FCI connector DDV15P064HTXLF D-sub solder bucket connector Datasheet

STD MOUNTING
FLOAT MOUNTING
LAY OUT OF 50P CONNECTOR
ORDERING INFORMATION
SEE NOTE
D B V
25
P
0
64
C
T
X
B
XXX
LF
SERIES
LEAD FREE
SHELL SIZE
SPECIAL CODES
E,A,B,C,D
INSULATOR COLOUR
OPTIONS
BLANK- NATURAL
B - BLACK
BLANK-STANDARD
F-FLOAT MOUNTING
DIMPLES
V-FEM. SCREW LOCK HEX. (UNC)
N-THREADED FEM. SCREW LOCK M3
L-CLINCH NUT (M3)
VIEW OF MATING FACE
"This LF product meets European Union Directives and other country
regulations as described in GS-22-008"
Packaging as per GS-14-920
X-ON MALE CONNECTORS ONLY
W-RIVETED FEM. SCREW LOCK ROUND UNC
SHELL PLATING
O-CLINCH NUT (UNC)
BLANK-ZINC
T-STD. TIN / Cu
NO.OF CONTACTS
09,15,25,37,50
OPTIONS
CONTACTS
BLANK-STANDARD
P - PIN
S - SOCKET
TECHNICAL SPECIFICATIONS
H-SHIELDING TERMINATION FINGERS
G-HARPOON
TERMINATION TYPE
M-METAL BRACKET
C-WITHOUT BRACKET
0 / BLANK - SOLDER BUCKET
CONTACT PLATING
SHELLS
: TIN/CADMIUM/ZINC PLATED STEEL
CONTACTS DIA ON ACTIVE AREA
: Ø1 MM.
CONTACTS MATERIAL
: COPPER ALLOY
CONTACT PLATING
: GOLD OVER NICKEL (ACTIVE ZONE)
BLANK-0.2
Au
64 - Au FLASH
65 - 0.75 Au
67 - 0.4 Au
: TINLEAD OVER NICKEL (TERMINATION ZONE)
FOR LEAD FREE PLATING
: 2
MIN.MATTE TIN TOP OVER 1.27 MIN.
NICKEL UNDER PLATE(ON TERMINATION ZONE)
INSULATOR MATERIAL
SELF EXTINGUISHING THERMOPLASTICTO UL CLASS 94 V0
THE HOUSING WILL WITHSTAND EXPOSURE TO
260-265°C IF WE USE PROTECTIVE ADHESIVE
(Kapton or Teflon)OR PROTECTIVE METALLIC DEVICE
OPERATING TEMPERATURE
-55°C +125°C
OPERATING CURRENT
5 A PER CONTACT
CONTACT RESISTANCE
<10m
INSULATION RESISTANCE
>5000 M
MAXIMUM VOLTAGE
1000 V.r.m.s
MECHANICAL ENDURANCE
DAMP HEAT
200 MATINGS .
21 DAYS.
2
0.6 MM (AWG 20) MAX.
WIRE SIZE
REFER TECHNICAL SPECIFICTIONS
LINEAR
ANGULAR ±1°
Mini K Vandanath
Elias C Thomas
20/03/1999
20/03/1999
George V Joseph
28/12/2004
K Somasundaram
28/12/2004
D-SUB
D- SUB SOLDER BUCKET CONNECTOR
e
28/12/2004
(WITH ASSEMBLY OPTIONS)
LEAD FREE DETAILS ADDED
e
I04-0127 GVJ 28/12/04
PDM: Rev:E
A2
C-D-SUB-0064
e
D SERIES
STATUS:Released
Printed: Sep 28, 2005.
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