive Mode
0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted
4
0
CPU[T/C]0
CPU[T/C]0 Stop Drive Mode
0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted
3
0
SRC[T/C][7:0]
SRC[T/C] PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
2
0
CPU[T/C]2
CPU[T/C]2 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
1
0
CPU[T/C]1
CPU[T/C]1 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
0
0
CPU[T/C]0
CPU[T/C]0 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
Document #: 38-07694 Rev. *B
Page 6 of 19
CY28411-1
Byte 6: Control Register 6
Bit
@Pup
Name
Description
7
0
REF/N or Hi-Z Select
0 = Hi-Z, 1 = REF/N Clock
6
0
Test Clock Mode Entry Control
0 = Normal operation, 1 = REF/N or Hi-Z mode,
5
0
Reserved
4
1
REF
3
1
PCIF, SRC, PCI
2
Externally
selected
CPUT/C
FS_C Reflects the value of the FS_C pin sampled on power up
0 = FS_C was low during VTT_PWRGD# assertion
1
Externally
selected
CPUT/C
FS_B Reflects the value of the FS_B pin sampled on power up
0 = FS_B was low during VTT_PWRGD# assertion
0
Externally
selected
CPUT/C
FS_A Reflects the value of the FS_A pin sampled on power up
0 = FS_A was low during VTT_PWRGD# assertion
Reserved, Set = 0
REF Output Drive Strength
0 = Low, 1 = High
SW PCI_STP Function
0=SW PCI_STP assert, 1= SW PCI_STP deassert
When this bit is set to 0, all STOPPABLE PCI, PCIF and SRC outputs will
be stopped in a synchronous manner with no short pulses.
When this bit is set to 1, all STOPPED PCI, PCIF and SRC outputs will
resume in a synchronous manner with no short pulses.
Byte 7: Vendor ID
Bit
@Pup
Name
Description
7
0
Revision Code Bit 3
Revision Code Bit 3
6
0
Revision Code Bit 2
Revision Code Bit 2
5
1
Revision Code Bit 1
Revision Code Bit 1
4
0
Revision Code Bit 0
Revision Code Bit 0
3
1
Vendor ID Bit 3
Vendor ID Bit 3
2
0
Vendor ID Bit 2
Vendor ID Bit 2
1
0
Vendor ID Bit 1
Vendor ID Bit 1
0
0
Vendor ID Bit 0
Vendor ID Bit 0
Crystal Recommendations
Crystal Loading
The CY28411-1 requires a Parallel Resonance Crystal.
Substituting a series resonance crystal will cause the
CY28411-1 to operate at the wrong frequency and violate the
ppm specification. For most applications there is a 300-ppm
frequency shift between series and parallel crystals due to
incorrect loading.
Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, the total capacitance
the crystal will see must be considered to calculate the appropriate capacitive loading (CL).
The following diagram shows a typical crystal configuration
using the two trim capacitors. An important clarification for the
following discussion is that the trim capacitors are in series
with the crystal not parallel. It’s a common misconception that
load capacitors are in parallel with the crystal and should be
approximately equal to the load capacitance of the crystal.
This is not true.
Table 5. Crystal Recommendations
Frequency
(Fund)
Cut
Loading Load Cap
Drive
(max.)
Shunt Cap
(max.)
Motional
(max.)
Tolerance
(max.)
Stability
(max.)
Aging
(max.)
14.31818 MHz
AT
Parallel
0.1 mW
5 pF
0.016 pF
35 ppm
30 ppm
5 ppm
Document #: 38-07694 Rev. *B
20 pF
Page 7 of 19
CY28411-1
Figure 1. Crystal Capacitive Clarification
Calculating Load Capacitors
In addition to the standard external trim capacitors, trace
capacitance and pin capacitance must also be considered to
correctly calculate crystal loading. As mentioned previously,
the capacitance on each side of the crystal is in series with the
crystal. This means the total capacitance on each side of the
crystal must be twice the specified crystal load capacitance
(CL). While the capacitance on each side of the crystal is in
series with the crystal, trim capacitors (Ce1,Ce2) should be
calculated to provide equal capacitive loading on both sides.
