Elpida EBE25UC8AAFV 256mb unbuffered ddr2 sdram hyper dimmâ ¢ Datasheet

PRELIMINARY DATA SHEET
256MB Unbuffered DDR2 SDRAM
HYPER DIMM
EBE25UC8AAFV (32M words × 64 bits, 1 Rank)
Features
The EBE25UC8AAFV is 32M words × 64 bits, 1 rank
DDR2 SDRAM unbuffered module, mounting 8 pieces
of 256M bits DDR2 SDRAM sealed in FBGA package.
Read and write operations are performed at the cross
points of the CK and the /CK. This high-speed data
transfer is realized by the 4 bits prefetch-pipelined
architecture. Data strobe (DQS and /DQS) both for
read and write are available for high speed and reliable
data bus design. By setting extended mode register,
the on-chip Delay Locked Loop (DLL) can be set
enable or disable. This module provides high density
mounting without utilizing surface mount technology.
Decoupling capacitors are mounted beside each FBGA
on the module board.
• 240-pin socket type dual in line memory module
(DIMM)
 PCB height: 30.0mm
 Lead pitch: 1.0mm
 Lead-free
• 1.8V power supply
• Data rate: 700Mbps/667Mbps/600Mbps (max.)
• 1.8V (SSTL_18 compatible) I/O
• Double-data-rate architecture: two data transfers per
clock cycle
• Bi-directional, differential data strobe (DQS and
/DQS) is transmitted/received with data, to be used in
capturing data at the receiver
• DQS is edge aligned with data for READs: centeraligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DQS transitions with CK
transitions
• Commands entered on each positive CK edge: data
and data mask referenced to both edges of DQS
• Four internal banks for concurrent operation
(components)
• Data mask (DM) for write data
• Burst lengths: 4, 8
• /CAS Latency (CL): 3, 4, 5
• Auto precharge operation for each burst access
• Auto refresh and self refresh modes
• 7.8µs average periodic refresh interval
• Posted CAS by programmable additive latency for
better command and data bus efficiency
• Off-Chip-Driver Impedance Adjustment and On-DieTermination for better signal quality
• /DQS can be disabled for single-ended Data Strobe
operation
L
EO
Description
Note: Do not push the components or drop the
modules in order to avoid mechanical defects,
which may result in electrical defects.
t
uc
od
Pr
Document No. E0527E12 (Ver. 1.2)
Date Published February 2006 (K) Japan
Printed in Japan
URL: http://www.elpida.com
This product became EOL in April, 2005.
Elpida Memory, Inc. 2004-2006
EBE25UC8AAFV
Ordering Information
Part number
Data rate
Mbps (max.)
Component
JEDEC speed bin
(CL-tRCD-tRP)
EBE25UC8AAFV-DF-E
700
DDR2-700 (5-6-6)
EBE25UC8AAFV-BE-E
667
DDR2-667 (5-5-5)
EBE25UC8AAFV-AE-E
600
DDR2-600 (5-5-5)
Contact
pad
Package
Mounted devices
EDE2508AASE-DF
240-pin DIMM
(lead-free)
Gold
EDE2508AASE -DF, -BE
EDE2508AASE -DF, -BE, -AE
Pin Configurations
Front side
1 pin
EO
121 pin
64 pin 65 pin
120 pin
184 pin 185 pin
240 pin
Back side
Pin name
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
1
VREF
61
A4
121
VSS
181
VDD
2
VSS
62
VDD
122
DQ4
182
A3
3
DQ0
63
A2
123
DQ5
183
A1
4
DQ1
64
VDD
124
VSS
184
VDD
5
VSS
65
VSS
125
DM0
185
CK0
6
/DQS0
66
VSS
126
NC
186
/CK0
7
DQS0
67
VDD
127
VSS
187
VDD
8
VSS
68
NC
128
DQ6
188
A0
9
DQ2
69
VDD
129
DQ7
189
VDD
10
DQ3
70
A10
130
VSS
190
BA1
11
VSS
71
BA0
131
DQ12
191
VDD
12
DQ8
72
VDD
132
DQ13
192
/RAS
13
DQ9
73
/WE
133
VSS
193
/CS0
14
VSS
74
/CAS
134
DM1
194
VDD
15
/DQS1
75
VDD
135
NC
195
ODT0
16
DQS1
76
NC
136
VSS
196
NC
17
VSS
77
NC
137
CK1
197
VDD
18
NC
78
VDD
19
NC
79
VSS
20
VSS
80
DQ32
21
DQ10
81
DQ33
141
DQ15
201
VSS
22
DQ11
82
VSS
142
VSS
202
DM4
23
VSS
83
/DQS4
143
DQ20
203
NC
24
DQ16
84
DQS4
144
DQ21
204
VSS
25
DQ17
85
VSS
145
VSS
205
DQ38
26
VSS
86
DQ34
146
DM2
27
/DQS2
87
DQ35
147
NC
207
28
DQS2
88
VSS
148
VSS
208
L
Pin No.
od
Pr
/CK1
198
VSS
VSS
199
DQ36
140
DQ14
200
DQ37
2
206
t
Preliminary Data Sheet E0527E12 (Ver. 1.2)
uc
138
139
DQ39
VSS
DQ44
EBE25UC8AAFV
Pin name
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
29
VSS
89
DQ40
149
DQ22
209
DQ45
30
DQ18
90
DQ41
150
DQ23
210
VSS
31
DQ19
91
VSS
151
VSS
211
DM5
32
VSS
92
/DQS5
152
DQ28
212
NC
33
DQ24
93
DQS5
153
DQ29
213
VSS
34
DQ25
94
VSS
154
VSS
214
DQ46
35
VSS
95
DQ42
155
DM3
215
DQ47
36
/DQS3
96
DQ43
156
NC
216
VSS
37
DQS3
97
VSS
157
VSS
217
DQ52
38
VSS
98
DQ48
158
DQ30
218
DQ53
39
DQ26
99
DQ49
159
DQ31
219
VSS
40
DQ27
100
VSS
160
VSS
220
CK2
41
VSS
101
SA2
161
NC
221
/CK2
42
NC
102
NC
162
NC
222
VSS
43
NC
103
VSS
163
VSS
223
DM6
44
VSS
104
/DQS6
164
NC
224
NC
45
NC
105
DQS6
165
NC
225
VSS
46
NC
106
VSS
166
VSS
226
DQ54
47
VSS
107
DQ50
167
NC
