Cypress CY28412OXCT Clock generator for intelâ® grantsdale chipset Datasheet

CY28412
PRELIMINARY
Clock Generator for Intel® Grantsdale Chipset
Features
• Low-voltage frequency select input
• I2C Support with read back capabilities
• Supports Intel P4 and Prescott CPU
• Ideal Lexmark Spread Spectrum profile for maximum
electromagnetic interference (EMI) reduction
• Selectable CPU frequencies
• Differential CPU clock pairs
• 3.3V power supply
• 100-MHz differential SRC clocks
• 56-pin SSOP package
• 96-MHz differential dot clock
• 48-MHz USB clocks
• 33-MHz PCI clock
Block Diagram
XIN
XOUT
CPU_STP#
PCI_STP#
XTAL
OSC
PLL1
SRC
PCI
REF
DOT96
USB_48
x7 / x8
x8
x2
x1
x1
Pin Configuration
VDD_REF
REF[1:0]
Divider
Network
IREF
PD
PLL2
I2C
Logic
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
CY28412
PCI0
PCI1
VDD_PCI
VDD_CPU
GND_PCI
CPUT[0:1], CPUC[0:1],
CPU(T/C)2_ITP]
PCI2
VDD_SRC
PCI3
SRCT[0:6], SRCC[0:6],
PCI4
SATA[T/C]
PCI5
GND_PCI
VDD_PCI
VDD_PCI
TEST_SEL/PCIF0
PCI[0:5]
ITP_EN/PCIF1
VDD_PCIF
PCIF[0:1]
VDD_48
USB48/FS_B
GND_48
VDD_48 MHz
DOT96T
DOT96T
DOT96C
DOT96C
VTT_PwrGd#/PD
USB_48
SRCT0
SRCC0
SRCT1
STCC1
VDD_SRC
GND_SRC
SRCT2
SRCC2
SATAT
SATAC
PLL Ref Freq
FS_[C:A]
VTT_PWRGD#
SDATA
SCLK
CPU
x2 / x3
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
VDD_REF
REF0/FS_C
REF1/FS_A
GND_REF
X1
X2
SDATA
SCLK
GND_CPU
CPUT0
CPUC0
VDD_CPU
CPUT1
CPUC1
IREF
GND_A
VDD_A
CPUT2_ITP/SRCT6
CPUC2_ITP/SRCC6
VDD_SRC
SRCT5
SRCC5
GND_SRC
SRCT4
SRCC4
SRCT3
SRCC3
VDD_SRC
56 SSOP
Cypress Semiconductor Corporation
Document #: 38-07612 Rev. *C
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised December 21, 2004
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CY28412
PRELIMINARY
Pin Definitions
Pin No.
Name
Type
Description
47,46,44,43
CPUT/C
O, DIF Differential CPU clock outputs.
39,38
CPUT2_ITP/SRCT6,
CPUC2_ITP/SRCC6
O, DIF Selectable Differential CPU or SRC clock output.
ITP_EN = 0 @ VTT_PWRGD# assertion = SRC6
ITP_EN = 1 @ VTT_PWRGD# assertion = CPU2
O, DIF Fixed 96-MHz clock output.
16,17
DOT96T, DOT96C
55, 54
REF0/FS_C,
REF1/FS_A
I/O
14.318-MHz reference clock/3.3V-tolerant input for CPU frequency selection.
Input is latched upon assertion (LOW) of VTT_PWRGD#/PD
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
14
USB48/FS_B
I/O
Fixed 48-MHz USB clock output/3.3V-tolerant input for CPU frequency
selection.
Input is latched upon assertion (LOW) of VTT_PWRGD#/PD
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
42
IREF
1,2,5,6,7,8
PCI[0:5]
11
TEST_SEL/PCIF0
12
ITP_EN/PCIF1
49
SCLK
50
SDATA
27,28
SATAT, SATAC
19,20,21,22, SRCT/C[0:5]
25,26,30,31,
32,33,35,36
13
VDD_48
I
A precision resistor is attached to this pin, which is connected to the
internal current reference.
O, SE 33-MHz clocks.
I/O
Free-running 33-MHz clocks/ 3.3V-tolerant input for selecting test mode.
Input is latched upon assertion (LOW) of VTT_PWRGD#/PD
1 = All outputs are three-stated for test
0 = All outputs normal operation
**This input has an internal pull-down resistor.
I/O, SE Free-running 33-MHz clock/CPU2 select (sampled on the VTT_PWRGD#
assertion).
1 = CPU2_ITP, 0 = SRC6
I
I/O
SMBus-compatible SCLOCK.
SMBus-compatible SDATA.
O, DIF Differential serial reference clock. Recommended output for SATA.
O, DIF Differential serial reference clocks.
PWR
3.3V power supply for outputs.
45
VDD_CPU
PWR
3.3V power supply for outputs.