Clock Chip
Ci2
Ci1
Pin
3 to 6p
X2
X1
Cs1
Cs2
Trace
2.8pF
XTAL
Ce1
Ce2
Trim
33pF
Figure 2. Crystal Loading Example
As mentioned previously, the capacitance on each side of the
crystal is in series with the crystal. This mean the total capacitance on each side of the crystal must be twice the specified
load capacitance (CL). While the capacitance on each side of
the crystal is in series with the crystal, trim capacitors
(Ce1,Ce2) should be calculated to provide equal capacitance
loading on both sides.
Use the following formulas to calculate the trim capacitor
values for Ce1 and Ce2.
Ce = 2 * CL – (Cs + Ci)
=
1
( Ce1 + Cs1
+ Ci1 +
Document #: 38-07694 Rev. *B
1
Ce2 + Cs2 + Ci2
Ce ..................................................... External trim capacitors
Cs ..............................................Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
CL ....................................................Crystal load capacitance
Ce ..................................................... External trim capacitors
Total Capacitance (as seen by the crystal)
CLe
CLe ......................................... Actual loading seen by crystal
using standard value trim capacitors
CLe ......................................... Actual loading seen by crystal
using standard value trim capacitors
Load Capacitance (each side)
1
CL ....................................................Crystal load capacitance
)
Cs ..............................................Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
Page 8 of 19
CY28411-1
PD (Power-down) Clarification
The VTT_PWRGD# /PD pin is a dual function pin. During initial
power-up, the pin functions as VTT_PWRGD#. Once
VTT_PWRGD# has been sampled low by the clock chip, the
pin assumes PD functionality. The PD pin is an asynchronous
active high input used to shut off all clocks cleanly prior to
shutting off power to the device. This signal is synchronized
internal to the device prior to powering down the clock synthesizer. PD is also an asynchronous input for powering up the
system. When PD is asserted high, all clocks need to be driven
to a low value and held prior to turning off the VCOs and the
crystal oscillator.
PD (Power-down) – Assertion
When PD is sampled high by two consecutive rising edges of
CPUC, all single-ended outputs will be held low on their next
high to low transition and differential clocks must held high or
Hi-Zd (depending on the state of the control register drive
mode bit) on the next diff clock# high to low transition within
four clock periods. When the SMBus PD drive mode bit corresponding to the differential (CPU, SRC, and DOT) clock output
of interest is programmed to ‘0’, the clock output are held with
“Diff clock” pin driven high at 2 x Iref, and “Diff clock#” tri-state.
If the control register PD drive mode bit corresponding to the
output of interest is programmed to “1”, then both the “Diff
clock” and the “Diff clock#” are tristate. Note the example
below shows CPUT = 133 MHz and PD drive mode = ‘1’ for all
differential outputs. This diagram and description is applicable
to valid CPU frequencies 100,133,166,200,266,333 and
400MHz. In the event that PD mode is desired as the initial
power-on state, PD must be asserted high in less than 10 uS
after asserting Vtt_PwrGd#.
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33 MHz
REF
Figure 3. Power-down Assertion Timing Waveform
PD Deassertion
The power-up latency is less than 1.8 ms. This is the time from
the deassertion of the PD pin or the ramping of the power
supply until the time that stable clocks are output from the
clock chip. All differential outputs stopped in a three-state
condition resulting from power down will be driven high in less
than 300 µs of PD deassertion to a voltage greater than 200
mV. After the clock chip’s internal PLL is powered up and
locked, all outputs will be enabled within a few clock cycles of
each other. Below is an example showing the relationship of
clocks coming up.
Tstable
<1.8nS
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33MHz
REF
Tdrive_PWRDN#
<300µS, >200mV
Figure 4. Power-down Deassertion Timing Waveform
Document #: 38-07694 Rev. *B
Page 9 of 19
CY28411-1
CPU_STP# Assertion
The CPU_STP# signal is an active low input used for
synchronous stopping and starting the CPU output clocks
while the rest of the clock generator continues to function.
