DS8922, DS8922A, DS8923A www.ti.com SNLS373B – JUNE 1998 – REVISED APRIL 2013 DS8922/DS8922A/DS8923A TRI-STATE RS-422 Dual Differential Line Driver and Receiver Pairs Check for Samples: DS8922, DS8922A, DS8923A FEATURES 1 • • • 2 • • • • • • • 12 ns Typical Propagation Delay Output Skew—±0.5 ns Typical Meets the Requirements of EIA Standard RS422 Complementary Driver Outputs High Differential or Common-Mode Input Voltage Ranges of ±7V ±0.2V Receiver Sensitivity over the Input Voltage Range Receiver Input Fail-Safe Circuitry Receiver Input Hysteresis—70 mV typical Glitch Free Power Up/Down TRI-STATE Outputs DESCRIPTION The DS8922/22A and DS8923A are Dual Differential Line Driver and Receiver pairs. These devices are designed specifically for applications meeting the ST506, ST412 and ESDI Disk Drive Standards. In addition, the devices meet the requirements of the EIA Standard RS-422. These devices offer an input sensitivity of 200 mV over a ±7V common mode operating range. Hysteresis is incorporated (typically 70 mV) to improve noise margin for slowly changing input waveforms. An input fail-safe circuit is provided such that if the receiver inputs are open the output assumes the logical one state. The DS8922A and DS8923A drivers are designed to provide unipolar differential drive to twisted pair or parallel wire transmission lines. Complementary outputs are logically ANDed and provide an output skew of 0.5 ns (typ.) with propagation delays of 12 ns. Both devices feature TRI-STATE outputs. The DS8922/22A have independent control functions common to a driver and receiver pair. The DS8923A has separate driver and receiver control functions. Power up/down circuitry is featured which will TRISTATE the outputs and prevent erroneous glitches on the transmission lines during system power up or power down operation. The DS8922/22A and DS8923A are designed to be compatible with TTL and CMOS. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS8922, DS8922A, DS8923A SNLS373B – JUNE 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DS8922A Dual-In-Line Top View See Package Number D (R-PDSO-G16) or NFG0016E DS8923A Dual-In-Line Top View See Package Number D (R-PDSO-G16) or NFG0016E 2 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A DS8922, DS8922A, DS8923A www.ti.com SNLS373B – JUNE 1998 – REVISED APRIL 2013 DS8922/22A EN1 EN2 RO1 RO2 DO1 DO2 0 0 ACTIVE ACTIVE ACTIVE ACTIVE 1 0 HI-Z ACTIVE HI-Z ACTIVE 0 1 ACTIVE HI-Z ACTIVE HI-Z 1 1 HI-Z HI-Z HI-Z HI-Z DEN REN RO1 RO2 DO1 DO2 0 0 ACTIVE ACTIVE ACTIVE ACTIVE 1 0 ACTIVE ACTIVE HI-Z HI-Z 0 1 HI-Z HI-Z ACTIVE ACTIVE 1 1 HI-Z HI-Z HI-Z HI-Z DS8923A Absolute Maximum Ratings (1) (2) Supply Voltage 7V −0.5V to +7V Drive Input Voltage Output Voltage 5.5V Receiver Output Sink Current 50 mA Receiver Input Voltage ±10V Differential Input Voltage ±12V Maximum Package Power Dissipation @ +25°C D Package 1300 mW NFG Package 1450 mW Derate D Package 10.4 mW/°C above +25°C Derate NFG Package 11.6 mW/°C above +25°C −65°C to +165°C Storage Temperature Range Lead Temp. (Soldering, 4 seconds) 260°C ESD Rating (HBM) (1) (2) 2000V+ “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the device should be operated at these limits. The Table of Electrical Characteristics provides conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Recommended Operating Conditions Supply Voltage Temperature (TA) Min Max 4.5 5.5 V 0 70 °C Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A Units Submit Documentation Feedback 3 DS8922, DS8922A, DS8923A SNLS373B – JUNE 1998 – REVISED APRIL 2013 www.ti.com DS8922/22A and DS8923A Electrical Characteristics (1) (2) (3) Symbol Conditions Min Typ Max Units +200 mV RECEIVER VTH −7V ≤ VCM ≤ +7V −200 ±35 VHYST −7V ≤ VCM ≤ +7V 15 70 RIN V IN = −7V, +7V (Other Input = GND) 4.0 6.0 IIN VIN = 10V 3.25 mA VIN = −10V −3.25 mA mV kΩ VOH V CC = MIN, IOH = − 400 μA VOL V CC = MAX, IOL = 8 mA ISC V CC = MAX, VOUT = 0V −15 VOH V CC = MIN, IOH = −20 mA 2.5 VOL V CC = MIN, IOL = +20 mA 0.5 V IOFF V CC = 0V, VOUT = 5.5V 100 μA 0.4 V 2.5 V 0.5 V −100 mA DRIVER V |VT|–| VT | VT 2.0 V |VOS– VOS | ISC 0.4 V −150 mA VOUT = 2.5V 50 μA VCC = MAX VOUT = 0.4V −50 μA VCC = MAX ACTIVE 76 mA TRI-STATE 78 mA −30 V CC = MAX, VOUT = 0V DRIVER and RECEIVER IOZ TRI-STATE Leakage ICC DRIVER and ENABLE INPUTS VIH 2.0 V VIL V IIL V CC = MAX, VIN = 0.4V −200 μA IIH V CC = MAX, VIN = 2.7V 20 μA II V CC = MAX, VIN = 7.0V 100 μA VCL V CC = MIN, IIN = −18 mA −1.5 V (1) (2) (3) −40 0.8 All currents into device pins are shown as positive values; all currents out of the device are shown as negative; all voltages are referenced to ground unless otherwise specified. All values shown as max or min are classified on absolute value basis. All typical values are VCC = 5V, TA = 25°C. Only one output at a time should be shorted. Receiver Switching Characteristics (Figure 1) (Figure 2) (Figure 2) Parameter Conditions Min Typ Max Units 8922 8922A/23A TpLH CL = 30 pF 12 22.5 20 ns TpHL CL = 30 pF 12 22.5 20 ns |TpLH–T pHL| CL = 30 pF 0.5 5 3.5 ns Skew (Channel to Channel) CL = 30 pF 0.5 3.0 2.0 ns TpLZ CL = 15 pF S2 Open 15 ns TpHZ CL = 15 pF S1 Open 15 ns TpZL CL = 30 pF S2 Open 20 