Elpida EBE52UC8AAFA-4A-E 512mb unbuffered ddr2 sdram dimm Datasheet

PRELIMINARY DATA SHEET
512MB Unbuffered DDR2 SDRAM DIMM
EBE52UC8AAFA (64M words × 64 bits, 2 Ranks)
Features
The EBE52UC8ABFA is 64M words × 64 bits, 2 ranks
DDR2 SDRAM unbuffered module, mounting 16 pieces
of 256M bits DDR2 SDRAM sealed in FBGA (µBGA)
package. Read and write operations are performed at
the cross points of the CK and the /CK. This highspeed data transfer is realized by the 4 bits prefetchpipelined architecture. Data strobe (DQS and /DQS)
both for read and write are available for high speed and
reliable data bus design. By setting extended mode
register, the on-chip Delay Locked Loop (DLL) can be
set enable or disable. This module provides high
density mounting without utilizing surface mount
technology.
Decoupling capacitors are mounted
beside each FBGA (µBGA) on the module board.
• 240-pin socket type dual in line memory module
(DIMM)
 PCB height: 30.0mm
 Lead pitch: 1.0mm
 Lead-free
• 1.8V power supply
• Data rate: 533Mbps/400Mbps (max.)
• 1.8V (SSTL_18 compatible) I/O
• Double-data-rate architecture: two data transfers per
clock cycle
• Bi-directional, differential data strobe (DQS and
/DQS) is transmitted/received with data, to be used in
capturing data at the receiver
• DQS is edge aligned with data for READs: centeraligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DQS transitions with CK
transitions
• Commands entered on each positive CK edge: data
and data mask referenced to both edges of DQS
• Four internal banks for concurrent operation
(Component)
• Data mask (DM) for write data
• Burst lengths: 4, 8
• /CAS Latency (CL): 3, 4, 5
• Auto precharge operation for each burst access
• Auto refresh and self refresh modes
• 7.8µs average periodic refresh interval
• Posted CAS by programmable additive latency for
better command and data bus efficiency
• Off-Chip-Driver Impedance Adjustment and On-DieTermination for better signal quality
• /DQS can be disabled for single-ended Data Strobe
operation
L
EO
Description
Note: Do not push the components or drop the
modules in order to avoid mechanical defects,
which may result in electrical defects.
t
uc
od
Pr
Document No. E0467E11 (Ver. 1.1)
Date Published April 2005 (K) Japan
Printed in Japan
URL: http://www.elpida.com
This product became EOL in April, 2005.
Elpida Memory, Inc. 2004-2005
EBE52UC8AAFA
Ordering Information
Part number
Data rate
Mbps (max.)
Component
JEDEC speed bin
(CL-tRCD-tRP)
EBE52UC8AAFA-5C-E
533
DDR2-533 (4-4-4)
Contact
pad
Package
EBE52UC8AAFA-4A-E
400
DDR2-400 (3-3-3)
EBE52UC8AAFA-4C-E
400
DDR2-400 (4-4-4)
Mounted devices
EDE2508AASE-5C
240-pin DIMM
(lead-free)
Gold
EDE2508AASE-5C, -4A
EDE2508AASE-5C, -4A, -4C
Pin Configurations
Front side
1 pin
EO
121 pin
64 pin 65 pin
120 pin
184 pin 185 pin
240 pin
Back side
Pin name
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
1
VREF
61
A4
121
VSS
181
VDD
2
VSS
62
VDD
122
DQ4
182
A3
3
DQ0
63
A2
123
DQ5
183
A1
4
DQ1
64
VDD
124
VSS
184
VDD
5
VSS
65
VSS
125
DM0
185
CK0
6
/DQS0
66
VSS
126
NC
186
/CK0
7
DQS0
67
VDD
127
VSS
187
VDD
8
VSS
68
NC
128
DQ6
188
A0
9
DQ2
69
VDD
129
DQ7
189
VDD
10
DQ3
70
A10/AP
130
VSS
190
BA1
11
VSS
71
BA0
131
DQ12
191
VDD
12
DQ8
72
VDD
132
DQ13
13
DQ9
73
/WE
14
VSS
74
/CAS
15
/DQS1
75
VDD
16
DQS1
76
/CS1
17
VSS
77
ODT1
18
NC
78
VDD
19
NC
79
VSS
20
VSS
80
DQ32
21
DQ10
81
DQ33
141
DQ15
201
VSS
22
DQ11
82
VSS
142
VSS
202
DM4
23
VSS
83
/DQS4
143
DQ20
203
NC
24
DQ16
84
DQS4
144
DQ21
204
VSS
25
DQ17
85
VSS
145
VSS
205
DQ38
26
VSS
86
DQ34
146
DM2
27
/DQS2
87
DQ35
147
NC
207
28
DQS2
88
VSS
148
VSS
208
L
Pin No.
/RAS
od
Pr
192
133
VSS
193
/CS0
134
DM1