227
DQ55
48
NC
108
DQ51
168
NC
228
VSS
49
NC
109
VSS
169
VSS
229
DQ60
50
VSS
110
DQ56
170
VDD
230
DQ61
51
VDD
111
52
CKE0
112
53
VDD
113
54
NC
114
55
NC
115
56
VDD
116
57
A11
117
58
A7
118
VSS
59
VDD
119
SDA
60
A5
120
SCL
L
EO
Pin No.
171
NC
231
VSS
172
VDD
232
DM7
/DQS7
173
NC
233
NC
Pr
DQ57
VSS
DQS7
174
NC
234
VSS
VSS
175
VDD
235
DQ62
DQ58
176
A12
236
DQ63
177
A9
237
VSS
178
VDD
238
VDDSPD
179
A8
239
SA0
180
A6
240
SA1
t
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DQ59
Preliminary Data Sheet E0527E12 (Ver. 1.2)
3
EBE25UC8AAFV
Pin Description
Pin name
Function
A0 to A12
Address input
Row address
Column address
A10 (AP)
Auto precharge
BA0, BA1
Bank select address
DQ0 to DQ63
Data input/output
/RAS
Row address strobe command
A0 to A12
A0 to A9
Column address strobe command
/WE
Write enable
/CS0
Chip select
CKE0
Clock enable
CK0 to CK2
Clock input
/CK0 to /CK2
Differential clock input
EO
/CAS
DQS0 to DQS7, /DQS0 to /DQS7
Input and output data strobe
DM0 to DM7
Input mask
SCL
Clock input for serial PD
SDA
Data input/output for serial PD
VDD
VDDSPD
VREF
L
SA0 to SA2
VSS
NC
Power for internal circuit
Power for serial EEPROM
Input reference voltage
Ground
Pr
ODT0
Serial address input
ODT control
No connection
t
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Preliminary Data Sheet E0527E12 (Ver. 1.2)
4
EBE25UC8AAFV
Serial PD Matrix
Byte No.
0
1
Function described
Number of bytes utilized by module
manufacturer
Total number of bytes in serial PD
device
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Hex value
Comments
1
0
0
0
0
0
0
0
80H
128 bytes
0
0
0
0
1
0
0
0
08H
256 bytes
Memory type
0
0
0
0
1
0
0
0
08H
DDR2 SDRAM
3
Number of row address
0
0
0
0
1
1
0
1
0DH
13
4
Number of column address
0
0
0
0
1
0
1
0
0AH
10
5
Number of DIMM ranks
0
1
1
0
0
0
0
0
60H
1
6
Module data width
0
1
0
0
0
0
0
0
40H
64
7
Module data width continuation
0
0
0
0
0
0
0
0
00H
0
8
Voltage interface level of this assembly 0
0
0
0
0
1
0
1
05H
SSTL 1.8V
9
DDR SDRAM cycle time, CL = 5
0
0
1
1
1
1
0
1
3DH
3.75ns*
10
SDRAM access from clock (tAC)
0
1
0
1
0
0
0
0
50H
0.5ns*
11
DIMM configuration type
0
0
0
0
0
0
0
0
00H
None.
12
Refresh rate/type
1
0
0
0
0
0
1
0
82H
7.8µs
EO
2
Primary SDRAM width
0
0
0
0
1
0
0
0
08H
×8
14
Error checking SDRAM width
0
0
0
0
0
0
0
0
00H
None.
Reserved
0
0
0
0
0
0
0
0
00H
0
0
0
0
0
1
1
0
0
0CH
4,8
0
0
0
0
0
1
0
0
04H
4
0
0
1
1
1
0
0
0
38H
3, 4, 5
15
16
17
18
L
13
Pr
SDRAM device attributes:
Burst length supported
SDRAM device attributes: Number of
banks on SDRAM device
SDRAM device attributes:
/CAS latency
19
Reserved
20
DIMM type information
21
SDRAM module attributes
22
1
1
0
0
0
0
0
0
0
0
00H
0
0
0
0
0
0
0
1
0
02H
Unbuffered
0
0
0
0
0
0
0
0
00H
Normal
SDRAM device attributes: General
0
0
1
1
0
0
0
0
30H
VDD ± 0.1V
23
Minimum clock cycle time at CL = 4
0
0
1
1
1
1
0
1
3DH
3.75ns*
24
Maximum data access time (tAC) from
0
clock at CL = 4
1
25
Minimum clock cycle time at CL = 3
0
1
26
Maximum data access time (tAC) from
0
clock at CL = 3
1
27
Minimum row precharge time (tRP)
0
0
28
Minimum row active to row active
delay (tRRD)
0
0
29
Minimum /RAS to /CAS delay (tRCD)
0
0
30
Minimum active to precharge time
(tRAS)
0
Module rank density
0
33
35
Data input hold time after clock (tDH)
0
0
0
0
0
50H
0.5ns*
1
0
1
0
0
0
0
50H
5.0ns*
1
1
0
0
0
0
0
60H
0.6ns*
1
1
1
1
1
0
0
3CH
15ns
0
1
1
1
1
0
1EH
7.5ns
1
1
1
1
0
0
3CH
15ns
0
1
0
1
1
0
1
2DH
45ns
1
0
0
0
0
0
0
40H
256M bytes
0
1
0
0
1
0
1
25H
0.25ns*
1
0
1
1
1
0
0
0
38H
0.38ns*
1
0
0
1
0
0
0
0
10H
0
1
0
0
0
1
1
23H
Preliminary Data Sheet E0527E12 (Ver. 1.2)
5
t
34
1
uc
32
Address and command setup time
0
before clock (tIS)
Address and command hold time after
0
clock (tIH)
Data input setup time before clock
0
(tDS)
0
od
31
1
0.10ns*
1
0.23ns*
1
EBE25UC8AAFV
Byte No.
Function described
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Hex value
Comments
36
Write recovery time (tWR)
0
0
1
1
1
1
0
0
3CH
15ns*
0
0
0
1
1
1
1
0
1EH
7.5ns*
1
0
0
0
1
1
1
1
0
1EH
7.5ns*
1
39
Memory analysis probe characteristics 0
0
0
0
0
0
0
0
00H
TBD
40
Extension of Byte 41 and 42
0
0
0
0
0
0
0
0
00H
Undefined
41
Active command period (tRC)
0
0
1
1
1
1
0
0
3CH
60ns*
1
42
Auto refresh to active/
Auto refresh command cycle (tRFC)
0
1
0
0
1
0
1
1
4BH
75ns*
1
43
SDRAM tCK cycle max. (tCK max.)
1
0
0
0
0
0
0
0
80H
8ns*
37
38
Internal write to read command delay
(tWTR)
Internal read to precharge command
delay (tRTP)
1
1
EO
44
Dout to DQS skew
0
0
0
1
1
1
1
0
1EH
0.30ns*
1
45