When the CPU_STP# pin is asserted, all CPU outputs that are
set with the SMBus configuration to be stoppable via assertion
of CPU_STP# will be stopped within two–six CPU clock
periods after being sampled by two rising edges of the internal
CPUC clock. The final states of the stopped CPU signals are
CPUT = HIGH and CPUC = LOW. There is no change to the
output drive current values during the stopped state. The
CPUT is driven HIGH with a current value equal to 6 x (Iref),
and the CPUC signal will be Hi-Z.
CPU_STP#
CPUT
CPUC
Figure 5. CPU_STP# Assertion Waveform
CPU_STP# Deassertion
The deassertion of the CPU_STP# signal will cause all CPU
outputs that were stopped to resume normal operation in a
synchronous manner. Synchronous manner meaning that no
short or stretched clock pulses will be produce when the clock
resumes. The maximum latency from the deassertion to active
outputs is no more than two CPU clock cycles.
CPU_STP#
CPUT
CPUC
CPUT Internal
CPUC Internal
Tdrive_CPU_STP#,10nS>200mV
Figure 6. CPU_STP# Deassertion Waveform
1.8mS
CPU_STOP#
PD
CPUT(Free Running
CPUC(Free Running
CPUT(Stoppable)
CPUC(Stoppable)
DOT96T
DOT96C
Figure 7. CPU_STP#= Driven, CPU_PD = Driven, DOT_PD = Driven
Document #: 38-07694 Rev. *B
Page 10 of 19
CY28411-1
1.8mS
CPU_STOP#
PD
CPUT(Free Running)
CPUC(Free Running)
CPUT(Stoppable)
CPUC(Stoppable)
DOT96T
DOT96C
Figure 8. CPU_STP# = Hi-Z, CPU_PD = Hi-Z, DOT_PD = tHi-Z
PCI_STP# Assertion[1]
The PCI_STP# signal is an active LOW input used for
synchronous stopping and starting the PCI outputs while the
rest of the clock generator continues to function. The set-up
PCI_STP#
time for capturing PCI_STP# going LOW is 10 ns (tSU). (See
Figure 9.) The PCIF clocks will not be affected by this pin if
their corresponding control bit in the SMBus register is set to
allow them to be free running.
Tsu
PCI_F
PCI
SRC 100MHz
Figure 9. PCI_STP# Assertion Waveform
PCI_STP# Deassertion
The deassertion of the PCI_STP# signal will cause all PCI and
stoppable PCIF clocks to resume running in a synchronous
manner within two PCI clock periods after PCI_STP# transitions to a high level.
Tsu
Tdrive_SRC
PCI_STP#
PCI_F
PCI
SRC 100MHz
Figure 10. PCI_STP# Deassertion Waveform
Note:
1. The PCI STOP function is controlled by two inputs. One is the device PCI_STP# pin number 34 and the other is SMBus byte 0 bit 3. These two inputs are logically
OR’ed. If either the external pin or the internal SMBus register bit is set low then the stoppable PCI clocks will be stopped in a logic low state. Reading SMBus
Byte 0 Bit 3 will return a 0 value if either of these control bits are set LOW thereby indicating the device’s stoppable PCI clocks are not running.
Document #: 38-07694 Rev. *B
Page 11 of 19
CY28411-1
FS_A, FS_B,FS_C
VTT_PW RGD#
PW RGD_VRM
0.2-0.3mS
Delay
VDD Clock Gen
State 0
Clock State
W ait for
VTT_PW RGD#
State 1
State 2
Off
Clock Outputs
State 3
On
On
Off
Clock VCO
Device is not affected,
VTT_PW RGD# is ignored
Sample Sels
Figure 11. VTT_PWRGD# Timing Diagram
S2
S1
Delay
>0.25mS
VTT_PWRGD# = Low
Sample
Inputs straps
VDD_A = 2.0V
Wait for <1.8ms
S0
Power Off
S3
VDD_A = off
Normal
Operation
Enable Outputs
VTT_PWRGD# = toggle
Figure 12. Clock Generator Power-up/Run State Diagram
Document #: 38-07694 Rev. *B
Page 12 of 19
CY28411-1
Absolute Maximum Conditions
Parameter
Description
Condition
Min.
