ETC EDS1232AABB-75

DATA SHEET
128M bits SDRAM
EDS1232AABB, EDS1232AATA (4M words × 32 bits)
Description
Features
The EDS1232AA is a 128M bits SDRAM organized as
1,048,576 words × 32 bits × 4 banks. All inputs and
outputs are synchronized with the positive edge of the
clock.
They are packaged in 90-ball FBGA, 86-pin plastic
TSOP (II).
•
•
•
•
•
3.3V power supply
Clock frequency: 166MHz (max.)
Single pulsed /RAS
×32 organization
4 banks can operate simultaneously and
independently
• Burst read/write operation and burst read/single write
operation capability
• Programmable burst length (BL): 1, 2, 4, 8 and full
page
• 2 variations of burst sequence
 Sequential (BL = 1, 2, 4, 8)
 Interleave (BL = 1, 2, 4, 8)
• Programmable /CAS latency (CL): 2, 3
• Byte control by DQM
• Refresh cycles: 4096 refresh cycles/64ms
• 2 variations of refresh
 Auto refresh
 Self refresh
Document No. E0205E30 (Ver. 3.0)
Date Published April 2002 (K) Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2001-2002
EDS1232AABB, EDS1232AATA
Ordering Information
Part number
EDS1232AABB-60
Supply
voltage
Organization
(words × bits) Internal Banks
Clock frequency
MHz (max.)
/CAS latency
3.3V
4M × 32
4
3.3V
4M × 32
4
166
133
133
100
166
133
133
100
166
133
133
100
166
133
133
100
3
2
3
2
3
2
3
2
3
2
3
2
3
2
3
2
EDS1232AABB-75
EDS1232AABB-60L
EDS1232AABB-75L
EDS1232AATA-60
EDS1232AATA-75
EDS1232AATA-60L
EDS1232AATA-75L
Package
90-ball FBGA
86-pin plastic
TSOP (II)
Part Number
E D S 12 32 A A TA - 60 L
Elpida Memory
Material Type
D: Monolithic Device
Function
S: SDRAM
Density & Bank
12: 128M/4 Banks
Bit Organization
32: x32
Interface
A: 3.3V, LVTTL
Mask Revision
Package
TA: TSOP (II)
BB: FBGA
Speed
60: 166MHz/CL3
133MHz/CL2
75: 133MHz/CL3
100MHz/CL2
Power Consumption
Blank: Normal
L: Low Power
Data Sheet E0205E30 (Ver. 3.0)
2
EDS1232AABB, EDS1232AATA
Pin Configurations
/xxx indicate active low signal.
90-ball FBGA
1
2
3
4
5
6
7
8
86-pin TSOP
9
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
NC
VDD
DQM0
/WE
/CAS
/RAS
/CS
A11
BA0
BA1
A10(AP)
A0
A1
A2
DQM2
VDD
NC
DQ16
VSSQ
DQ17
DQ18
VDDQ
DQ19
DQ20
VSSQ
DQ21
DQ22
VDDQ
DQ23
VDD
A
DQ26 DQ24 VSS
VDD DQ23 DQ21
DQ28 VDDQ VSSQ
VDDQ VSSQ DQ19
VSSQ DQ27 DQ25
DQ22 DQ20 VDDQ
VSSQ DQ29 DQ30
DQ17 DQ18 VDDQ
B
C
D
E
VDDQ DQ31
NC
NC
DQ16 VSSQ
VSS DQM3
A3
A2
DQM2 VDD
F
G
A4
A5
A6
A10
A0
A1
A7
A8
NC
NC
BA1
A11
CLK
CKE
A9
BA0
/CS
/RAS
DQM1
NC
NC
/CAS
/WE DQM0
VSS
VDD
DQ7 VSSQ
VSSQ DQ10 DQ9
DQ6
DQ5 VDDQ
VSSQ DQ12 DQ14
DQ1
DQ3 VDDQ
H
J
K
L
VDDQ DQ8
M
N
P
DQ11 VDDQ VSSQ
VDDQ VSSQ DQ4
R
DQ13 DQ15 VSS
VDD
DQ0
DQ2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
(Top view)
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
(Top view)
Pin name
Function
A0 to A11
Address inputs
BA0, BA1
Bank select
DQ0 to DQ31
Data input/output
CLK
Clock input
CKE
Clock enable
/CS
Chip select
/RAS
Row address strobe
/CAS
Column address strobe
/WE
Write enable
DQM0 to DQM3
DQ mask enable
VDD
Supply voltage
VSS
Ground
VDDQ
Supply voltage for DQ
VSSQ
Ground for DQ
NC
No connection
Data Sheet E0205E30 (Ver. 3.0)
3
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
NC
VSS
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
VSS
NC
DQ31
VDDQ
DQ30
DQ29
VSSQ
DQ28
DQ27
VDDQ
DQ26
DQ25
VSSQ
DQ24
VSS
EDS1232AABB, EDS1232AATA
CONTENTS
Description .................................................................................................................................................... 1
Features ........................................................................................................................................................ 1
Ordering Information ..................................................................................................................................... 2
Part Number .................................................................................................................................................. 2
Pin Configurations ......................................................................................................................................... 3
Electrical Specifications................................................................................................................................. 5
Block Diagram ............................................................................................................................................. 10
Pin Function ................................................................................................................................................ 11
Command Operation ................................................................................................................................... 12
Truth Table .................................................................................................................................................. 16
Simplified State Diagram............................................................................................................................. 22
Programming Mode Registers .................................................................................................................... 23
Mode Register ............................................................................................................................................. 24
Power-up sequence .................................................................................................................................... 27
Operation of the SDRAM ............................................................................................................................ 28
Timing Waveforms ...................................................................................................................................... 44
Package Drawing ........................................................................................................................................ 51
Recommended Soldering Conditions.......................................................................................................... 53
Revision History .......................................................................................................................................... 56
Data Sheet E0205E30 (Ver. 3.0)
4
EDS1232AABB, EDS1232AATA
Electrical Specifications
• All voltages are referenced to VSS (GND).
• After power up, wait more than 100 µs and then, execute Power on sequence and CBR (auto) Refresh before
proper device operation is achieved.
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Voltage on any pin relative to VSS
VT
–0.5 to +4.6
V
Supply voltage relative to VSS
VDD, VDDQ
–0.5 to +4.6
V
Short circuit output current
IOS
50
mA
Power dissipation
PD
1.0
W
Operating ambient temperature
TA
0 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
Note
Caution
Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended Operating Conditions (TA = 0 to +70°°C)
Parameter
Symbol
min.
typ.
max.
Unit
Supply voltage
VDD, VDDQ
3.0
3.3
3.6
V
VSS
0
0
0
V
Input high voltage
VIH
2.0

VDD + 0.3*
V
Input low voltage
VIL
–0.3*2

0.8
V
Notes: 1. VIH (max.) = VDDQ + 1.5V (pulse width ≤ 5ns).
2. VIL (min.) = –1.5V (pulse width ≤ 5ns).
Data Sheet E0205E30 (Ver. 3.0)
5
1
Notes
EDS1232AABB, EDS1232AATA
DC Characteristics (TA = 0 to +70°°C, VDD, VDDQ = 3.3V±
±0.3V, VSS, VSSQ = 0V)
Parameter
/CAS latency
Symbol
Operating current
(CL = 2)
max.
Unit
IDD1
135
mA
(CL = 3)
IDD1
135
mA
Standby current in power down
IDD2P
1
mA
Standby current in power down
(input signal stable)
IDD2PS
1
mA
Standby current in non power
down
Standby current in non power
down
(input signal stable)
Active standby current in power
down
Active standby current in power
down (input signal stable)
Grade
Test condition
Burst length = 1
tRC ≥ tRC (min.)
IO = 0mA
One bank active
Notes
1
CKE ≤ VIL (max.) tCK = 15ns
CKE ≤ VIL (max.) tCK = ∞
IDD2N
20
mA
CKE ≥ VIH (min.) tCK = 15ns
CS ≥ VIH (min.)
Input signals are changed one
time during 30ns
IDD2NS
8
mA
CKE ≥ VIH (min.) tCK = ∞
IDD3P
5
mA
CKE ≤ VIL (max.) tCK = 15ns
IDD3PS
4
mA
CKE ≤ VIL (max.), tCK = ∞
Active standby current in non
power down
IDD3N
45
mA
CKE ≥ VIH (min.), tCK = 15 ns,
/CS ≥ VIH (min.),
Input signals are changed one
time during 30ns.
Active standby current in non
power down
(input signal stable)
IDD3NS
28
mA
CKE ≥ VIH (min.), tCK = ∞,
Burst operating current
IDD4
200
180
mA
tCK ≥ tCK (min.),
IO = 0mA, All banks active
2
Refresh current
IDD5
280
mA
tRC ≥ tRC (min.)
3
2.0
mA
VIH ≥ VDD − 0.2V,
VIL ≤ GND + 0.2V
0.6
mA
Self refresh current
IDD6
Self refresh current
(L-version)
IDD6
-60
-75
-xxL
Notes: 1. IDD1 depends on output loading and cycle rates. Specified values are obtained with the output open. In
addition to this, IDD1 is measured condition that addresses are changed only one time during tCK (min.).
2. IDD4 depends on output loading and cycle rates. Specified values are obtained with the output open.
In addition to this, IDD4 is measured condition that addresses are changed only one time during tCK
(min.).
3. IDD5 is measured on condition that addresses are changed only one time during tCK (min.).
DC Characteristics 2 (TA = 0 to +70°°C, VDD, VDDQ = 3.3V±
±0.3V, VSS, VSSQ = 0V)
Parameter
Symbol
min.
max.
Unit
Test condition
Input leakage current
ILI
–1.0
1.0
µA
0 = VIN = VDDQ, VDDQ = VDD,
All other pins not under test = 0V
Output leakage current
ILO
–1.5
1.5
µA
0 = VIN = VDDQ DOUT is disabled
Output high voltage
VOH
2.4
—
V
IOH = –2 mA
Output low voltage
VOL
—
0.4
V
IOL = 2 mA
Data Sheet E0205E30 (Ver. 3.0)
6
Notes
EDS1232AABB, EDS1232AATA
Pin Capacitance (TA = 25°C, f = 1MHz)
90-ball FBGA
86-pin TSOP (II)
Parameter
Symbol Pins
min.
Typ
max.
min.
Typ
max.
Unit
Input capacitance
CI1
Address
1.5
—
3.0
2.5
—
4.0
pF
CI2
CLK, CKE, /CS, /RAS,
1.5
/CAS, /WE, DQM
—
3.0
2.5
—
4.0
pF
CI/O
DQ
—
5.5
4.0
—
6.5
pF
Data input/output
capacitance
3.0
Notes
AC Characteristics (TA = 0 to +70°°C, VDD, VDDQ = 3.3V±
±0.3V, VSS, VSSQ = 0V)
-60
-75
Parameter
Symbol
min.
max.
min.
max.
Unit
System clock cycle time
(CL = 2)
tCK
7.5
—
10
—
ns
(CL = 3)
tCK
6
—
7.5
—
ns
CLK high pulse width
tCH
2.5
—
2.5
—
ns
CLK low pulse width
tCL
2.5
—
2.5
—
ns
Access time from CLK
tAC
—
5.4
—
5.4
ns
Data-out hold time
tOH
2
—
2
—
ns
CLK to Data-out low impedance
tLZ
0
—
0
—
ns
CLK to Data-out high impedance
tHZ
2
5.4
2
5.4
ns
Input setup time
tSI
1.5
—
1.5
—
ns
Input hold time
tHI
0.8
—
0.8
—
ns
CKE setup time (Power down exit)
tCKSP
1.5
—
1.5
—
ns
ACT to REF/ACT command period
(operation)
tRC
60