194
VDD
135
NC
195
ODT0
136
VSS
196
NC
137
CK1
197
VDD
/CK1
198
VSS
VSS
199
DQ36
140
DQ14
200
DQ37
2
206
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
uc
138
139
DQ39
VSS
DQ44
EBE52UC8AAFA
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
29
VSS
89
DQ40
149
DQ22
209
DQ45
30
DQ18
90
DQ41
150
DQ23
210
VSS
31
DQ19
91
VSS
151
VSS
211
DM5
32
VSS
92
/DQS5
152
DQ28
212
NC
33
DQ24
93
DQS5
153
DQ29
213
VSS
34
DQ25
94
VSS
154
VSS
214
DQ46
35
VSS
95
DQ42
155
DM3
215
DQ47
36
/DQS3
96
DQ43
156
NC
216
VSS
37
DQS3
97
VSS
157
VSS
217
DQ52
38
VSS
98
DQ48
158
DQ30
218
DQ53
EO
DQ26
99
DQ49
159
DQ31
219
VSS
40
DQ27
100
VSS
160
VSS
220
CK2
41
VSS
101
SA2
161
NC
221
/CK2
42
NC
102
NC
162
NC
222
VSS
43
NC
103
VSS
163
VSS
223
DM6
44
VSS
104
/DQS6
164
NC
224
NC
45
NC
105
DQS6
165
NC
225
VSS
46
NC
106
VSS
166
VSS
226
DQ54
47
VSS
107
DQ50
167
NC
227
DQ55
48
NC
108
DQ51
168
NC
228
VSS
49
NC
109
VSS
169
VSS
229
DQ60
50
VSS
110
DQ56
170
VDD
230
DQ61
51
VDD
111
52
CKE0
112
53
VDD
113
54
NC
114
55
NC
115
56
VDD
116
57
A11
117
DQ59
58
A7
118
VSS
59
VDD
119
SDA
60
A5
120
SCL
L
39
171
CKE1
231
VSS
172
VDD
232
DM7
/DQS7
173
NC
233
NC
Pr
DQ57
VSS
DQS7
174
NC
234
VSS
VSS
175
VDD
235
DQ62
DQ58
176
A12
236
DQ63
od
177
A9
237
VSS
178
VDD
238
VDDSPD
179
A8
239
SA0
180
A6
240
SA1
t
uc
Preliminary Data Sheet E0467E11 (Ver. 1.1)
3
EBE52UC8AAFA
Pin Description
Pin name
Function
A0 to A12
Address input
Row address
Column address
A10 (AP)
Auto precharge
BA0, BA1
Bank select address
DQ0 to DQ63
Data input/output
/RAS
Row address strobe command
A0 to A12
A0 to A9
Column address strobe command
/WE
Write enable
/CS0, /CS1
Chip select
CKE0, CKE1
Clock enable
CK0 to CK2
Clock input
/CK0 to /CK2
Differential clock input
EO
/CAS
DQS0 to DQS7, /DQS0 to /DQS7
Input and output data strobe
DM0 to DM7
Input mask
SCL
Clock input for serial PD
SDA
Data input/output for serial PD
VDD
VDDSPD
VREF
L
SA0 to SA2
VSS
NC
Power for internal circuit
Power for serial EEPROM
Input reference voltage
Ground
Pr
ODT0, ODT1
Serial address input
ODT control
No connection
t
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Preliminary Data Sheet E0467E11 (Ver. 1.1)
4
EBE52UC8AAFA
Serial PD Matrix
Byte No.
0
1
Function described
Number of bytes utilized by module
manufacturer
Total number of bytes in serial PD
device
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Hex value
Comments
1
0
0
0
0
0
0
0
80H
128 bytes
0
0
0
0
1
0
0
0
08H
256 bytes
Memory type
0
0
0
0
1
0
0
0
08H
DDR2 SDRAM
3
Number of row address
0
0
0
0
1
1
0
1
0DH
13
4
Number of column address
0
0
0
0
1
0
1
0
0AH
10
5
Number of DIMM ranks
0
1
1
0
0
0
0
1
61H
2
6
Module data width
0
1
0
0
0
0
0
0
40H
64
7
Module data width continuation
0
0
0
0
0
0
0
0
00H
0
8
Voltage interface level of this assembly 0
0
0
0
0
1
0
1
05H
SSTL 1.8V
9
DDR SDRAM cycle time, CL = 5
-5C
0
0
1
1
1
1
0
1
3DH
3.75ns*
0
1
0
1
0
0
0
0
50H
5.0ns*
1
0
1
0
1
0
0
0
0
50H
0.5ns*
1
0
1
1
0
0
0
0
0
60H
0.6ns*
1
EO
2
-4A, -4C
10
SDRAM access from clock (tAC)
-5C
-4A, -4C
DIMM configuration type
0
0
0
0
0
0
0
0
00H
None.
12
Refresh rate/type
1
0
0
0
0
0
1
0
82H
7.8µs
L
11
13
Primary SDRAM width
0
0
0
0
1
0
0
0
08H
×8
14
Error checking SDRAM width
0
0
0
0
0
0
0
0
00H
None.
Reserved
0
0
0
0
0
0
0
0
00H
0
0
0
0
0
1
1
0
0
0CH
4,8
15
16
18
Pr
17
SDRAM device attributes:
Burst length supported
SDRAM device attributes: Number of
banks on SDRAM device
SDRAM device attributes:
/CAS latency
0
0
0
0
0
1
0
0
04H
4
0
0
1
1
1
0
0
0
38H
3, 4, 5
0
0
0
0
0
0
0
0
00H
0
1
Reserved
20
DIMM type information
0
0
0
0
0
0
1
0
02H
Unbuffered
21
SDRAM module attributes
0
0
0
0
0
0
0
0
00H
Normal
22
SDRAM device attributes: General
0
