NSC DS7837 Hex unified bus receiver Datasheet

DS7837/DS8837 Hex Unified Bus Receiver
General Description
Features
The DS7837/DS8837 are high speed receivers designed for
use in bus organized data transmission systems interconnected by terminated 120X impedance lines. The external
termination is intended to be 180X resistor from the bus to
the a 5V logic supply together with a 390X resistor from the
bus to ground. The receiver design employs a built-in input
hysteresis providing substantial noise immunity. Low input
current allows up to 27 driver/receiver pairs to utilize a common bus. Disable inputs provide time discrimination. Disable
inputs and receiver outputs are TTL compatible. Performance is optimized for systems with bus rise and fall times
s 1.0 ms/V.
Y
Y
Y
Y
Y
Y
Y
Y
Low receiver input current for normal VCC or VCC e 0V
(15 mA typ)
Six separate receivers per package
Built-in receiver input hysteresis (1V typ)
High receiver noise immunity (2V typ)
Temperature insensitive receiver input thresholds track
bus logic levels
TTL compatible disable and output
Molded or cavity dual-in-line or flat package
High speed
Typical Application
TL/F/5811 – 1
Connection Diagram
Dual-In-Line Package
TL/F/5811 – 2
Top View
Order Number DS7837J, DS8837M or DS8837N
See NS Package Number J16A, M16A or N16A
C1996 National Semiconductor Corporation
TL/F/5811
RRD-B30M36/Printed in U. S. A.
http://www.national.com
DS7837/DS8837 Hex Unified Bus Receiver
February 1996
Absolute Maximum Ratings (Note 1)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage
Input Voltage
Operating Temperature Range
DS7837
DS8837
Supply Voltage, (VCC)
DS7837
DS8837
Temperature (TA)
DS7837
DS8837
7V
5.5V
b 55§ C to a 125§ C
0§ C to a 70§ C
Min
Max
Units
4.5
4.75
5.5
5.25
V
V
b 55
a 125
a 70
§C
§C
0
b 65§ C to a 150§ C
Storage Temperature Range
Maximum Power Dissipation* at 25§ C
Cavity Package
1433 mW
Molded DIP Package
1362 mW
SO Package
1002 mW
Lead Temperature (Soldering, 4 seconds)
260§ C
*Derate cavity package 9.6 mW/§ C above 25§ C; derate molded DIP package
10.9 mW/§ C above 25§ C; derate SO package 8.01 mW/§ C above 25§ C.
Electrical Characteristics
The following apply for VMIN s VCC s VMAX, TMIN s TA s TMAX, unless otherwise specified (Notes 2 and 3)
Symbol
VTH
VTL
IIH
Parameter
High Level Receiver Threshold
Conditions
VCC e Max
Low Level Receiver Threshold
VCC e Min
Maximum Receiver Input Current
VIN e 4V
Min
Typ
Max
Units
DS7837
1.65
2.25
2.65
V
DS8837
1.80
2.25
2.50
V
DS7837
0.97
1.30
1.63
V
DS8837
1.05
1.30
1.55
V
VCC e VMAX
15.0
50.0
mA
VCC e 0V
1.0
50.0
mA
1.0
50.0
mA
IIL
Logical ‘‘0’’ Receiver Input Current
VIN e 0.4V, VCC e VMAX
VIH
Logical ‘‘1’’ Input Voltage
VIL
Logical ‘‘0’’ Input Voltage
IIH
Logical ‘‘1’’ Input Current
Disable Input
IIL
Logical ‘‘0’’ Input Current
VIN e 4V, VIND e 0.4V, Disable Input
VOH
Logical ‘‘1’’ Output Voltage
VIN e 0.5V, VIND e 0.8V,
IOH e b400 mA
VOL
Logical ‘‘0’’ Output Voltage
VIN e 4V, VIND e 0.8V, IOH e 16 mA
IOS
Output Short Circuit Current
VIN e 0.5V, VIND e 0V, VOS e 0V,
VCC e VMAX, (Note 4)
ICC
Power Supply Current
VIN e 4V, VIND e 0V, (Per Package)
VCL
Input Clamp Diode
VIN e b12 mA, VIND e b12 mA,
TA e 25§ C
Disable
2.0
V
Disable
0.8
V
VIND e 2.4V
80.0
mA
2.0
mA
b 3.2
mA
VIND e 5.5V
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2
2.4
V
0.25
0.4
V
b 55.0
mA
45.0
60.0
mA
b 1.0
b 1.5
V
b 18.0
Switching Characteristics TA e 25§ C, nominal power supplies unless otherwise noted
Symbol
tpd
Parameter
Propagation Delays
Typ
Max
Units
VIND e 0V,
Receiver
Input to Logical ‘‘1’’ Output, (Note 5)
Conditions
Min
20
30
ns
Input to Logical ‘‘0’’ Output, (Note 6)
18
30
ns
Input e 0V,
Disable, (Note 7)
Input to Logical ‘‘1’’ Output
9
15
ns
Input to Logical ‘‘0’’ Output
4
10
ns
Note 1: ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaranteed. Except for ‘‘Operating Temperature Range’’
they are not meant to imply that the devices should be operated at these limits. The table of ‘‘Electrical Characteristics’’ provides conditions for actual device
operation.
Note 2: Unless otherwise specified min/max limits apply across the b 55§ C to a 125§ C temperature range for the DS7837 and across the 0§ C to a 70§ C range for
the DS8837. All typical values are for TA e 25§ C and VCC e 5V.
Note 3: All currents into device pins shown as positive, out of device pins as negative, all voltages referenced to ground unless otherwise noted. All values shown
as max or min on absolute value basis.
Note 4: Only one output at a time should be shorted.
Note 5: Fan-out of 10 load, CLOAD e 15 pF total. Measured from VIN e 1.3V to VOUT e 1.5V, VIN e 0V to 3V pulse.
Note 6: Fan-out of 10 load, CLOAD e 15 pF total. Measured from VIN e 2.3V to VOUT e 1.5V, VIN e 0V to 3V pulse.
Note 7: Fan-out of 10 load, CLOAD e 15 pF total. Measured from VIN e 1.5V to VOUT e 1.5V, VIN e 0V to 3V pulse.
Physical Dimensions inches (millimeters)
Ceramic Dual-In-Line Package (J)
Order Number DS7837J
NS Package Number J16A
3
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DS7837/DS8837 Hex Unified Bus Receiver
Physical Dimensions inches (millimeters) (Continued)
SO Package (M)
Order Number DS8837M
NS Package Number M16A
Molded Dual-In-Line Package (N)
Order Number DS8837N
NS Package Number N16A
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