67.5

ns
(refresh)
tRC
60

67.5

ns
Active to Precharge command period
tRAS
42
120000
45
120000
ns
Active command to column command
(same bank)
tRCD
15

20

ns
Precharge to active command period
tRP
15

20

ns
Write recovery or data-in to precharge
lead time
tDPL
12

15

ns
Last data into active latency
tDAL
2CLK +
15ns

2CLK +
20ns

Active (a) to Active (b) command period
tRRD
12

15

ns
Mode register set cycle time
tRSC
2

2

CLK
Transition time (rise and fall)
tT
0.5
30
0.5
30
ns
Refresh period
(4096 refresh cycles)
tREF
—
64
—
64
ms
Data Sheet E0205E30 (Ver. 3.0)
7
Notes
EDS1232AABB, EDS1232AATA
Test Conditions
• AC high level input voltage / low level input voltage: 2.4V / 0.4V
• Input timing measurement reference level: 1.4V
• Transition time (Input rise and fall time): 1ns
• Output timing measurement reference level: 1.4V
• Termination voltage (Vtt): 1.4V
tCK
tCH
CLK
tCL
2.4V
1.4V
0.4V
tSETUP tHOLD
Input
2.4V
1.4V
0.4V
tAC
tOH
Output
Vtt
Z = 50 Ω
50 Ω
Output
30pF
Input Waveforms and Output Load
Data Sheet E0205E30 (Ver. 3.0)
8
EDS1232AABB, EDS1232AATA
Relationship Between Frequency and Minimum Latency
Parameter
-60
Frequency (MHz)
-75
166
133
133
100
Symbol
6
7.5
7.5
10
Notes
lRCD
3
2
3
2
1
lRC
10
8
9
7
1
lRAS
7
6
6
5
1
lRP
3
2
3
2
1
lDPL
2
2
2
2
1
lRRD
2
2
2
2
1
Self refresh exit time
lSREX
1
1
1
1
2
Last data in to active command
(Auto precharge, same bank)
lDAL
5
4
5
4
= [lDPL + lRP]
Self refresh exit to command input
lSEC
10
8
9
7
= [lRC]
3
Precharge command to high impedance
(CL = 2)
lHZP

