TI CY74FCT16652ATPVC/PVCT 16-bit registered transceiver Datasheet

1CY74FCT162652T
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16652T
CY74FCT162652T
16-Bit Registered Transceivers
SCCS061B - July 1994 - Revised September 2001
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
• Industrial temperature range of −40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16652T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162652T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
These 16-bit, high-speed, low-power, registered transceivers
that are organized as two independent 8-bit bus transceivers
with three-state D-type registers and control circuitry arranged
for multiplexed transmission of data directly from the input bus
or from the internal storage registers. OEAB and OEBA control
pins are provided to control the transceiver functions. SAB and
SBA control pins are provided to select either real-time or
stored data transfer.
Data on the A or B data bus, or both, can be stored in the
internal D flip-flops by LOW-to-HIGH transitions at the
appropriate clock pins (CLKAB or CLKBA), regardless of the
select or enable control pins. When SAB and SBA are in the
real-time transfer mode, it is also possible to store data without
using the internal D-type flip-flops by simultaneously enabling
OEAB and OEBA. In this configuration, each output reinforces
its input. Thus, when all other data sources to the two sets of
bus lines are at high impedance, each set of bus lines will
remain at its last state.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16652T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162652T has 24-mA balanced output drivers
with current-limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162652T is ideal for driving transmission lines.
Logic Block Diagrams
1OEAB
2OEAB
1OEBA
2OEBA
1CLKBA
2CLKBA
1SBA
2SBA
1CLKAB
2CLKAB
1SAB
2SAB
B REG
B REG
D
D
C
C
2A1
1A1
A REG
A REG
D
D
1B1
C
TO 7 OTHER CHANNELS
FCT16652-1
2 B1
C
TO 7 OTHER CHANNELS
Copyright
FCT16652-2
© 2001, Texas Instruments Incorporated
CY74FCT16652T
CY74FCT162652T
Pin Configuration
SSOP/TSSOP
Top View
1OEAB
1
56
1CLKAB
2
55
1OEBA
1CLKBA
1SAB
3
54
1SBA
GND
4
53
1A 1
5
52
1B1
GND
1A 2
6
51
1B2
VCC
7
50
VCC
1A 3
8
49
1B3
1A 4
9
48
1B4
1A 5
10
47
1B5
GND
11
46
GND
1A 6
12
45
1B6
1A 7
13
44
1B7
1A 8
14
43
1B8
2A 1
15
42
2B1
2A 2
16
41
2B2
2A3
17
40
2B3
GND
18
39
GND
2A 4
19
38
2B4
2A 5
20
37
2B5
2A 6
21
36
2B6
V CC
22
35
VCC
2A 7
23
34
2B7
2A 8
2B8
GND
33
24 FCT16652–1
32
25
2SAB
26
31
2SBA
2CLKAB
27
30
2CLKBA
2OEAB
28
29
GND
2OEBA
FCT16652-3
Pin Description
Name
Description
A
Data Register A Inputs
Data Register B Outputs
B
Data Register B Inputs
Data Register A Outputs
CLKAB, CLKBA
Clock Pulse Inputs
SAB, SBA
Output Data Source Select Inputs
OEAB, OEBA
Output Enable Inputs
2
CY74FCT16652T
CY74FCT162652T
Function Table[1]
Data I/O[2]
Inputs
OEAB
OEBA
CLKAB
CLKBA
SAB
SBA
A
B
L
L
H
H
H or L
H or L
X
X
X
X
Input
Input
Operation or Function
X
H
H
H
H or L
X
X[3]
X
X
Input
Input
Unspecified[2]
Output
Store A, Hold B
Store A in Both Registers
L
L
X
L
H or L
X
X
X
X[3]
Unspecified[2]
Input
Input
Hold A, Store B
Store B in both Registers
L
L
X
X
X
L
Output
Input
Real Time B Data to A Bus
Stored B Data to A Bus
L
L
X
H or L
X
H
H
H
X
X
L
X
Input
Output
Real Time A Data to B Bus
Stored A Data to B Bus
H
H
H or L
X
H
X
H
L
H or L
H or L
H
H
Output
Output
Stored A Data to B Bus and
Stored B Data to A Bus
Isolation
Store A and B Data
Notes:
1. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
=LOW-to-HIGH Transition
2. The data output functions may be enabled or disabled by various signals at the OEAB or OEBA inputs. Data input functions are always enabled, i.e., data at
the bus pins will be stored on every LOW-to-HIGH transition on the clock inputs.
