Cypress CY7C09159 8k/16k x 9 synchronous dual-port static ram Datasheet

fax id: 5218
51
CY7C09159
CY7C09169
PRELIMINARY
8K/16K x 9
Synchronous Dual-Port Static RAM
Features
• True Dual-Ported memory cells which allow simultaneous access of the same memory location
• 2 Flow-Through/Pipelined devices
— 8K x 9 organization (CY7C09159)
— 16K x 9 organization (CY7C09169)
• 3 Modes
— Flow-Through
• High-speed clock to data access 6.5/7.5/12 ns (max.)
• Low operating power
— Active= 200 mA (typical)
— Standby= 0.05 mA (typical)
• Fully synchronous interface for easier operation
• Burst counters increment addresses internally
— Shorten cycle times
— Minimize bus noise
— Pipelined
— Burst
• Pipelined output mode on both ports allows fast
100-MHz cycle time
• 0.35-micron CMOS for optimum speed/power
•
•
•
•
— Supported in Flow-Through and Pipelined modes
Dual Chip Enables for easy depth expansion
Automatic power-down
Commercial and Industrial temperature ranges
Available in 100-pin TQFP
v
Logic Block Diagram
R/WL
R/WR
OEL
OER
CE0L
CE1L
1
1
0
0
0/1
1
0/1
FT/PipeL
CE0R
CE1R
0/1
0
0
1
0/1
9
FT/PipeR
9
I/O0L–I/O8L
I/O0R–I/O8R
I/O
Control
[1]
I/O
Control
13/14
13/14
A0–A12/13L
CLKL
ADSL
Counter/
Address
Register
Decode
CNTENL
CNTRSTL
Counter/
Address
Register
Decode
True Dual-Ported
RAM Array
[1]
A0–A12/13R
CLKR
ADSR
CNTENR
CNTRSTR
Note:
1. A0–A12 for 8K; A0–A13 for 16K.
For the most recent information, visit the Cypress web site at www.cypress.com
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134 •
408-943-2600
November 1997 - Revised June 5, 1998
CY7C09159
CY7C09169
PRELIMINARY
A HIGH on CE0 or LOW on CE1 for one clock cycle will power
down the internal circuitry to reduce the static power consumption. The use of multiple Chip Enables allows easier banking
of multiple chips for depth expansion configurations. In the
pipelined mode, one cycle is required with CE 0 LOW and CE1
HIGH to reactivate the outputs.
Functional Description
The CY7C09159 and CY7C09169 are high speed synchronous CMOS 8K and 16K x 9 dual-port static RAMs. Two ports
are provided, permitting independent, simultaneous access for
reads and writes to any location in memory. [2] Registers on
control, address, and data lines allow for minimal set-up and
hold times. In pipelined output mode, data is registered for
decreased cycle time. Clock to data valid tCD2 = 6.5 ns (pipelined). Flow-through mode can also be used to bypass the
pipelined output register to eliminate access latency. In
flow-through mode data will be available tCD1 = 15 ns after the
address is clocked into the device. Pipelined output or
flow-through mode is selected via the FT/Pipe pin.
Counter enable inputs are provided to stall the operation of the
address input and utilize the internal address generated by the
internal counter for fast interleaved memory applications. A
port’s burst counter is loaded with the port’s address strobe
(ADS). When the port’s count enable (CNTEN) is asserted, the
address counter will increment on each LOW-to-HIGH transistion of that port’s clock signal. This will read/write one word
from/into each successive address location until CNTEN is
deasserted. The counter can address the entire memory array
and will loop back to the start. Counter reset (CNTRST) is used
to reset the burst counter.
Each port contains a burst counter on the input address register. The internal write pulse width is independent of the LOWto-HIGH transition of the clock signal. The internal write pulse
is self-timed to allow the shortest possible cycle times.
All parts are available in 100-pin Thin Quad Plastic Flatpack
(TQFP) packages.