2

2
(CL = 3)
lHZP
3
3
3
3
lAPR
1
1
1
1
lEP

–1

–1
(CL = 3)
lEP
–2
–2
–2
–2
Column command to column command
lCCD
1
1
1
1
Write command to data in latency
lWCD
0
0
0
0
DQM to data in
lDID
0
0
0
0
DQM to data out
lDOD
2
2
2
2
tCK (ns)
Active command to column command
(same bank)
Active command to active command
(same bank)
Active command to precharge command
(same bank)
Precharge command to active command
(same bank)
Write recovery or data-in to precharge
command (same bank)
Active command to active command
(different bank)
Last data out to active command
(auto precharge) (same bank)
Last data out to precharge
(early precharge)
(CL = 2)
CKE to CLK disable
lCLE
1
1
1
1
Register set to active command
lMRD
2
2
2
2
/CS to command disable
lCDD
0
0
0
0
Power down exit to command input
lPEC
1
1
1
1
Notes: 1. IRCD to IRRD are recommended value.
2. Be valid [DESL] or [NOP] at next command of self refresh exit.
3. Except [DESL] and [NOP]
Data Sheet E0205E30 (Ver. 3.0)
9
EDS1232AABB, EDS1232AATA
Block Diagram
CLK
CKE
Clock
Generator
Bank 3
Bank 2
Bank 1
Mode
Register
Row
Address
Buffer
&
Refresh
Counter
Row Decoder
Address
Bank 0
Data Control Circuit
Data Sheet E0205E30 (Ver. 3.0)
10
Input & Output
Buffer
/WE
DQM
Column Decoder &
Latch Circuit
Column
Address
Buffer
&
Burst
Counter
Latch Circuit
/CAS
Control Logic
/RAS
Command Decoder
Sense Amplifier
/CS
DQ
EDS1232AABB, EDS1232AATA
Pin Function
CLK (input pin)
CLK is the master clock input. Other inputs signals are referenced to the CLK rising edge.
CKE (input pins)
CKE determine validity of the next CLK (clock). If CKE is high, the next CLK rising edge is valid; otherwise it is
invalid. If the CLK rising edge is invalid, the internal clock is not issued and the Synchronous DRAM suspends
operation.
When the Synchronous DRAM is not in burst mode and CKE is negated, the device enters power down mode.
During power down mode, CKE must remain low.
/CS (input pins)
/CS low starts the command input cycle. When /CS is high, commands are ignored but operations continue.
/RAS, /CAS, and /WE (input pins)
/RAS, /CAS and /WE have the same symbols on conventional DRAM but different functions. For details, refer to the
command table.
A0 to A11 (input pins)
Row Address is determined by A0 to A11 at the CLK (clock) rising edge in the active command cycle.
Column Address is determined by A0 to 7 at the CLK rising edge in the read or write command cycle.
A10 defines the precharge mode. When A10 is high in the precharge command cycle, all banks are precharged;
when A10 is low, only the bank selected by BA0 and BA1 is precharged.
When A10 is high in read or write command cycle, the precharge starts automatically after the burst access.
BA0 and BA1 (input pin)
BA0 and BA1 are bank select signal. (See Bank Select Signal Table)
[Bank Select Signal Table]
BA0
BA1
Bank 0
L
L
Bank 1
H
L
Bank 2
L
H
Bank 3
H
H
Remark: H: VIH. L: VIL. ×: VIH or VIL
DQM (input pins)
DQM controls I/O buffers. DQM0 controls DQ0 to 7, DQM1 controls DQ8 to DQ15, DQM2 controls DQ16 to DQ23,
DQM3 controls DQ24 to DQ31. In read mode, DQM controls the output buffers like a conventional /OE pin. DQM
high and DQM low turn the output buffers off and on, respectively. The DQM latency for the read is two clocks. In
write mode, DQM controls the word mask. Input data is written to the memory cell if DQM is low but not if DQM is
high. The DQM latency for the write is zero.
DQ0 to DQ31 (input/output pins)
DQ pins have the same function as I/O pins on a conventional DRAM.
VDD, VSS, VDDQ, VSSQ (Power supply)
VDD and VSS are power supply pins for internal circuits. VDDQ and VSSQ are power supply pins for the output
buffers.
Data Sheet E0205E30 (Ver. 3.0)
11
EDS1232AABB, EDS1232AATA
Command Operation
Mode register set command (/CS, /RAS, /CAS, /WE)
The Synchronous DRAM has a mode register that defines how the device operates. In this command, A0 through
A11 are the data input pins. After power on, the mode register set command must be executed to initialize the
device. The mode register can be set only when all banks are in idle state. During 2CLK (tRSC) following this
command, the Synchronous DRAM cannot accept any other commands.
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Add
Mode Register Set Command
Activate command (/CS, /RAS = Low, /CAS, /WE = High)
The Synchronous DRAM has four banks, each with 8,192 rows. This command activates the bank selected by BA0
and BA1 and a row address selected by A0 through A11. This command corresponds to a conventional DRAM's
/RAS falling.
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Row
Add
Row
Row Address Strobe and Bank Activate Command
Data Sheet E0205E30 (Ver. 3.0)
12
EDS1232AABB, EDS1232AATA
Precharge command (/CS, /RAS, /WE = Low, /CAS = High)
This command begins precharge operation of the bank selected by BA0 and BA1. When A10 is High, all banks are
precharged, regardless of BA0 and BA1. When A10 is Low, only the bank selected by BA0 and BA1 is precharged.
After this command, the Synchronous DRAM can’t accept the activate command to the precharging bank during tRP
(precharge to activate command period). This command corresponds to a conventional DRAM’s /RAS rising.
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
(Precharge select)
Add
Precharge Command
Write command (/CS, /CAS, /WE = Low, /RAS = High)
If the mode register is in the burst write mode, this command sets the burst start address given by the column
address to begin the burst write operation. The first write data in burst mode can input with this command with
subsequent data on following clocks.
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Add
Col.
Column Address and Write Command
Data Sheet E0205E30 (Ver. 3.0)
13
EDS1232AABB, EDS1232AATA
Read command (/CS, /CAS = Low, /RAS, /WE = High)
Read data is available after /CAS latency requirements have been met. This command sets the burst start address
given by the column address.
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Add
Col.
Column Address and and Read Command
CBR (auto) refresh command (/CS, /RAS, /CAS = Low, /WE, CKE = High)
This command is a request to begin the CBR (auto) refresh operation. The refresh address is generated internally.
Before executing CBR (auto) refresh, all banks must be precharged. After this cycle, all banks will be in the idle
(precharged) state and ready for a row activate command. During tRC period (from refresh command to refresh or
activate command), the Synchronous DRAM cannot accept any other command
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Add
CBR (auto) Refresh Command
Data Sheet E0205E30 (Ver. 3.0)
14
EDS1232AABB, EDS1232AATA
Self refresh entry command (/CS, /RAS, /CAS, CKE = Low, /WE = High)
After the command execution, self refresh operation continues while CKE remains low. When CKE goes high, the
Synchronous DRAM exits the self refresh mode. During self refresh mode, refresh interval and refresh operation are
performed internally, so there is no need for external control. Before executing self refresh, all banks must be
precharged.
CLK
CKE
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Add
Self Refresh Entry Command
Burst stop command (/CS = /WE = Low, /RAS, /CAS = High)
This command can stop the current burst operation.
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Add
Burst Stop Command in Full Page Mode
No operation (/CS = Low, /RAS, /CAS, /WE = High)
This command is not an execution command. No operations begin or terminate by this command.
CLK
CKE
H
/CS
/RAS
/CAS
/WE
BA0, BA1
(Bank select)
A10
Add
No Operation
Data Sheet E0205E30 (Ver. 3.0)
15
EDS1232AABB, EDS1232AATA
Truth Table
Command Truth Table
CKE
BA0,
A9 - A0,
Function
Symbol
n–1
n
/CS
/RAS
/CAS
/WE
BA1
A10
A11
Device deselect
DESL
H
×
H
×
×
×
×
×
×
No operation
NOP
H
×
L
H
H
H
×
×
×
Burst stop
BST
H
×
L
H
H
L
×
×
×
Read
READ
H
×
L
H
L
H
V
L
V
Read with auto precharge
READA
H
×
L
H
L
H
V
H
V
Write
WRIT
H
×
L
H
L
L
V
L
V
Write with auto precharge
WRITA
H
×
L
H
L
L
V
H
V
Bank activate
ACT
H
×
L
L
H
H
V
V
V
Precharge select bank
PRE
H
×
L
L
H
L
V
L
×
Precharge all banks
PALL
H
×
L
L
H
L
×
H
×
Mode register set
MRS
H
×
L
L
L
L
L
L
V
Remark: H: VIH. L: VIL. ×: VIH or VIL, V = Valid data
DQM Truth Table
CKE
DQM
Symbol
n–1
n
0
1
2
3
Data write / output enable
ENB
H
×
L
L
L
L
Data mask / output disable
MASK
H
×
H
H
H
H
DQ0 to DQ7 write enable/output enable
ENB0
H
×
L
×
×
×
DQ8 to DQ15 write enable/output enable
ENB1
H
×
×
L
×
×
DQ16 to DQ23 write enable/output enable
ENB2
H
×
×
×
L
×
DQ24 to DQ31 write enable/output enable
ENB3
H
×
×
×
×
L
DQ0 to DQ7 write inhibit/output disable
MASK0
H
×
H
×
×
×
DQ8 to DQ15 write inhibit/output disable
MASK 1
H
×
×
H
×
×
DQ16 to DQ23 write inhibit/output disable
MASK 2
H
×
×
×
H
×
DQ24 to DQ31 write inhibit/output disable
MASK 3
H
×
×
×
×
H
Function
Remark: H: VIH. L: VIL. ×: VIH or VIL
Data Sheet E0205E30 (Ver. 3.0)
16
EDS1232AABB, EDS1232AATA
CKE Truth Table
CKE