3,10
VDD_PCI
PWR
3.3V power supply for outputs.
56
VDD_REF
PWR
3.3V power supply for outputs.
23,29,37
VDD_SRC
PWR
3.3V power supply for outputs.
40
VDD_A
PWR
3.3V power supply for PLL.
15
GND_48
GND
Ground for outputs.
48
GND_CPU
GND
Ground for outputs.
4,9
GND_PCI
GND
Ground for outputs.
53
GND_REF
GND
Ground for outputs.
24,34
GND_SRC
GND
Ground for outputs.
41
GND_A
GND
Ground for PLL.
18
VTT_PWRGD#/PD
I, PU
3.3V LVTTL input is a level sensitive strobe used to latch the REF0/FSC,
REF1/FSA, USB48/FSB, TEST_SEL/PCIF0 and ITP_EN/PCIF1 inputs. After
VTT_PWRGD# (active LOW) assertion, this pin becomes a realtime input for
asserting power-down (active HIGH).
52
X1
51
X2
Document #: 38-07612 Rev. *C
I
14.318-MHz crystal input.
O, SE 14.318-MHz crystal output.
Page 2 of 17
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CY28412
PRELIMINARY
Frequency Select Pins (FS_A, FS_B and FS_C)
Host clock frequency selection is achieved by applying the
appropriate logic levels to FS_A, FS_B, FS_C inputs prior to
VTT_PWRGD# assertion (as seen by the clock synthesizer).
Upon VTT_PWRGD# being sampled low by the clock chip
(indicating processor VTT voltage is stable), the clock chip
samples the FS_A, FS_B and FS_C input values. For all logic
levels of FS_A, FS_B and FS_C VTT_PWRGD# employs a
one-shot functionality in that once a valid low on
VTT_PWRGD# has been sampled, all further VTT_PWRGD#,
FS_A, FS_B and FS_C transitions will be ignored, except in
test mode.
Serial Data Interface
To enhance the flexibility and function of the clock synthesizer,
a two-signal serial interface is provided. Through the Serial
Data Interface, various device functions, such as individual
clock output buffers, can be individually enabled or disabled.
The registers associated with the Serial Data Interface initial-
izes to their default setting upon power-up, and therefore use
of this interface is optional. Clock device register changes are
normally made upon system initialization, if any are required.
The interface cannot be used during system operation for power management functions.
Data Protocol
The clock driver serial protocol accepts byte write, byte read,
block write, and block read operations from the controller. For
block write/read operation, the bytes must be accessed in sequential order from lowest to highest byte (most significant bit
first) with the ability to stop after any complete byte has been
transferred. For byte write and byte read operations, the system controller can access individually indexed bytes. The offset of the indexed byte is encoded in the command code, as
described in Table 2.
The block write and block read protocol is outlined in Table 3
while Table 4 outlines the corresponding byte write and byte
read protocol. The slave receiver address is 11010010 (D2h).
Table 1. Frequency Select Table (FS_A, FS_B, FS_C)
FS_C
FS_B
FS_A
CPU
SRC
PCIF/PCI
REF0
DOT96
USB
1
0
1
100 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
0
1
133 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
1
1
166 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
1
0
200 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
0
0
266 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
1
0
0
333 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
1
1
0
400 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
1
1
1
Reserved
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
Table 2. Command Code Definition
Bit
Description
7
0 = Block read or block write operation, 1 = Byte read or byte write operation
(6:0) Byte offset for byte read or byte write operation. For block read or block write operations, these bits should be '0000000'
Table 3. Block Read and Block Write Protocol
Block Write Protocol
Bit
1
2:8
9
10
11:18
19
20:27
28
29:36
37
38:45
46
Description
Start
Slave address – 7 bits
Write = 0
Acknowledge from slave
Command Code – 8 bits
'00000000' stands for block operation
Acknowledge from slave
Byte Count – 8 bits
Acknowledge from slave
Block Read Protocol
Bit
1
2:8
Description
Start
Slave address – 7 bits
9
Write = 0
10
Acknowledge from slave
11:18
19
20
21:27
Command Code – 8 bits
'00000000' stands for block operation
Acknowledge from slave
Repeat start
Slave address – 7 bits
Data byte 1 – 8 bits
28
Read = 1
Acknowledge from slave
29
Acknowledge from slave
Data byte 2 – 8 bits
Acknowledge from slave
Document #: 38-07612 Rev. *C
30:37
38
Byte count from slave – 8 bits
Acknowledge from master
Page 3 of 17
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CY28412
PRELIMINARY
Table 3. Block Read and Block Write Protocol (continued)
Block Write Protocol
Bit
Block Read Protocol
Description
Bit
39:46
Description
....
......................
Data byte from slave – 8 bits
....
Data Byte (N – 1) – 8 bits
47
....
Acknowledge from slave
48:55
....