Note:
2. When simultaneously writing to the same location, final value cannot be guaranteed.
2
CY7C09159
CY7C09169
PRELIMINARY
Pin Configurations
NC
A6R
A5R
A4R
A3R
A2R
A1R
A0R
CNTENR
CLKR
ADSR
GND
GND
ADSL
CLKL
CNTENL
A0L
A1L
A2L
A3L
A4L
A5L
A6L
NC
NC
100-Pin TQFP
(Top View)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
NC
1
75
NC
NC
2
74
NC
A7L
3
73
A7R
A8L
4
72
A8R
A9L
5
71
A9R
A10L
6
70
A10R
A11L
7
69
A11R
A12L
8
68
A12R
[Note 3] A13L
9
67
A13R [Note 3]
66
NC
NC
10
NC
11
NC
12
VCC
13
NC
14
62
NC
NC
15
61
NC
CY7C09169 (16K x 9)
CY7C09159 (8K x 9)
65
NC
64
NC
63
GND
NC
16
60
NC
NC
17
59
NC
CE0L
18
58
CE0R
CE1L
19
57
CE1R
CNTRSTL
20
56
CNTRSTR
R/WL
21
55
R/WR
OEL
22
54
OER
FT/PIPEL
23
53
FT/PIPER
NC
24
52
GND
NC
25
51
NC
Note:
3. This pin is NC for CY7C09159.
3
NC
NC
I/O8R
I/O7R
I/O6R
I/O5R
I/O4R
I/O3R
VCC
I/O2R
I/01R
I/O0R
GND
VCC
I/O0L
I/O1L
GND
I/O2L
I/O3L
I/O4L
I/O5L
I/O6L
I/O7L
GND
I/O8L
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
CY7C09159
CY7C09169
PRELIMINARY
Selection Guide
fMAX2 (MHz) (Pipelined)
CY7C09159
CY7C09169
-6
CY7C09159
CY7C09169
-7
CY7C09159
CY7C09169
-12
100
83
50
Max Access Time (ns) (Clock to Data, Pipelined)
6.5
7.5
12
Typical Operating Current ICC (mA)
250
235
195
Typical Standby Current for ISB1 (mA)
(Both Ports TTL Level)
45
40
30
Typical Standby Current for ISB3 (mA)
(Both Ports CMOS Level)
0.05
0.05
0.05
Pin Definitions
Left Port
Right Port
Description
A0L–A13L
A0R–A13R
Address Inputs. (A0−A12 for 8K; A0−A13 for 16K devices)
ADSL
ADSR
Address Strobe Input. Used as an address qualifier. This signal should be asserted LOW during
normal read or write transactions. Asserting this signal LOW also loads the burst address counter
with data present on the I/O pins.
CE0L,CE1L
CE0R,CE1R
Chip Enable Input. To select either the left or right port, both CE0 AND CE1 must be asserted to
their active states (CE0 ≤ VIL and CE1 ≥ VIH).
CLKL
CLKR
Clock Signal. This input can be free running or strobed. Maximum clock input rate is fMAX.
CNTENL
CNTENR
Counter Enable Input. Asserting this signal LOW increments the burst address counter of its
respective port on each rising edge of CLK. CNTEN is disabled if ADS or CNTRST are asserted
LOW.
CNTRSTL
CNTRSTR
Counter Reset Input. Asserting this signal LOW resets the burst address counter of its respective
port to zero. CNTRST is not disabled by asserting ADS or CNTEN.
I/O0L–I/O 8L
I/O0R–I/O8R
Data Bus Input/Output (I/O0–I/O7 for x8 devices; I/O0–I/O8 for x9 devices).
OEL
OER
Output Enable Input. This signal must be asserted LOW to enable the I/O data pins during read
operations.
R/WL
R/WR
Read/Write Enable Input. This signal is asserted LOW to write to the dual port memory array. For
read operations, assert this pin HIGH.
FT/PIPEL
FT/PIPE R
Flow-Through/Pipelined Select Input. For flow-through mode operation, assert this pin LOW. For
pipelined mode operation, assert this pin HIGH.
GND
Ground Input.
NC
No Connect.
VCC
Power Input.
Output Current into Outputs (LOW)............................. 20 mA
Maximum Ratings
Static Discharge Voltage ........................................... >2001V
(Above which the useful life may be impaired. For user guidelines, not tested.)
