Micross DPAD100 A low leakage monolithic dual pico-amp diode Datasheet

DPAD100
LOW LEAKAGE
PICO-AMP DUAL DIODE
Linear Systems replaces discontinued Siliconix DPAD100
The DPAD100 is a low leakage Monolithic Dual Pico-Amp Diode
The DPAD100 extremely low-leakage monolithic dual
diode provides a superior alternative to conventional
diode technology when reverse current (leakage) must
be minimized. In addition the monolithic dual
construction allows excellent capacitance matching per
diode. The DPAD100 features a leakage current of 100 pA and is well suited for use in applications such as
input protection for operational amplifiers.
DPAD100 Benefits:



Negligible Circuit Leakage Contribution
Circuit “Transparent” Except to Shunt
High-Frequency Spikes
Simplicity of Operation
DPAD100 Applications:


Op Amp Input Protection
Multiplexer Overvoltage Protection
FEATURES DIRECT REPLACEMENT FOR SILICONIX DPAD100 HIGH ON ISOLATION EXCELLENT CAPACITANCE MATCHING ULTRALOW LEAKAGE REVERSE BREAKDOWN VOLTAGE REVERSE CAPACITANCE ABSOLUTE MAXIMUM RATINGS @ 25°C (unless otherwise noted) 20fA ∆CR ≤ 0.5pF ≤ 100 pA BVR ≥ -­‐45V Crss ≤ 2.0pF Maximum Temperatures Storage Temperature Operating Junction Temperature Maximum Power Dissipation Continuous Power Dissipation MAXIMUM CURRENT
Forward Current (Note 1) DPAD100 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL CHARACTERISTICS MIN. TYP. BVR Reverse Breakdown Voltage -­‐45 -­‐-­‐ VF Forward Voltage -­‐-­‐ 0.8 CrSS Total Reverse Capacitance -­‐-­‐ -­‐-­‐ |CR1-­‐CR2| Differential Capacitance (∆CR) -­‐-­‐ -­‐-­‐ IR Maximum Reverse Leakage Current -­‐-­‐ -­‐-­‐ MAX. -­‐-­‐ 1.5 2.0 0.5 -­‐100 -­‐65°C to +150°C -­‐55°C to +135°C 500mW 50mA UNITS V V pF pF pA CONDITIONS IR = -­‐1µA IF = 1mA VR = -­‐5V, f = 1MHz VR1 = VR2 = -­‐5V, f = 1MHz VR = -­‐ 20V Notes:
1. Absolute maximum ratings are limiting values above which DPAD100 serviceability may be impaired.
Available Packages:
TO-72 (Bottom View)
DPAD100 in TO-72
DPAD100 available as bare die
Please contact Micross for full package and die dimensions
Micross Components Europe
Tel: +44 1603 788967
Email: [email protected]
Web: http://www.micross.com/distribution.com
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
Micross Components Ltd, United Kingdom, Tel: +44 1603 788967, Fax: +44 1603788920, Email: [email protected] Web: www.micross.com/distribution.aspx
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