Max.
Unit
VDD
Core Supply Voltage
–0.5
4.6
V
VDD_A
Analog Supply Voltage
–0.5
4.6
V
VIN
Input Voltage
Relative to VSS
–0.5
VDD + 0.5
VDC
TS
Temperature, Storage
Non-functional
–65
150
°C
TA
Temperature, Operating Ambient
Functional
0
85
°C
TJ
Temperature, Junction
Functional
–
150
°C
ØJC
Dissipation, Junction to Case
(Mil-Spec 883E Method 1012.1)
SSOP
39.56
TSSOP
20.62
Dissipation, Junction to Ambient
JEDEC (JESD 51)
SSOP
45.29
TSSOP
62.26
ESDHBM
ESD Protection (Human Body Model)
MIL-STD-883, Method 3015
UL-94
Flammability Rating
At 1/8 in.
MSL
Moisture Sensitivity Level
ØJA
2000
°C/W
°C/W
–
V
V–0
1
Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
DC Electrical Specifications
Parameter
Description
3.3V Operating Voltage
VDD_A,
VDD_REF,
VDD_PCI,
VDD_3V66,
VDD_48,
VDD_CPU
Condition
3.3 ± 5%
Min.
Max.
Unit
3.135
3.465
V
VILI2C
Input Low Voltage
SDATA, SCLK
–
1.0
V
VIHI2C
Input High Voltage
SDATA, SCLK
2.2
–
V
VIL_FS
FS_A/FS_B Input Low Voltage
VSS – 0.3
0.35
V
VIH_FS
FS_A/FS_B Input High Voltage
0.7
VDD + 0.5
V
VILFS_C
FS_C Low Range
0
0.35
V
VIMFS_C
FS_C Mid Range
0.7
1.7
V
VIH FS_C
FS_C High Range
VIL
3.3V Input Low Voltage
2.1
VDD
V
VSS – 0.5
0.8
V
VIH
3.3V Input High Voltage
2.0
VDD + 0.5
V
IIL
Input Low Leakage Current
except internal pull-up resistors, 0 < VIN < VDD
–5
–
µA
IIH
Input High Leakage Current
except internal pull-down resistors, 0 < VIN < VDD
–
5
µA
VOL
3.3V Output Low Voltage
IOL = 1 mA
–
0.4
V
VOH
3.3V Output High Voltage
IOH = –1 mA
IOZ
High-impedance Output Current
2.4
–
V
–10
10
µA
CIN
Input Pin Capacitance
2
5
pF
COUT
Output Pin Capacitance
3
6
pF
LIN
Pin Inductance
VXIH
Xin High Voltage
VXIL
Xin Low Voltage
IDD3.3V
Dynamic Supply Current
At max. load and freq. per Figure 14
IPD3.3V
Power-down Supply Current
IPD3.3V
Power-down Supply Current
Document #: 38-07694 Rev. *B
–
7
nH
0.7VDD
VDD
V
0
0.3VDD
V
–
550
mA
PD asserted, Outputs driven
–
70
mA
PD asserted, Outputs Hi-Z
–
2
mA
Page 13 of 19
CY28411-1
AC Electrical Specifications
Parameter
Condition
Min.
Max.