Data hold skew (tQHS)
0
0
1
0
1
0
0
0
28H
0.40ns*
1
46
PLL relock time
0
0
0
0
0
0
0
0
00H
Undefined
0
0
0
0
0
0
0
0
00H
62
SPD Revision
0
0
0
1
0
0
0
0
10H
63
Checksum for bytes 0 to 62
1
0
0
0
0
0
1
0
82H
64 to 65
Manufacturer’s JEDEC ID code
0
1
1
1
1
1
1
1
7FH
Continuation
code
66
Manufacturer’s JEDEC ID code
1
1
1
1
1
1
1
0
FEH
Elpida Memory
67 to 71
Manufacturer’s JEDEC ID code
0
0
0
0
0
0
0
0
00H
72
Manufacturing location
×
×
×
×
×
×
×
×
××
(ASCII-8bit
code)
73
Module part number
0
1
0
0
0
1
0
1
45H
E
74
Module part number
0
1
0
0
0
0
1
0
42H
B
75
Module part number
0
1
0
0
0
1
0
1
45H
E
76
Module part number
0
0
1
1
0
0
1
0
32H
2
77
Module part number
0
0
1
1
0
1
0
1
35H
5
78
Module part number
0
1
0
1
0
1
0
1
55H
U
79
Module part number
0
1
0
0
0
0
1
1
43H
C
80
Module part number
0
0
81
Module part number
0
1
47 to 61
L
0
1
Module part number
0
1
84
Module part number
0
1
85
Module part number
0
0
86
Module part number
-DF
0
1
-BE
0
-AE
87
Module part number
-DF
-BE
Module part number
1
1
0
0
0
38H
8
0
0
0
0
0
1
41H
A
0
0
0
0
0
1
41H
A
0
0
0
1
1
0
46H
F
0
1
0
1
1
0
56H
V
1
0
1
1
0
1
2DH
—
0
0
0
1
0
0
44H
D
1
0
0
0
0
1
0
42H
B
0
1
0
0
0
0
0
1
41H
A
0
1
0
0
0
1
1
0
46H
F
0
1
0
0
0
1
0
1
45H
E
0
1
0
0
0
1
0
0
1
0
1
1
Preliminary Data Sheet E0527E12 (Ver. 1.2)
6
0
1
45H
0
1
2DH
E
t
-AE
88
1
uc
Module part number
83
od
Pr
82
Rev. 1.0
—
EBE25UC8AAFV
Byte No.
Function described
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Hex value
Comments
89
Module part number
0
1
0
0
0
1
0
1
45H
E
90
Module part number
0
0
1
0
0
0
0
0
20H
(Space)
91
Revision code
0
0
1
1
0
0
0
0
30H
Initial
92
Revision code
0
0
1
0
0
0
0
0
20H
(Space)
93
Manufacturing date
×
×
×
×
×
×
×
×
××
94
Manufacturing date
×
×
×
×
×
×
×
×
××
95 to 98
Module serial number
99 to 127
Manufacture specific data
Year code
(BCD)
Week code
(BCD)
L
EO
Note: These specifications are defined based on component specification, not module.
t
uc
od
Pr
Preliminary Data Sheet E0527E12 (Ver. 1.2)
7
EBE25UC8AAFV
Block Diagram
/CS0
RS1
RS1
/DQS0
/DQS4
RS1
RS1
DQS0
DQS4
RS1
DM0
DM
8
RS1
DQ0 to DQ7
RS1
/CS DQS /DQS
DQ0
to DQ7
DM4
/CS DQS /DQS
DM
D0
8
RS1
DQ32 to DQ39
RS1
DQ0
to DQ7
D4
RS1
/DQS1
/DQS5
EO
RS1
RS1
DQS1
DQS5
RS1
DM1
8
RS1
/CS DQS /DQS
DM5
DM
RS1
DQ8 to DQ15
DQ0
to DQ7
D1
RS1
DQ40 to DQ47
RS1
DQ0
to DQ7
D5
RS1
/DQS2
/DQS6
RS1
RS1
DQS2
DQS6
RS1
RS1
L
/CS DQS /DQS
DM
DM2
8
/CS DQS /DQS
DM
8
RS1
DQ16 to DQ23
DQ0
to DQ7
DM6
8
D2
/CS DQS /DQS
DM
RS1
DQ48 to DQ55
RS1
DQ0
to DQ7
D6
RS1
/DQS3
/DQS7
DQS3
Pr
RS1
RS1
DQS7
RS1
/CS DQS /DQS
DM
DM3
8
RS1
DQ24 to DQ31
DQ0
to DQ7
D3
DM
8
RS1
DQ56 to DQ63
A0 to A12: SDRAMs (D0 to D7)
RS2
/RAS
SCL
SCL
SA0
A0
SA1
A1
SA2
A2
/RAS: SDRAMs (D0 to D7)
RS2
/CAS: SDRAMs (D0 to D7)
/CAS
D7
Serial PD
BA0 to BA1: SDRAMs (D0 to D7)
RS2
A0 to A12
DQ0
to DQ7
od
RS2
BA0 to BA1
/CS DQS /DQS
RS1
DM7
RS2
/WE: SDRAMs (D0 to D7)
CKE0
CKE: SDRAMs (D0 to D7)
ODT0
ODT:SDRAMs (D0 to D7)
Notes :
SDA
U0
WP
uc
/WE
SDA
1. DQ wiring maybe changed within a byte.
2. DQ, DQS, /DQS, ODT, DM, CKE, /CS relationships
VDDSPD
VREF
must be meintained as shown.
SPD
3. Refer to the appropriate clock wiring topology
SDRAMs (D0 to D7)
under the DIMM wiring details section of this document.
VDD
SDRAMs (D0 to D7)
VSS
SDRAMs (D0 to D7)
t
* D0 to D7 : 256M bits DDR2 SDRAM
U0 : 2k bits EEPROM
Rs1 : 22Ω
Rs2 : 5.1Ω
Preliminary Data Sheet E0527E12 (Ver. 1.2)
8
EBE25UC8AAFV
Logical Clock Net Structure
3DRAM loads (CK1 and /CK1, CK2 and /CK2)
R = 200Ω
DRAM
C1
DRAM
C1
DIMM
connector
R = 200Ω
DRAM
C1
2DRAM loads (CK0 and /CK0)
L
EO
R = 200Ω
R = 200Ω
DRAM
C1
Pr
C2
DIMM
connector
R = 200Ω
od
R = 200Ω
DRAM
C1
* C1: 1pF
C2: 2pF
t
uc
Preliminary Data Sheet E0527E12 (Ver. 1.2)
9
EBE25UC8AAFV
Electrical Specifications
• All voltages are referenced to VSS (GND).
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
–0.5 to +2.3
V
Supply voltage relative to VSS
VDD
–0.5 to +2.3
V
Short circuit output current
IOS
50
mA
Power dissipation
PD
8
W
Operating case temperature
TC
0 to +85
°C
Storage temperature
Tstg
–55 to +100
°C
Note
1
EO
Note: DDR2 SDRAM component specification.
Caution
Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
DC Operating Conditions (TC = 0 to +85°C) (DDR2 SDRAM Component Specification)
Parameter
Symbol
min.
typ.
max.
Unit
Notes
Supply voltage
VDD, VDDQ
4
1.85
1.9
V
0
0
0
V
VDDSPD
1.7
—
3.6
V
L
1.8
VSS
VREF
0.49 × VDDQ
0.50 × VDDQ 0.51 × VDDQ
V
1, 2
Termination voltage
VTT
VREF − 0.04
VREF
VREF + 0.04
V
3
DC input logic high
VIH (DC)
VREF + 0.125

