Fairchild FDPF44N25 250v n-channel mosfet Datasheet

TM
FDPF44N25
250V N-Channel MOSFET
Features
Description
• 18A, 250V, RDS(on) = 0.069Ω @VGS = 10 V
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
• Low gate charge ( typical 47 nC)
• Low Crss ( typical 60 pF)
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor
correction.
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
D
G
TO-220F
GD S
FDPF Series
S
Absolute Maximum Ratings
Symbol
Parameter
VDSS
Drain-Source Voltage
ID
Drain Current
- Continuous (TC = 25°C)
- Continuous (TC = 100°C)
IDM
Drain Current
- Pulsed
VGSS
Gate-Source voltage
EAS
IAR
FDPF44N25
Unit
250
V
18
10.8
A
A
72
A
±30
V
Single Pulsed Avalanche Energy
(Note 2)
2055
mJ
Avalanche Current
(Note 1)
18
A
EAR
Repetitive Avalanche Energy
(Note 1)
5.6
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
PD
Power Dissipation
56
0.45
W
W/°C
-55 to +150
°C
300
°C
(Note 1)
(TC = 25°C)
- Derate above 25°C
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
Thermal Characteristics
Symbol
Parameter
Min.
Max.
Unit
RθJC
Thermal Resistance, Junction-to-Case
--
2.23
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
--
62.5
°C/W
©2005 Fairchild Semiconductor Corporation
FDPF44N25 Rev A
1
www.fairchildsemi.com
FDPF44N25 250V N-Channel MOSFET
UniFET
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FDPF44N25
FDPF44N25T
TO-220F
Potting Type
--
--
50
FDPF44N25
FDPF44N25
TO-220F
--
--
50
Electrical Characteristics
Symbol
TC = 25°C unless otherwise noted
Parameter
Conditions
Min.
Typ.
Max Units
250
--
--
V
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250µA
∆BVDSS
/ ∆TJ
Breakdown Voltage Temperature
Coefficient
ID = 250µA, Referenced to 25°C
--
0.25
--
V/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 250V, VGS = 0V
VDS = 200V, TC = 125°C
---
---
1
10
µA
µA
IGSSF
Gate-Body Leakage Current, Forward
VGS = 30V, VDS = 0V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -30V, VDS = 0V
--
--
-100
nA
3.0
--
5.0
V
--
0.058
0.069
Ω
--
32
--
S
--
2210
2870
pF
--
450
585
pF
--
60
90
pF
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
RDS(on)
Static Drain-Source
On-Resistance
VGS = 10V, ID = 9A
gFS
Forward Transconductance
VDS = 40V, ID = 9A
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25V, VGS = 0V,
f = 1.0MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDD = 125V, ID = 44A
RG = 25Ω
(Note 4, 5)
VDS = 200V, ID = 44A
VGS = 10V
(Note 4, 5)
--
53
117
ns
--
402
814
ns
--
85
179
ns
--
112
234
ns
--
47
61
nC
--
18
--
nC
--
24
--
nC
18
A
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
ISM
Maximum Pulsed Drain-Source Diode Forward Current
--
--
72
A
VSD
Drain-Source Diode Forward Voltage
VGS = 0V, IS = 18A
--
--
1.4
V
trr
Reverse Recovery Time
195
--
ns
Reverse Recovery Charge
VGS = 0V, IS = 44A
dIF/dt =100A/µs
--
Qrr
--
1.8
--
µC
(Note 4)
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 10.1mH, IAS = 18A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 18A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
2
FDPF44N25 Rev A
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FDPF44N25 250V N-Channel MOSFET
Package Marking and Ordering Information
10
2
10
1
10
Figure 2. Transfer Characteristics
VGS
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
Top :
ID, Drain Current [A]
ID, Drain Current [A]
Figure 1. On-Region Characteristics
10
2
10
1
o
150 C
o
25 C
o
-55 C
0
∝ Notes :
1. VDS = 40V
2. 250レs Pulse Test
∝ Notes :
1. 250レs Pulse Test
2. TC = 25∩
10
-1
10
0
10
10
1
0
2
4
6
8
10
12
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
2
IDR, Reverse Drain Current [A]
RDS(ON) [ヘ ],
Drain-Source On-Resistance
0.10
0.08
VGS = 10V
0.06
VGS = 20V
0.04
∝ Note : TJ = 25∩
10
1
10
150∩
25∩
∝ Notes :
1. VGS = 0V
2. 250レs Pulse Test
0
0
25
50
75
100
125
10
150
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VSD, Source-Drain voltage [V]
ID, Drain Current [A]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
12
6000
Capacitances [pF]
5000
4000
3000
Coss
Ciss
2000
1000
VGS, Gate-Source Voltage [V]
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
∝ Note ;
1. VGS = 0 V
2. f = 1 MHz
Crss
VDS = 50V
10
VDS = 125V
VDS = 200V
8
6
4
2
∝ Note : ID = 44A
0
-1
10
0
0
10
1
10
3
FDPF44N25 Rev A
0
10
20
30
40
50
60
70
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
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FDPF44N25 250V N-Channel MOSFET
Typical Performance Characteristics
FDPF44N25 250V N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
1.1
1.0
∝ Notes :
1. VGS = 0 V
2. ID = 250 レA
0.9
0.8
-100
-50
0
50
100
150
2.5
2.0
1.5
1.0
∝ Notes :
1. VGS = 10 V
2. ID = 9 A
0.5
0.0
-100
200
-50
0
50
100
o
TJ, Junction Temperature [ C]
150
200
o
TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
20
2
10
1 ms
10 ms
1
10
100 ms
Operation in This Area
is Limited by R DS(on)
0
10
ID, Drain Current [A]
ID, Drain Current [A]
10 µs
100 µs
DC
∝ Notes :
-1
10
o
10
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
-2
10
0
1
10
0
25
2
10
10
50
VDS, Drain-Source Voltage [V]
75
100
125
150
TC, Case Temperature [∩ ]
Figure 11. Transient Thermal Response Curve
Zヨ JC(t), Thermal Response
10
D = 0 .5
0
0 .2
0 .1
10
∝ N o te s :
1 . Z ヨ J C( t ) = 2 . 2 3 ∩ / W M a x .
2 . D u t y F a c t o r , D = t 1 /t 2
3 . T J M - T C = P D M * Z ヨ J C( t )
0 .0 5
-1
0 .0 2
0 .0 1
PDM
t1
10
s in g le p u ls e
-2
10
-5
10
-4
10
-3
10
-2
10
-1
t2
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
4
FDPF44N25 Rev A
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FDPF44N25 250V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
5
FDPF44N25 Rev A
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FDPF44N25 250V N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
6
FDPF44N25 Rev A
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Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
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First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
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changes at any time without notice in order to improve
design.
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any time without notice in order to improve design.
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This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I16
7
FDPF44N25 Rev A
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FDPF44N25 250V N-Channel MOSFET
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