Data Byte N – 8 bits
56
Acknowledge from master
....
Acknowledge from slave
....
Data byte N from slave – 8 bits
....
Stop
....
Acknowledge from master
....
Stop
Acknowledge from master
Data byte from slave – 8 bits
Table 4. Byte Read and Byte Write Protocol
Byte Write Protocol
Bit
1
2:8
Description
1
Slave address – 7 bits
2:8
Write = 0
10
Acknowledge from slave
19
20:27
Bit
Start
9
11:18
Byte Read Protocol
Command Code – 8 bits
'100xxxxx' stands for byte operation, bits[6:0] of the
command code represents the offset of the byte to
be accessed
Acknowledge from slave
Data byte from master – 8 bits
28
Acknowledge from slave
29
Stop
Description
Start
Slave address – 7 bits
9
Write = 0
10
Acknowledge from slave
11:18
19
20
21:27
Command Code – 8 bits
'100xxxxx' stands for byte operation, bits[6:0] of
the command code represents the offset of the
byte to be accessed
Acknowledge from slave
Repeat start
Slave address – 7 bits
28
Read = 1
29
Acknowledge from slave
30:37
Data byte from slave – 8 bits
38
Acknowledge from master
39
Stop
Control Registers
Byte 0:Control Register 0
Bit
@Pup
Name
7
1
CPUT2_ITP/SRCT6
CPUC2_ITP/SRCC6
6
1
SRC[T/C]5
SRC[T/C]5 Output Enable
0 = Disable (Hi-Z), 1 = Enable
5
1
SRC[T/C]4
SRC[T/C]4 Output Enable
0 = Disable (Hi-Z), 1 = Enable
4
1
SRC[T/C]3
SRC[T/C]3 Output Enable
0 = Disable (Hi-Z), 1 = Enable
3
1
SATAT/C]
SATA[T/C] Output Enable
0 = Disable (Hi-Z), 1 = Enable
2
1
SRC[T/C]2
SRC[T/C]2 Output Enable
0 = Disable (Hi-Z), 1 = Enable
1
1
SRC[T/C]1
SRC[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enable
0
1
SRC[T/C]0
SRC[T/C]0 Output Enable
0 = Disable (Hi-Z), 1 = Enable
Document #: 38-07612 Rev. *C
Description
CPU[T/C]2_ITP/SRC[T/C]6 Output Enable
0 = Disable (Hi-Z), 1 = Enable
Page 4 of 17
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CY28412
PRELIMINARY
Byte 1: Control Register 1
Bit
@Pup
Name
Description
7
1
CPUT/C
SRCT/C
PCIF
PCI
6
1
DOT_96T/C
5
1
USB_48
4
1
REF0
REF0 Output Enable
0 = Disabled, 1 = Enabled
3
1
REF1
REF1 Output Enable
0 = Disabled, 1 = Enabled
2
1
CPU[T/C]1
CPU[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
1
1
CPU[T/C]0
CPU[T/C]0 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
0
0
CPUT/C
SRCT/C
PCIF
PCI
Center Spread Enable
0 = ±0.25% Center Spread, 1 = –0.5% Down Spread
DOT_96 MHz Output Enable
0 = Disable (Hi-Z), 1 = Enabled
USB_48 MHz Output Enable
0 = Disabled, 1 = Enabled
Spread Spectrum Enable
0 = Spread off, 1 = Spread on
Byte 2: Control Register 2
Bit
@Pup
Name
Description
7
1
PCI5
PCI5 Output Enable
0 = Disabled, 1 = Enabled
6
1
PCI4
PCI4 Output Enable
0 = Disabled, 1 = Enabled
5
1
PCI3
PCI3 Output Enable
0 = Disabled, 1 = Enabled
4
1
PCI2
PCI2 Output Enable
0 = Disabled, 1 = Enabled
3
1
PCI1
PCI1 Output Enable
0 = Disabled, 1 = Enabled
2
1
PCI0
PCI0 Output Enable
0 = Disabled, 1 = Enabled
1
1
PCIF1
PCIF1 Output Enable
0 = Disabled, 1 = Enabled
0
1
PCIF0
PCIF0 Output Enable
0 = Disabled, 1 = Enabled
Byte 3: Control Register 3
Bit
@Pup
Name
7
0
CPUT2_ITP/SRCT6
CPUC2_ITP/SRCC6
Allow control of SRC[T/C]6 with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
6
0
SRC[T/C]5
Allow control of SRC[T/C]5with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
5
0
SRC[T/C]4
Allow control of SRC[T/C]4 with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
4
0
SRC[T/C]3
Allow control of SRC[T/C]3with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
3
0
SATA[T/C]
Allow control of SATA[T/C] with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
Document #: 38-07612 Rev. *C
Description
Page 5 of 17
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CY28412
PRELIMINARY
Byte 3: Control Register 3 (continued)
Bit
@Pup
Name
Description
2
0
SRC2
Allow control of SRC[T/C]2 with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
1
0
SRC1