Current state
Function
n–1
n
/CS
/RAS
/CAS
/WE
Address
Activating
Clock suspend mode entry
Symbol
H
L
×
×
×
×
×
Any
Clock suspend mode
L
L
×
×
×
×
×
Clock suspend
Clock suspend mode exit
L
H
×
×
×
×
×
Idle
CBR (auto) refresh command
REF
H
H
L
L
L
H
×
Idle
Self refresh entry
SELF
H
L
L
L
L
H
×
Self refresh
Self refresh exit
L
H
L
H
H
H
×
L
H
H
×
×
×
×
Idle
Power down entry
H
L
L
H
H
H
×
H
L
H
×
×
×
×
Power down
Power down exit
L
H
H
×
×
×
×
L
H
L
H
H
H
×
Remark: H: VIH. L: VIL. ×: VIH or VIL
Data Sheet E0205E30 (Ver. 3.0)
17
EDS1232AABB, EDS1232AATA
1
Function Truth Table*
Current state
Idle
Row active
Read
Write
/CS
/RAS /CAS /WE Address
Command
Operation
Notes
H
×
×
×
×
DESL
Nop or power down
2
L
H
H
×
×
NOP or BST
Nop or power down
2
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL
3
L
H
L
L
BA, CA, A10
WRIT/ WRITA
ILLEGAL
3
L
L
H
H
BA, RA
ACT
Row activating
L
L
H
L
BA, A10
PRE/PALL
Nop
L
L
L
H
×
REF/SELF
CBR (auto) refresh or self refresh
L
L
L
L
OPCODE
MRS
Mode register accessing
4
H
×
×
×
×
DESL
Nop
L
H
H
×
×
NOP or BST
Nop
L
H
L
H
BA, CA, A10
READ/READA
Begin read: Determine AP
5
L
H
L
L
BA, CA, A10
WRIT/ WRITA
Begin write: Determine AP
5
L
L
H
H
BA, RA
ACT
ILLEGAL
3
L
L
H
L
BA, A10
PRE/PALL
Precharge
6
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Continue burst to end → Row active
L
H
H
H
×
NOP
Continue burst to end → Row active
L
H
H
L
×
BST
Burst stop → Row active
L
H
L
H
BA, CA, A10
READ/READA
Terminate burst, new read: Determine AP
7
L
H
L
L
BA, CA, A10
WRIT/WRITA
Terminate burst, begin write: Determine AP 7, 8
L
L
H
H
BA, RA
ACT
ILLEGAL
L
L
H
L
BA, A10
PRE/PALL
Terminate burst, Precharging
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Continue burst to end → Write recovering
L
H
H
H
×
NOP
Continue burst to end → Write recovering
L
H
H
L
×
BST
Burst stop → Row active
L
H
L
H
BA, CA, A10
READ/READA
Terminate burst, start read : Determine AP
7, 8
L
H
L
L
BA, CA, A10
WRIT/WRITA
Terminate burst, new write : Determine AP
7
L
L
H
H
BA, RA
ACT
ILLEGAL
3
L
L
H
L
BA, A10
PRE/PALL
Terminate burst, Precharging
9
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
Data Sheet E0205E30 (Ver. 3.0)
18
3
EDS1232AABB, EDS1232AATA
Current state
/CS
/RAS /CAS /WE Address
Command
Operation
Read with auto
H
×
×
×
×
DESL
Continue burst to end → Precharging
precharge
L
H
H
H
×
NOP
Continue burst to end → Precharging
Write with auto
precharge
Precharging
Row activating
Notes
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL
3
L
H
L
L
BA, CA, A10
WRIT/ WRITA
ILLEGAL
3
L
L
H
H
BA, RA
ACT
ILLEGAL
3
L
L
H
L
BA, A10
PRE/PALL
ILLEGAL
3
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Continue burst to end → Write
recovering with auto precharge
L
H
H
H
×
NOP
Continue burst to end → Write
recovering with auto precharge
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL
3
L
H
L
L
BA, CA, A10
WRIT/ WRITA
ILLEGAL
3
L
L
H
H
BA, RA
ACT
ILLEGAL
3
L
L
H
L
BA, A10
PRE/PALL
ILLEGAL
3
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Nop → Enter idle after tRP
L
H
H
H
×
NOP
Nop → Enter idle after tRP
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL
3
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL
3
L
L
H
H
BA, RA
ACT
ILLEGAL
3
L
L
H
L
BA, A10
PRE/PALL
Nop → Enter idle after tRP
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Nop → Enter bank active after tRCD
L
H
H
H
×
NOP
Nop → Enter bank active after tRCD
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL
3
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL
3
L
L
H
H
BA, RA
ACT
ILLEGAL
3, 10
L
L
H
L
BA, A10
PRE/PALL
ILLEGAL
3
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
Data Sheet E0205E30 (Ver. 3.0)
19
EDS1232AABB, EDS1232AATA
Current state
/CS
/RAS /CAS /WE Address
Command
Operation
Write recovering
H
×
×
×
×
DESL
Nop → Enter row active after tDPL
L
H
H
H
×
NOP
Nop → Enter row active after tDPL
Notes
L
H
H
L
×
BST
Nop → Enter row active after tDPL
L
H
L
H
BA, CA, A10
READ/READA
Start read, Determine AP
L
H
L
L
BA, CA, A10
WRIT/ WRITA
New write, Determine AP
L
L
H
H
BA, RA
ACT
ILLEGAL
3
L
L
H
L
BA, A10
PRE/PALL
ILLEGAL
3
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
Write recovering
H
×
×
×
×
DESL
Nop → Enter precharge after tDPL
with auto
L
H
H
H
×
NOP
Nop → Enter precharge after tDPL
precharge
L
H
H
L
×
BST
Nop → Enter row active after tDPL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL
3, 8
L
L
H
H
BA, RA
ACT
ILLEGAL
3
L
L
H
L
BA, A10
PRE/PALL
ILLEGAL
3
L
L
L
H
×
REF/SELF
ILLEGAL
L
L
L
L
OPCODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Nop → Enter idle after tRC
L
H
H
H
×
NOP/BST
Nop → Enter idle after tRC
L
H
H
L
×
READ/READA
ILLEGAL
L
H
L
H
×
ACT/PRE/PALL ILLEGAL
Refresh
L
H
L
L
×
REF/SELF/MRS ILLEGAL
Mode register
H
×
×
×
×
DESL
Nop → Enter idle after tRSC
accessing
L
H
H
H
×
NOP
Nop → Enter idle after tRSC
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
×
READ/READA
ILLEGAL
×
ACT/PRE/PLL/
ILLEGAL
REF/SELF/MRS
L
L
L
L
8
Remark: H: VIH. L: VIL. ×: VIH or VIL, V = Valid data
BA: Bank Address, CA: Column Address, RA: Row Address
Notes: 1. All entries assume that CKE was active (High level) during the preceding clock cycle.
2. If all banks are idle, and CKE is inactive (Low level), the Synchronous DRAM will enter Power down
mode.
3. Illegal to bank in specified states; Function may be legal in the bank indicated by Bank Address (BA),
depending on the state of that bank.
4. If all banks are idle, and CKE is inactive (Low level), the Synchronous DRAM will enter Self refresh mode.
All input buffers except CKE will be disabled.
5. Illegal if tRCD is not satisfied.
6. Illegal if tRAS is not satisfied.
7. Must satisfy burst interrupt condition.
8. Must satisfy bus contention, bus trun around, and/or write recovery requirements.
9. Must mask preceding data which don’t satisfy tDPL.
10. Illegal if tRRD is not satisfied.
Data Sheet E0205E30 (Ver. 3.0)
20
EDS1232AABB, EDS1232AATA
Command Truth Table for CKE
CKE
Current State
Self refresh
Self refresh recovery
n–1 n
/CS
/RAS /CAS /WE Address
Operation
H
×
×
×
×
×
×
INVALID, CLK (n – 1) would exit self refresh
L
H
H
×
×
×
×
Self refresh recovery
L
H
L
H
H
×
×
Self refresh recovery
L
H
L
H
L
×
×
ILLEGAL
L
H
L
L
×
×
×
ILLEGAL
L
L
×
×
×
×
×
Continue self refresh
H
H
H
×
×
×
×
Idle after tRC
H
H
L
H
H
×
×
Idle after tRC
H
H
L
H
L
×
×
ILLEGAL
H
H
L
L
×
×
×
ILLEGAL
H
L
H
×
×
×
×
ILLEGAL
H
L
L
H
H
×
×
ILLEGAL
H
L
L
H
L
×
×
ILLEGAL
×
H
L
L
L
×
×
H
×
×
×
×
×
L
H
H
×
×
×
L
H
L
H
H
H
×
EXIT power down
L
L
×
×
×
×
×
Continue power down mode
H
H
H
×
×
×
Refer to operations in Function Truth Table
H
H
L
H
×
×
Refer to operations in Function Truth Table
H
H
L
L
H
×
Refer to operations in Function Truth Table
H
H
L
L
L
H
×
H
H
L
L
L
L
OPCODE Refer to operations in Function Truth Table
H
L
H
×
×
×
Begin power down next cycle
H
L
L
H
×
×
Refer to operations in Function Truth Table
H
L
L
L
H
×
Refer to operations in Function Truth Table
H
L
L
L
L
H
×
H
L
L
L
L
L
OPCODE Refer to operations in Function Truth Table
L
H
×
×
×
×
×
L
L
×
×
×
×
×
Power down
H
×
×
×
×
×
×
Refer to operations in Function Truth Table
L
×
×
×
×
×
×
Clock suspend
Any state other than
H
H
×
×
×
×
listed above
H
L
×
×
×
×
×
Begin clock suspend next cycle
L
H
×
×
×
×
×
Exit clock suspend next cycle
L
L
×
×
×
×
×
Maintain clock suspend
Power down
All banks idle
Row active
Notes
ILLEGAL
INVALID, CLK (n – 1) would exit power down
×
EXIT power down
CBR (auto) Refresh
Self refresh
1
Exit power down next cycle
1
1
Refer to operations in Function Truth Table
2
Remark: H = VIH, L = VIL, × = VIH or VIL
Notes: 1. Self refresh can be entered only from the all banks idle state. Power down can be entered only from all
banks idle or row active state.
2. Must be legal command as defined in Function Truth Table.
Data Sheet E0205E30 (Ver. 3.0)
21
EDS1232AABB, EDS1232AATA
Simplified State Diagram
Self
Refresh
SE
LF
t
LF
exi
SE
MRS
Mode
Register
Set
REF
IDLE
CBR(auto)
Refresh
CK
E
ACT
CK
E
Power
Down
CKE
ROW
ACTIVE
BS
T
ite
wit
pre h
ch
arg
to
Wr
CKE
Read
Re
Read
CKE
READ
CKE
WRITEA
CKE
Precharge
PR
E(
Pre
cha
rge
ter
min
atio
n)
Write
CKE
POWER
ON
T
ad
WRITE
n)
atio
min
ter
rge
cha
Pre
E(
PR
WRITEA
SUSPEND
Au
WRITE
SUSPEND
h
wit
ad arge
h
Re
c
pre
to
Au
PRE
Write
e
BS
e
rit
W
Active
Power
Down
CKE
CKE
CKE
READA
CKE
READ
SUSPEND
READA
SUSPEND
Precharge
Automatic sequence
Manual input
Data Sheet E0205E30 (Ver. 3.0)
22
EDS1232AABB, EDS1232AATA
Programming Mode Registers
The mode register is programmed by the Mode register set command using address bits A11 through A0, BA0 and
BA1 as data inputs. The registers retain data until it is re-programmed, or the device loses power.
The mode register has three fields;
Options
/CAS latency
Wrap type
Burst length
:
:
:
:
A11 through A7, BA0, BA1
A6 through A4
A3
A2 through A0
Following mode register programming, no command can be issued before at least 2 CLK have elapsed.
/CAS Latency
/CAS latency is the most critical of the parameters being set. It tells the device how many clocks must elapse before
