Fairchild FDP75N08 0606 75v n-channel mosfet Datasheet

TM
UniFET
FDP75N08
75V N-Channel MOSFET
Features
Description
•
•
•
•
•
•
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power supplies, active power factor
correction, electronic lamp ballast based on half bridge
topology.
75A, 75V, RDS(on) = 0.011Ω @VGS = 10 V
Low gate charge ( typical 150 nC)
Low Crss ( typical 85 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
G
TO-220
G DS
FDP Series
S
Absolute Maximum Ratings
Symbol
Parameter
FDP75N08
Units
VDSS
Drain-Source Voltage
75
V
ID
Drain Current
- Continuous (TC = 25°C)
75
A
IDM
Drain Current
- Pulsed
- Continuous (TC = 100°C)
47.7
A
(Note 1)
300
A
± 20
V
1164
mJ
VGSS
Gate-Source Voltage
EAS
Single Pulsed Avalanche Energy
(Note 2)
IAR
Avalanche Current
(Note 1)
75
A
EAR
Repetitive Avalanche Energy
(Note 1)
13.1
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
PD
Power Dissipation (TC = 25°C)
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
- Derate above 25°C
4.5
V/ns
131
W
1
W/°C
-55 to +150
°C
300
°C
Thermal Characteristics
Symbol
Parameter
FDP75N08
Units
0.95
°C/W
RθJC
Thermal Resistance, Junction-to-Case
RθCS
Thermal Resistance, Case-to-Sink
0.5
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
62.5
°C/W
©2006 Fairchild Semiconductor Corporation
FDP75N08 Rev. A
1
www.fairchildsemi.com
FDP75N08 75V N-Channel MOSFET
June 2006
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FDP75N08
FDP75N08
TO-220
--
--
50
Electrical Characteristics
Symbol
TC = 25°C unless otherwise noted
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = 250 µA
75
--
--
V
∆BVDSS/
∆TJ
Breakdown Voltage Temperature Coefficient
ID = 250 µA, Referenced to 25°C
--
0.6
--
V/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 75 V, VGS = 0 V
--
--
1
µA
VDS = 60 V, TC = 125°C
--
--
10
µA
IGSSF
Gate-Body Leakage Current, Forward
VGS = 20 V, VDS = 0 V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -20 V, VDS = 0 V
--
--
-100
nA
VDS = VGS, ID = 250 µA
2.0
--
4.0
V
On Characteristics
VGS(th)
Gate Threshold Voltage
RDS(on)
Static Drain-Source On-Resistance
VGS = 10 V, ID = 37.5 A
gFS
Forward Transconductance
VDS = 40 V, ID =37.5 A
(Note 4)
--
9.5
11
mΩ
--
15
--
S
--
2940
3820
pF
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
--
680
890
pF
--
85
125
pF
--
7.2
25
ns
--
68
146
ns
--
77
164
ns
--
93
196
ns
--
64
84
nC
--
16
--
nC
--
24
--
nC
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
VDD = 37.5 V, ID = 75A,
RG = 25 Ω
(Note 4, 5)
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
VDS = 60 V, ID = 75A,
VGS = 10 V
(Note 4, 5)
Gate-Drain Charge
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
75
A
ISM
Maximum Pulsed Drain-Source Diode Forward Current
--
--
300
A
VSD
Drain-Source Diode Forward Voltage
VGS = 0 V, IS = 75 A
--
--
1.4
V
trr
Reverse Recovery Time
--
62
--
ns
Qrr
Reverse Recovery Charge
VGS = 0 V, IS = 75 A,
dIF / dt = 100 A/µs
--
150
--
nC
(Note 4)
NOTES:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 138µH, IAS = 75A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 75A, di/dt ≤200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
2
FDP75N08 Rev. A
www.fairchildsemi.com
FDP75N08 75V N-Channel MOSFET
Package Marking and Ordering Information