Allow control of SRC[T/C]1 with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
0
0
SRC0
Allow control of SRC[T/C]0 with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
Byte 4: Control Register 4
Bit
@Pup
Name
Description
7
0
RESERVED
RESERVED, Set = 0
6
0
DOT96[T/C]
DOT_PWRDWN Drive Mode
0 = Driven in PWRDWN, 1 = Hi-Z
5
0
PCIF1
Allow control of PCIF2 with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
4
0
PCIF0
Allow control of PCIF1 with assertion of SW PCI_STP#
0 = Free-running, 1 = Stopped with SW PCI_STP#
3
0
RESERVED
RESERVED, Set = 0
2
1
RESERVED
RESERVED, Set = 1
1
1
RESERVED
RESERVED, Set = 1
0
1
RESERVED
RESERVED, Set = 1
Byte 5: Control Register 5
Bit
@Pup
Name
Description
7
0
6
0
RESERVED
RESERVED, Set = 0
5
0
RESERVED
RESERVED, Set = 0
4
0
RESERVED
RESERVED, Set = 0
3
0
2
0
CPU[T/C]2
CPU[T/C]2 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
1
0
CPU[T/C]1
CPU[T/C]1 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
0
0
CPU[T/C]0
CPU[T/C]0 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
SRC[T/C][6:0],SATA[T/C] SRC[T/C], SATA[T/C]Stop Drive Mode
0 = Driven when SW PCI_STP# asserted,1 = Hi-Z when PCI_STP#
asserted
SRC[T/C][6:0],SATA[T/C] SRC[T/C], SATA[T/C] PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
Document #: 38-07612 Rev. *C
Page 6 of 17
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CY28412
PRELIMINARY
Byte 6: Control Register 6
Bit
@Pup
Name
RESERVED
Description
7
0
6
0
RESERVED, Set = 0
5
1
REF1
REF1 Output Drive Strength
0 = Low, 1 = High
4
1
REF0
REF0 Output Drive Strength
0 = Low, 1 = High
3
1
PCIF, SRC, PCI
2
Externally
selected
CPUT/C
FS_C. Reflects the value of the FS_C pin sampled on power up
0 = FS_C was low during VTT_PWRGD# assertion
1
Externally
selected
CPUT/C
FS_B. Reflects the value of the FS_B pin sampled on power up
0 = FS_B was low during VTT_PWRGD# assertion
0
Externally
selected
CPUT/C
FS_A. Reflects the value of the FS_A pin sampled on power up
0 = FS_A was low during VTT_PWRGD# assertion
Test Clock Mode Entry Control
1 = Hi-Z mode, 0 = Normal operation
SW PCI_STP# Function
0=SW PCI_STP assert, 1= SW PCI_STP deassert
When this bit is set to 0, all STOPPABLE PCI, PCIF and SRC outputs will
be stopped in a synchronous manner with no short pulses.
When this bit is set to 1, all STOPPED PCI, PCIF and SRC outputs will
resume in a synchronous manner with no short pulses.
Byte 7: Vendor ID
Bit
@Pup
7
0
Revision Code Bit 3
Name
Revision Code Bit 3
Description
6
0
Revision Code Bit 2
Revision Code Bit 2
5
1
Revision Code Bit 1
Revision Code Bit 1
4
0
Revision Code Bit 0
Revision Code Bit 0
3
1
Vendor ID Bit 3
Vendor ID Bit 3
2
0
Vendor ID Bit 2
Vendor ID Bit 2
1
0
Vendor ID Bit 1
Vendor ID Bit 1
0
0
Vendor ID Bit 0
Vendor ID Bit 0
Crystal Recommendations
Crystal Loading
The CY28412 requires a Parallel Resonance Crystal.
Substituting a series resonance crystal will cause the
CY28412 to operate at the wrong frequency and violate the
ppm specification. For most applications there is a 300-ppm
frequency shift between series and parallel crystals due to
incorrect loading.
Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, the total capacitance
the crystal will see must be considered to calculate the appropriate capacitive loading (CL).
The following diagram shows a typical crystal configuration
using the two trim capacitors. An important clarification for the
following discussion is that the trim capacitors are in series
with the crystal not parallel. It’s a common misconception that
load capacitors are in parallel with the crystal and should be
approximately equal to the load capacitance of the crystal.
This is not true.
Table 5. Crystal Recommendations
Frequency
(Fund)
Cut
Loading Load Cap
Drive
(max.)
Shunt Cap
(max.)
Motional
(max.)
Tolerance
(max.)
Stability
(max.)
Aging
(max.)