0
1
1
0
0
0
0
30H
VDD ± 0.1V
23
Minimum clock cycle time at CL = 4
-5C
0
0
1
1
1
1
0
1
3DH
3.75ns*
0
1
0
1
0
0
0
0
50H
5.0ns*
1
Maximum data access time (tAC) from
clock at CL = 4
0
-5C
1
0
1
0
0
0
0
50H
0.5ns*
1
-4A, -4C
24
25
1
1
0
0
0
0
1
0
1
0
0
1
1
1
1
1
1
Maximum data access time (tAC) from
clock at CL = 3
0
-5C, -4A
1
1
0
0
0
1
1
1
1
1
Minimum clock cycle time at CL = 3
-5C, -4A
-4C
26
-4C
1
Preliminary Data Sheet E0467E11 (Ver. 1.1)
5
0
0
60H
0.6ns*
1
0
0
50H
5.0ns*
1
1
1
FFH
Undefined*
0
0
60H
0.6ns*
1
1
FFH
Undefined*
1
1
1
t
0
1
uc
-4A, -4C
od
19
EBE52UC8AAFA
Byte No.
Function described
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Hex value
Comments
27
Minimum row precharge time (tRP)
-5C, -4A
0
0
1
1
1
1
0
0
3CH
15ns
0
1
0
1
0
0
0
0
50H
20ns
0
0
0
1
1
1
1
0
1EH
7.5ns
0
0
1
1
1
1
0
0
3CH
15ns
-4C
28
29
Minimum row active to row active
delay (tRRD)
Minimum /RAS to /CAS delay (tRCD)
-5C, -4A
-4C
30
31
1
0
1
0
0
0
0
50H
20ns
0
0
1
0
1
1
0
1
2DH
45ns
Module rank density
0
1
0
0
0
0
0
0
40H
256M bytes
Address and command setup time
before clock (tIS)
-5C
0
0
1
0
0
1
0
1
25H
0.25ns*
1
0
0
1
1
0
1
0
1
35H
0.35ns*
1
Address and command hold time after
clock (tIH)
0
-5C
0
1
1
1
0
0
0
38H
0.38ns*
1
0
1
0
0
1
0
0
0
48H
0.48ns*
1
0
0
0
1
0
0
0
0
10H
0.10ns*
1
0
0
0
1
0
1
0
1
15H
0.15ns*
1
0
0
1
0
0
0
1
1
23H
0.23ns*
1
0
0
1
0
1
0
0
0
28H
0.28ns*
1
EO
0
Minimum active to precharge time
(tRAS)
32
-4A, -4C
33
-4A, -4C
34
L
Data input setup time before clock
(tDS)
-5C
-4A, -4C
35
Data input hold time after clock (tDH)
-5C
-4A, -4C
1
Write recovery time (tWR)
0
0
1
1
1
1
0
0
3CH
15ns*
37
Internal write to read command delay
(tWTR)
-5C
0
0
0
1
1
1
1
0
1EH
7.5ns*
0
0
1
0
1
0
0
0
28H
10ns*
-4A , -4C
Pr
36
1
1
Internal read to precharge command
delay (tRTP)
0
0
0
1
1
1
1
0
1EH
7.5ns*
39
Memory analysis probe characteristics 0
0
0
0
0
0
0
0
00H
TBD
40
Extension of Byte 41 and 42
0
0
0
0
0
0
0
0
00H
Undefined
41
Active command period (tRC)
-5C, -4A
0
0
1
1
1
1
0
0
3CH
60ns*
1
0
1
0
0
0
0
0
1
41H
65ns*
1
0
0
1
0
1
1
4BH
75ns*
1
0
0
0
0
0
0
80H
8ns*
-4C
Auto refresh to active/
Auto refresh command cycle (tRFC)
0
1
43
SDRAM tCK cycle max. (tCK max.)
1
0
44
Dout to DQS skew
-5C
0
0
0
1
1
1
0
0
1
0
0
0
0
0
1
0
1
0
0
0
1
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
-4A, -4C
45
Data hold skew (tQHS)
-5C
-4A, -4C
46
PLL relock time
47 to 61
Preliminary Data Sheet E0467E11 (Ver. 1.1)
6
1
1
0
1EH
0.30ns*
1
1
1
23H
0.35ns*
1
0
0
28H
0.40ns*
1
0
1
2DH
0.45ns*
1
0
0
00H
Undefined
0
0
00H
t
42
1
uc
od
38
EBE52UC8AAFA
Byte No.
Function described
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Hex value
Comments
62
SPD Revision
0
0
0
1
0
0
0
0
10H
Rev. 1.0
63
Checksum for bytes 0 to 62
-5C
1
0
0
0
0
0
1
1
83H
-4A
0
0
0
0
0
1
1
1
07H
-4C
1
0
0
0
0
0
1
0
82H
64 to 65
Manufacturer’s JEDEC ID code
0
1
1
1
1
1
1
1
7FH
Continuation
code
66
Manufacturer’s JEDEC ID code
1
1
1
1
1
1
1
0
FEH
Elpida Memory
67 to 71
Manufacturer’s JEDEC ID code
0
0
0
0
0
0
0
0
00H
72
Manufacturing location
×
×
×
×
×
×
×
×
××
(ASCII-8bit
code)
EO
Module part number
0
1
0
0
0
1
0
1
45H
E
74
Module part number
0
1
0
0
0
0
1
0
42H
B
75
Module part number
0
1
0
0
0
1
0
1
45H
E
76
Module part number
0
0
1
1
0
1
0
1
35H
5
77
Module part number
0
0
1
1
0
0
1
0
32H
2
78
Module part number
0
1
0
1
0
1
0
1
55H
U
79
Module part number
0
1
0
0
0
0
1
1
43H
C
80
Module part number
0
0
1
1
1
0
0
0
38H
8
81
Module part number
0
1
0
0
0
0
0
1
41H
A
L
73
Module part number
0
1
0
0
0
0
0
1
41H
A
83
Module part number
0
1
0
0
0
1
1
0
46H
F
84
Module part number
0
1
0
0
0
0
0
1
41H
A
85
Module part number
0
0
1
0
1
1
0
1
2DH
—