the data will be available. The value is determined by the frequency of the clock and the speed grade of the device.
”Relationship between Frequency and Latency” shows the relationship of /CAS latency to the clock period and the
speed grade of the device.
Burst Length
Burst Length is the number of words that will be output or input in a read or write cycle. After a read burst is
completed, the output bus will become High-Z. The burst length is programmable as 1, 2, 4, 8 or full page.
Wrap Type (Burst Sequence)
The wrap type specifies the order in which the burst data will be addressed. This order is programmable as either
“Sequential” or “Interleave”. The method chosen will depend on the type of CPU in the system.
Some microprocessor cache systems are optimized for sequential addressing and others for interleaved addressing.
“Burst Length Sequence” shows the addressing sequence for each burst length using them. Both sequences
support bursts of 1, 2, 4 and 8. Additionally, sequence supports the full page length.
Data Sheet E0205E30 (Ver. 3.0)
23
EDS1232AABB, EDS1232AATA
Mode Register
BA0 BA1 A11
0
0
0
BA0 BA1 A11
x
x
x
BA0 BA1 A11
BA0 BA1 A11
x
x
x
BA0 BA1 A11
0
0
0
A10
A9
A8
A7
0
0
0
1
A10
A9
A8
A7
x
1
0
0
A10
A9
A8
A7
1
0
A6
A5
A4
A3
A2
A1
A0
JEDEC Standard Test Set (refresh counter test)
A6
A5
A4
LTMODE
A6
A5
A3
A2
WT
A4
A3
A1
A0
BL
A2
A1
Burst Read and Single Write
(for Write Through Cache)
A0
Use in future
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
x
x
1
1
V
V
V
V
V
V
V
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
0
0
0
0
LTMODE
WT
BL
Vender Specific
V = Valid
x = Don’t care
Mode Register Set
Burst length
Bits2-0
000
001
010
011
100
101
110
111
Wrap type
0
1
Latency
mode
WT = 0
1
2
4
8
R
R
R
Full page
Sequential
Interleave
Bits6-4
000
001
010
011
100
101
110
111
Remark R : Reserved
Mode Register Set Timing
CLK
CKE
/CS
/RAS
/CAS
/WE
A0 - A11,
BA0(13), BA1(A12)
Mode Register Set
Data Sheet E0205E30 (Ver. 3.0)
24
/CAS latency
R
R
2
3
R
R
R
R
WT = 1
1
2
4
8
R
R
R
R
EDS1232AABB, EDS1232AATA
Burst Length and Sequence
[Burst of Two]
Starting address
(column address A0, binary)
Sequential addressing sequence
(decimal)
Interleave addressing sequence
(decimal)
0
0, 1
0, 1
1
1, 0
1, 0
Starting address
(column address A1 to A0, binary)
Sequential addressing sequence
(decimal)
Interleave addressing sequence
(decimal)
00
0, 1, 2, 3
0, 1, 2, 3
01
1, 2, 3, 0
1, 0, 3, 2
10
2, 3, 0, 1
2, 3, 0, 1
11
3, 0, 1, 2
3, 2, 1, 0
Starting address
(column address A2 to A0, binary)
Sequential addressing sequence
(decimal)
Interleave addressing sequence
(decimal)
000
0, 1, 2, 3, 4, 5, 6, 7
0, 1, 2, 3, 4, 5, 6, 7
001
1, 2, 3, 4, 5, 6, 7, 0
1, 0, 3, 2, 5, 4, 7, 6
010
2, 3, 4, 5, 6, 7, 0, 1
2, 3, 0, 1, 6, 7, 4, 5
011
3, 4, 5, 6, 7, 0, 1, 2
3, 2, 1, 0, 7, 6, 5, 4
100
4, 5, 6, 7, 0, 1, 2, 3
4, 5, 6, 7, 0, 1, 2, 3
101
5, 6, 7, 0, 1, 2, 3, 4
5, 4, 7, 6, 1, 0, 3, 2
110
6, 7, 0, 1, 2, 3, 4, 5
6, 7, 4, 5, 2, 3, 0, 1
111
7, 0, 1, 2, 3, 4, 5, 6
7, 6, 5, 4, 3, 2, 1, 0
[Burst of Four]
[Burst of Eight]
Full page burst is an extension of the above tables of sequential addressing, with the length being 256.
Data Sheet E0205E30 (Ver. 3.0)
25
EDS1232AABB, EDS1232AATA
Address Bits of Bank-Select and Precharge
Row
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
BA1 BA0
(Activate command)
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
BA1(A12) BA0(A13)
Result
Select Bank A
“Activate” command
Select Bank B
“Activate” command
0
0
0
1
1
0
Select Bank C
“Activate” command
1
1
Select Bank D
“Activate” command
BA1 BA0
A10 BA1(A12) BA0(A13)
0
0
0
0
1
0
0
0
1
0
1
1
1
x
x
(Precharge command)
Result
Precharge Bank A
Precharge Bank B
Precharge Bank C
Precharge Bank D
Precharge All Banks
x : Don’t care
0
Col.
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
x
BA1 BA0
1
disables Auto-Precharge
(End of Burst)
enables Auto-Precharge
(End of Burst)
(/CAS strobes)
BA1(A12) BA0(A13)
Data Sheet E0205E30 (Ver. 3.0)
26
Result
enables Read/Write
commands for Bank A
enables Read/Write
commands for Bank B
0
0
0
1
1
0
enables Read/Write
commands for Bank C
1
1
enables Read/Write
commands for Bank D
EDS1232AABB, EDS1232AATA
Power-up sequence
Power-up sequence
The SDRAM should be goes on the following sequence with power up.
The CLK, CKE, /CS, DQM and DQ pins keep low till power stabilizes.
The CLK pin is stabilized within 100 µs after power stabilizes before the following initialization sequence.
The CKE and DQM is driven to high between power stabilizes and the initialization sequence.
This SDRAM has VDD clamp diodes for CLK, CKE, /CS DQM and DQ pins. If these pins go high before power up,
the large current flows from these pins to VDD through the diodes.
Initialization sequence
When 200 µs or more has past after the above power-up sequence, all banks must be precharged using the
precharge command (PALL). After tRP delay, set 8 or more auto refresh commands (REF). Set the mode register
set command (MRS) to initialize the mode register. We recommend that by keeping DQM and CKE to High, the
output buffer becomes High-Z during Initialization sequence, to avoid DQ bus contention on memory system formed
with a number of device.
Initialization sequence
Power up sequence
100 µs
VDD, VDDQ
200 µs
0V
CKE, DQM
Low
CLK
Low
/CS, DQ
Low
Power stabilize
Power-up sequence and Initialization sequence
Data Sheet E0205E30 (Ver. 3.0)
27
EDS1232AABB, EDS1232AATA
Operation of the SDRAM
Read/Write Operations
Bank active
Before executing a read or write operation, the corresponding bank and the row address must be activated by the
bank active (ACT) command. An interval of tRCD is required between the bank active command input and the
following read/write command input.
Read operation
A read operation starts when a read command is input. Output buffer becomes Low-Z in the (/CAS Latency - 1)
cycle after read command set. The SDRAM can perform a burst read operation.
The burst length can be set to 1, 2, 4 and 8. The start address for a burst read is specified by the column address
and the bank select address at the read command set cycle. In a read operation, data output starts after the number
of clocks specified by the /CAS Latency. The /CAS Latency can be set to 2 or 3.
When the burst length is 1, 2, 4 and 8 the DOUT buffer automatically becomes High-Z at the next clock after the
successive burst-length data has been output.
The /CAS latency and burst length must be specified at the mode register.
CLK
tRCD
Command
ACT
READ
Address
Row
Column
DQ
out 0
CL = 2
CL = 3
out 1
out 2
out 3
out 0
out 1
out 2
out 3
CL = /CAS latency
Burst Length = 4
/CAS Latency
CLK
tRCD
Command
ACT
READ
Address
Row
Column
BL = 1
out 0
out 0 out 1
DQ
BL = 2
out 0 out 1 out 2 out 3
BL = 4
out 0 out 1 out 2 out 3 out 4 out 5 out 6 out 7
BL = 8
BL : Burst Length
/CAS Latency = 2
Burst Length
Data Sheet E0205E30 (Ver. 3.0)
28
EDS1232AABB, EDS1232AATA
Write operation
Burst write or single write mode is selected by the OPCODE of the mode register.
1. Burst write: A burst write operation is enabled by setting OPCODE (A9, A8) to (0, 0). A burst write starts in the
same clock as a write command set. (The latency of data input is 0 clock.) The burst length can be set to 1, 2, 4
and 8, like burst read operations. The write start address is specified by the column address and the bank select
address at the write command set cycle.
CLK
tRCD
Command
ACT
WRIT
Address
Row
Column
in 0
BL = 1
DQ
in 0
in 1
in 0
in 1
in 2
in 3
in 0
in 1
in 2
in 3
BL = 2
BL = 4
in 4
in 5
in 6
BL = 8
in 7
CL = 2, 3
Burst write
2. Single write: A single write operation is enabled by setting OPCODE (A9, A8) to (1, 0). In a single write
operation, data is only written to the column address and the bank select address specified by the write
command set cycle without regard to the burst length setting. (The latency of data input is 0 clock).
CLK
tRCD
Command
Address
DQ
ACT
Row
WRIT
Column
in 0
Single write
Data Sheet E0205E30 (Ver. 3.0)
29
EDS1232AABB, EDS1232AATA
Auto Precharge
Read with auto-precharge
In this operation, since precharge is automatically performed after completing a read operation, a precharge
command need not be executed after each read operation. The command executed for the same bank after the
execution of this command must be the bank active (ACT) command. In addition, an interval defined by lAPR is
required before execution of the next command.
[Clock cycle time]
/CAS latency
Precharge start cycle
3
2 cycle before the final data is output
2
1 cycle before the final data is output
CLK
CL=2 Command
ACT
READA
ACT
lRAS
DQ
out0
out1
out2
out3
lAPR
CL=3 Command
ACT
READA
ACT
lRAS
DQ
out0
out1
Note: Internal auto-precharge starts at the timing indicated by " ".
And an interval of tRAS (lRAS) is required between previous active (ACT) command and internal precharge "
out2
out3
lAPR
".
Burst Read (BL = 4)
Write with auto-precharge