14.31818 MHz
AT
Parallel
0.1 mW
5 pF
0.016 pF
50 ppm
50 ppm
5 ppm
Document #: 38-07612 Rev. *C
20 pF
Page 7 of 17
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CY28412
PRELIMINARY
Figure 1. Crystal Capacitive Clarification
Calculating Load Capacitors
CL ....................................................Crystal load capacitance
In addition to the standard external trim capacitors, trace
capacitance and pin capacitance must also be considered to
correctly calculate crystal loading. As mentioned previously,
the capacitance on each side of the crystal is in series with the
crystal. This means the total capacitance on each side of the
crystal must be twice the specified crystal load capacitance
(CL). While the capacitance on each side of the crystal is in
series with the crystal, trim capacitors (Ce1,Ce2) should be
calculated to provide equal capacitive loading on both sides.
As mentioned previously, the capacitance on each side of the
crystal is in series with the crystal. This mean the total capacitance on each side of the crystal must be 2 times the specified
load capacitance (CL). While the capacitance on each side of
the crystal is in series with the crystal, trim capacitors
(Ce1,Ce2) should be calculated to provide equal capacitance
loading on both sides.
Use the following formulas to calculate the trim capacitor
values for Ce1 and Ce2.
Load Capacitance (each side)
1
( Ce1 + Cs1
+ Ci1
1
+
Cs ..............................................Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
PD (Power-down) Clarification
The VTT_PWRGD# /PD pin is a dual function pin. During initial
power-up, the pin functions as VTT_PWRGD#. Once
VTT_PWRGD# has been sampled low by the clock chip, the
pin assumes PD functionality. The PD pin is an asynchronous
active high input used to shut off all clocks cleanly prior to
shutting off power to the device. This signal is synchronized
internal to the device prior to powering down the clock synthesizer. PD is also an asynchronous input for powering up the
system. When PD is asserted high, all clocks are driven to a
low value and held prior to turning off the VCOs and the crystal
oscillator.
When PD is sampled high by two consecutive rising edges of
CPUC, all single-ended outputs will be held low on their next
high to low transition and differential clocks must be held high
or Hi-Z (depending on the state of the control register drive
mode bit) on the next diff clock# high to low transition. When
the SMBus PD drive mode bit corresponding to the differential
Total Capacitance (as seen by the crystal)
=
Ce ..................................................... External trim capacitors
PD (Power-down) – Assertion
Ce = 2 * CL – (Cs + Ci)
CLe
CLe ......................................... Actual loading seen by crystal
using standard value trim capacitors
1
Ce2 + Cs2 + Ci2
)
Clock Chip
Ci2
Ci1
Pin
3 to 6p
X2
X1
Cs1
Cs2
Trace
2.8pF
XTAL
Ce1
Ce2
Trim
33pF
Figure 2. Crystal Loading Example
Document #: 38-07612 Rev. *C
Page 8 of 17
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PRELIMINARY
(CPU, SRC, and DOT) clock output of interest is programmed
to ‘0’, the clock output must be held with “Diff clock” pin driven
high at 2 x Iref, and “Diff clock#” tristate. If the control register
PD drive mode bit corresponding to the output of interest is
programmed to “1”, then both the “Diff clock” and the “Diff
clock#” are Hi-Z. Note the example below shows CPUT = 133
MHz and PD drive mode = ‘1’ for all differential outputs. This
diagram and description is applicable to valid CPU
frequencies 100,133,166,200,266,333, and 400 MHz. In the
event that PD mode is desired as the initial power-on state, PD
must be asserted high in less than 10 µs after asserting
VTT_PWRGD#.
CY28412
PD Deassertion
The power-up latency is less than 1.8 ms. This is the time from
the deassertion of the PD pin or the ramping of the power
supply until the time that stable clocks are output from the
clock chip. All differential outputs stopped in a tristate condition
resulting from power down must be driven high in less than
300 µs of PD deassertion to a voltage greater than 200 mV.
After the clock chip’s internal PLL is powered up and locked,
all outputs are enabled within a few clock cycles of each other.
Below is an example showing the relationship of clocks
coming up.
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33 MHz
REF
Figure 3. Power-down Assertion Timing Waveform
Tstable
<1.8ms
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33MHz
REF
Tdrive_PWRDN#
<300µS, >200mV
Figure 4. Power-down Deassertion Timing Waveform
Document #: 38-07612 Rev. *C
Page 9 of 17
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CY28412
PRELIMINARY
FS_A, FS_B,FS_C
VTT_PW RGD#
PW RGD_VRM
0.2-0.3mS
Delay
VDD Clock Gen
Clock State
Clock Outputs
Clock VCO
State 0
W ait for
VTT_PW RGD#
State 1
Device is not affected,
VTT_PW RGD# is ignored
Sample Sels
State 2
Off
State 3
On
On
Off
Figure 5. VTT_PWRGD# Timing Diagram
S2
S1
D elay
>0.25m S
VTT_PW R G D# = Low
S am ple
Inputs straps
VDD _A = 2.0V
W ait for <1.8m s
S0
P ow er O ff
S3
VD D_A = off
N orm al
O peration
Enable O utputs
VTT_PW RG D # = toggle
Figure 6. Clock Generator Power-up/Run State Diagram
Document #: 38-07612 Rev. *C
Page 10 of 17
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CY28412
PRELIMINARY
Absolute Maximum Conditions
Parameter
Description
Condition
Min.