Latch-Up Current..................................................... >200 mA
Storage Temperature ................................. –65 °C to +150°C
Ambient Temperature with Power Applied ..–55°C to +125°C
Operating Range
Supply Voltage to Ground Potential ............... –0.3V to +7.0V
Range
DC Voltage Applied to
Outputs in High Z State ................................. –0.5V to +7.0V
Commercial
DC Input Voltage............................................ –0.5V to +7.0V
Industrial
4
Ambient
Temperature
VCC
0°C to +70°C
5V ± 10%
−40°C to +85°C
5V ± 10%
CY7C09159
CY7C09169
PRELIMINARY
Electrical Characteristics Over the Operating Range
CY7C09159
CY7C09169
-6
Symbol
Parameter
Min
VOH
Output HIGH Voltage (VCC=Min,
IOH=–4.0 mA)
VOL
Output LOW Voltage (VCC=Min,
IOH= +4.0 mA)
Input HIGH Voltage
Input LOW Voltage
IOZ
Output Leakage Current
ICC
Operating Current
(V CC=Max, IOUT=0 mA)
Outputs Disabled
Indust.
Standby Current (Both
Ports TTL Level)[4] CEL &
CER ≥ VIH, f=fMAX
Indust.
ISB3
Typ
10
250
Com’l.
Standby Current (One Port
TTL Level)[4] CEL | CER ≥
VIH, f=fMAX
Com’l.
Indust.
Standby Current (Both
Ports CMOS Level)[4] CEL
& CER ≥ V CC – 0.2V, f=0
Indust.
Com’l.
Com’l.
−10
0.25
160
200
Indust.
Units
V
V
0.8
−10
V
10
µA
235
420
195
300
mA
260
445
225
375
mA
10
235
0.05
0.4
2.2
115
175
Max
V
0.8
450
45
Typ
0.4
2.2
−10
Min
2.4
0.8
Com’l.
-12
Max
2.4
2.2
Standby Current (One Port
CMOS Level)[4] CEL | CER
≥ VIH, f=fMAX
ISB4
Min
0.4
VIH
ISB2
Max
2.4
VIL
ISB1
-7
Typ
40
105
30
85
mA
55
120
45
100
mA
160
220
125
190
mA
175
235
140
205
mA
0.05
0.25
0.05
0.25
mA
0.05
0.25
0.05
0.25
mA
145
185
110
150
mA
160
200
125
165
mA
Capacitance
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Max.
Unit
10
pF
10
pF
AC Test Loads
5V
5V
R1 = 893Ω
OUTPUT
OUTPUT
C = 30 pF
RTH = 250Ω
R1 = 893Ω
OUTPUT
C = 30 pF
R2 = 347Ω
C = 5 pF
VTH = 1.4V
(a) Normal Load (Load 1)
(b) Thévenin Equivalent (Load 1)
ALL INPUT PULSES
3.0V
GND
10%
R2 = 347Ω
(c) Three-State Delay (Load 2)
(Used for tCKLZ, tOLZ, & tOHZ
including scope and jig)
90%
10%
90%
≤ 3 ns
≤ 3 ns
Note:
4. CEL and CER are internal signals. To select either the left or right port, both CE0 AND CE1 must be asserted to their active states (CE0 ≤ VIL and CE1 ≥ VIH).