In this operation, since precharge is automatically performed after completing a burst write or single write operation,
a precharge command need not be executed after each write operation. The command executed for the same bank
after the execution of this command must be the bank active (ACT) command. In addition, an interval of lDAL is
required between the final valid data input and input of next command.
CLK
Command
ACT
ACT
WRITA
IRAS
DQ
in0
in1
in2
in3
lDAL
Note: Internal auto-precharge starts at the timing indicated by " ".
and an interval of tRAS (lRAS) is required between previous active (ACT) command
and internal precharge " ".
Burst Write (BL = 4)
Data Sheet E0205E30 (Ver. 3.0)
30
EDS1232AABB, EDS1232AATA
CLK
Command
ACT
ACT
WRITA
IRAS
DQ
in
lDAL
Note: Internal auto-precharge starts at the timing indicated by " ".
and an interval of tRAS (lRAS) is required between previous active (ACT) command
and internal precharge " ".
Single Write
Data Sheet E0205E30 (Ver. 3.0)
31
EDS1232AABB, EDS1232AATA
Burst Stop Command
During a read cycle, when the burst stop command is issued, the burst read data are terminated and the data bus
goes to High-Z after the /CAS latency from the burst stop command.
CLK
Command
READ
BST
DQ
(CL = 2)
out
DQ
(CL = 3)
out
out
out
out
High-Z
out
High-Z
Burst Stop at Read
During a write cycle, when the burst stop command is issued, the burst write data are terminated and data bus goes
to High-Z at the same clock with the burst stop command.
CLK
Command
WRITE
BST
High-Z
DQ
in
in
in
Burst Stop at Write
Data Sheet E0205E30 (Ver. 3.0)
32
in
EDS1232AABB, EDS1232AATA
Command Intervals
Read command to Read command interval
1. Same bank, same ROW address: When another read command is executed at the same ROW address of the
same bank as the preceding read command execution, the second read can be performed after an interval of no
less than 1 clock. Even when the first command is a burst read that is not yet finished, the data read by the
second command will be valid.
CLK
Command
ACT
Address
Row
READ
READ
Column A Column B
BS
DQ
out A0 out B0 out B1 out B2 out B3
Bank0
Active
Column =A Column =B Column =A Column =B
Dout
Read
Read
Dout
CL = 3
BL = 4
Bank 0
READ to READ Command Interval (same ROW address in same bank)
2. Same bank, different ROW address: When the ROW address changes on same bank, consecutive read
commands cannot be executed; it is necessary to separate the two read commands with a precharge command
and a bank active command.
3. Different bank: When the bank changes, the second read can be performed after an interval of no less than 1
clock, provided that the other bank is in the bank active state. Even when the first command is a burst read that
is not yet finished, the data read by the second command will be valid.
CLK
Command
Address
ACT
ACT
READ READ
Row 0
Row 1
Column A Column B
BS
DQ
out A0 out B0 out B1 out B2 out B3
Bank0
Active
Bank3 Bank0 Bank3
Active Read Read
Bank0 Bank3
Dout
Dout
READ to READ Command Interval (different bank)
Data Sheet E0205E30 (Ver. 3.0)
33
CL = 3
BL = 4
EDS1232AABB, EDS1232AATA
Write command to Write command interval
1. Same bank, same ROW address: When another write command is executed at the same ROW address of the
same bank as the preceding write command, the second write can be performed after an interval of no less than
1 clock. In the case of burst writes, the second write command has priority.
CLK
Command
ACT
Address
Row
WRIT
WRIT
Column A Column B
BS
DQ
in A0
Bank0
Active
in B0
in B1
in B2
in B3
Burst Write Mode
BL = 4
Bank 0
Column =A Column =B
Write
Write
WRITE to WRITE Command Interval (same ROW address in same bank)
2. Same bank, different ROW address: When the ROW address changes, consecutive write commands cannot be
executed; it is necessary to separate the two write commands with a precharge command and a bank active
command.
3. Different bank: When the bank changes, the second write can be performed after an interval of no less than 1
clock, provided that the other bank is in the bank active state. In the case of burst write, the second write
command has priority.
CLK
Command
Address
ACT
ACT
WRIT
Row 0
Row 1
Column A Column B
WRIT
BS
DQ
in A0
Bank0
Active
in B0
in B1
in B2
in B3
Burst Write Mode
BL = 4
Bank3 Bank0 Bank3
Active Write Write
WRITE to WRITE Command Interval (different bank)
Data Sheet E0205E30 (Ver. 3.0)
34
EDS1232AABB, EDS1232AATA
Read command to Write command interval
1. Same bank, same ROW address: When the write command is executed at the same ROW address of the same
bank as the preceding read command, the write command can be performed after an interval of no less than 1
clock. However, DQM must be set High so that the output buffer becomes High-Z before data input.
CLK
Command
READ WRIT
CL=2
DQM
CL=3
in B0
DQ (input)
in B1
in B2
in B3
BL = 4
Burst write
High-Z
DQ (output)
READ to WRITE Command Interval (1)
CLK
Command
READ
WRIT
DQM
CL=2
2 clock
out
out
out
in
in
in
in
out
out
in
in
in
in
DQ
CL=3
READ to WRITE Command Interval (2)
2. Same bank, different ROW address: When the ROW address changes, consecutive write commands cannot be
executed; it is necessary to separate the two commands with a precharge command and a bank active
command.
3. Different bank: When the bank changes, the write command can be performed after an interval of no less than 1
cycle, provided that the other bank is in the bank active state. However, DQM must be set High so that the
output buffer becomes High-Z before data input.
Data Sheet E0205E30 (Ver. 3.0)
35
EDS1232AABB, EDS1232AATA
Write command to Read command interval:
1. Same bank, same ROW address: When the read command is executed at the same ROW address of the same
bank as the preceding write command, the read command can be performed after an interval of no less than 1
clock. However, in the case of a burst write, data will continue to be written until one clock before the read
command is executed.
CLK
Command
WRIT
READ
DQM
DQ (input)
in A0
DQ (output)
out B0
Column = A
Write
Column = B
Read
out B1
out B2
out B3
Burst Write Mode
CL = 2
BL = 4
Bank 0
/CAS Latency
Column = B
Dout
WRITE to READ Command Interval (1)
CLK
Command
WRIT
READ
DQM
DQ (input)
in A1
in A0
DQ (output)
out B0
Column = A
Write
out B1
/CAS Latency
Column = B
Read
Column = B
Dout
out B2
out B3
Burst Write Mode
CL = 2
BL = 4
Bank 0
WRITE to READ Command Interval (2)
2. Same bank, different ROW address: When the ROW address changes, consecutive read commands cannot be
executed; it is necessary to separate the two commands with a precharge command and a bank active
command.
3. Different bank: When the bank changes, the read command can be performed after an interval of no less than 1
clock, provided that the other bank is in the bank active state. However, in the case of a burst write, data will
continue to be written until one clock before the read command is executed (as in the case of the same bank and
the same address).
Data Sheet E0205E30 (Ver. 3.0)
36
EDS1232AABB, EDS1232AATA
Read with auto precharge to Read command interval
1. Different bank: When some banks are in the active state, the second read command (another bank) is executed.
Even when the first read with auto-precharge is a burst read that is not yet finished, the data read by the second
command is valid. The internal auto-precharge of one bank starts at the next clock of the second command.
CLK
Command
READA
READ
BS
DQ
out A0
bank0
Read A
out A1
out B0
out B1
bank3
Read
Note: Internal auto-precharge starts at the timing indicated by "
CL= 3
BL = 4
".
Read with Auto Precharge to Read Command Interval (Different bank)
2. Same bank: The consecutive read command (the same bank) is illegal.
Write with auto precharge to Write command interval
1. Different bank: When some banks are in the active state, the second write command (another bank) is executed.
In the case of burst writes, the second write command has priority. The internal auto-precharge of one bank
starts 2 clocks later from the second command.
CLK
Command
WRITA
WRIT
BS
DQ
in A0
bank0
Write A
in A1
in B0
in B1
in B2
in B3
bank3
Write
BL= 4
Note: Internal auto-precharge starts at the timing indicated by "
".
Write with Auto Precharge to Write Command Interval (Different bank)
2. Same bank: The consecutive write command (the same bank) is illegal.
Data Sheet E0205E30 (Ver. 3.0)
37
EDS1232AABB, EDS1232AATA
Read with auto precharge to Write command interval
1. Different bank: When some banks are in the active state, the second write command (another bank) is executed.
However, DQM must be set High so that the output buffer becomes High-Z before data input. The internal autoprecharge of one bank starts at the next clock of the second command.
CLK
Command
READA
WRIT
BS
CL = 2
DQM
CL = 3
DQ (input)
in B0
DQ (output)
in B1
in B2
in B3
High-Z
bank0
ReadA
BL = 4
bank3
Write
Note: Internal auto-precharge starts at the timing indicated by "
".
Read with Auto Precharge to Write Command Interval (Different bank)