Max.
Unit
VDD
Core Supply Voltage
–0.5
4.6
V
VDD_A
Analog Supply Voltage
–0.5
4.6
V
VIN
Input Voltage
Relative to VSS
–0.5
VDD + 0.5
VDC
TS
Temperature, Storage
Non-functional
–65
150
°C
TA
Temperature, Operating Ambient
Functional
0
70
°C
TJ
Temperature, Junction
Functional
–
150
°C
ØJC
Dissipation, Junction to Case
Mil-Spec 883E Method 1012.1
–
31.89
°C/W
ØJA
Dissipation, Junction to Ambient
JEDEC (JESD 51)
–
48.29
°C/W
ESDHBM
ESD Protection (Human Body Model)
MIL-STD-883, Method 3015
–
V
UL-94
Flammability Rating
At 1/8 in.
MSL
Moisture Sensitivity Level
2000
V–0
1
Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
DC Electrical Specifications
Parameter
Description
VDD_A,
3.3V Operating Voltage
VDD_REF,
VDD_PCI,
VDD_3V66,
VDD_48,
VDD_CPU
Condition
3.3 ± 5%
Min.
Max.
Unit
3.135
3.465
V
VILI2C
Input Low Voltage
SDATA, SCLK
–
1.0
V
VIHI2C
Input High Voltage
SDATA, SCLK
2.2
–
V
VIL_FS
FS_(A,B,C) Input Low Voltage
VSS – 0.3
0.35
V
VIH_FS
FS_(A,B,C) Input High Voltage
0.7
VDD + 0.5
V
VIL
Input Low Voltage
VSS – 0.5
0.8
V
VIH
Input High Voltage
2.0
VDD + 0.5
V
IIL
Input Low Leakage Current
except internal pull-up resistors, 0 < VIN < VDD
IIH
Input High Leakage Current
except internal pull-down resistors, 0 < VIN < VDD
µA
–5
5
µA
VOL
Output Low Voltage
IOL = 1 mA
VOH
Output High Voltage
IOH = –1 mA
IOZ
High-impedance Output Current
CIN
Input Pin Capacitance
COUT
Output Pin Capacitance
3
6
pF
LIN
Pin Inductance
–
7
nH
–
0.4
V
2.4
–
V
–10
10
µA
2
5
pF
VXIH
Xin High Voltage
0.7VDD
VDD
V
VXIL
Xin Low Voltage
0
0.3VDD
V
IDD3.3V
Dynamic Supply Current
At max load and freq per Figure 8
–
500
mA
IPD3.3V
Power-down Supply Current
PD asserted, Outputs driven
–
75
mA
IPD3.3V
Power-down Supply Current
PD asserted, Outputs Hi-Z
–
2
mA
Document #: 38-07612 Rev. *C
Page 11 of 17
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CY28412
PRELIMINARY
AC Electrical Specifications
Parameter
Description
Condition
Min.
Max.
Unit
47.5
52.5
%
69.841
71.0
ns
Crystal
TDC
XIN Duty Cycle
The device will operate reliably with input duty
cycles up to 30/70 but the REF clock duty cycle
will not be within specification
TPERIOD
XIN Period
When XIN is driven from an external clock
source
TR / TF
XIN Rise and Fall Times
Measured between 0.3VDD and 0.7VDD
–
10.0
ns
TCCJ
XIN Cycle to Cycle Jitter
As an average over 1-µs duration
–
500
ps
LACC
Long-term Accuracy
Over 150 ms
–
300
ppm
CPU at 0.7V
TDC
CPUT and CPUC Duty Cycle
Measured at crossing point VOX
45
55
%
TPERIOD
100 MHz CPUT and CPUC Period
Measured at crossing point VOX
9.9970
10.003
ns
TPERIOD
133 MHz CPUT and CPUC Period
Measured at crossing point VOX
7.4978
7.5023
ns
TPERIOD
166 MHz CPUT and CPUC Period
Measured at crossing point VOX
5.9982
6.0018
ns
TPERIOD
200 MHz CPUT and CPUC Period
Measured at crossing point VOX
4.9985
5.0015
ns
TPERIOD
266 MHz CPUT and CPUC Period
Measured at crossing point VOX
3.7489
3.7511
ns
TPERIOD
333 MHz CPUT and CPUC Period
Measured at crossing point VOX
2.9991
3.0009
ns
TPERIOD
400 MHz CPUT and CPUC Period
Measured at crossing point VOX
2.4993
2.5008
ns
TPERIODSS 100 MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
9.9970
10.0533
ns
TPERIODSS 133 MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
7.4978
7.5400
ns
TPERIODSS 166 MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
5.9982
6.0320
ns
TPERIODSS 200 MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
4.9985
5.0266
ns
TPERIODSS 266 MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
3.7489
3.7700
ns
TPERIODSS 333 MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
2.9991
3.0160
ns
TPERIODSS 400 MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
2.4993
2.5133
ns
TSKEW
Any CPUT/C to CPUT/C Clock Skew,
SSC
Measured at crossing point VOX
–
100
ps
TCCJ
CPUT/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