Unit
XIN Duty Cycle
The device will operate reliably with input
duty cycles up to 30/70 but the REF clock
duty cycle will not be within specification
47.5
52.5
%
TPERIOD
XIN Period
When XIN is driven from an external
clock source
69.841
71.0
ns
TR / TF
XIN Rise and Fall Times
Measured between 0.3VDD and 0.7VDD
–
10.0
ns
TCCJ
XIN Cycle to Cycle Jitter
As an average over 1-µs duration
–
500
ps
LACC
Long-term Accuracy
Over 150 ms
–
300
ppm
CPU at 0.7V
TDC
CPUT and CPUC Duty Cycle
Measured at crossing point VOX
45
55
%
Crystal
TDC
Description
TPERIOD
100-MHz CPUT and CPUC Period
Measured at crossing point VOX
9.997001
10.00300
ns
TPERIOD
133-MHz CPUT and CPUC Period
Measured at crossing point VOX
7.497751
7.502251
ns
TPERIODSS
100-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
9.997001
10.05327
ns
TPERIODSS
133-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
7.497751
7.539950
ns
TPERIODAbs
100-MHz CPUT and CPUC Absolute
period
Measured at crossing point VOX
9.912001
10.08800
ns
TPERIODAbs
133-MHz CPUT and CPUC Absolute
period
Measured at crossing point VOX
7.412751
7.587251
ns
TPERIODSSAbs 100-MHz CPUT and CPUC Absolute
period, SSC
Measured at crossing point VOX
9.912001
10.13827
ns
TPERIODSSAbs 133-MHz CPUT and CPUC Absolute
period, SSC
Measured at crossing point VOX
7.412751
7.624950
ns
TCCJ
CPUT/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
85
ps
TCCJ2
CPU2_ITP Cycle to Cycle Jitter
Measured at crossing point VOX
–
125
ps
TSKEW2
CPU2_ITP to CPU0 Clock Skew
Measured at crossing point VOX
–
150
ps
TR / TF
CPUT and CPUC Rise and Fall Times
Measured from VOL = 0.175 to VOH =
0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of
2 * (TR – TF)/(TR + TF)
–
20
%
∆TR
Rise Time Variation
–
125
ps
∆TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 14
660
850
mV
VLOW
Voltage Low
Math averages Figure 14
–150
–
mV
VOX
Crossing Point Voltage at 0.7V Swing
250
550
mV
VOVS
Maximum Overshoot Voltage
–
VHIGH + 0.3
V
VUDS
Minimum Undershoot Voltage
–0.3
–
V
VRB
Ring Back Voltage
See Figure 14. Measure SE
–
0.2
V
SRC
TDC
SRCT and SRCC Duty Cycle
Measured at crossing point VOX
45
55
%
TPERIOD
100-MHz SRCT and SRCC Period
Measured at crossing point VOX
9.997001
10.00300
ns
TPERIODSS
100-MHz SRCT and SRCC Period, SSC Measured at crossing point VOX
9.997001
10.05327
ns
TPERIODAbs
100-MHz SRCT and SRCC Absolute
Period
Measured at crossing point VOX
10.12800
9.872001
ns
TPERIODSSAbs 100-MHz SRCT and SRCC Absolute
Period, SSC
Measured at crossing point VOX
9.872001
10.17827
ns
TSKEW
Measured at crossing point VOX
–
250
ps
Any SRCT/C to SRCT/C Clock Skew
Document #: 38-07694 Rev. *B
Page 14 of 19
CY28411-1
AC Electrical Specifications (continued)
Parameter
Description
Min.
Max.