ns TpZH CL = 30 pF S1 Open 20 ns 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A DS8922, DS8922A, DS8923A www.ti.com SNLS373B – JUNE 1998 – REVISED APRIL 2013 Driver Switching Characteristics Parameter Conditions Min Typ Max Units 8922 8922A/23A SINGLE ENDED CHARACTERISTICS (Figure 4, Figure 5, Figure 6, and Figure 8) TpLH CL = 30 pF 12 15 15 ns TpHL CL = 30 pF 12 15 15 ns TTLH CL = 30 pF 5 10 10 ns TTHL CL = 30 pF 5 10 10 ns |TpLH–T pHL| CL = 30 pF Skew CL = 30 pF 0.5 5 3.5 ns 0.5 3.0 2.0 ns 0.5 (1) Skew (Channel to Channel) ns TpLZ CL = 30 pF 15 ns TpHZ CL = 30 pF 15 ns TpZL CL = 30 pF 20 ns TpZH CL = 30 pF 20 ns DIFFERENTIAL SWITCHING CHARACTERISTICS (2) , (Figure 4) TpLH CL = 30 pF 12 15 15 ns TpHL CL = 30 pF 12 15 15 ns |TpLH–T pHL| CL = 30 pF 0.5 6.0 2.75 ns (1) (2) Difference between complementary outputs at the 50% point. Differential Delays are defined as calculated results from single ended rise and fall time measurements. This approach in establishing AC performance specifications has been taken due to limitations of available Automatic Test Equipment (ATE). The calculated ATE results assume a linear transition between measurement points and are a result of the following equations: input. Where: Tcp = Crossing Point Tra, Trb, Tfa and Tfb are time measurements with respect to the Switching Time Waveforms AC Test Circuits and Switching Waveforms Figure 1. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A Submit Documentation Feedback 5 DS8922, DS8922A, DS8923A SNLS373B – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 2. Figure 3. S1 S2 S3 TPLZ Closed Open +2.5V TPHZ Open Closed −2.5V TPZL Closed Open +2.5V TPZH Open Closed −2.5V Figure 4. Figure 5. 6 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A DS8922, DS8922A, DS8923A www.ti.com SNLS373B – JUNE 1998 – REVISED APRIL 2013 Figure 6. Figure 7. Figure 8. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A Submit Documentation Feedback 7 DS8922, DS8922A, DS8923A SNLS373B – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (DS8923A) 8 Driver VOH vs IOH vs Temperature Driver VOH vs IOH vs VCC Figure 9. Figure 10. Driver VOL vs IOL vs Temperature Driver VOL vs IOL vs VCC Figure 11. Figure 12. Receiver V OH vs IOH vs Temperature Receiver VOH vs IOH vs VCC Figure 13. Figure 14. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A DS8922, DS8922A, DS8923A www.ti.com SNLS373B – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) (DS8923A) Receiver V OL vs IOL vs Temperature Receiver VOL vs IOL vs VCC Figure 15. Figure 16. Driver Differential Propagation Delay vs Temperature Driver Differential Propagation Delay vs VCC Figure 17. Figure 18. Receiver Propagation Delay vs Temperature Receiver Propagation Delay vs VCC Figure 19. Figure 20. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A Submit Documentation Feedback 9 DS8922, DS8922A, DS8923A SNLS373B – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) (DS8923A) 10 Driver VOD vs Temperature Driver VOD vs VCC Figure 21. Figure 22. Driver VOD vs RL Driver Differential Transition Time vs Temperature Figure 23. Figure 24. Driver Differential Transition Time vs VCC Supply Current vs Temperature Figure 25. Figure 26. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A DS8922, DS8922A, DS8923A www.ti.com SNLS373B – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) (DS8923A) Supply Current vs V CC ICC vs Driver Switching Frequency Figure 27. Figure 28. Driver Short Circuit Current vs Temperature Driver Short Circuit Current vs VCC Figure 29. Figure 30. Receiver Short Circuit Current vs Temperature Receiver Short Circuit Current vs VCC Figure 31. Figure 32. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A Submit Documentation Feedback 11 DS8922, DS8922A, DS8923A SNLS373B – JUNE 1998 – REVISED APRIL 2013 www.ti.com TYPICAL APPLICATIONS Figure 33. ESDI Application Figure 34. Figure 35. ST504 and ST412 Applications Figure 36. 12 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A DS8922, DS8922A, DS8923A www.ti.com SNLS373B – JUNE 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision A (April 2013) to Revision B • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8922 DS8922A DS8923A Submit Documentation Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS8922AM LIFEBUY SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS8922AM DS8922AM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS8922AM DS8922AMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS8922AM DS8923AM LIFEBUY SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS8923AM DS8923AM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS8923AM DS8923AN LIFEBUY PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DS8923AN DS8923AN/NOPB ACTIVE PDIP NFG 16 25 Pb-Free (RoHS) CU SN Level-1-NA-UNLIM 0 to 70 DS8923AN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS8922AMX/NOPB Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 10.3 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS8922AMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NFG0016E N0016E N16E (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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