2. Same bank: The consecutive write command from read with auto precharge (the same bank) is illegal. It is
necessary to separate the two commands with a bank active command.
Write with auto precharge to Read command interval
1. Different bank: When some banks are in the active state, the second read command (another bank) is executed.
However, in case of a burst write, data will continue to be written until one clock before the read command is
executed. The internal auto-precharge of one bank starts at 2 clocks later from the second command.
CLK
Command
WRITA
READ
BS
DQM
DQ (input)
in A0
DQ (output)
out B0
bank0
WriteA
out B1
out B2
out B3
CL = 3
BL = 4
bank3
Read
Note: Internal auto-precharge starts at the timing indicated by "
".
Write with Auto Precharge to Read Command Interval (Different bank)
2. Same bank: The consecutive read command from write with auto precharge (the same bank) is illegal. It is
necessary to separate the two commands with a bank active command.
Data Sheet E0205E30 (Ver. 3.0)
38
EDS1232AABB, EDS1232AATA
Read command to Precharge command interval (same bank)
When the precharge command is executed for the same bank as the read command that preceded it, the minimum
interval between the two commands is one clock. However, since the output buffer then becomes High-Z after the
clocks defined by lHZP, there is a case of interruption to burst read data output will be interrupted, if the precharge
command is input during burst read. To read all data by burst read, the clocks defined by lEP must be assured as
an interval from the final data output to precharge command execution.
CLK
PRE/PALL
READ
Command
DQ
out A0
out A1
CL=2
out A2
out A3
lEP = -1 cycle
READ to PRECHARGE Command Interval (same bank): To output all data (CL = 2, BL = 4)
CLK
PRE/PALL
READ
Command
DQ
out A0
CL=3
out A1
out A2
out A3
lEP = -2 cycle
READ to PRECHARGE Command Interval (same bank): To output all data (CL = 3, BL = 4)
CLK
Command
READ
PRE/PALL
High-Z
DQ
out A0
lHZP = 2
READ to PRECHARGE Command Interval (same bank): To stop output data (CL = 2, BL = 1, 2, 4, 8)
CLK
Command
READ
PRE/PALL
High-Z
DQ
out A0
lHZP =3
READ to PRECHARGE Command Interval (same bank): To stop output data (CL = 3, BL = 1, 2, 4, 8)
Data Sheet E0205E30 (Ver. 3.0)
39
EDS1232AABB, EDS1232AATA
Write command to Precharge command interval (same bank)
When the precharge command is executed for the same bank as the write command that preceded it, the minimum
interval between the two commands is 1 clock. However, if the burst write operation is unfinished, the input data
must be masked by means of DQM for assurance of the clock defined by tDPL.
CLK
WRIT
Command
PRE/PALL
DQM
DQ
tDPL
CLK
PRE/PALL
WRIT
Command
DQM
in A0
DQ
in A1
tDPL
WRITE to PRECHARGE Command Interval (same bank) (BL = 4 (To stop write operation))
CLK
Command
PRE/PALL
WRIT
DQM
in A0
DQ
in A1
in A2
in A3
tDPL
WRITE to PRECHARGE Command Interval (same bank) (BL = 4 (To write all data))
Data Sheet E0205E30 (Ver. 3.0)
40
EDS1232AABB, EDS1232AATA
Bank active command interval
1. Same bank: The interval between the two bank active commands must be no less than tRC.
2. In the case of different bank active commands: The interval between the two bank active commands must be no
less than tRRD.
CLK
Command
ACT
ACT
Address
ROW
ROW
BS
tRC
Bank 0
Active
Bank 0
Active
Bank Active to Bank Active for Same Bank
CLK
Command
Address
ACT
ACT
ROW:0
ROW:1
BS
tRRD
Bank 0
Active
Bank 3
Active
Bank Active to Bank Active for Different Bank
Mode register set to Bank active command interval
The interval between setting the mode register and executing a bank active command must be no less than lMRD.
CLK
Command
Address
MRS
ACT
OPCODE
BS & ROW
IMRD
Mode
Register Set
Bank
Active
Mode register set to Bank active command interval
Data Sheet E0205E30 (Ver. 3.0)
41
EDS1232AABB, EDS1232AATA
DQM Control
The DQM mask the DQ data. The UDQM and LDQM mask the upper and lower bytes of the DQ data, respectively.
The timing of UDQM/LDQM is different during reading and writing.
Reading
When data is read, the output buffer can be controlled by DQM. By setting DQM to Low, the output buffer becomes
Low-Z, enabling data output. By setting DQM to High, the output buffer becomes High-Z, and the corresponding
data is not output. However, internal reading operations continue. The latency of DQM during reading is 2 clocks.
Writing
Input data can be masked by DQM. By setting DQM to Low, data can be written. In addition, when DQM is set to
High, the corresponding data is not written, and the previous data is held. The latency of DQM during writing is 0
clock.
CLK
DQM
DQ
High-Z
out 0
out 1
out 3
lDOD = 2 Latency
Reading
CLK
DQM
DQ
in 0
in 3
in 1
lDID = 0 Latency
Writing
Data Sheet E0205E30 (Ver. 3.0)
42
EDS1232AABB, EDS1232AATA
Refresh
Auto-refresh
All the banks must be precharged before executing an auto-refresh command. Since the auto-refresh command
updates the internal counter every time it is executed and determines the banks and the ROW addresses to be
refreshed, external address specification is not required. The refresh cycles are required to refresh all the ROW
addresses within tREF (max.). The output buffer becomes High-Z after auto-refresh start. In addition, since a
precharge has been completed by an internal operation after the auto-refresh, an additional precharge operation by
the precharge command is not required.
Self-refresh
After executing a self-refresh command, the self-refresh operation continues while CKE is held Low. During selfrefresh operation, all ROW addresses are refreshed by the internal refresh timer. A self-refresh is terminated by a
self-refresh exit command. Before and after self-refresh mode, execute auto-refresh to all refresh addresses in or
within tREF (max.) period on the condition 1 and 2 below.
1. Enter self-refresh mode within time as below* after either burst refresh or distributed refresh at equal interval to
all refresh addresses are completed.
2. Start burst refresh or distributed refresh at equal interval to all refresh addresses within time as below*after
exiting from self-refresh mode.
Note: tREF (max.) / refresh cycles.
Others
Power-down mode
The SDRAM enters power-down mode when CKE goes Low in the IDLE state. In power down mode, power
consumption is suppressed by deactivating the input initial circuit. Power down mode continues while CKE is held
Low. In addition, by setting CKE to High, the SDRAM exits from the power down mode, and command input is
enabled from the next clock. In this mode, internal refresh is not performed.
Clock suspend mode
By driving CKE to Low during a bank active or read/write operation, the SDRAM enters clock suspend mode. During
clock suspend mode, external input signals are ignored and the internal state is maintained. When CKE is driven
High, the SDRAM terminates clock suspend mode, and command input is enabled from the next clock. For details,
refer to the "CKE Truth Table".
Data Sheet E0205E30 (Ver. 3.0)
43
EDS1232AABB, EDS1232AATA
Timing Waveforms
Read Cycle
tCK
tCH t CL
CLK
t RC
VIH
CKE
t RP
tRAS
tRCD
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/CS
tSI tHI
tSI tHI
/RAS
tSI tHI
tSI tHI
/CAS
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/WE
tSI tHI
BS
tSI tHI
tSI tHI
A10
tSI tHI
tSI tHI
tSI tHI
Address
tSI
tHI
DQM
DQ (input)
tAC
tAC
tAC
tHZ
DQ (output)
t AC
tOH
tOH
Bank 0
Active
Bank 0
Read
tLZ
tOH
Bank 0
Precharge
Data Sheet E0205E30 (Ver. 3.0)
44
tOH
/CAS latency = 2
Burst length = 4
Bank 0 access
= VIH or VIL
EDS1232AABB, EDS1232AATA
Write Cycle
tCK
tCH tCL
CLK
tRC
VIH
CKE
tRP
tRAS
tRCD
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/CS
tSI tHI
tSI tHI
/RAS
tSI tHI
tSI tHI
/CAS
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/WE
tSI tHI
tSI tHI
BS
tSI tHI
tSI tHI
A10
tSI tHI
tSI tHI
tSI tHI
Address
tSI
tHI
DQM
tSI
t HI
tSI
tHI tSI
tHI
tSI
tHI
DQ (input)
tDPL
DQ (output)
Bank 0
Precharge
Bank 0
Write
Bank 0
Active
CL = 2
BL = 4
Bank 0 access
= VIH or VIL
Mode Register Set Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
b+3
b’
b’+1
b’+2
b’+3
19
CLK
CKE
VIL
/CS
/RAS
/CAS
/WE
BS
Address
code
valid
C: b’
C: b
R: b
DQM
DQ (output)
b
High-Z
DQ (input)
lMRD
lRP
Precharge
If needed
Mode
register
Set
Bank 3
Active
lRCD
Output mask
Bank 3
Read
Data Sheet E0205E30 (Ver. 3.0)
45
lRCD = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
EDS1232AABB, EDS1232AATA
Read Cycle/Write Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
VIH
Read cycle
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
R:b
C:b
C:b'
C:b"
DQM
DQ (output)
DQ (input)
CKE
a
a+1 a+2 a+3
b
b+1 b+2 b+3 b'
b'+1 b"
b"+1 b"+2 b"+3
High-Z
Bank 0
Active
Bank 0
Read
Bank 3
Active
Bank 3 Bank 0
Read
Precharge
Bank 3
Read
Bank 3
Read
Bank 3
Precharge
VIH
Write cycle
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
R:b
C:b
C:b'
C:b"
DQM
High-Z
DQ (output)
DQ (input)
a
Bank 0
Active
Bank 0
Write
a+1 a+2 a+3
Bank 3
Active
b
Bank 3
Write
b+1 b+2 b+3 b'
Bank 0