VDDQ + 0.3V
V
DC input low
VIL (DC)
−0.3

VREF – 0.125
V
AC input logic high
VIH (AC)
VREF + 0.250


V
AC input low
VIL (AC)


VREF − 0.250
V
Pr
Input reference voltage
t
uc
od
Notes: 1. The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically
the value of VREF is expected to be about 0.5 × VDDQ of the transmitting device and VREF are expected
to track variations in VDDQ.
2. Peak to peak AC noise on VREF may not exceed ±2% VREF (DC).
3. VTT of transmitting device must track VREF of receiving device.
4. VDDQ must be equal to VDD.
Preliminary Data Sheet E0527E12 (Ver. 1.2)
10
EBE25UC8AAFV
DC Characteristics 1 (TC = 0 to +85°C, VDD = 1.85V ± 0.05V, VSS = 0V)
Parameter
Symbol
Operating current
(ACT-PRE)
Operating current
(ACT-READ-PRE)
IDD0
IDD1
EO
Precharge power-down
standby current
IDD2P
Precharge quiet standby
IDD2Q
current
Grade
-DF
1000
-BE
1000
-AE
960
-DF
1120
-BE
1120
-AE
1080
-DF
96
-BE
96
-AE
88
-DF
240
-BE
240
-AE
200
L
Idle standby current
IDD2N
Active power-down
standby current
IDD3P-S
Operating current
(Burst write operating)
IDD4R
IDD4W
-BE
320
-AE
280
-DF
360
mA
mA
one bank; IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK (IDD), tRC = tRC (IDD),
tRAS = tRAS min.(IDD); tRCD = tRCD (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data pattern is same as IDD4W
mA
all banks idle;
tCK = tCK (IDD);
CKE is L;
Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
mA
all banks idle;
tCK = tCK (IDD);
CKE is H, /CS is H;
Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
mA
all banks idle;
tCK = tCK (IDD);
CKE is H, /CS is H;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
-BE
360
-AE
320
-DF
240
-BE
240
-AE
200
-DF
680
-BE
640
-AE
600
-DF
1840
-BE
1760
-AE
1680
-DF
1840
-BE
1760
-AE
1680
mA
Fast PDN Exit
all banks open;
MRS(12) = 0
tCK = tCK (IDD);
CKE is L;
Other control and address bus
inputs are STABLE;
Slow PDN Exit
Data bus inputs are FLOATING
MRS(12) = 1
mA
mA
all banks open;
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
mA
all banks open, continuous burst reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data pattern is same as IDD4W
mA
all banks open, continuous burst writes;
BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
t
uc
Operating current
(Burst read operating)
IDD3N
320
Test condition
one bank; tCK = tCK (IDD), tRC = tRC (IDD),
tRAS = tRAS min.(IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
od
Active standby current
-DF
Unit
Pr
IDD3P-F
max.
Preliminary Data Sheet E0527E12 (Ver. 1.2)
11
EBE25UC8AAFV
Parameter
Symbol
Auto-refresh current
IDD5
Self-refresh current
Grade
-DF
2160
-BE
2160
-AE
2080
IDD6
EO
Operating current
(Bank interleaving)
IDD7
max.
48
-DF
2720
-BE
2720
-AE
2640
Unit
Test condition
mA
tCK = tCK (IDD);
Refresh command at every tRFC (IDD) interval;
CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
mA
mA
Self Refresh Mode;
CK and /CK at 0V;
CKE ≤ 0.2V;
Other control and address bus inputs are FLOATING;
Data bus inputs are FLOATING
all bank interleaving reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = tRCD (IDD) −1 × tCK (IDD);
tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD),
tRCD = 1 × tCK (IDD); See Notes 7;
CKE is H, CS is H between valid commands;
Address bus inputs are STABLE during DESELECTs;
Data pattern is same as IDD4W;
Notes: 1.
2.
3.
4.
L
IDD specifications are tested after the device is properly initialized.
Input slew rate is specified by AC Input Test Condition.
IDD parameters are specified with ODT disabled.
Data bus consists of DQ, DM, DQS, /DQS, RDQS, /RDQS, LDQS, /LDQS, UDQS, and /UDQS. IDD
values must be met with all combinations of EMRS bits 10 and 11.
5. Definitions for IDD
L is defined as VIN ≤VIL (AC) (max.)
H is defined as VIN ≥VIH (AC) (min.)
STABLE is defined as inputs stable at an H or L level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between H and L every other clock cycle (once per two clocks) for address and control
signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals
not including masks or strobes.
6. Refer to AC Timing for IDD Test Conditions.
7. In case of -DF (DDR2-700), tRCD must be 2 × tCK (IDD) and AL must be 4 × tCK (IDD) because AL = 5 is
not supported in this device.
od
Pr
AC Timing for IDD Test Conditions
For purposes of IDD testing, the following parameters are to be utilized.
DDR2-700
DDR2-667
DDR2-600
Parameter
5-6-6
5-5-5
5-5-5
Unit
CL(IDD)
5
5
5
tCK
15
15
tRC(IDD)
67.5
60
65
15
tRRD(IDD)
7.5
7.5
7.5
ns
uc
tRCD(IDD)
ns
ns
2.85
3
3.3
ns
tRAS(min.)(IDD)
50
45
47.5
ns
tRAS(max.)(IDD)
70000
70000
70000
ns
tRP(IDD)
15
15
15
ns
tRFC(IDD)
85
75
80
Preliminary Data Sheet E0527E12 (Ver. 1.2)
12
t
tCK(IDD)
ns
EBE25UC8AAFV
DC Characteristics 2 (TC = 0 to +85°C, VDD, VDDQ = 1.85V ± 0.05V)
(DDR2 SDRAM Component Specification)
Parameter
Symbol
Value
Input leakage current
ILI
TBD
µA
VDD ≥ VIN ≥ VSS
Output leakage current
ILO
TBD
µA
VDDQ ≥ VOUT ≥ VSS
VTT + 0.603
V
5
VTT – 0.603
V
5
Minimum required output pull-up under AC
VOH
test load
Maximum required output pull-down under
VOL
AC test load
Unit
Notes
0.5 × VDDQ
V
1
Output minimum sink DC current
IOL
+13.4
mA
3, 4, 5
Output minimum source DC current
IOH
–13.4
mA
2, 4, 5
EO
Output timing measurement reference level VOTR
Notes: 1.
2.
3.
4.
5.
The VDDQ of the device under test is referenced.
VDDQ = 1.7V; VOUT = 1.42V.
VDDQ = 1.7V; VOUT = 0.28V.
The DC value of VREF applied to the receiving device is expected to be set to VTT.
After OCD calibration to 18Ω at TA = 25°C, VDD = VDDQ = 1.8V.
DC Characteristics 3 (TC = 0 to +85°C, VDD, VDDQ = 1.85V ± 0.05V)
Parameter
L
(DDR2 SDRAM Component Specification)
Symbol
min.
max.
Unit
Notes
AC differential input voltage
VID (AC)
0.5
VDDQ + 0.6
V
1
AC differential cross point voltage
VIX (AC)
0.5 × VDDQ − 0.175
0.5 × VDDQ + 0.175
V
2
AC differential cross point voltage
VOX (AC)
0.5 × VDDQ − 0.125
0.5 × VDDQ + 0.125
V
3
Pr
od
Notes: 1. VID(AC) specifies the input differential voltage |VTR -VCP| required for switching, where VTR is the true
input signal (such as CK, DQS, LDQS or UDQS) and VCP is the complementary input signal (such as
/CK, /DQS, /LDQS or /UDQS). The minimum value is equal to VIH(AC) − VIL(AC).
2. The typical value of VIX(AC) is expected to be about 0.5 × VDDQ of the transmitting device and VIX(AC)
is expected to track variations in VDDQ . VIX(AC) indicates the voltage at which differential input signals
must cross.
3. The typical value of VOX(AC) is expected to be about 0.5 × VDDQ of the transmitting device and
VOX(AC) is expected to track variations in VDDQ . VOX(AC) indicates the voltage at which differential
output signals must cross.
VDDQ
VTR
Crossing point
VID
VSSQ
Differential Signal Levels*1, 2
t
uc
VIX or VOX
VCP
Preliminary Data Sheet E0527E12 (Ver. 1.2)
13
EBE25UC8AAFV
ODT DC Electrical Characteristics (TC = 0 to +85°C, VDD, VDDQ = 1.85V ± 0.05V)
(DDR2 SDRAM Component Specification)
Parameter
Symbol
min.
typ.
max.
Unit
Notes
Rtt effective impedance value for EMRS (A6, A2) = 0, 1; 75 Ω
Rtt1(eff)
60
Rtt effective impedance value for EMRS (A6, A2) = 1, 0; 150 Ω
Rtt2(eff)
120
75
90
Ω
1
150
180
Ω
1
Deviation of VM with respect to VDDQ/2
∆VM
−3.75