5
CY7C09159
CY7C09169
PRELIMINARY
Switching Characteristics Over the Operating Range
CY7C09159
CY7C09169
-6
Symbol
fMAX1
fMAX2
tCYC1
tCYC2
tCH1
tCL1
tCH2
tCL2
tR
tF
tSA
tHA
tSC
tHC
tSW
tHW
tSD
tHD
tSAD
tHAD
tSCN
tHCN
tSRST
tHRST
tOE
tOLZ
tOHZ
tCD1
tCD2
tDC
tCKHZ
tCKLZ
Parameter
fMax Flow-Through
fMax Pipelined
Clock Cycle Time - Flow-Through
Clock Cycle Time - Pipelined
Clock HIGH Time - Flow-Through
Clock LOW Time - Flow-Through
Clock HIGH Time - Pipelined
Clock LOW Time - Pipelined
Clock Rise Time
Clock Fall Time
Address Set-up Time
Address Hold Time
Chip Enable Set-up Time
Chip Enable Hold Time
R/W Set-up Time
R/W Hold Time
Input Data Set-up Time
Input Data Hold Time
ADS Set-up Time
ADS Hold Time
CNTEN Set-up Time
CNTEN Hold Time
CNTRST Set-up Time
CNTRST Hold Time
Output Enable to Data Valid
OE to Low Z
OE to High Z
Clock to Data Valid - Flow-Through
Clock to Data Valid - Pipelined
Data Output Hold After Clock HIGH
Clock HIGH to Output High Z
Clock HIGH to Output Low Z
Min
-7
Max
Min
53
100
19
10
6.5
6.5
4
4
22
12
7.5
7.5
5
5
3.5
0
3.5
0
3.5
0
3.5
0
3.5
0
3.5
0
3.5
0
9
2
2
2
Units
33
50
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
3
3
4
1
4
1
4
1
4
1
4
1
4
1
4
1
9
2
1
Max
30
20
12
12
8
8
4
0
4
0
4
0
4
0
4
0
4
0
4
0
7
15
6.5
Min
3
3
8
2
2
2
Max
45
83
3
3
2
1
-12
7
18
7.5
9
12
2
1
2
2
2
7
25
12
9
Port to Port Delays
tCWDD
tCCS
Write Port Clock HIGH to Read Data Delay
Clock to Clock Set-up Time
30
9
6
35
10
40
15
ns
ns
CY7C09159
CY7C09169
PRELIMINARY
Switching Waveforms
Read Cycle for Flow-Through Output (FT/PIPE = V IL)[5,6,7,8]
tCH1
tCYC1
tCL1
CLK
CE0
tSC
tHC
tSW
tSA
tHW
tHA
tSC
tHC
CE1
R/W
An
ADDRESS
An+1
An+2
An+3
tCKHZ
tDC
tCD1
DATAOUT
Qn
Qn+1
Qn+2
tDC
tCKLZ
tOHZ
tOLZ
OE
tOE
Read Cycle for Pipelined Operation (FT/PIPE = VIH)[5,6,7,8]
tCH2
tCYC2
tCL2
CLK
CE0
tSC
tHC
tSW
tSA
tHW
tHA
tSC
tHC
CE1
R/W
ADDRESS
DATAOUT
An
An+1
1 Latency
An+2
An+3
tDC
tCD2
Qn
Qn+1
tOHZ
tCKLZ
Qn+2
tOLZ
OE
tOE
Notes:
5. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge.
6. ADS = VIL, CNTEN and CNTRST = VIH.
7. The output is disabled (high-impedance state) by CE0=VIH or CE1 = VIL following the next rising edge of the clock.
8. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK. Numbers are for reference only.
7
CY7C09159
CY7C09169
PRELIMINARY
Switching Waveforms (continued)
Bank Select Pipelined Read[9,10]
tCH2
tCYC2
tCL2
CLK L
tHA
tSA
ADDRESS(B1)
A0
A1
A3
A2
A4
A5
tHC
tSC
CE 0(B1)
tCD2
tHC
tSC
tCD2
tHA
tSA
ADDRESS (B2)
tDC
A0
A1
tDC
tCKLZ
A3
A2
tCKHZ
D3
D1
D0
DATAOUT(B1)
tCD2
tCKHZ
A4
A5
tHC
tSC
CE 0(B2)
tSC
tCD2
tHC
DATAOUT(B2)
tCKHZ
tCD2
D4
D2
tCKLZ
tCKLZ
Left Port Write to Flow-Through Right Port Read[11,12,13,14]
CLK L
tSW
tHW
tSA
tHA
R/WL
ADDRESS L
NO
MATCH
MATCH
tHD
tSD
DATAINL
VALID
tCCS
CLKR
R/WR
ADDRESSR
tCD1
tSW
tSA
tHW
tHA
NO
MATCH
MATCH
tCWDD
tCD1
DATAOUTR
VALID
tDC
VALID
tDC
Notes:
9. In this depth expansion example, B1 represents Bank #1 and B2 is Bank #2. Each Bank consists of one Cypress dual-port device from this datasheet.
ADDRESS(B1) = ADDRESS(B2).
10. OE and ADS = VIL ; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH.
11. The same waveforms apply for a right port write to flow-through left port read.
12. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.
13. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.