85
ps
TCCJ2
CPU2_ITP Cycle to Cycle Jitter
Measured at crossing point VOX
–
125
ps
TSKEW2
CPU2_ITP to CPU0 Clock Skew
Measured at crossing point VOX
–
150
ps
TR / TF
CPUT and CPUC Rise and Fall Times
Measured from VOL = 0.175 to VOH = 0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of 2*(TR – TF)/(TR + TF)
–
20
%
∆TR
Rise Time Variation
–
125
ps
∆TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 8
660
850
mv
VLOW
Voltage Low
Math averages Figure 8
–150
–
mv
250
550
mv
–
VHIGH +
0.3
V
–0.3
–
V
–
0.2
V
VOX
Crossing Point Voltage at 0.7V Swing
VOVS
Maximum Overshoot Voltage
VUDS
Minimum Undershoot Voltage
VRB
Ring Back Voltage
See Figure 8. Measure SE
SRC
TDC
SRCT and SRCC Duty Cycle
Measured at crossing point VOX
45
55
%
TPERIOD
100 MHz SRCT and SRCC Period
Measured at crossing point VOX
9.9970
10.003
ns
TPERIODSS 100 MHz SRCT and SRCC Period, SSC Measured at crossing point VOX
9.9970
10.0533
ns
Document #: 38-07612 Rev. *C
Page 12 of 17
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CY28412
PRELIMINARY
AC Electrical Specifications (continued)
Parameter
Description
Condition
Min.
Max.
Unit
–
125
ps
–
300
ppm
175
700
ps
TCCJ
SRCT/C Cycle to Cycle Jitter
Measured at crossing point VOX
LACC
SRCT/C Long Term Accuracy
Measured at crossing point VOX
TR / TF
SRCT and SRCC Rise and Fall Times
Measured from VOL = 0.175 to VOH = 0.525V
TRFM
Rise/Fall Matching
Determined as a fraction of 2*(TR – TF)/(TR + TF)
∆TR
Rise Time Variation
∆TF
Fall Time Variation
VHIGH
Voltage High
Math averages Figure 8
VLOW
Voltage Low
Math averages Figure 8
–150
–
mv
VOX
Crossing Point Voltage at 0.7V Swing
250
550
mV
VOVS
Maximum Overshoot Voltage
–
VHIGH +
0.3
V
–
20
%
–
125
ps
–
125
ps
660
850
mv
VUDS
Minimum Undershoot Voltage
–0.3
–
V
VRB
Ring Back Voltage
See Figure 8. Measure SE
–
0.2
V
TSKEW
Any SRCT/C to SRCT/C Clock Skew
Measured at Crossing point VOX
–
250
ps
PCI/PCIF
TDC
PCI Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
Spread Disabled PCIF/PCI Period
Measurement at 1.5V
29.9910
30.0090
ns
TPERIOD
Spread Enabled PCIF/PCI Period
Measurement at 1.5V
29.9910
30.1598
ns
THIGH
PCIF and PCI high time
Measurement at 2.4V
12.0
–
ns
TLOW
PCIF and PCI low time
Measurement at 0.4V
12.0
–
ns
TR / TF
PCIF and PCI Edge Rate
Measured between 0.8V and 2.0V
0.5
2.0
V/ns
TSKEW
Any PCI clock to Any PCI clock Skew
Measurement at 1.5V
–
500
ps
TCCJ
PCIF and PCI Cycle to Cycle Jitter
Measurement at 1.5V
–
500
ps
TDC
DOT96T and DOT96C Duty Cycle
Measured at crossing point VOX
45
55
%
DOT
TPERIOD
DOT96T and DOT96C Period
Measured at crossing point VOX
10.4135
10.4198
ns
TCCJ
DOT96T/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
250
ps
LACC
DOT96T/C Long Term Accuracy
Measured at crossing point VOX
–
300
ppm
TR / TF
DOT96T and DOT96C Rise and Fall
Times
Measured from VOL = 0.175 to VOH = 0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of 2*(TR – TF)/(TR + TF)
–
20
%
∆TR
Rise Time Variation
–
125
ps
∆TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 8
660
850
mv
VLOW
Voltage Low
Math averages Figure 8
–150
–
mv
250
550
mV
–
VHIGH +
0.3
V
–0.3
–
V
–
0.2
V
VOX
Crossing Point Voltage at 0.7V Swing
VOVS
Maximum Overshoot Voltage
VUDS
Minimum Undershoot Voltage
VRB
Ring Back Voltage
See Figure 8. Measure SE
USB
TDC
Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
Period
Measurement at 1.5V
20.8271
20.8396
ns
THIGH
USB high time
Measurement at 2.4V
8.094
10.036
ns
TLOW
USB low time
Measurement at 0.4V
7.694
9.836
ns
Document #: 38-07612 Rev. *C
Page 13 of 17
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CY28412
PRELIMINARY
AC Electrical Specifications (continued)
Parameter
Description
Condition
TR / TF
USB Edge Rate
Measured between 0.8V and 2.0V
TCCJ
USB Cycle to Cycle Jitter
Measurement at 1.5V
Min.
