TI DS26LS31CM Ds26ls31c/ds26ls31m quad high speed differential line driver Datasheet

DS26LS31C, DS26LS31M
www.ti.com
SNOSBK1C – JUNE 1998 – REVISED APRIL 2013
DS26LS31C/DS26LS31M Quad High Speed Differential Line Driver
Check for Samples: DS26LS31C, DS26LS31M
FEATURES
DESCRIPTION
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The DS26LS31 is a quad differential line driver
designed for digital data transmission over balanced
lines. The DS26LS31 meets all the requirements of
EIA Standard RS-422 and Federal Standard 1020. It
is designed to provide unipolar differential drive to
twisted-pair or parallel-wire transmission lines.
1
2
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Output Skew—2.0 ns Typical
Input to output delay—10 ns Typical
Operation from Single 5V Supply
Outputs Won't Load Line when VCC = 0V
Four Line Drivers in One Package for
Maximum Package Density
Output Short-Circuit Protection
Complementary Outputs
Meets the Requirements of EIA Standard RS422
Pin Compatible with AM26LS31
Available in Military and Commercial
Temperature Range
The circuit provides an enable and disable
common to all four drivers. The DS26LS31
TRI-STATE
outputs
and
logically
complementary outputs. The inputs are
compatible and are all one unit load.
function
features
ANDed
all LS
Logic and Connection Diagrams
Top View
For Complete Military Product Specifications, refer to the appropriate SMD or MDS.
Figure 1. PDIP Package
See Package D0016A or NFG0016E
See Package Numbers NAJ0020A, NFE0016A or NAD0016A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS26LS31C, DS26LS31M
SNOSBK1C – JUNE 1998 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Supply Voltage
7V
Input Voltage
7V
Output Voltage
5.5V
−0.25 to 6V
Output Voltage (Power OFF)
Maximum Power Dissipation
(3)
at 25°C
Cavity Package
1509 mW
NFG0016E Package
1476 mW
D0016A Package
1051 mW
(1)
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply
that the devices should be operated at these limits. The Electrical Characteristics provide conditions for actual device operation.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Derate cavity package 10.1 mW/°C above 25°C; derate molded DIP package 11.9 mW/°C above 25°C; derate SO package 8.41 mW/°C
above 25°C.
(2)
(3)
Operating Conditions
Min
Max
Units
Supply Voltage, VCC
DS26LS31M
4.5
5.5
V
DS26LS31
4.75
5.25
V
−55
+125
°C
0
+70
°C
Typ
Max
Units
Temperature, TA
DS26LS31M
DS26LS31
Electrical Characteristics (1) (2) (3)
Parameter
Test Conditions
Min
VOH
Output High Voltage
IOH = −20 mA
VOL
Output Low Voltage
IOL = 20 mA
VIH
Input High Voltage
VIL
Input Low Voltage
IIL
Input Low Current
VIN = 0.4V
IIH
Input High Current
VIN = 2.7V
20
μA
II
Input Reverse Current
VIN = 7V
0.1
mA
IO
TRI-STATE Output Current
VO = 2.5V
20
μA
VO = 0.5V
−20
μA
VCL
Input Clamp Voltage
IIN = −18 mA
−1.5
V
ISC
Output Short-Circuit Current
−150
mA
ICC
Power Supply Current
60
mA
(1)
(2)
(3)
2
2.5
V
0.5
2.0
V
−40
−30
All Outputs Disabled or Active
V
35
0.8
V
−200
μA
Unless otherwise specified min/max limits apply across the −55°C to +125°C temperature range for the DS726LS31M and across the
0°C to +70°C range for the DS26LS31. All typicals are given for V CC = 5V and TA = 25°C.
All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to ground unless
otherwise specified.
Only one output at a time should be shorted.
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M
www.ti.com
SNOSBK1C – JUNE 1998 – REVISED APRIL 2013
Switching Characteristics
VCC = 5V, TA = 25°C
Parameter
Test Conditions
Min
Typ
Max
Units
tPLH
Input to Output
CL = 30 pF
10
15
ns
tPHL
Input to Output
CL = 30 pF
10
15
ns
Skew
Output to Output
CL = 30 pF
2.0
6.0
ns
tLZ
Enable to Output
CL = 10 pF, S2 Open
15
35
ns
tHZ
Enable to Output
CL = 10 pF, S1 Open
15
25
ns
tZL
Enable to Output
CL = 30 pF, S2 Open
20
30
ns
tZH
Enable to Output
CL = 30 pF, S1 Open
20
30
ns
AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS
S1 and S2 of load circuit are closed except where shown.
Figure 2. AC Test Circuit
f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns
Figure 3. Propagation Delays
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
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3
DS26LS31C, DS26LS31M
SNOSBK1C – JUNE 1998 – REVISED APRIL 2013
www.ti.com
f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns
Figure 4. Enable and Disable Times
TYPICAL APPLICATIONS
RT is optional although highly recommended to reduce reflection.
Figure 5. Two-Wire Balanced System, RS-422
4
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M
www.ti.com
SNOSBK1C – JUNE 1998 – REVISED APRIL 2013
Typical Performance Characteristics
DS26LS31CN Unloaded IC
vs
Frequency
vs TA
DS26LS31 ICC
vs VCC
vs TA
Figure 6.
Figure 7.
DS26LS31CN VOH
vs IOH
vs TA
DS26LS31CN VOL
vs IOL
vs TA
Figure 8.
Figure 9.
DS26LS31CN VOD
vs IO
vs TA
Figure 10.
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
Submit Documentation Feedback
5
DS26LS31C, DS26LS31M
SNOSBK1C – JUNE 1998 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
6
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 5
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
AM26LS31PC
Package Type Package Pins Package
Drawing
Qty
NRND
PDIP
NFG
16
25
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
TBD
Call TI
Call TI
0 to 70
DS26LS31CN
AM26LS31PC
(4/5)
DS26LS31CM
NRND
SOIC
D
16
48
TBD
Call TI
Call TI
0 to 70
DS26LS31CM
DS26LS31CM/NOPB
ACTIVE
SOIC
D
16
48
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS26LS31CM
DS26LS31CMX
NRND
SOIC
D
16
2500
TBD
Call TI
Call TI
0 to 70
DS26LS31CM
DS26LS31CMX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS26LS31CM
DS26LS31CN
NRND
PDIP
NFG
16
25
TBD
Call TI
Call TI
0 to 70
DS26LS31CN
AM26LS31PC
DS26LS31CN/NOPB
ACTIVE
PDIP
NFG
16
25
Pb-Free
(RoHS)
CU SN
Level-1-NA-UNLIM
0 to 70
DS26LS31CN
AM26LS31PC
DS26LS31N
NRND
PDIP
NFG
16
25
TBD
Call TI
Call TI
0 to 70
DS26LS31CN
AM26LS31PC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS26LS31CMX
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
DS26LS31CMX/NOPB
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS26LS31CMX
SOIC
D
16
2500
367.0
367.0
35.0
DS26LS31CMX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NFG0016E
N0016E
N16E (Rev G)
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