14. It t CCS ≤ maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD. If tCCS>maximum specified, then data is not valid
until tCCS + tCD1. t CWDD does not apply in this case.
8
CY7C09159
CY7C09169
PRELIMINARY
Switching Waveforms (continued)
Pipelined Read-to-Write-to-Read (OE = VIL)[8,12,15,16]
tCH2
tCYC2
tCL2
CLK
CE0
tSC
tHC
CE1
tSW
tHW
R/W
tSW
tHW
An
ADDRESS
An+1
tSA
An+2
An+2
An+3
An+4
tSD tHD
tHA
DATAIN
tCD2
tCKHZ
Dn+2
tCD2
tCKLZ
Qn
DATAOUT
READ
Qn+3
NO OPERATION
WRITE
READ
Pipelined Read-to-Write-to-Read (OE Controlled)[8,12,15,16]
tCH2
tCYC2
tCL2
CLK
CE 0
tSC
tHC
CE 1
R/W
tSW tHW
tSW
tHW
An
An+1
An+2
An+3
An+4
An+5
ADDRESS
tSA
tHA
tSD tHD
Dn+2
DATAOUT
Dn+3
tCD2
DATAIN
tCKLZ
tCD2
Qn
Qn+4
tOHZ
OE
READ
WRITE
READ
Notes:
15. Output state (HIGH, LOW, or High-Impedance) is determined by the previous cycle control signals.
16. During “No operation”, data in memory at the selected address may be corrupted and should be re-written to ensure data integrity.
9
CY7C09159
CY7C09169
PRELIMINARY
Switching Waveforms (continued)
Flow-Through Read-to-Write-to-Read (OE = VIL)[6,8,12,15]
tCH1
tCYC1
tCL1
CLK
CE0
tSC
tHC
CE1
tSW
tHW
R/W
tSW
tHW
An
ADDRESS
An+1
tSA
DATAIN
An+2
An+2
tSD
tHA
An+3
tHD
Dn+2
tCD1
tCD1
DATAOUT
An+4
tCD1
Qn
Qn+1
tDC
tCKHZ
READ
tCD1
Qn+3
tCKLZ
NO
OPERATION
WRITE
tDC
READ
Flow-Through Read-to-Write-to-Read (OE Controlled)[6,8,12,15]
tCH1
tCYC1
tCL1
CLK
CE0
tSC
tHC
CE1
tSW
tHW
R/W
tSW
tHW
An
An+1
An+2
An+3
An+4
An+5
ADDRESS
tSA
DATAIN
DATAOUT
tSD
tHA
Dn+2
tDC
tCD1
tHD
Dn+3
tOE
tCD1
Qn
tCD1
Qn+4
tOHZ
tCKLZ
tDC
OE
READ
WRITE
10
READ
CY7C09159
CY7C09169
PRELIMINARY
Switching Waveforms (continued)
Pipelined Read with Address Counter Advance[17]
tCH2
tCYC2
tCL2
CLK
tSA
tHA
ADDRESS
An
tSAD
tHAD
ADS
tSAD
tHAD
tSCN
tHCN
CNTEN
tSCN
DATAOUT
tHCN
Qx-1
tCD2
Qx
READ
EXTERNAL
ADDRESS
Qn
Qn+1
tDC
READ WITH COUNTER
Qn+2
COUNTER HOLD
Qn+3
READ WITH COUNTER
Flow-Through Read with Address Counter Advance[17]
tCH1
tCYC1
tCL1
CLK
tSA
tHA
An
ADDRESS
tSAD
tHAD
ADS
tSAD
tHAD
tSCN
tHCN
CNTEN
tSCN
DATA OUT
tHCN
tCD1
Qx
Qn
Qn+1
Qn+2
Qn+3
tDC
READ
EXTERNAL
ADDRESS
READ WITH COUNTER
Note:
17. CE0 and OE = VIL; CE1, R/W and CNTRST = VIH.
11
COUNTER HOLD
READ
WITH
COUNTER
CY7C09159
CY7C09169
PRELIMINARY
Switching Waveforms (continued)
Write with Address Counter Advance (Flow-Through or Pipelined Outputs)[18,19]
tCH2
tCYC2
tCL2
CLK
tSA
tHA
An
ADDRESS
INTERNAL
ADDRESS
An
tSAD
tHAD
tSCN
tHCN
An+1
An+2
An+3
An+4
ADS
CNTEN
Dn
DATAIN
tSD
tHD
WRITE EXTERNAL
ADDRESS
Dn+1
Dn+1
WRITE WITH
COUNTER
Dn+2
WRITE COUNTER
HOLD
Dn+3
WRITE WITH COUNTER
Notes:
18. CE0 and R/W = VIL ; CE1 and CNTRST = VIH.
19. The “Internal Address” is equal to the “External Address” when ADS = VIL and equals the counter output when ADS = VIH.