Unit
Measured at crossing point VOX
–
125
ps
SRCT/C Long Term Accuracy
Measured at crossing point VOX
–
300
ppm
SRCT and SRCC Rise and Fall Times
Measured from VOL = 0.175 to VOH =
0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of
2 * (TR – TF)/(TR + TF)
–
20
%
∆TR
Rise TimeVariation
–
125
ps
∆TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 14
660
850
mV
VLOW
Voltage Low
Math averages Figure 14
–150
–
mV
VOX
Crossing Point Voltage at 0.7V Swing
250
550
mV
VOVS
Maximum Overshoot Voltage
–
VHIGH +
0.3
V
VUDS
Minimum Undershoot Voltage
–0.3
–
V
VRB
Ring Back Voltage
See Figure 14. Measure SE
–
0.2
V
PCI/PCIF
TDC
PCI Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
Spread Disabled PCIF/PCI Period
Measurement at 1.5V
29.99100
30.00900
ns
TPERIODSS
Spread Enabled PCIF/PCI Period, SSC Measurement at 1.5V
29.9910
30.15980
ns
TPERIODAbs
Spread Disabled PCIF/PCI Period
Measurement at 1.5V
29.49100
30.50900
ns
TPERIODSSAbs Spread Enabled PCIF/PCI Period, SSC Measurement at 1.5V
TCCJ
SRCT/C Cycle to Cycle Jitter
LACC
TR / TF
Condition
29.49100
30.65980
ns
Measurement at 2.4V
12.0
–
ns
PCIF and PCI low time
Measurement at 0.4V
12.0
–
ns
PCIF and PCI rise and fall times
Measured between 0.8V and 2.0V
1.0
4.0
V/ns
TSKEW
Any PCI clock to Any PCI clock Skew
Measurement at 1.5V
–
500
ps
TCCJ
PCIF and PCI Cycle to Cycle Jitter
Measurement at 1.5V
–
500
ps
DOT
TDC
DOT96T and DOT96C Duty Cycle
Measured at crossing point VOX
45
55
%
TPERIOD
DOT96T and DOT96C Period
Measured at crossing point VOX
10.41354
10.41979
ns
TPERIODAbs
DOT96T and DOT96C Absolute Period Measured at crossing point VOX
TCCJ
DOT96T/C Cycle to Cycle Jitter
LACC
TR / TF
THIGH
PCIF and PCI high time
TLOW
TR / TF
10.16354
10.66979
ns
Measured at crossing point VOX
–
250
ps
DOT96T/C Long Term Accuracy
Measured at crossing point VOX
–
100
ppm
DOT96T and DOT96C Rise and Fall
Times
Measured from VOL = 0.175 to VOH =
0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of
2 * (TR – TF)/(TR + TF)
–
20
%
∆TR
Rise Time Variation
–
125
ps
∆TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 14
660
850
mV
VLOW
Voltage Low
Math averages Figure 14
–150
–
mV
VOX
Crossing Point Voltage at 0.7V Swing
250
550
mV
VOVS
Maximum Overshoot Voltage
–
VHIGH + 0.3
V
VUDS
Minimum Undershoot Voltage
–0.3
–
V
VRB
Ring Back Voltage
See Figure 14. Measure SE
–
0.2
V
USB
TDC
Duty Cycle
Measurement at 1.5V
45
55
%
Document #: 38-07694 Rev. *B
Page 15 of 19
CY28411-1
AC Electrical Specifications (continued)
Parameter
Description
Condition
Min.
Max.
Unit
20.83125
20.83542
ns
TPERIOD
Period
TPERIODAbs
Absolute Period
Measurement at 1.5V
21.18542
ns
THIGH
USB high time
Measurement at 2.4V
8.094
10.036
ns
TLOW
USB low time
Measurement at 0.4V
7.694
9.836
ns
TR / TF
Rise and Fall Times
Measured between 0.8V and 2.0V
1.0
2.0
V/ns
TCCJ
Cycle to Cycle Jitter
Measurement at 1.5V
–
350
ps
REF
TDC
REF Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
REF Period
Measurement at 1.5V
69.8203
69.8622
ns
TPERIODAbs
REF Absolute Period
Measurement at 1.5V
68.82033
70.86224
ns
TR / TF
REF Rise and Fall Times
Measured between 0.8V and 2.0V
1.0
4.0
V/ns
TCCJ
REF Cycle to Cycle Jitter
Measurement at 1.5V
–
1000
ps
Measurement at 1.5V
20.48125
ENABLE/DISABLE and SET-UP
TSTABLE
Clock Stabilization from Power-up
TSS
Stopclock Set-up Time
TSH
Stopclock Hold Time
–
1.8
ms
10.0
–
ns
0
–
ns
Test and Measurement Set-up
For PCI Single-ended Signals and Reference
The following diagram shows the test load configurations for
the single-ended PCI, USB, and REF output signals.