+3.75
%
1
Note: 1. Test condition for Rtt measurements.
Measurement Definition for Rtt(eff)
Apply VIH (AC) and VIL (AC) to test pin separately, then measure current I(VIH(AC)) and I(VIL(AC)) respectively.
VIH(AC), and VDDQ values defined in SSTL_18.
EO
Rtt(eff) =
VIH(AC) − VIL(AC)
I(VIH(AC)) − I(VIL(AC))
Measurement Definition for ∆VM
Measure voltage (VM) at test pin (midpoint) with no load.
2 × VM
VDDQ
L
∆VM =
− 1 × 100%
OCD Default Characteristics (TC = 0 to +85°C, VDD, VDDQ = 1.85V ± 0.05V)
Parameter
Output impedance
Pull-up and pull-down mismatch
Output slew rate
Pr
(DDR2 SDRAM Component Specification)
min.
typ.
max.
Unit
Notes
12.6
18
23.4
Ω
1
0

4
Ω
1, 2
1.5

4.5
V/ns
3, 4
Pin Capacitance (TA = 25°C, VDD = 1.85V ± 0.05V)
uc
od
Notes: 1. Impedance measurement condition for output source DC current: VDDQ = 1.7V; VOUT = 1420mV;
(VOUT−VDDQ)/IOH must be less than 23.4Ω for values of VOUT between VDDQ and VDDQ−280mV.
Impedance measurement condition for output sink DC current: VDDQ = 1.7V; VOUT = 280mV;
VOUT/IOL must be less than 23.4Ω for values of VOUT between 0V and 280mV.
2. Mismatch is absolute value between pull up and pull down, both are measured at same temperature and
voltage.
3. Slew rate measured from VIL(AC) to VIH(AC).
4. The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate
as measured from AC to AC. This is guaranteed by design and characterization.
Symbol
Pins
max.
Unit
Input capacitance
CI1
Address, /RAS, /CAS, /WE,
/CS, CKE, ODT
TBD
pF
Input capacitance
CI2
CK, /CK
TBD
pF
Data and DQS input/output
capacitance
CO
DQ, DQS, /DQS, DM
TBD
pF
Preliminary Data Sheet E0527E12 (Ver. 1.2)
14
Note
t
Parameter
EBE25UC8AAFV
AC Characteristics (TC = 0 to +85°C, VDD, VDDQ = 1.85V ± 0.05V, VSS = 0V)
(DDR2 SDRAM Component Specification)
Frequency (Mbps)
-DF
-BE
-AE
700
667
600
Parameter
Symbol
min.
max.
min.
max.
min.
max.
Unit Notes
/CAS latency
CL
5
5
5
5
5
5
tCK
Active to read or write
command delay
tRCD
15

15

15

ns
Precharge command period
tRP
15

15

15

ns

60

60

ns
+450
−450
+450
−500
+500
ps
+400
−400
+400
−450
+450
ps
EO
Active to active/auto refresh
tRC
60
command time
DQ output access time from
tAC
−450
CK, /CK
DQS output access time from
tDQSCK −400
CK, /CK
tCH
0.45
0.55
0.45
0.55
0.45
0.55
tCK
CK low-level width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
tCK
CK half period
tHP
min.
(tCL, tCH)

min.
(tCL, tCH)

min.
(tCL, tCH)

ps
Clock cycle time
tCK
2850
8000
3000
8000
3300
8000
ps
DQ and DM input hold time
tDH
225

225

225

ps
5
4
L
CK high-level width
DQ and DM input setup time
DQ hold skew factor
100

100

100

ps
tIPW
0.6

0.6

0.6

tCK
tDIPW
0.35

0.35

0.35

tCK
tHZ

tAC max.

tAC max.

tAC max.
ps
tAC min.
tAC max.
tAC min.
tAC max.
tAC min.
tAC max.
ps
tDQSQ

300

300

300
ps
tQHS

400

400

400
ps
tLZ
tQH
tHP – tQHS 
tHP – tQHS 
tHP – tQHS 
ps
od
DQ/DQS output hold time
from DQS
Write command to first DQS
latching transition
tDS
Pr
Control and Address input
pulse width for each input
DQ and DM input pulse width
for each input
Data-out high-impedance
time from CK,/CK
Data-out low-impedance time
from CK,/CK
DQS-DQ skew for DQS and
associated DQ signals
WL − 0.25
WL + 0.25
WL − 0.25
WL + 0.25
WL − 0.25
WL + 0.25
tCK
DQS input high pulse width
tDQSH
0.35

0.35

0.35

tCK
DQS input low pulse width
tDQSL
0.35

0.35

0.35

tCK
0.2

0.2

0.2

tCK
0.2

0.2

0.2

tCK
2

2

2

tCK
DQS falling edge to CK setup
tDSS
time
DQS falling edge hold time
tDSH
from CK
Mode register set command
tMRD
cycle time
tWPRES 0

0

Write postamble
tWPST
0.4
0.6
0.4
0.6
Write preamble
tWPRE
0.35

0.35

tIH
250

250

tIS
125

125
tRPRE
0.9
1.1
0.9
Address and control input
hold time
Address and control input
setup time
Read preamble
Preliminary Data Sheet E0527E12 (Ver. 1.2)
15
0

tCK
0.4
0.6
tCK
0.35

tCK
375

ps

250

1.1
0.9
1.1
5
t
Write preamble setup time
uc
tDQSS
ps
tCK
4
EBE25UC8AAFV
Frequency (Mbps)
Parameter
Symbol
Read postamble
tRPST
Write recovery time
-AE
700
667
600
min.
max.
min.
max.
min.
max.
Unit Notes
0.4
0.6
0.4
0.6
0.4
0.6
tCK
70000
45
70000
45
70000
ns
tRAP
tRCD min.

tRCD min.

tRCD min.