FDP75N08 75V N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
VGS
15.0V
9.0V
7.5V
7.0V
6.5v
6.0V
5.5V
5.0V
Bottom : 4.5V
2
10
100
ID, Drain Current [A]
ID, Drain Current [A]
Top:
0
150 C
0
-55 C
0
25 C
10
* Note :
1. VDS=40V
2. 250µs Pulse Test
* Note :
1. 250µs Pulse Test
0
2. TC=25 C
1
1
10
0
2
1
10
10
4
6
8
10
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
RDS(ON) [Ω],
Drain-Source On-Resistance
0.012
IDR, Reverse Drain Current [A]
0.011
VGS = 10V
0.010
0.009
VGS = 20V
0.008
o
* Note : TJ = 25 C
2
10
0
150 C
0
25 C
1
10
* Note :
1. VGS=0V
2. 250µs Pulse Test
0
0.007
10
0
25
50
75
100
125
150
175
0.2
200
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VDS, Source-Drain Violtage [V]
ID, Drain Current [A]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Coss
5000
10
VGS, Gate-Source Voltage [V]
6000
Capacitances [pF]
Ciss
4000
3000
2000
* Note :
1. VGS = 0 V
2. f = 1 MHz
Crss
1000
0
-1
10
VDS = 60V
8
6
4
2
* Note : ID = 75A
0
10
0
0
1
10
20
30
40
50
60
70
80
10
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
3
FDP75N08 Rev. A
VDS = 37.5V
www.fairchildsemi.com
FDP75N08 75V N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
1.1
1.0
* Notes :
1. VGS = 0 V
2. ID = 250 µA
0.9
0.8
-100
-50
0
50
100
150
2.5
2.0
1.5
1.0
* Notes :
1. VGS = 10 V
2. ID = 37.5 A
0.5
0.0
-100
200
-50
0
o
3
70
100 µs
10
0
10
60
ID, Drain Current [A]
ID, Drain Current [A]
1ms
1
10ms
100ms
Operation in This Area
is Limited by R DS(on)
DC
* Notes :
o
1. TC = 25 C
-1
50
40
30
20
o
2. TJ = 150 C
3. Single Pulse
10
200
80
2
10
150
Figure 10. Maximum Drain Current
vs. Case Temperature
10 µs
10
100
TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area
10
50
o
TJ, Junction Temperature [ C]
10
-2
10
0
10
1
10
0
25
2
50
75
100
125
150
o
VDS, Drain-SourceVoltage[V]
TC, Case Temperature [ C]
Figure 11. Transient Thermal Response Curve
0
D = 0 .5
0 .2
10
?
0 .1
-1
N o te s :
0
1 . Z ? J C( t ) = 1 . 1 C / W M a x .
2 . D u ty F a c to r , D = t1/t2
3 . T J M - T C = P D M * Z ? J C( t )
0 .0 5
PDM
0 .0 2
0 .0 1
? JC
(t), Thermal Response
10
t1
t2
Z
s in g le p u ls e
10
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
4
FDP75N08 Rev. A
www.fairchildsemi.com
FDP75N08 75V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
5
FDP75N08 Rev. A
www.fairchildsemi.com
FDP75N08 75V N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
6
FDP75N08 Rev. A
www.fairchildsemi.com
TO-220
4.50 ±0.20
2.80 ±0.10
(3.00)
+0.10
1.30 –0.05
18.95MAX.
(3.70)
ø3.60 ±0.10
15.90 ±0.20
1.30 ±0.10
(8.70)
(1.46)
9.20 ±0.20
(1.70)
9.90 ±0.20
(45°
1.52 ±0.10
10.08 ±0.30
(1.00)
13.08 ±0.20
)
1.27 ±0.10
0.80 ±0.10
2.54TYP
[2.54 ±0.20]
+0.10
0.50 –0.05
2.40 ±0.20
2.54TYP
[2.54 ±0.20]
10.00 ±0.20
Dimensions in Millimeters
7
FDP75N08 Rev. A
www.fairchildsemi.com
FDP75N08 75V N-Channel MOSFET
Mechanical Dimensions
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This datasheet contains the design specifications for
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First Production
This datasheet contains preliminary data, and
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The datasheet is printed for reference information only.
Rev. I19
8
FDP75N08 Rev. A
www.fairchildsemi.com
FDP75N08 75V N-Channel MOSFET
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