PANASONIC ERJ

Thick Film Chip Resistors
Thick Film Chip Resistors
0201, 0402, 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type:
ERJ 1G, 2G, 3G, 6G, 8G, 14,
12, 12Z, 1T
n Features
l Small size and lightweight
l High reliability
Metal glaze thick film resistive element and three layers of electrodes
l Compatible with placement machines
Taping and bulk case packaging available
l Suitable for both reflow and flow soldering
l Approved under the ISO 9001 system
Approved under the QS-9000 system
l Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A
n Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
3
G
E
Y
J
1
0
2
V
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type : inches Power R.
0.05 W
1GE : 0201
0.063 W
2GE : 0402
0.1 W
3GE : 0603
0.125 W
6GE : 0805
0.25 W
8GE : 1206
0.25 W
14 : 1210
0.5 W
12 : 1812
0.5 W
12Z : 2010
1W
1T : 2512
Code
Y
]Nil
Marking
Marking
Value Marking on
black side
No marking
Resistance Tolerance
Code
J
0
Tolerance
±5%
Jumper
Resistance Value
The first two digits are significant figures of resistance and
the third one denotes number of zeros following. Decimal
Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
Packaging Specifications
Packaging
Punched (Paper)
Taping
V
(Only 3G, 6G, 8G type)
Code
U
Embossed Taping
(Only 14, 12, 12Z, 1T type)
B
Bulk case
(Only 2G, 3G, 6G type)
X
Punched (Paper) Taping
2 mm pitch, 10000 pcs.
Y
Punched (Paper) Taping
2 mm pitch, 20000 pcs.
(Only 2G, 3G type)
(Only 2G type)
C
Punched (Paper) Taping
2 mm pitch, 15000 pcs.
(Only 1G type)
] When partly omitted, all the rest P/N factors should be moved up respectively.
Rev.02/04
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Thick Film Chip Resistors
n Dimensions in mm (not to scale)
n Construction
L
a
W
Protective coating
High purity alumina
Termination (Inner)
t
substrate
b
Dimensions (mm)
Type
(inches)
Termination
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12
(1812)
ERJ12Z
(2010)
ERJ1T
(2512)
(Between)
Resistive element
Termination (Outer)
L
W
a
b
Weight
(1000 pcs.)
t
0.60 ±0.03 0.30 ±0.03 0.12±0.05 0.15±0.05 0.25 ±0.05
0.15 g
1.00 ±0.05 0.50 ±0.05 0.20±0.10 0.25±0.05 0.35 ±0.05
0.8 g
1.60 ±0.15 0.80 +0.15
0.30±0.20 0.30±0.15 0.45 ±0.10
Ð0.05
2g
2.00
±0.10
4g
1.60 +0.05
0.50±0.20 0.50±0.20 0.60 ±0.10
3.20 +0.05
Ð0.20
Ð0.15
10 g
3.20 ±0.20 2.50 ±0.20 0.50±0.20 0.50±0.20 0.60 ±0.10
16 g
4.50 ±0.20 3.20 ±0.20 0.50±0.20 0.50±0.20 0.60 ±0.10
27 g
27 g
45 g
±0.20
5.00
±0.20
6.40
±0.20
1.25
±0.10
2.50
±0.20
3.20
±0.20
0.40
±0.20
0.60
±0.20
0.65
±0.20
0.40
±0.20
0.60
0.60
±0.20
0.60
±0.10
0.60
±0.20
0.60
±0.10
n Ratings
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12, 12Z
(1812, 2010)
ERJ1T
(2512)
Jumper
Power Rating Limiting Element Maximum Overload
Resistance
Voltage (Maximum Voltage(2)
at 70 ¡C
Tolerance(%)
(1)
RCWV) (V)
(W)
(V)
Resistance Range (W)
min.
max.
0.05
15
30
±5
10
1 M
0.063
50
100
±5
1
2.2 M
0.1
50
100
±5
1
10 M
0.125
150
200
±5
1
10 M
0.25
200
400
±5
1
10 M
0.25
200
400
±5
1
10 M
0.5
200
400
±5
1
10 M
1
200
400
±5
1
1 M
1G
2G á 3G
6Gá8Gá14á12á12Zá1T
Rated Current
Maximum Overload Current
0.5 A
1 A
2 A
1A
2A
4A
T.C.R.
Standard
´10-6/¡C
Resistance Values
(ppm/¡C)
<10 W:
Ð100 to
+600
E24
E24
E24
10 W to
1 MW:
±200
E24
E24
E24
1 MW<:
Ð400 to
+150
E24
E24
(1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV=Ö Power Rating ´ Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever is less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined from SOTV=2.5 ´ Power Rating or max. Overload Voltage listed above
whichever is less.
70 ¡C
100Ð55 ¡C
80
60
3G, 6G, 8G
40
1G,2G,14,12,12Z,1T
155 ¡C
20
125
¡C
0Ð60 Ð40 Ð20 0 20 40 60 80 100 120 140 160 180
Ambient Temperature (¡C)
Rated Load (%)
Power Derating Curve
For resistors operating in ambient temperature above
70 ¡C, power rating should be derated in accordance
with the right figure.