86
Module part number
-5C
0
0
1
1
0
1
0
1
35H
5
0
0
1
1
0
1
0
0
34H
4
87
Module part number
-4A
0
1
0
0
0
0
0
1
41H
A
0
1
0
0
0
0
1
1
43H
C
0
0
-4A, -4C
-5C, -4C
Module part number
89
Module part number
0
1
90
Module part number
0
0
Revision code
0
0
92
Revision code
0
0
93
Manufacturing date
×
×
94
Manufacturing date
×
×
95 to 98
Module serial number
99 to 127
Manufacture specific data
1
0
1
1
0
1
2DH
—
0
0
0
1
0
1
45H
E
1
0
0
0
0
0
20H
(Space)
1
1
0
0
0
0
30H
Initial
1
0
0
0
0
0
20H
(Space)
×
×
×
×
×
×
××
×
×
×
×
Year code
(BCD)
Week code
(BCD)
uc
91
od
88
Pr
82
×
×
××
Note: These specifications are defined based on component specification, not module.
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
7
EBE52UC8AAFA
Block Diagram
/CS1
/CS0
/DQS0
DQS0
DM0
RS1
RS1
DQ0 to DQ7
DQS1
DQ0
to DQ7
D0
RS1
DQ0
to DQ7
D10
RS1
RS1
DQ0
to DQ7
8
D11
RS1
BA0 to BA1
A0 to A12
D3
RS2
DQ0
to DQ7
8
RS1
DQ0
to DQ7
DQ56 to DQ63
A0 to A12: SDRAMs (D0 to D7, D9 to D16)
RS2
RS2
DQ0
to DQ7
D16
SDA
/RAS: SDRAMs (D0 to D7, D9 to D16)
/WE: SDRAMs (D0 to D7, D9 to D16)
SA1
A1
CKE0
CKE: SDRAMs (D0 to D7)
SA2
A2
CKE1
CKE: SDRAMs (D9 to D16)
ODT0
ODT1
ODT:SDRAMs (D0 to D7)
ODT:SDRAMs (D9 to D16)
RS2
D15
DM /CS DQS /DQS
D7
SDA
SCL
A0
/WE
DQ0
to DQ7
Serial PD
SCL
SA0
/CAS
D6
DM /CS DQS /DQS
BA0 to BA1: SDRAMs (D0 to D7, D9 to D16)
RS2
DM /CS DQS /DQS
RS1
DM /CS DQS /DQS
D12
D14
RS1
DQS7
DQ0
to DQ7
DQ0
to DQ7
D5
od
/RAS
DQ0
to DQ7
DQ0
to DQ7
RS1
/DQS7
Pr
8
RS1
DQ48 to DQ55
DM7
DQ24 to DQ31
DM /CS DQS /DQS
DM /CS DQS /DQS
RS1
DM /CS DQS /DQS
DM /CS DQS /DQS
RS1
DM /CS DQS /DQS
DQ0
to DQ7
D13
RS1
DM6
D2
DQ0
to DQ7
RS1
DQS6
RS1
RS1
RS1
DQ40 to DQ47
/DQS6
L
DM3
8
RS1
8
DQS3
DQ0
to DQ7
D4
RS1
DM /CS DQS /DQS
RS1
DQ16 to DQ23
DQ0
to DQ7
RS1
DM5
D1
RS1
RS1
DQS5
DM /CS DQS /DQS
/DQS3
8
DQ32 to DQ39
/DQS5
DQ8 to DQ15
DM2
D9
RS1
8
DQS2
DQ0
to DQ7
DM /CS DQS /DQS
DM /CS DQS /DQS
RS1
DM /CS DQS /DQS
/DQS2
DM /CS DQS /DQS
RS1
EO
DM1
RS1
DM4
DM /CS DQS /DQS
/DQS1
RS1
DQS4
RS1
8
RS1
/DQS4
RS1
/CAS: SDRAMs (D0 to D7, D9 to D16))
U0
WP
Notes :
1. DQ wiring may be changed within a byte.
VDDSPD
SPD
SDRAMs (D0 to D7, D9 to D16)
VDD
SDRAMs (D0 to D7, D9 to D16)
VSS
SDRAMs (D0 to D7, D9 to D16)
2. DQ, DQS, /DQS, ODT, DM, CKE, /CS relationships
must be meintained as shown.
uc
VREF
3. Refer to the appropriate clock wiring topology
under the DIMM wiring details section of this document.
* D0 to D15 : 256M bits DDR2 SDRAM
U0 : 2k bits EEPROM
Rs1 : 22Ω
Rs2 : 3.0Ω
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
8
EBE52UC8AAFA
Logical Clock Net Structure
6DRAM loads (CK1 and /CK1, CK2 and /CK2)
R = 200Ω
DRAM
DRAM
DRAM
DIMM
connector
R = 200Ω
EO
DRAM
DRAM
DRAM
R = 200Ω
L
4DRAM loads (CK0 and /CK0)
Pr
R = 200Ω
DRAM
C2
od
DIMM
connector
DRAM
R = 200Ω
DRAM
DRAM
uc
R = 200Ω
*C2: 2pF
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
9
EBE52UC8AAFA
Electrical Specifications
• All voltages are referenced to VSS (GND).
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
–0.5 to +2.3
V
Supply voltage relative to VSS
VDD
–0.5 to +2.3
V
Short circuit output current
IOS
50
mA
Power dissipation
PD
8
W
Operating case temperature
TC
0 to +85
°C
Storage temperature
Tstg
–55 to +100
°C
Note
1
EO
Note: DDR2 SDRAM component specification.
Caution
Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
DC Operating Conditions (TC = 0 to +85°C) (DDR2 SDRAM Component Specification)
Parameter
Symbol
min.
typ.
max.
Unit
Notes
Supply voltage
VDD, VDDQ
4
1.8
1.9
V
0
0
0
V
VDDSPD
1.7
—
3.6
V
L
1.7
VSS
VREF
0.49 × VDDQ
0.50 × VDDQ 0.51 × VDDQ
V
1, 2
Termination voltage
VTT
VREF − 0.04
VREF
VREF + 0.04
V
3
DC input logic high
VIH (DC)
VREF + 0.125