Precharge
Data Sheet E0205E30 (Ver. 3.0)
46
Bank 3
Write
b'+1 b"
Bank 3
Write
b"+1 b"+2 b"+3
Bank 3
Precharge
EDS1232AABB, EDS1232AATA
Read/Single Write Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
VIH
/CS
/RAS
/CAS
/WE
BS
R:a
Address
C:a
R:b
C:a' C:a
DQM
a
DQ (input)
DQ (output)
a
Bank 0
Active
CKE
Bank 0
Read
Bank 3
Active
C:a
R:b
a+1 a+2 a+3
a
Bank 0 Bank 0
Read
Write
a+1 a+2 a+3
Bank 0
Precharge
Bank 3
Precharge
VIH
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
C:b C:c
a
b
DQM
DQ (input)
DQ (output)
a
Bank 0
Active
Bank 0
Read
a+1
c
a+3
Bank 0
Write
Bank 3
Active
Bank 0 Bank 0
Write
Write
Bank 0
Precharge
Read/Single write
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
Data Sheet E0205E30 (Ver. 3.0)
47
EDS1232AABB, EDS1232AATA
Read/Burst Write Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
/CS
/RAS
/CAS
/WE
BS
R:a
Address
C:a
R:b
C:a'
DQM
a
DQ (input)
DQ (output)
a
Bank 0
Active
CKE
a+1 a+2 a+3
Clock
suspend
Bank 0
Read
Bank 3
Active
C:a
R:b
a+1 a+2 a+3
Bank 0
Precharge
Bank 0
Write
Bank 3
Precharge
VIH
/CS
/RAS
/CAS
/WE
BS
R:a
Address
C:a
DQM
a
DQ (input)
DQ (output)
a
Bank 0
Active
Bank 0
Read
a+1
a+1 a+2 a+3
a+3
Bank 0
Write
Bank 3
Active
Bank 0
Precharge
Read/Burst write
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
Auto Refresh Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
a
a+1
CLK
CKE
VIH
/CS
/RAS
/CAS
/WE
BS
Address
R:a
A10=1
C:a
DQM
DQ (input)
High-Z
DQ (output)
t RP
Precharge
If needed
t RC
Auto Refresh
t RC
Auto Refresh
Data Sheet E0205E30 (Ver. 3.0)
48
Active
Bank 0
Read
Bank 0
Refresh cycle and
Read cycle
/RAS-/CAS delay = 2
/CAS latency = 2
Burst length = 4
= VIH or VIL
EDS1232AABB, EDS1232AATA
Self Refresh Cycle
CLK
lSREX
CKE Low
CKE
/CS
/RAS
/CAS
/WE
BS
Address
A10=1
DQM
DQ (input)
High-Z
DQ (output)
t RP
Precharge command
If needed
t RC
t RC
Self refresh entry
command
Next
clock
enable
Self refresh exit
ignore command
or No operation
Auto
Next
clock refresh
enable
Self refresh entry
command
Self refresh cycle
/RAS-/CAS delay = 3
CL = 3
BL = 4
= VIH or VIL
Clock Suspend Mode
tSI
0
1
2
3
4
5
tSI
tHI
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
Read cycle
/RAS-/CAS delay = 2
/CAS latency = 2
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
R:b
C:b
DQM
DQ (output)
a
a+1 a+2
a+3
b
b+1 b+2 b+3
High-Z
DQ (input)
Bank0 Active clock
Active suspend start
Active clock Bank0
suspend end Read
Bank3
Active
Read suspend
start
Read suspend
end
Bank3
Read
Bank0
Precharge
Earliest Bank3
Precharge
CKE
Write cycle
/RAS-/CAS delay = 2
/CAS latency = 2
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
C:a R:b
R:a
C:b
DQM
High-Z
DQ (output)
DQ (input)
a
Bank0
Active
Active clock
suspend start
a+1 a+2
Active clock Bank0 Bank3
supend end Write Active
Write suspend
start
a+3 b
Write suspend
end
Data Sheet E0205E30 (Ver. 3.0)
49
b+1 b+2 b+3
Bank3 Bank0
Write Precharge
Earliest Bank3
Precharge
EDS1232AABB, EDS1232AATA
Power Down Mode
CLK
CKE Low
CKE
/CS
/RAS
/CAS
/WE
BS
Address
R: a
A10=1
DQM
DQ (input)
High-Z
DQ (output)
tRP
Precharge command
If needed
Power down cycle
Power down entry
Power down
/RAS-/CAS delay = 3
mode exit
Active Bank 0 /CAS latency = 3
Burst length = 4
= VIH or VIL
Initialization Sequence
0
1
2
3
4
5
6
7
8
9
10
48
49
50
51
52
53
54
CLK
CKE
VIH
/CS
/RAS
/CAS
/WE
DQM
code
valid
Address
Valid
VIH
High-Z
DQ
t RC
tRP
All banks
Precharge
tRC
Auto Refresh
Auto Refresh
Data Sheet E0205E30 (Ver. 3.0)
50
l MRD
Mode register
Set
Bank active
If needed
55
EDS1232AABB, EDS1232AATA
Package Drawing
90-ball FBGA
Unit: mm
0.2 S A
8.0 ± 0.1
0.2 S B
13.0 ± 0.1
INDEX AREA
0.2 S
1.07 max.
S
0.27 ± 0.05
0.1 S
B
A
0.8
INDEX MARK
0.8
0.8
0.9
1.6
90-φ0.45 ± 0.05
φ0.08 M S A B
ECA-TS2-0061-01
Data Sheet E0205E30 (Ver. 3.0)
51
EDS1232AABB, EDS1232AATA
86-pin TSOP (II)
Unit: mm
22.22 ± 0.10
*1
A
PIN#1 ID
1
43
0.50
0.15 to 0.30
11.76 ± 0.20
44
10.16
86
B
0.10 M S A B
0.80
Nom
0.81 max.
0.25
0.10 +0.08
−0.05
0.10 S
0.09 to 0.20
S
1.2 max.
1.0 ± 0.05
0 to 8°
0.60 ± 0.15
Note: 1. This dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or
gate burrs shall not exceed 0.20mm per side.
ECA-TS2-0030-01
Data Sheet E0205E30 (Ver. 3.0)
52
EDS1232AABB, EDS1232AATA
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the EDS1232AA.
Type of Surface Mount Device
EDS1232AABB: 90-ball FBGA
EDS1232AATA: 86-pin TSOP (II)
Data Sheet E0205E30 (Ver. 3.0)
53
EDS1232AABB, EDS1232AATA
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR MOS DEVICES
Exposing the MOS devices to a strong electric field can cause destruction of the gate
oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it, when once
it has occurred. Environmental control must be adequate. When it is dry, humidifier
should be used. It is recommended to avoid using insulators that easily build static
electricity. MOS devices must be stored and transported in an anti-static container,
static shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded using
wrist strap. MOS devices must not be touched with bare hands. Similar precautions
need to be taken for PW boards with semiconductor MOS devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES
No connection for CMOS devices input pins can be a cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input level may be
generated due to noise, etc., hence causing malfunction. CMOS devices behave
differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected
to VDD or GND with a resistor, if it is considered to have a possibility of being an output
pin. The unused pins must be handled in accordance with the related specifications.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Power-on does not necessarily define initial status of MOS devices. Production process
of MOS does not define the initial operation status of the device. Immediately after the
power source is turned ON, the MOS devices with reset function have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or
contents of registers. MOS devices are not initialized until the reset signal is received.
Reset operation must be executed immediately after power-on for MOS devices having
reset function.
CME0107
Data Sheet E0205E30 (Ver. 3.0)
54
EDS1232AABB, EDS1232AATA
The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of Elpida Memory, Inc.
Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights
(including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or
third parties by or arising from the use of the products or information listed in this document. No license,
express, implied or otherwise, is granted under any patents, copyrights or other intellectual property
rights of Elpida Memory, Inc. or others.
Descriptions of circuits, software and other related information in this document are provided for
illustrative purposes in semiconductor product operation and application examples. The incorporation of
these circuits, software and information in the design of the customer's equipment shall be done under
the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses
incurred by customers or third parties arising from the use of these circuits, software and information.
[Product applications]
Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability.
However, users are instructed to contact Elpida Memory's sales office before using the product in
aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment,
medical equipment for life support, or other such application in which especially high quality and
reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury.
[Product usage]
Design your application so that the product is used within the ranges and conditions guaranteed by
Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation
characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no
responsibility for failure or damage when the product is used beyond the guaranteed ranges and
conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure
rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so
that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other
consequential damage due to the operation of the Elpida Memory, Inc. product.
[Usage environment]
This product is not designed to be resistant to electromagnetic waves or radiation. This product must be
used in a non-condensing environment.
If you export the products or technology described in this document that are controlled by the Foreign
Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance
with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by
U.S. export control regulations, or another country's export control laws or regulations, you must follow
the necessary procedures in accordance with such laws or regulations.
If these products/technology are sold, leased, or transferred to a third party, or a third party is granted
license to use these products, that third party must be made aware that they are responsible for
compliance with the relevant laws and regulations.
M01E0107
Data Sheet E0205E30 (Ver. 3.0)
55