PCI/
USB
12Ω
60Ω
Measurement
Point
4pF
12Ω
60Ω
Measurement
Point
4pF
12Ω
60Ω
12Ω
60Ω
Measurement
Point
4pF
REF
Measurement
Point
4pF
12Ω
60Ω
Measurement
Point
4pF
Figure 13. Single-ended Load Configuration
Document #: 38-07694 Rev. *B
Page 16 of 19
CY28411-1
For Differential CPU, SRC and DOT96 Output Signals
The following diagram shows the test load configuration for the
differential CPU and SRC outputs.
CPUT
SRCT
D O T96T
M e a s u re m e n t
P o in t
33Ω
4 9 .9 Ω
CPUC
SRCC
D O T96C
IR E F
2pF
1 0 0 Ω D iff e r e n tia l
M e a s u re m e n t
P o in t
33Ω
2pF
4 9 .9 Ω
475Ω
Figure 14. 0.7V Single-ended Load Configuration
O u tp u t u n d e r T e s t
tD C
P ro b e
3 .3 V
2 .4 V
Loas
C ap
1 .5 V
0 .4 V
0V
Tr
Tf
Figure 15. Single-ended Output Signals (for AC Parameters Measurement)
Ordering Information
Part Number
Package Type
Product Flow
Lead-free
CY28411OXC-1
56-pin SSOP
Commercial, 0° to 85°C
CY28411OXCT-1
56-pin SSOP – Tape and Reel
Commercial, 0° to 85°C
CY28411ZXC-1
56-pin TSSOP
Commercial, 0° to 85°C
CY28411ZXCT-1
56-pin TSSOP – Tape and Reel
Commercial, 0° to 85°C
Document #: 38-07694 Rev. *B
Page 17 of 19
CY28411-1
Package Drawing and Dimensions
56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56
0.249[0.009]
28
1
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
7.950[0.313]
8.255[0.325]
PACKAGE WEIGHT 0.42gms
5.994[0.236]
6.198[0.244]
PART #
Z5624 STANDARD PKG.
ZZ5624 LEAD FREE PKG.
29
56
13.894[0.547]
14.097[0.555]
1.100[0.043]
MAX.
GAUGE PLANE
0.25[0.010]
0.20[0.008]
0.851[0.033]
0.950[0.037]
0.500[0.020]
BSC
0.051[0.002]
0.152[0.006]
0.170[0.006]
0.279[0.011]
0.508[0.020]
0.762[0.030]
0°-8°
0.100[0.003]
0.200[0.008]
SEATING
PLANE
51-85060-*C
56-Lead Shrunk Small Outline Package O56
.020
1
28
0.395
0.420
0.292
0.299
29
DIMENSIONS IN INCHES MIN.
MAX.
56
0.720
0.730
SEATING PLANE
0.088
0.092
0.095
0.110
0.005
0.010
.010
GAUGE PLANE
0.025
BSC
0.110
0.008
0.0135
0.008
0.016
0°-8°
0.024
0.040
51-85062-*C
Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips
I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification
as defined by Philips. Intel and Pentium are registered trademarks of Intel Corporation. All product and company names mentioned
in this document are the trademarks of their respective holders.
Document #: 38-07694 Rev. *B
Page 18 of 19
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY28411-1
Document History Page
Document Title: CY28411-1 Clock Generator for Intel Alviso Chipset
Document Number: 38-07694
REV.
ECN NO.
Issue Date
Orig. of
Change
Description of Change
**
246811
See ECN
RGL
New data sheet
*A
299753
See ECN
RGL
Corrected the Operating Ambient Temp from 0 to 85°C to 0 to 70°C
*B
331934
See ECN
RGL
Minor Change: Pls. ignore the changes in Rev *A - Ambient Temp. remained
0 to 85°C
Document #: 38-07694 Rev. *B
Page 19 of 19
Similar pages