VDDQ + 0.3V
V
DC input low
VIL (DC)
−0.3

VREF – 0.125
V
AC input logic high
VIH (AC)
VREF + 0.250


V
AC input low
VIL (AC)


VREF − 0.250
V
Pr
Input reference voltage
t
uc
od
Notes: 1. The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically
the value of VREF is expected to be about 0.5 × VDDQ of the transmitting device and VREF are expected
to track variations in VDDQ.
2. Peak to peak AC noise on VREF may not exceed ±2% VREF (DC).
3. VTT of transmitting device must track VREF of receiving device.
4. VDDQ must be equal to VDD.
Preliminary Data Sheet E0467E11 (Ver. 1.1)
10
EBE52UC8AAFA
DC Characteristics 1 (TC = 0 to +85°C, VDD = 1.8V ± 0.1V, VSS = 0V)
Parameter
Symbol
Grade
max.
Unit
-5C
-4A, -4C
960
824
mA
-5C
-4A, -4C
1400
1240
mA
Operating current
IDD1
(ACT-READ-PRE)
(Another rank is in IDD2P)
-5C
-4A, -4C
1080
944
mA
Operating current
IDD1
(ACT-READ-PRE)
(Another rank is in IDD3N)
-5C
-4A, -4C
1520
1360
mA
-5C
-4A, -4C
160
-5C
-4A, -4C
128
-5C
400
-4A, -4C
320
-5C
480
-4A, -4C
400
-5C
640
-4A, -4C
560
Operating current
IDD0
(ACT-PRE)
(Another rank is in IDD2P)
Operating current
IDD0
(ACT-PRE)
(Another rank is in IDD3N)
EO
Precharge power-down
standby current
Precharge quiet standby
current
mA
IDD2P
IDD2Q
mA
L
Idle standby current
IDD2N
mA
mA
-5C
400
-4A, -4C
320
-5C
1040
-4A, -4C
960
IDD4R
-5C
-4A, -4C
1600
1264
IDD4R
-5C
-4A, -4C
2040
1680
IDD4W
-5C
-4A, -4C
1600
1264
mA
IDD4W
-5C
-4A, -4C
2040
1680
mA
Auto-refresh current
IDD5
(Another rank is in IDD2P)
-5C
-4A, -4C
2080
1904
mA
Auto-refresh current
IDD5
(Another rank is in IDD3N)
-5C
-4A, -4C
2520
2320
mA
IDD3P-S
mA
mA
all banks open;
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
mA
mA
11
all banks open, continuous burst writes;
BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
tCK = tCK (IDD);
Refresh command at every tRFC (IDD) interval;
CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
all banks open, continuous burst reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data pattern is same as IDD4W
uc
Operating current
(Burst read operating)
(Another rank is in IDD2P)
Operating current
(Burst read operating)
(Another rank is in IDD3N)
Operating current
(Burst write operating)
(Another rank is in IDD2P)
Operating current
(Burst write operating)
(Another rank is in IDD3N)
IDD3N
one bank; IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK (IDD), tRC = tRC (IDD),
tRAS = tRAS min.(IDD); tRCD = tRCD (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data pattern is same as IDD4W
all banks idle;
tCK = tCK (IDD);
CKE is L;
Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
all banks idle;
tCK = tCK (IDD);
CKE is H, /CS is H;
Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
all banks idle;
tCK = tCK (IDD);
CKE is H, /CS is H;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
all banks open;
Fast PDN Exit
tCK = tCK (IDD);
MRS(12) = 0
CKE is L;
Other control and address bus
Slow PDN Exit
inputs are STABLE;
Data bus inputs are FLOATING MRS(12) = 1
od
Active standby current
one bank; tCK = tCK (IDD), tRC = tRC (IDD),
tRAS = tRAS min.(IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
Pr
IDD3P-F
Active power-down
standby current
Test condition
EBE52UC8AAFA
Parameter
Symbol
Self-refresh current
Grade
IDD6
max.
Unit
96
mA
Operating current
IDD7
(Bank interleaving)
(Another rank is in IDD2P)
-5C
-4A, -4C
2640
2464
mA
Operating current
IDD7
(Bank interleaving)
(Another rank is in IDD3N)
-5C
-4A, -4C
3080
2880
mA
Test condition
Self Refresh Mode;
CK and /CK at 0V;
CKE ≤ 0.2V;
Other control and address bus inputs are FLOATING;
Data bus inputs are FLOATING
all bank interleaving reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = tRCD (IDD) −1 × tCK (IDD);
tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD),
tRCD = 1 × tCK (IDD);
CKE is H, CS is H between valid commands;
Address bus inputs are STABLE during DESELECTs;
Data pattern is same as IDD4W;
IDD specifications are tested after the device is properly initialized.
Input slew rate is specified by AC Input Test Condition.
IDD parameters are specified with ODT disabled.
Data bus consists of DQ, DM, DQS, /DQS, RDQS, /RDQS, LDQS, /LDQS, UDQS, and /UDQS. IDD
values must be met with all combinations of EMRS bits 10 and 11.
5. Definitions for IDD
L is defined as VIN ≤ VIL (AC) (max.)
H is defined as VIN ≥ VIH (AC) (min.)
STABLE is defined as inputs stable at an H or L level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between H and L every other clock cycle (once per two clocks) for address and control
signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals
not including masks or strobes.
6. Refer to AC Timing for IDD Test Conditions.
L
EO
Notes: 1.
2.
3.
4.
Pr
AC Timing for IDD Test Conditions
For purposes of IDD testing, the following parameters are to be utilized.
DDR2-400
Parameter
4-4-4
3-3-3
CL(IDD)
4
3
tRCD(IDD)
15
15
tRC(IDD)
60
60
7.5
7.5
tCK(IDD)
3.75
5
tRAS(min.)(IDD)
45
45
tRAS(max.)(IDD)
70000
tRP(IDD)
tRFC(IDD)
Unit
4
tCK
20
ns
65
ns
7.5
ns
5
ns
45
ns
70000
70000
ns
15
15
20
ns
75
75
75
uc
tRRD(IDD)
4-4-4
od
DDR2-533
ns
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
12
EBE52UC8AAFA
DC Characteristics 2 (TC = 0 to +85°C, VDD, VDDQ = 1.8V ± 0.1V)
(DDR2 SDRAM Component Specification)
Parameter
Symbol
Value
Input leakage current
ILI
TBD
µA
VDD ≥ VIN ≥ VSS
Output leakage current
ILO
TBD
µA
VDDQ ≥ VOUT ≥ VSS
VTT + 0.603
V
5
VTT – 0.603
V
5
Minimum required output pull-up under AC
VOH
test load
Maximum required output pull-down under
VOL
AC test load
Unit
Notes
0.5 × VDDQ
V
1
Output minimum sink DC current
IOL
+13.4
mA
3, 4, 5
Output minimum source DC current
IOH
–13.4
mA
2, 4, 5
EO
Output timing measurement reference level VOTR
Notes: 1.
2.
3.
4.
5.
The VDDQ of the device under test is referenced.
VDDQ = 1.7V; VOUT = 1.42V.
VDDQ = 1.7V; VOUT = 0.28V.
The DC value of VREF applied to the receiving device is expected to be set to VTT.
After OCD calibration to 18Ω at TA = 25°C, VDD = VDDQ = 1.8V.
DC Characteristics 3 (TC = 0 to +85°C, VDD, VDDQ = 1.8V ± 0.1V)
Parameter
L
(DDR2 SDRAM Component Specification)
Symbol
min.
max.
Unit
Notes
AC differential input voltage
VID (AC)
0.5
VDDQ + 0.6
V
1
AC differential cross point voltage
VIX (AC)
0.5 × VDDQ − 0.175
0.5 × VDDQ + 0.175
V
2
AC differential cross point voltage
VOX (AC)
0.5 × VDDQ − 0.125
0.5 × VDDQ + 0.125
V
3
Pr
od
Notes: 1. VID(AC) specifies the input differential voltage |VTR -VCP| required for switching, where VTR is the true
input signal (such as CK, DQS, LDQS or UDQS) and VCP is the complementary input signal (such as
/CK, /DQS, /LDQS or /UDQS). The minimum value is equal to VIH(AC) − VIL(AC).
2. The typical value of VIX(AC) is expected to be about 0.5 × VDDQ of the transmitting device and VIX(AC)
is expected to track variations in VDDQ . VIX(AC) indicates the voltage at which differential input signals
must cross.
3. The typical value of VOX(AC) is expected to be about 0.5 × VDDQ of the transmitting device and
VOX(AC) is expected to track variations in VDDQ . VOX(AC) indicates the voltage at which differential
output signals must cross.
VDDQ
VTR
Crossing point
VID
VSSQ
Differential Signal Levels*1, 2
t
uc
VIX or VOX
VCP
Preliminary Data Sheet E0467E11 (Ver. 1.1)
13
EBE52UC8AAFA
ODT DC Electrical Characteristics (TC = 0 to +85°C, VDD, VDDQ = 1.8V ± 0.1V)
(DDR2 SDRAM Component Specification)
Parameter
Symbol
min.
typ.
max.
Unit
Note
Rtt effective impedance value for EMRS (A6, A2) = 0, 1; 75 Ω
Rtt1(eff)
60
Rtt effective impedance value for EMRS (A6, A2) = 1, 0; 150 Ω
Rtt2(eff)
120
75
90
Ω
1
150
180
Ω
1
Deviation of VM with respect to VDDQ/2
∆VM
−3.75