3. Select control=L; clocks can occur simultaneously.
Select control=H; clocks must be staggered to load both registers.
3
CY74FCT16652T
CY74FCT162652T
BUS A
BUS B
OEAB
L
OEBA
L
CLKAB
X
CLKBA
X
SAB
X
BUS A
SBA
L
OEAB
H
BUS B
OEBA
L
Real-Time Transfer
Bus B to BusA
OEBA
H
X
H
CLKAB
CLKBA
X
X
CLKBA
X
SAB
L
SBA
X
Real-Time Transfer
BusA to Bus B
BUS A
OEAB
X
L
L
CLKAB
X
SAB
X
X
X
BUS B
BUS A
SBA
X
X
X
OEAB
H
BUS A
OEBA
L
Storage from
A and/or B
CLKAB
H or L
CLKBA
H or L
SAB
H
SBA
H
Transfer Stored Data
to A and/or B
Maximum Ratings[4]
(Above which the useful life may be impaired. For user guidelines, not tested.)
Power Dissipation .......................................................... 1.0W
Storage Temperature .....................Com’l −55°C to +125°C
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Ambient Temperature with
Power Applied .................................Com’l −55°C to +125°C
Operating Range
DC Input Voltage .................................................−0.5V to +7.0V
Range
DC Output Voltage ..............................................−0.5V to +7.0V
Industrial
DC Output Current
(Maximum Sink Current/Pin) ...........................−60 to +120 mA
Ambient
Temperature
VCC
−40°C to +85°C
5V ± 10%
Note:
4. Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
4
CY74FCT16652T
CY74FCT162652T
DC Electrical Characteristics Over the Operating Range
Parameter
Test Conditions[5]
Description
VIH
Input HIGH Voltage
Logic HIGH Level
VIL
Input LOW Voltage
Logic LOW Level
VH
Input Hysteresis
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=−18 mA
IIH
Input HIGH Current
IIL
Input LOW Current
IOZH
Min.
Typ.[6]
Max.
2.0
Unit
V
0.8
100
mV
−1.2
V
VCC=Max., VI=VCC
±1
µA
VCC=Max., VI=GND
±1
µA
High Impedance Output
Current
(Three-State Output pins)
VCC=Max., VOUT=2.7V
±1
µA
IOZL
High Impedance Output
Current
(Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
IOS
Short Circuit Current[8]
VCC=Max., VOUT=GND
−80
−200
mA
IO
Output Drive Current[8]
VCC=Max., VOUT=2.5V
−50
−180
mA
±1
µA
Max.
Unit
IOFF
Power-Off Disable
VCC=0V, VOUT
−0.7
V
−140
≤4.5V[7]
Output Drive Characteristics for CY74FCT16652T
Parameter
VOH
VOL
Test Conditions[5]
Min.
Typ.[6]
VCC=Min., IOH=−3 mA
2.5
3.5
VCC=Min., IOH=−15 mA
2.4
3.5
VCC=Min., IOH=−32 mA
2.0
3.0
Description
Output HIGH Voltage
Output LOW Voltage
VCC=Min., IOL=64 mA
V
0.2
0.55
V
Min.
Typ.[6]
Max.
