05206 EMIF4-100FCD4 EMI FILTER/TVS ARRAY APPLICATIONS ✔ Cellular Phones ✔ Notebooks ✔ Personal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART Card IEC COMPATIBILITY (EN61000-4) 15 BUMP FLIP CHIP ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FEATURES ✔ ESD Protection > 25 kilovolts ✔ 4 Symmetrical I/O Channel EMI Filtering/TVS for ESD Protection ✔ Low Insertion Loss: -3db Roll-Off @ 60MHz ✔ Four Seperate TVS Diodes for ESD Protection ✔ Low Lead Inductance ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ 15 Bump Flip Chip Package ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Tape and Reel Per EIA Standard 481 PIN CONFIGURATION D2 I/O1 I/O2 I/O3 G1 D1 05206.R3 2/07 G2 I/O1 I/O2 G3 I/O3 1 D4 I/O4 I/O4 D3 www.protekdevices.com EMIF4-100FCD4 DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS TA -40 to 85 °C Operating Temperature TSTG -55 to 150 °C DC Power Per Resistor P 100 mW Typical Resistance @ ± 20% R 100 OHMS Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER @ 25°C Unless Otherwise Specified CUT-OFF FREQUENCY (50 OHMS I/O) ZERO BIAS TYPICAL CAPACITANCE PER LINE (See Note 1) @ 800-3000 MHz dB fC MHz @2.5V, 1MHz CLINE pF 30 60 30 RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM REVERSE LEAKAGE CURRENT TYPICAL FORWARD VOLTAGE MINIMUM ATTENUATION V WM VOLTS @ 1mA V(BR) VOLTS @3.3V ID µA @10mA VF VOLTS 5.0 6.0 0.5 0.8 EMIF4-100FCD4 Note 1: ± 20% tolerance. FIGURE 1 RESISTANCE VS TEMPERATURE (Normalized to Resistance at 25°C) Normalized Resistance 1.100 1.060 1.020 0.980 0.940 0.900 -40 05206.R3 2/07 -20 0 20 40 Temperature °C 2 60 80 100 www.protekdevices.com EMIF4-100FCD4 GRAPHS FIGURE 2 INSERTION LOSS - EMIF4-100FCD4 0 -5 -10 Gain (dB) -15 -20 2.5 Volts -25 -30 -35 0 Volts -40 -45 -50 0.1 1 10 100 1000 10000 Frequency (MHz) FIGURE 3 OVERSHOOT & CLAMPING VOLTAGE 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse: +15 kilovolt, 1/30ns (waveform) FIGURE 4 OVERSHOOT & FORWARD CLAMPING VOLTAGE 1 Volts per Division 4 2 0 -2 -4 ESD Test Pulse: -15 kilovolt, 1/30ns (waveform) 05206.R3 2/07 3 www.protekdevices.com EMIF4-100FCD4 SOLDER RECOMMENDATIONS PRINTED CIRCUIT BOARD RECOMMENDATIONS VALUE PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Temperature - °C Ramp-up Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat t 25°C to Peak 30-60 seconds 05206.R3 2/07 Ramp-up 15 seconds 4 Solder Time 15-20 seconds Ramp-down www.protekdevices.com EMIF4-100FCD4 15 BUMP FLIP CHIP PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE PACKAGE DIMENSIONS MILLIMETERS BOTTOM VIEW A G D C SIDE VIEW E O F G B H I 1 2 3 4 5 6 I 0.30 DIA. 63/67 Sn/Pb Solder Bumps INCHES DIM MIN MAX MIN MAX A B C D E F G H I J 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 0.1148 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.0170 0.0130 0.1183 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.0220 0.0180 NOTE: 1. Controlling dimensions in millimeters. J SOLDER PAD LAYOUT TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., EMIF4-100FCD4-T73-1. 3. Suffix - LF = Lead-Free, i.e., EMIF4-100FCD4LF-T73-1. 4. Suffix - C = Coated Version, i.e., EMIF4-100FCD4-LF-T73C-1. Non solder mask defined pad 0.275mm Solder mask opening 0.325mm 0.86 Solder stencil opening 0.330mm 0.25 0.50 Outline & Dimensions: Rev 2 - 8/06, 06042 Tape & Reel Specifications (Dimensions in millimeters) Reel Dia. Tape Width 178mm (7”) 8mm A0 B0 K0 D E F W P0 P t P2 D 10 Pitches Cumulative Tolerance on Tape. ± 0.2 E Top cover tape FCD4 FCD4 P2 1.78 ± 0.05 3.35 ± 0.05 0.76 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025 t MARKING CODE DIAGRAM P0 A0 F W K0 B0 FCD4 P User Direction of Feed COPYRIGHT © ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05206.R3 2/07 5 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com www.protekdevices.com