+3.75
%
1
Note: 1. Test condition for Rtt measurements.
Measurement Definition for Rtt(eff)
Apply VIH (AC) and VIL (AC) to test pin separately, then measure current I(VIH(AC)) and I(VIL(AC)) respectively.
VIH(AC), and VDDQ values defined in SSTL_18.
EO
Rtt(eff) =
VIH(AC) − VIL(AC)
I(VIH(AC)) − I(VIL(AC))
Measurement Definition for ∆VM
Measure voltage (VM) at test pin (midpoint) with no load.
2 × VM
VDDQ
L
∆VM =
− 1 × 100%
OCD Default Characteristics (TC = 0 to +85°C, VDD, VDDQ = 1.8V ± 0.1V)
Parameter
Output impedance
Pull-up and pull-down mismatch
Output slew rate
Pr
(DDR2 SDRAM Component Specification)
min.
typ.
max.
Unit
Notes
12.6
18
23.4
Ω
1
0

4
Ω
1, 2
1.5

4.5
V/ns
3, 4
Pin Capacitance (TA = 25°C, VDD = 1.8V ± 0.1V)
uc
od
Notes: 1. Impedance measurement condition for output source DC current: VDDQ = 1.7V; VOUT = 1420mV;
(VOUT−VDDQ)/IOH must be less than 23.4Ω for values of VOUT between VDDQ and VDDQ−280mV.
Impedance measurement condition for output sink DC current: VDDQ = 1.7V; VOUT = 280mV;
VOUT/IOL must be less than 23.4Ω for values of VOUT between 0V and 280mV.
2. Mismatch is absolute value between pull up and pull down, both are measured at same temperature and
voltage.
3. Slew rate measured from VIL(AC) to VIH(AC).
4. The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate
as measured from AC to AC. This is guaranteed by design and characterization.
Symbol
Pins
max.
Unit
Input capacitance
CI1
Address, /RAS, /CAS, /WE,
/CS, CKE, ODT
TBD
pF
Input capacitance
CI2
CK, /CK
TBD
pF
Data and DQS input/output
capacitance
CO
DQ, DQS, /DQS, DM
TBD
pF
Preliminary Data Sheet E0467E11 (Ver. 1.1)
14
Note
t
Parameter
EBE52UC8AAFA
AC Characteristics (TC = 0 to +85°C, VDD, VDDQ = 1.8V ± 0.1V, VSS = 0V)
(DDR2 SDRAM Component Specification)
Frequency (Mbps)
-5C
-4A, -4C
533
400
Symbol
min.
max.
min.
max.
Unit
/CAS latency
CL
4
5
3 (-4A)
4 (-4C)
15 (-4A)
20 (-4C)
15 (-4A)
20 (-4C)
60 (-4A)
65 (-4C)
5 (-4A)
5 (-4C)
tCK
Active to read or write command delay
tRCD
15


ns
Precharge command period
tRP
15


ns
Active to active/auto refresh command
time
tRC
60


ns
DQ output access time from CK, /CK
tAC
−500
+500
DQS output access time from CK, /CK
tDQSCK −450
+450
−600
+600
ps
−500
+500
ps
CK high-level width
tCH
0.45
0.55
0.45
0.55
tCK
CK low-level width
tCL
0.45
CK half period
tHP
min.
(tCL, tCH)
0.55
0.45
0.55
tCK

min.
(tCL, tCH)

ps
Clock cycle time
tCK
DQ and DM input hold time
tDH
3750
8000
5000
8000
ps
225

275

ps
5
tDS
100

150

ps
4
tIPW
0.6

0.6

tCK
tDIPW
0.35

0.35

tCK
tHZ

tAC max.

tAC max.
ps
tLZ
tAC min.
tAC max.
tAC min.
tAC max.
ps
tDQSQ

300

350
ps
tQHS

400

450
ps
tQH
tHP – tQHS

tHP – tQHS

ps
Write command to first DQS latching
transition
tDQSS
WL − 0.25
WL + 0.25
WL − 0.25
WL + 0.25
tCK
DQS input high pulse width
tDQSH
0.35

0.35

tCK
DQS input low pulse width
tDQSL
0.35

0.35

tCK
DQS falling edge to CK setup time
tDSS
0.2

0.2

tCK
DQS falling edge hold time from CK
tDSH
0.2

0.2

tCK
Mode register set command cycle time
tMRD
2

2

tCK
L
EO
Parameter
DQ and DM input setup time
DQ hold skew factor
DQ/DQS output hold time from DQS
uc
od
Pr
Control and Address input pulse width
for each input
DQ and DM input pulse width for each
input
Data-out high-impedance time from
CK,/CK
Data-out low-impedance time from
CK,/CK
DQS-DQ skew for DQS and associated
DQ signals
tWPRES 0

0
Write postamble
tWPST
0.4
0.6
0.4
Write preamble
tWPRE
0.25

0.25
Address and control input hold time
tIH
375

475
Address and control input setup time
tIS
250

350
Read preamble
tRPRE
0.9
1.1
0.9
Read postamble
tRPST
0.4
0.6
0.4
0.6
Active to precharge command
tRAS
45
70000
45
70000
Active to auto-precharge delay
tRAP
tRCD min.

tRCD min.