ns
tRRD
7.5

7.5

7.5

ns
tWR
15

15

15

ns
tDAL
(tWR/tCK) +

(tRP/tCK)
tWTR
7.5

7.5

7.5

ns
tRTP
7.5

7.5

7.5

ns
tXSNR
tRFC + 10

tRFC + 10

tRFC + 10

ns
tXSRD
200

200

200

tCK
tXP
2

2

2

tCK
tXARD
2

2

2

tCK
3
tXARDS 6 − AL

6 − AL

6 − AL

tCK
2, 3
tCKE
3

3

3

tCK
tOIT
0
12
0
12
0
12
ns
75

75

75

ns

7.8

7.8

7.8
µs
L
EO
Auto precharge write
recovery + precharge time
Internal write to read
command delay
Internal read to precharge
command delay
Exit self refresh to a non-read
command
Exit self refresh to a read
command
Exit precharge power down to
any non-read command
Exit active power down to
read command
Exit active power down to
read command
(slow exit/low power mode)
CKE minimum pulse width
(high and low pulse width)
Output impedance test driver
delay
Auto refresh to active/auto
refresh command time
Average periodic refresh
interval
Minimum time clocks remains
ON after CKE
asynchronously drops low
-BE
45
Active to precharge command tRAS
Active to auto-precharge
delay
Active bank A to active bank
B command period
-DF
tREFI
(tWR/tCK) +