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Thick Film Chip Resistors
n Packaging Specifications
l Standard Quantity
Type
(inches)
Thickness
(mm)
Punched (Paper) Taping
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12,12Z
(1812, 2010)
ERJ1T
(2512)
0.25
15000 pcs./reel (2 mm pitch)
10000
20000
10000
5000
0.35
0.45
pcs./reel
pcs./reel
pcs./reel
pcs./reel
Embossed Taping
(4 mm pitch)
Bulk Case
(2 mm pitch)
(2 mm pitch)
(2 mm pitch)
(4 mm pitch) ]
0.6
5000 pcs./reel (4 mm pitch)]
0.6
5000 pcs./reel (4 mm pitch)]
50000 pcs./case
25000 pcs./case
10000 pcs./case
0.6
5000 pcs./reel
0.6
5000 pcs./reel
0.6
4000 pcs./reel
] Please consult us if resistors other than shown above are needed.
l Taping Reel
l Bulk Case
(mm)
T
Slider
12
Shutter
38
fB
fC
fA
Type
110
W
fA
fB
fC
W
T
Dimensions 1G,2G,3G
9.0±1.0 11.4±2.0
0
(mm)
6G,8G,14 180.0Ð3.0
60 min. 13.0±1.0
12,12Z,1T
13.0±1.0 15.4±2.0
l Punched (Paper) Taping
Compartment
Chip component
Type
1G
Dimensions 2G
3G
(mm)
6G
8G
P1 P2
A
B
0.38±0.05
0.70±0.05
1.10±0.10
1.65±0.15
2.00±0.15
0.68±0.05
1.20±0.05
1.90±0.10
2.50±0.20
3.60±0.20
8.00±0.20
3.50±0.05
1.75±0.10
P2
P0
fD0
2.00±0.05
4.00±0.10
1.50+0.10
0
T
0.47±0.05
0.52±0.05
0.70±0.05
Type
P1
1G
2.00±0.10
Dimensions 2G
3G
(mm)
6G 4.00±0.10
8G
W
F
E
F
W
A
Tape running direction
P0
Compartment
B
B
A
T
Sprocket hole
fD0
F E
W
Sprocket hole
fD0
l Embossed Taping
E
0.84±0.05
t
Chip component
Type
14
Dimensions 12
(mm)
12Z
1T
A
2.80±0.20
3.50±0.20
2.80±0.20
3.60±0.20
Type
P2
14
Dimensions 12
2.00±0.05
(mm)
12Z
1T
P1
P2
B
fD1
Tape running direction
P0
W
F
E
P1
3.50±0.20 8.00±0.30 3.50±0.05
4.80±0.20
1.75±0.10 4.00±0.10
5.30±0.20 12.00±0.30 5.50±0.05
6.90±0.20
P0
fD0
t
4.00±0.10
1.50+0.10
0
1.00±0.10
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
fD1
1 min.
1.5 min.
Thick Film Chip Resistors
n Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Type
(inches)
ERJ1G(0201)
ERJ2G(0402)
ERJ3G(0603)
ERJ6G(0805)
ERJ8G(1206)
ERJ14(1210)
ERJ12(1812)
ERJ12Z(2010)
ERJ1T(2512)
c
Chip Resistor
a
b
Dimensions (mm)
a
b
c
0.3 to 0.4
0.8 to 0.9 0.25 to 0.35
0.5 to 0.6
1.4 to 1.6
0.4 to 0.6
0.7 to 0.9
2 to 2.2
0.8 to 1
1 to 1.4
3.2 to 3.8
0.9 to 1.4
2 to 2.4
4.4 to 5
1.2 to 1.8
2 to 2.4
4.4 to 5
1.8 to 2.8
3.3 to 3.7
5.7 to 6.5
2.3 to 3.5
3.6 to 4
6.2 to 7
1.8 to 2.8
5 to 5.4
7.6 to 8.6
2.3 to 3.5
n Recommended Soldering Conditions
Recommendations and precautions are described below.
l Recommended soldering conditions for reflow
áReflow soldering should be a maximum of two times
áPlease contact us for additional information when
used in conditions other than those specified.
áPlease measure the temperature of terminations and study
every type of printed circuit board for solderability, before
actual use.
Peak
Preheating
Main heating
Peak
Temperature
Time
140 ¡C to 160 ¡C
60 s to 120 s
Above 200 ¡C
30 s to 40 s
235 ± 5 ¡C
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
Temperature
For soldering (Example : Sn/Pb)
Preheating
Heating
Main heating
Peak
150 ¡C to 180 ¡C
60 s to 120 s
Above 230 ¡C
30 s to 40 s
max. 260 ¡C
max. 10 s
Time
l Recommended soldering conditions for flow
For soldering
For lead-free soldering
Temperature
Time
Temperature
Time
Preheating
140 ¡C to 160 ¡C
60 s to 120 s
150 ¡C to 180 ¡C
60 s to 120 s
Soldering
245±5 ¡C
20 s to 30 s
max. 260 ¡C
max. 10 s
Safety Precautions
1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and
confirmation test with the resistors actually mounted on the board.
When a load of more than the rated power is applied under load condition at steady state, it may
impair performance and/or reliability of the resistor.
Never exceed the specified rated power.
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of
the resistors.
3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a
soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds
and up to 350 ¡C).
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may
damage the protective coating of the resistor and may affect its performance.
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.