15

tCK
0.6
tCK

tCK

ps
5

ps
4
1.1
tCK
t
Write preamble setup time
Preliminary Data Sheet E0467E11 (Ver. 1.1)
Notes
tCK
ns
ns
EBE52UC8AAFA
Frequency (Mbps)
-5C
-4A, -4C
533
400
Parameter
Symbol
min.
max.
min.
max.
Unit
Active bank A to active bank B
command period
tRRD
7.5

7.5

ns
Write recovery time
Notes
15

15

ns
tDAL
(tWR/tCK)+
(tRP/tCK)

(tWR/tCK)+
(tRP/tCK)

tCK
Internal write to read command delay
tWTR
7.5

10

ns
Internal read to precharge command
delay
tRTP
7.5

7.5

ns
Exit self refresh to a non-read command tXSNR
tRFC + 10

tRFC + 10

ns
Exit self refresh to a read command
tXSRD
200

200

tCK
tXP
2

2

tCK
tXARD
2

2

tCK
3
tXARDS 6 − AL

6 − AL

tCK
2, 3
tCKE
3

3

tCK
Output impedance test driver delay
tOIT
0
12
0
12
ns
Auto refresh to active/auto refresh
command time
tRFC
75

75

ns
Average periodic refresh interval
tREFI

7.8

7.8
µs
Minimum time clocks remains ON after
CKE asynchronously drops low
tDELAY tIS + tCK + tIH 
EO
tWR
Auto precharge write recovery +
precharge time
Exit precharge power down to any nonread command
Exit active power down to read
command
Exit active power down to read
command
(slow exit/low power mode)
CKE minimum pulse width (high and
low pulse width)
L
ns
For each of the terms above, if not already an integer, round to the next higher integer.
AL: Additive Latency.
MRS A12 bit defines which active power down exit timing to be applied.
The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the
VIH(AC) level for a rising signal and VIL(AC) for a falling signal applied to the device under test.
5. The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the
VIH(DC) level for a rising signal and VIL(DC) for a falling signal applied to the device under test.
od
Pr
Notes: 1.
2.
3.
4.
tIS + tCK + tIH 
1
CK
DQS
/CK
/DQS
tDS
tDH
tDS
tDH
tIS
tIS
tIH
VDDQ
VIH (AC)(min.)
VIH (DC)(min.)
VREF
VIL (DC)(max.)
VIL (AC)(max.)
VSS
uc
VDDQ
VIH (AC)(min.)
VIH (DC)(min.)
VREF
VIL (DC)(max.)
VIL (AC)(max.)
VSS
tIH
Input Waveform Timing 1 (tDS, tDH)
Input Waveform Timing 2 (tIS, tIH)
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
16
EBE52UC8AAFA
ODT AC Electrical Characteristics (DDR2 SDRAM Component Specification)
Parameter
Symbol
min.
max.
Unit
ODT turn-on delay
tAOND
2
2
tCK
ODT turn-on
tAON
tAC(min)
tAC(max) + 1000
ps
ODT turn-on (power down mode)
tAONPD
tAC(min) + 2000
2tCK + tAC(max) + 1000
ps
ODT turn-off delay
tAOFD
2.5
2.5
tCK
ODT turn-off
tAOF
tAC(min)
tAC(max) + 600
ps
ODT turn-off (power down mode)
tAOFPD
tAC(min) + 2000
2.5tCK + tAC(max) + 1000
ns
ODT to power down entry latency
tANPD
3
3
tCK
ODT power down exit latency
tAXPD
8
8
tCK
Notes
1
2
EO
Notes: 1. ODT turn on time min is when the device leaves high impedance and ODT resistance begins to turn on.
ODT turn on time max is when the ODT resistance is fully on. Both are measured from tAOND.
2. ODT turn off time min is when the device starts to turn off ODT resistance.
ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD.
AC Input Test Conditions
Symbol
Value
Unit
Notes
Input reference voltage
VREF
0.5 × VDDQ
V
1
Input signal maximum peak to peak swing
VSWING(max.)
1.0
V
1
Input signal maximum slew rate
SLEW
1.0
V/ns
2, 3
L
Parameter
Pr
Notes: 1. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the
device under test.
2. The input signal minimum slew rate is to be maintained over the range from VIL(DC) (max.) to VIH(AC)
(min.) for rising edges and the range from VIH(DC) (min.) to VIL(AC) (max.) for falling edges as shown in
the below figure.
3. AC timings are referenced with input waveforms switching from VIL(AC) to VIH(AC) on the positive
transitions and VIH(AC) to VIL(AC) on the negative transitions.
Start of rising edge input timing
Start of falling edge input timing
VDDQ
od
VIH (AC)(min.)
VIH (DC)(min.)
VSWING(max.)
VREF
VIL (DC)(max.)
VIL (AC)(max.)
VIH (DC)(min.) − VIL (AC)(max.)
Rising slew =
∆TF
VIH (AC) min. − VIL (DC)(max.)
AC Input Test Signal Wave forms
Measurement point
VTT
RT =25 Ω
Output Load
Preliminary Data Sheet E0467E11 (Ver. 1.1)
17
∆TR
t
DQ
uc
Falling slew =
VSS
∆TR
∆TF
EBE52UC8AAFA
Pin Functions
CK, /CK (input pin)
The CK and the /CK are the master clock inputs. All inputs except DMs, DQSs and DQs are referred to the cross
point of the CK rising edge and the VREF level. When a read operation, DQSs and DQs are referred to the cross
point of the CK and the /CK. When a write operation, DMs and DQs are referred to the cross point of the DQS and
the VREF level. DQSs for write operation are referred to the cross point of the CK and the /CK.
/CS (input pin)
When /CS is low, commands and data can be input. When /CS is high, all inputs are ignored. However, internal
operations (bank active, burst operations, etc.) are held.
EO
/RAS, /CAS, and /WE (input pins)
These pins define operating commands (read, write, etc.) depending on the combinations of their voltage levels.
See "Command operation".
A0 to A12 (input pins)
Row address (AX0 to AX12) is determined by the A0 to the A12 level at the cross point of the CK rising edge and the
VREF level in a bank active command cycle. Column address (AY0 to AY9) is loaded via the A0 to the A9 at the
cross point of the CK rising edge and the VREF level in a read or a write command cycle. This column address
becomes the starting address of a burst operation.
L
A10 (AP) (input pin)
A10 defines the precharge mode when a precharge command, a read command or a write command is issued. If
A10 = high when a precharge command is issued, all banks are precharged. If A10 = low when a precharge
command is issued, only the bank that is selected by BA1, BA0 is precharged. If A10 = high when read or write
command, auto-precharge function is enabled. While A10 = low, auto-precharge function is disabled.
[Bank Select Signal Table]
Bank 0
BA0
BA1
L
L
H
Bank 2
L
Bank 3
H
Remark: H: VIH. L: VIL.
L
od
Bank 1
Pr
BA0 and BA1 (input pins)
BA0, BA1 are bank select signals (BA). The memory array is divided into bank 0, bank 1, bank 2 and bank 3. (See
Bank Select Signal Table)
H
H
DQ (input and output pins)
Data are input to and output from these pins.
DQS and /DQS (input and output pin)
DQS and /DQS provide the read data strobes (as output) and the write data strobes (as input).
Preliminary Data Sheet E0467E11 (Ver. 1.1)
18
t
uc
CKE (input pin)
CKE controls power down and self-refresh. The power down and the self-refresh commands are entered when the
CKE is driven low and exited when it resumes to high.
