Dynex DRD1010F57 Rectifier diode Datasheet

DRD1010F60
Rectifier Diode
DS5984-1 January 2011(LN28005)
FEATURES

Double Side Cooling

High Surge Capability
KEY PARAMETERS
VRRM
IF(AV)
IFSM
APPLICATIONS

Rectification

Free-wheel Diode

DC Motor Control

Power Supplies

Welding

Battery Chargers
6000V
1015A
16500A
VOLTAGE RATINGS
Part and
Ordering
Number
Repetitive Peak
Voltages
VDRM and VDRM
V
DRD1010F60
DRD1010F59
DRD1010F58
DRD1010F57
DRD1010F56
DRD1010F55
6000
5900
5800
5700
5600
5500
Conditions
VRSM = VRRM+100V
Lower voltage grades available.
(See Package Details for further information)
Fig. 1 Package outlines
ORDERING INFORMATION
When ordering, select the required part number
shown in the Voltage Ratings selection table, e.g.:
DRD1010F59
Note: Please use the complete part number when ordering
and quote this number in any future correspondence
relating to your order.
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DRD1010F60
SEMICONDUCTOR
CURRENT RATINGS
Tcase = 75°C unless stated otherwise
Symbol
Parameter
Test Conditions
Max.
Units
1320
A
Double Side Cooled
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
2073
A
Continuous (direct) on-state current
-
1897
A
947
A
IF
Half wave resistive load
Single Side Cooled (Anode side)
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
1487
A
Continuous (direct) on-state current
-
1283
A
Test Conditions
Max.
Units
1015
A
IF
Half wave resistive load
Tcase = 100°C unless stated otherwise
Symbol
Parameter
Double Side Cooled
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
1594
A
Continuous (direct) on-state current
-
1480
A
680
A
IF
Half wave resistive load
Single Side Cooled (Anode side)
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
1067
A
Continuous (direct) on-state current
-
920
A
IF
Half wave resistive load
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DRD1010F60
-3SEMICONDUCTOR
SURGE RATINGS
Symbol
IFSM
2
It
IFSM
2
It
Parameter
Surge (non-repetitive) on-state current
2
I t for fusing
Surge (non-repetitive) on-state current
Test Conditions
Max.
Units
10ms half sine, Tcase = 150°C
13.5
kA
VR = 50% VRRM - ¼ sine
0.92
MA s
10ms half sine, Tcase = 150°C
16.5
kA
VR = 0
1.425
MA s
Min.
Max.
Units
2
I t for fusing
2
2
THERMAL AND MECHANICAL RATINGS
Symbol
Rth(j-c)
Rth(c-h)
Parameter
Thermal resistance – junction to case
Thermal resistance – case to heatsink
Test Conditions
Double side cooled
DC
-
0.022
°C/W
Single side cooled
Anode DC
-
0.038
°C/W
Cathode DC
-
0.052
°C/W
Double side
-
0.004
°C/W
-
0.008
°C/W
On-state (conducting)
-
160
°C
Reverse (blocking)
-
150
°C
Clamping force 19.5kN
(with mounting compound)
Tvj
Virtual junction temperature
Single side
Tstg
Storage temperature range
-55
175
°C
Fm
Clamping force
18.0
22.0
kN
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DRD1010F60
SEMICONDUCTOR
CHARACTERISTICS
Symbol
Parameter
Test Conditions
Min.
Max.
Units
VFM
Forward voltage
At 3400A peak, Tcase = 25°C
-
2.1
V
IRM
Peak reverse current
At VDRM, Tcase = 150°C
-
75
mA
QS
Total stored charge
IF = 2000A, dIRR/dt =3A/µs
-
4500
µC
Irr
Peak reverse recovery current
Tcase = 150°C, VR =100V
-
120
A
VTO
Threshold voltage
At Tvj = 150°C
-
1.0
V
rT
Slope resistance
At Tvj = 150°C
-
0.42
m
CURVES
Mean Power Dissipation - (W)
4000
3000
2000
dc
1/2 wave
1000
3 phase sq.
6 phase sq.
12 phase sq.
0
0
500
1000
1500
2000
2500
Mean forward current IF(AV) - (A)
Fig.2 Maximum (limit) on-state characteristics
VTM EQUATION
VTM = A + Bln (IT) + C.IT+D.IT
Fig.3 Dissipation curves
Where
A = 0.819645
B = -0.13673
-5
C = 5.73x10
D = 0.042435
these values are valid for Tj = 150 °C for IF 500A to 5000A
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DRD1010F60
-5SEMICONDUCTOR
Fig.4 Total stored charge
Fig.5 Maximum reverse recovery current
Fig.6 Surge (non-repetitive) forward current vs time
(with 50% VRRM at Tcase 150°C)
Fig.7 Maximum (limit) transient thermal impedancejunction to case
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DRD1010F60
SEMICONDUCTOR
PACKAGE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Normal weight: 450g
Pakage outline type code:F
Note:
Some packages may be supplied with gate and or tags.
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DRD1010F60
-7SEMICONDUCTOR
IMPORTANT INFORMATION:
This publication is provided for information only and not for resale.
The products and information in this publication are intended for use by appropriately trained technical personnel.
Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute
any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of
the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements
are met. Should additional product information be needed please contact Customer Service.
Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical
errors. The information is provided without any warranty or guarantee of any kind.
This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the
most up to date version and has not been superseded.
The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property.
The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or
malfunction.
The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use
protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any
electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves.
Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the
product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include
potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design
and safety precautions should always be followed to protect persons and property.
Product Status & Product Ordering:
We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for
production. The annotations are as follows:Target Information:
Preliminary Information:
No Annotation:
This is the most tentative form of information and represents a very preliminary specification.
No actual design work on the product has been started.
The product design is complete and final characterisation for volume production is in
progress.The datasheet represents the product as it is now understood but details may change.
The product has been approved for production and unless otherwise notified by Dynex any
product ordered will be supplied to the current version of the data sheet prevailing at the
time of our order acknowledgement.
All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request.
Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their
respective owners.
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE
DYNEX SEMICONDUCTOR LIMITED
Doddington Road, Lincoln, Lincolnshire, LN6 3LF
United Kingdom.
Phone: +44 (0) 1522 500500
Fax:
+44 (0) 1522 500550
Web: http://www.dynexsemi.com
Phone: +44 (0) 1522 502753 / 502901
Fax:
+44 (0) 1522 500020
e-mail: [email protected]
 Dynex Semiconductor Ltd.
Technical Documentation – Not for resale.
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