(tRP/tCK)
Pr
tRFC
(tWR/tCK) +

(tRP/tCK)
tDELAY
tIS + tCK +

tIH
tIS + tCK +

tIH
tIS + tCK +

tIH
tCK
1
ns
od
Notes: 1.
2.
3.
4.
For each of the terms above, if not already an integer, round to the next higher integer.
AL: Additive Latency.
MRS A12 bit defines which active power down exit timing to be applied.
The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the
VIH(AC) level for a rising signal and VIL(AC) for a falling signal applied to the device under test.
5. The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the
VIH(DC) level for a rising signal and VIL(DC) for a falling signal applied to the device under test.
CK
/DQS
/CK
tDS
tDH
tDS
tIS
tDH
tIH
uc
DQS
tIS
tIH
VDDQ
VIH (AC)(min.)
VIH (DC)(min.)
VREF
VIL (DC)(max.)
VIL (AC)(max.)
VSS
t
VDDQ
VIH (AC)(min.)
VIH (DC)(min.)
VREF
VIL (DC)(max.)
VIL (AC)(max.)
VSS
Input Waveform Timing 1 (tDS, tDH)
Input Waveform Timing 2 (tIS, tIH)
Preliminary Data Sheet E0527E12 (Ver. 1.2)
16
EBE25UC8AAFV
ODT AC Electrical Characteristics (DDR2 SDRAM Component Specification)
Parameter
Symbol
min.
max.
Unit
ODT turn-on delay
tAOND
2
2
tCK
ODT turn-on
tAON
tAC(min)
tAC(max) + 1000
ps
ODT turn-on (power down mode)
tAONPD
tAC(min) + 2000
2tCK + tAC(max) + 1000
ps
ODT turn-off delay
tAOFD
2.5
2.5
tCK
ODT turn-off
tAOF
tAC(min)
tAC(max) + 600
ps
ODT turn-off (power down mode)
tAOFPD
tAC(min) + 2000
2.5tCK + tAC(max) + 1000
ns
ODT to power down entry latency
tANPD
3
3
tCK
ODT power down exit latency
tAXPD
8
8
tCK
Notes
1
2
EO
Notes: 1. ODT turn on time min is when the device leaves high impedance and ODT resistance begins to turn on.
ODT turn on time max is when the ODT resistance is fully on. Both are measured from tAOND.
2. ODT turn off time min is when the device starts to turn off ODT resistance.
ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD.
AC Input Test Conditions
Parameter
Symbol
Value
Unit
Notes
VREF
0.5 × VDDQ
V
1
Input signal maximum peak to peak swing
VSWING(max.)
1.0
V
1
Input signal maximum slew rate
SLEW
1.0
V/ns
2, 3
L
Input reference voltage
Pr
Notes: 1. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the
device under test.
2. The input signal minimum slew rate is to be maintained over the range from VIL(DC) (max.) to VIH(AC)
(min.) for rising edges and the range from VIH(DC) (min.) to VIL(AC) (max.) for falling edges as shown in
the below figure.
3. AC timings are referenced with input waveforms switching from VIL(AC) to VIH(AC) on the positive
transitions and VIH(AC) to VIL(AC) on the negative transitions.
Start of rising edge input timing
Start of falling edge input timing
VDDQ
VIH (AC)(min.)
od
VIH (DC)(min.)
VSWING(max.)
VREF
VIL (DC)(max.)
VIL (AC)(max.)
Falling slew =
VSS
∆TR
∆TF
VIH (DC)(min.) − VIL (AC)(max.)
Rising slew =
VIH (AC) min. − VIL (DC)(max.)
AC Input Test Signal Wave forms
Measurement point
DQ
VTT
RT =25 Ω
Preliminary Data Sheet E0527E12 (Ver. 1.2)
17
t
Output Load
∆TR
uc
∆TF
EBE25UC8AAFV
Pin Functions
CK, /CK (input pin)
The CK and the /CK are the master clock inputs. All inputs except DMs, DQSs and DQs are referred to the cross
point of the CK rising edge and the VREF level. When a read operation, DQSs and DQs are referred to the cross
point of the CK and the /CK. When a write operation, DMs and DQs are referred to the cross point of the DQS and
the VREF level. DQSs for write operation are referred to the cross point of the CK and the /CK.
/CS (input pin)
When /CS is low, commands and data can be input. When /CS is high, all inputs are ignored. However, internal
operations (bank active, burst operations, etc.) are held.
EO
/RAS, /CAS, and /WE (input pins)
These pins define operating commands (read, write, etc.) depending on the combinations of their voltage levels.
See "Command operation".
A0 to A12 (input pins)
Row address (AX0 to AX12) is determined by the A0 to the A12 level at the cross point of the CK rising edge and the
VREF level in a bank active command cycle. Column address (AY0 to AY9) is loaded via the A0 to the A9 at the
cross point of the CK rising edge and the VREF level in a read or a write command cycle. This column address
becomes the starting address of a burst operation.
L
A10 (AP) (input pin)
A10 defines the precharge mode when a precharge command, a read command or a write command is issued. If
A10 = high when a precharge command is issued, all banks are precharged. If A10 = low when a precharge
command is issued, only the bank that is selected by BA1, BA0 is precharged. If A10 = high when read or write
command, auto-precharge function is enabled. While A10 = low, auto-precharge function is disabled.
[Bank Select Signal Table]
Bank 0
BA0
BA1
L
L
H
Bank 2
L
Bank 3
H
Remark: H: VIH. L: VIL.
L
od
Bank 1
Pr
BA0 and BA1 (input pins)
BA0, BA1 are bank select signals (BA). The memory array is divided into bank 0, bank 1, bank 2 and bank 3. (See
Bank Select Signal Table)
H
H
DQ (input and output pins)
Data are input to and output from these pins.
DQS and /DQS (input and output pin)
DQS and /DQS provide the read data strobes (as output) and the write data strobes (as input).
Preliminary Data Sheet E0527E12 (Ver. 1.2)
18
t
uc
CKE (input pin)
CKE controls power down and self-refresh. The power down and the self-refresh commands are entered when the
CKE is driven low and exited when it resumes to high.
The CKE level must be kept for 1 CK cycle at least, that is, if CKE changes at the cross point of the CK rising edge
and the VREF level with proper setup time tIS, at the next CK rising edge CKE level must be kept with proper hold
time tIH.
EBE25UC8AAFV
DM (input pins)
DM is the reference signal of the data input mask function. DMs are sampled at the cross point of DQS and /DQS.
VDD (power supply pins)
1.8V is applied. (VDD is for the internal circuit.)
VDDSPD (power supply pin)
1.8V is applied (For serial EEPROM).
VSS (power supply pin)
Ground is connected.
EO