The CKE level must be kept for 1 CK cycle at least, that is, if CKE changes at the cross point of the CK rising edge
and the VREF level with proper setup time tIS, at the next CK rising edge CKE level must be kept with proper hold
time tIH.
EBE52UC8AAFA
DM (input pins)
DM is the reference signal of the data input mask function. DMs are sampled at the cross point of DQS and /DQS.
VDD (power supply pins)
1.8V is applied. (VDD is for the internal circuit.)
VDDSPD (power supply pin)
1.8V is applied (For serial EEPROM).
VSS (power supply pin)
Ground is connected.
EO
Detailed Operation Part and Timing Waveforms
Refer to the EDE2504AASE, EDE2508AASE, EDE2516AASE datasheet (E0427E).
L
t
uc
od
Pr
Preliminary Data Sheet E0467E11 (Ver. 1.1)
19
EBE52UC8AAFA
Physical Outline
Unit: mm
4.00 max
0.5 min
4.00 min
(DATUM -A-)
Component area
(Front)
1
120
A
63.00
1.27 ± 0.10
55.00
L
240
FULL R
3.00
2.50 ± 0.20
Pr
Detail A
Detail B
(DATUM -A-)
1.00
4.00
0.20 ± 0.15
4.00
Component area
(Back)
30.00
121
17.80
133.35
10.00
EO
B
2.50
FULL R
od
0.80 ± 0.05
3.80
5.00
1.50 ± 0.10
uc
ECA-TS2-0093-01
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
20
EBE52UC8AAFA
CAUTION FOR HANDLING MEMORY MODULES
When handling or inserting memory modules, be sure not to touch any components on the modules, such as
the memory ICs, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on
these components to prevent damaging them.
In particular, do not push module cover or drop the modules in order to protect from mechanical defects,
which would be electrical defects.
When re-packing memory modules, be sure the modules are not touching each other.
Modules in contact with other modules may cause excessive mechanical stress, which may damage the
modules.
MDE0202
EO
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR MOS DEVICES
L
Exposing the MOS devices to a strong electric field can cause destruction of the gate
oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it, when once
it has occurred. Environmental control must be adequate. When it is dry, humidifier
should be used. It is recommended to avoid using insulators that easily build static
electricity. MOS devices must be stored and transported in an anti-static container,
static shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded using
wrist strap. MOS devices must not be touched with bare hands. Similar precautions
need to be taken for PW boards with semiconductor MOS devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES
3
od
Pr
No connection for CMOS devices input pins can be a cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input level may be
generated due to noise, etc., hence causing malfunction. CMOS devices behave
differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected
to VDD or GND with a resistor, if it is considered to have a possibility of being an output
pin. The unused pins must be handled in accordance with the related specifications.
STATUS BEFORE INITIALIZATION OF MOS DEVICES
uc
Power-on does not necessarily define initial status of MOS devices. Production process
of MOS does not define the initial operation status of the device. Immediately after the
power source is turned ON, the MOS devices with reset function have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or
contents of registers. MOS devices are not initialized until the reset signal is received.
Reset operation must be executed immediately after power-on for MOS devices having
reset function.
CME0107
t
Preliminary Data Sheet E0467E11 (Ver. 1.1)
21
EBE52UC8AAFA
µBGA is a registered trademark of Tessera, Inc.
All other trademarks are the intellectual property of their respective owners.
The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of Elpida Memory, Inc.
Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights
(including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or
third parties by or arising from the use of the products or information listed in this document. No license,
express, implied or otherwise, is granted under any patents, copyrights or other intellectual property
rights of Elpida Memory, Inc. or others.
EO
Descriptions of circuits, software and other related information in this document are provided for
illustrative purposes in semiconductor product operation and application examples. The incorporation of
these circuits, software and information in the design of the customer's equipment shall be done under
the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses
incurred by customers or third parties arising from the use of these circuits, software and information.
[Product applications]
Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability.
However, users are instructed to contact Elpida Memory's sales office before using the product in
aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment,
medical equipment for life support, or other such application in which especially high quality and
reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury.
L
[Product usage]
Design your application so that the product is used within the ranges and conditions guaranteed by
Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation
characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no
responsibility for failure or damage when the product is used beyond the guaranteed ranges and
conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure
rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so
that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other
consequential damage due to the operation of the Elpida Memory, Inc. product.
Pr
[Usage environment]
This product is not designed to be resistant to electromagnetic waves or radiation. This product must be
used in a non-condensing environment.
M01E0107
t
uc
od
If you export the products or technology described in this document that are controlled by the Foreign
Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance
with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by
U.S. export control regulations, or another country's export control laws or regulations, you must follow
the necessary procedures in accordance with such laws or regulations.
If these products/technology are sold, leased, or transferred to a third party, or a third party is granted
license to use these products, that third party must be made aware that they are responsible for
compliance with the relevant laws and regulations.
Preliminary Data Sheet E0467E11 (Ver. 1.1)
22
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