12
Dn+4
CY7C09159
CY7C09169
PRELIMINARY
Switching Waveforms (continued)
Counter Reset (Pipelined Outputs)[8,15,20,21]
tCH2
tCYC2
tCL2
CLK
tSA
tHA
An
ADDRESS
INTERNAL
ADDRESS
AX
0
tSW
tHW
tSD
tHD
1
An+1
An
An+1
R/W
tSAD
tHAD
tSCN
tHCN
tSRST
tHRST
ADS
CNTEN
CNTRST
DATAIN
D0
DATAOUT
Q0
COUNTER
RESET
WRITE
ADDRESS 0
READ
ADDRESS 0
READ
ADDRESS 1
Notes:
20. CE0 = VIL; CE1 = VIH.
21. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset.
13
Q1
READ
ADDRESS n
Qn
CY7C09159
CY7C09169
PRELIMINARY
Read/Write and Enable Operation[22,23,24]
Inputs
OE
CLK
Outputs
CE0
CE1
R/W
I/O 0–I/O8
X
H
X
X
High-Z
Deselected[25]
X
X
L
X
High-Z
Deselected[25]
X
L
H
L
DIN
L
L
H
H
DOUT
Read[25]
L
H
X
High-Z
Outputs Disabled
H
X
Operation
Write
Address Counter Control Operation[22,26,27,28]
Address
Previous
Address
ADS
CNTEN
CNTRST
I/O
Mode
X
X
X
X
L
Dout(0)
Reset
Counter Reset to Address 0
An
X
L
X
H
Dout(n)
Load
Address Load into Counter
X
An
H
H
H
Dout(n)
Hold
External Address Blocked—Counter
Disabled
X
An
H
L
H
Dout(n+1)
Increment
Counter Enabled—Internal Address
Generation
CLK
Notes:
22. “X” = Don’t Care, “H” = VIH, “L” = VIL.
23. ADS, CNTEN, CNTRST = Don’t Care.
24. OE is an asynchronous input signal.
25. When CE changes state in the pipelined mode, deselection and read happen in the following clock cycle.
26. CE0 and OE = VIL; CE1 and R/W = VIH.
27. Data shown for Flow-through mode; pipelined mode output will be delayed by one cycle.
28. Counter operation is independent of CE0 and CE1.
14
Operation
CY7C09159
CY7C09169
PRELIMINARY
Ordering Information
8K x9 Synchronous Dual-Port SRAM
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
6.5
CY7C09159-6AC
A100
100-Pin Thin Quad Flat Pack
Commercial
7.5
CY7C09159-7AC
A100
100-Pin Thin Quad Flat Pack
Commercial
CY7C09159-7AI
A100
100-Pin Thin Quad Flat Pack
Industrial
CY7C09159-12AC
A100
100-Pin Thin Quad Flat Pack
Commercial
CY7C09159-12AI
A100
100-Pin Thin Quad Flat Pack
Industrial
12
16K x9 Synchronous Dual-Port SRAM
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
6.5
CY7C09169-6AC
A100
100-Pin Thin Quad Flat Pack
Commercial
7.5
CY7C09169-7AC
A100
100-Pin Thin Quad Flat Pack
Commercial
CY7C09169-7AI
A100
100-Pin Thin Quad Flat Pack
Industrial
CY7C09169-12AC
A100
100-Pin Thin Quad Flat Pack
Commercial
CY7C09169-12AI
A100
100-Pin Thin Quad Flat Pack
Industrial
12
Document #: 38–00671–B
Package Diagram
100-Pin Thin Quad Flat Pack A100
© Cypress Semiconductor Corporation, 1998. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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