Max.
Unit
1.0
2.0
V/ns
–
350
ps
REF
TDC
REF Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
REF Period
Measurement at 1.5V
69.8203
69.8622
ns
TR / TF
REF Edge Rate
Measured between 0.8V and 2.0V
0.5
2.0
V/ns
TCCJ
REF Cycle to Cycle Jitter
Measurement at 1.5V
–
1000
ps
–
1.8
ms
10.0
–
ns
0
–
ns
ENABLE/DISABLE and SETUP
TSTABLE
Clock Stabilization from Power-up
TSS
Stopclock Set-up Time
TSH
Stopclock Hold Time
Test and Measurement Set-up
For PCI Single-ended Signals and Reference
The following diagram shows the test load configurations for
the single-ended PCI, USB, and REF output signals.
PCI/
USB
12Ω
60Ω
12Ω
60Ω
Measurement
Point
4pF
Measurement
Point
4pF
12Ω
60Ω
Measurement
Point
4pF
12Ω
60Ω
REF
Measurement
Point
4pF
12Ω
60Ω
Measurement
Point
4pF
Figure 7. Single-ended Load Configuration
Document #: 38-07612 Rev. *C
Page 14 of 17
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CY28412
PRELIMINARY
For Differential CPU, SRC and DOT96 Output Signals
The following diagram shows the test load configuration for the
differential CPU and SRC outputs.
CPUT
SRCT
D O T96T
CPUC
SRCC
D O T96C
IR E F
M e a s u re m e n t
P o in t
33Ω
4 9 .9 Ω
2pF
1 0 0 Ω D iff e r e n tia l
M e a s u re m e n t
P o in t
33Ω
2pF
4 9 .9 Ω
475Ω
Figure 8. 0.7V Single-ended Load Configuration
3 .3 V s ig n a l s
T DC
-
-
3 .3 V
2 .4 V
1 .5 V
0 .4 V
0V
TF
TR
Figure 9. Single-ended Output Signals (for AC Parameters Measurement)
Ordering Information
Part Number
Package Type
Product Flow
Standard
CY28412OC
56-pin SSOP
Commercial, 0° to 70°C
CY28412OCT
56-pin SSOP – Tape and Reel
Commercial, 0° to 70°C
CY28412OXC
56-pin SSOP
Commercial, 0° to 70°C
CY28412OXCT
56-pin SSOP – Tape and Reel
Commercial, 0° to 70°C
Lead-free
Document #: 38-07612 Rev. *C
Page 15 of 17
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PRELIMINARY
CY28412
Package Drawing and Dimensions
56-lead Shrunk Small Outline Package O56
51-85062-*C
Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips
I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification
as defined by Philips. Intel and Pentium are registered trademarks of Intel Corporation. All product and company names mentioned
in this document are the trademarks of their respective holders.
Document #: 38-07612 Rev. *C
Page 16 of 17
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
[+] Feedback
PRELIMINARY
CY28412
Document History Page
Document Title: CY28412 Clock Generator for Intel® Grantsdale Chipset
Document Number: 38-07612
REV.
ECN NO. Issue Date
Orig. of
Change
Description of Change
**
131327
12/08/03
RGL
New data sheet
*A
208217
See ECN
RGL
Corrected Theta JA/JC values
Added TCCJ2 specs in the AC Electrical Specs table
Added TSKEW2 specs in the AC Electrical Specs table
Fixed Figure 7 0.7V Single-ended Load Config
Changed max PD supply current from 70 to 75 mA in the AC Electrical Specs table
*B
249075
See ECN
RGL
Fixed the loading diagram
Changed the Revision ID
Changed the power supply current for Hi-Z to 2 mA
*C
305733
See ECN
RGL
Changed Single-ended outputs from Rise /Fall times to Edge rate
Changed Byte 1 Bit 7 from Reserved to Enable Center Spread
Document #: 38-07612 Rev. *C
Page 17 of 17
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