Detailed Operation Part and Timing Waveforms
Refer to the EDE2508AASE-DF, -BE, -AE, EDE2516AASE-DF, -BE, -AE datasheet (E0515E).
L
t
uc
od
Pr
Preliminary Data Sheet E0527E12 (Ver. 1.2)
19
EBE25UC8AAFV
Physical Outline
Unit: mm
4.00 max
0.5 min
4.00 min
(DATUM -A-)
Component area
(Front)
1
120
A
63.00
1.27 ± 0.10
55.00
L
240
FULL R
3.00
2.50 ± 0.20
Pr
Detail A
Detail B
(DATUM -A-)
1.00
4.00
0.20 ± 0.15
4.00
Component area
(Back)
30.00
121
17.80
133.35
10.00
EO
B
2.50
FULL R
od
0.80 ± 0.05
3.80
5.00
1.50 ± 0.10
uc
ECA-TS2-0093-01
t
Preliminary Data Sheet E0527E12 (Ver. 1.2)
20
EBE25UC8AAFV
CAUTION FOR HANDLING MEMORY MODULES
When handling or inserting memory modules, be sure not to touch any components on the modules, such as
the memory ICs, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on
these components to prevent damaging them.
In particular, do not push module cover or drop the modules in order to protect from mechanical defects,
which would be electrical defects.
When re-packing memory modules, be sure the modules are not touching each other.
Modules in contact with other modules may cause excessive mechanical stress, which may damage the
modules.
MDE0202
EO
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR MOS DEVICES
L
Exposing the MOS devices to a strong electric field can cause destruction of the gate
oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it, when once
it has occurred. Environmental control must be adequate. When it is dry, humidifier
should be used. It is recommended to avoid using insulators that easily build static
electricity. MOS devices must be stored and transported in an anti-static container,
static shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded using
wrist strap. MOS devices must not be touched with bare hands. Similar precautions
need to be taken for PW boards with semiconductor MOS devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES
3
od
Pr
No connection for CMOS devices input pins can be a cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input level may be
generated due to noise, etc., hence causing malfunction. CMOS devices behave
differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected
to VDD or GND with a resistor, if it is considered to have a possibility of being an output
pin. The unused pins must be handled in accordance with the related specifications.
STATUS BEFORE INITIALIZATION OF MOS DEVICES
uc
Power-on does not necessarily define initial status of MOS devices. Production process
of MOS does not define the initial operation status of the device. Immediately after the
power source is turned ON, the MOS devices with reset function have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or
contents of registers. MOS devices are not initialized until the reset signal is received.
Reset operation must be executed immediately after power-on for MOS devices having
reset function.
CME0107
t
Preliminary Data Sheet E0527E12 (Ver. 1.2)
21
EBE25UC8AAFV
HYPER DIMM is a trademark of Elpida Memory, Inc.
The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of Elpida Memory, Inc.
Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights
(including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or
third parties by or arising from the use of the products or information listed in this document. No license,
express, implied or otherwise, is granted under any patents, copyrights or other intellectual property
rights of Elpida Memory, Inc. or others.
Descriptions of circuits, software and other related information in this document are provided for
illustrative purposes in semiconductor product operation and application examples. The incorporation of
these circuits, software and information in the design of the customer's equipment shall be done under
the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses
incurred by customers or third parties arising from the use of these circuits, software and information.
EO
[Product applications]
Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability.
However, users are instructed to contact Elpida Memory's sales office before using the product in
aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment,
medical equipment for life support, or other such application in which especially high quality and
reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury.
L
[Product usage]
Design your application so that the product is used within the ranges and conditions guaranteed by
Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation
characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no
responsibility for failure or damage when the product is used beyond the guaranteed ranges and
conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure
rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so
that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other
consequential damage due to the operation of the Elpida Memory, Inc. product.
Pr
[Usage environment]
This product is not designed to be resistant to electromagnetic waves or radiation. This product must be
used in a non-condensing environment.
M01E0107
t
uc
od
If you export the products or technology described in this document that are controlled by the Foreign
Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance
with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by
U.S. export control regulations, or another country's export control laws or regulations, you must follow
the necessary procedures in accordance with such laws or regulations.
If these products/technology are sold, leased, or transferred to a third party, or a third party is granted
license to use these products, that third party must be made aware that they are responsible for
compliance with the relevant laws and regulations.
Preliminary Data Sheet E0527E12 (Ver. 1.2)
22
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