Unit
Output Drive Characteristics for CY74FCT162652T
Parameter
Test Conditions[5]
Description
Output LOW
Current[8]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
60
115
150
mA
IODH
Output HIGH
Current[8]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
−60
−115
−150
mA
VOH
Output HIGH Voltage
VCC=Min., IOH=−24 mA
2.4
3.3
VOL
Output LOW Voltage
VCC=Min., IOL=24 mA
IODL
V
0.3
0.55
V
Typ.
Max.
Unit
Capacitance (TA = +25˚C, f = 1.0 MHz)
Parameter
Description[10]
Test Conditions
CIN
Input Capacitance
VIN = 0V
4.5
6.0
pF
COUT
Output Capacitance
VOUT = 0V
5.5
8.0
pF
Notes:
5. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
6. Typical values are at VCC=5.0V, +25°C ambient.
7. Tested at TA= +25°C.
8. Not more than one output should be tested at one time. Duration of the test should not exceed one second.
9. Duration of the condition cannot exceed one second.
10. This parameter is measured at characterization but not tested.
5
CY74FCT16652T
CY74FCT162652T
Power Supply Characteristics
Param.
Test Conditions[11]
Description
VIN<0.2V
VIN>VCC−0.2V
Min.
Typ.[12]
Max.
Unit
—
5
500
µA
—
0.5
1.5
mA
ICC
Quiescent Power Supply
Current
VCC=Max.
∆ICC
Quiescent Power Supply
Current
TTL Inputs HIGH
VCC = Max. VIN=3.4V[13]
ICCD
Dynamic Power Supply
Current[14]
VCC=Max.
Outputs Open
OEAB=OEAB=GND
One Input Toggling
50% Duty Cycle
VIN=VCC or
VIN=GND
—
75
120
µA/
MHz
IC
Total Power Supply Current[15]
VCC=Max.
Outputs Open
fo=10 MHz (CLKBA)
50% Duty Cycle
OEAB=OEBA=GND
One-Bit Toggling
f1=5 MHz
50% Duty Cycle
VIN=VCC or
VIN=GND
—
0.8
1.7
mA
VIN=3.4V or
VIN=GND
—
1.3
3.2
mA
VCC=Max.
Outputs Open
fo=10 MHz (CLKBA)
50% Duty Cycle
OEAB=OEBA=GND
Sixteen Bits Toggling
f1=2.5 MHz
50% Duty Cycle
VIN=VCC or
VIN=GND
—
3.8
6.5[16]
mA
VIN=3.4V or
VIN=GND
—
8.3
20.0[16]
mA
Notes:
11. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
12. Typical values are at VCC=5.0V +25° ambient.
13. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
14. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
15. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
DH
= Number of TTL inputs at DH
NT
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
= Number of inputs changing at f1
N1
All currents are in milliamps and all frequencies are in megahertz.
16. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
6
CY74FCT16652T
CY74FCT162652T
Switching Characteristics Over the Operating Range[17]
CY74FCT16652AT
CY74FCT162652AT
Parameter
Description
Min.
Max.
Unit
Fig. No.[18]
tPLH
tPHL
Propagation Delay Bus to Bus
1.5
6.3
ns
1, 3
tPZH
tPHL
Output Enable Time OEAB or OEBA to Bus
1.5
9.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time OEAB or OEBA to Bus
1.5
6.3
ns
1, 7, 8
tPLH
tPHL
Propagation Delay Clock to Bus
1.5
6.3
ns
1, 5
tPLH
tPHL
Propagation Delay SBA or SAB to Bus
1.5
7.7
ns
1, 5
tSU
Set-Up time HIGH or LOW Bus to Clock
2.0
—
ns
4
tH
Hold Time HIGH or LOW Bus to Clock
1.5
—
ns
4
tW
Clock Pulse Width HIGH or LOW
5.0
—
ns
5
—
0.5
ns
tSK(O)
Output
Skew[19]
CY74FCT16652CT
CY74FCT162652CT
Parameter
Description
Min.
Max.
Unit
Fig. No.[18]
tPLH
tPHL
Propagation Delay
Bus to Bus
1.5
5.4
ns
1, 3
tPZH
tPHL
Output Enable Time
OEAB or OEBA to Bus
1.5
7.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
OEAB or OEBA to Bus
1.5
6.3
ns
1, 7, 8
tPLH
tPHL
Propagation Delay
Clock to Bus
1.5
5.7
ns
1, 5
tPLH
tPHL
Propagation Delay
SBA or SAB to Bus
1.5
6.2
ns
1, 5
tSU
Set-Up Time
HIGH or LOW
Bus to Clock
2.0
—
ns
4
tH
Hold Time
HIGH or LOW
Bus to Clock
1.5
—
ns
4
tW
Clock Pulse Width
HIGH or LOW
5.0
—
ns
5
tSK(O)
Output Skew[19]
—
0.5
ns
Notes:
17. Minimum limits are specified, but not tested, on propagation delays.
18. See “Parameter Measurement Information” in the General Information section.
19. Skew between any two outputs of the same package switching in the same direction. This parameter ensured by design.
7
CY74FCT16652T
CY74FCT162652T
Ordering Information CY74FCT16652
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
5.4
CY74FCT16652CTPVC/PVCT
O56
56-Lead (300-Mil) SSOP
Industrial
6.3
CY74FCT16652ATPVC/PVCT
O56
56-Lead (300-Mil) SSOP
Industrial
Ordering Information CY74FCT162652
Speed
(ns)
5.4
6.3
Ordering Code
Package
Name
Package Type
74FCT162652CTPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT162652CTPVC
O56
56-Lead (300-Mil) SSOP
74FCT162652CTPVCT
O56
56-Lead (300-Mil) SSOP
CY74FCT162652ATPVC
O56
56-Lead (300-Mil) SSOP
74FCT162652ATPVCT
O56
56-Lead (300-Mil) SSOP
8
Operating
Range
Industrial
Industrial
CY74FCT16652T
CY74FCT162652T
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
9
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74FCT162652ATPVCG4
ACTIVE
SSOP
DL
56
74FCT162652ATPVCT
ACTIVE
SSOP
DL
74FCT162652CTPACT
ACTIVE
TSSOP
74FCT162652CTPVCG4
ACTIVE
74FCT162652CTPVCT
20
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162652ETPACT
OBSOLETE
TSSOP
DGG
56
TBD
Call TI
Call TI
74FCT162652ETPVCT
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
74FCT16652ATPVCG4
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16652ATPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16652CTPVCG4
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16652CTPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162652ATPVC
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162652CTPVC
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162652ETPAC
OBSOLETE
TSSOP
DGG
56
TBD
Call TI
Call TI
CY74FCT162652ETPVC
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
CY74FCT16652ATPVC
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16652ATPVCT
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16652CTPVC
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16652CTPVCT
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
20
20
20
20
CY74FCT16652ETPAC
OBSOLETE
TSSOP
DGG
56
TBD
Call TI
Call TI
CY74FCT16652ETPACT
OBSOLETE
TSSOP
DGG
56
TBD
Call TI
Call TI
CY74FCT16652ETPVC
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
CY74FCT16652ETPVCT
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
FCT162652ATPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162652CTPACTE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162652CTPACTG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162652CTPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
11.35
18.67
3.1
16.0
32.0
Q1
74FCT162652ATPVCT
SSOP
DL
56
1000
330.0
32.4
74FCT162652CTPACT
TSSOP
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
74FCT162652CTPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
CY74FCT16652ATPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
CY74FCT16652CTPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74FCT162652ATPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
74FCT162652CTPACT
TSSOP
DGG
56
2000
346.0
346.0
41.0
74FCT162652CTPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
CY74FCT16652ATPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
CY74FCT16652CTPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Similar pages