WJ FH1-G High dynamic range fet Datasheet

FH1
The Communications Edge TM
Product Information
High Dynamic Range FET
Product Features
x 50 – 3000 MHz
x Low Noise Figure
x 18 dB Gain
x +42 dBm OIP3
x +21 dBm P1dB
x Single or Dual Supply Operation
x Lead-free/Green/RoHS-compliant
SOT-89 Package
x MTTF > 100 years
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x Defense / Homeland Security
Product Description
Functional Diagram
The FH1 is a high dynamic range FET packaged in a lowcost surface-mount package. The combination of low noise
figure and high output IP3 at the same bias point makes it
ideal for receiver and transmitter applications. The device
combines dependable performance with superb quality to
maintain MTTF values exceeding 100 years at mounting
temperatures of +85 qC. The FH1 is available the
enviornmentally-friendly lead-free/green/RoHS-compliant
SOT-89 package.
4
Saturated Drain Current, Idss (2)
Transconductance, Gm
Pinch-off Voltage, Vp (3)
RF Parameter
3
Pin No.
1
3
2, 4
Typical Performance (6)
Units Min
mA
mS
V
100
-3
Units Min
Operational Bandwidth
Test Frequency
Small-signal Gain, Gss
Max Stable Gain, Gmsg
Output IP3 (4)
P1dB
Minimum Noise Figure (5)
Drain Bias
Gate Bias
2
Function
Gate
Drain
Source
The device utilizes a high reliability GaAs MESFET
technology and is targeted for applications where high
linearity is required. It is well suited for various current
and next generation wireless technologies such as GPRS,
GSM, CDMA, and W-CDMA. In addition, the FH1 will
work for other applications within the 50 to 3000 MHz
frequency range such as fixed wireless.
Specifications (1)
DC Electrical Parameter
1
MHz
MHz
dB
dB
dBm
dBm
dB
V
V
Typ
Max
Parameter
Units
140
120
-1.5
170
Typ
Max
Frequency
S21
S11
S22
Output IP3 (4)
Output P1dB
Noise Figure
Drain Bias
Gate Voltage
MHz
dB
dB
dB
dBm
dBm
dB
50 – 3000
800
17
18
23
+38
+42
+21
0.77
+5
0
Typical
900
19
-11
-10
+42
+21.8
2.7
V
1960
2140
16.5
16.5
-20
-22
-9
-9
+40
+40
+22.1
+22.1
3.1
3.0
5V @ 140mA
0
6. The device requires appropriate matching to become unconditionally stable. Parameters reflect
performance in an appropriate application circuit.
1. DC and RF parameters are measured under
the following conditions unless otherwise noted:
25 C with Vds = 5V, Vgs = 0V, in a 50 system.
2. Idss is measured with Vgs = 0V.
3. Pinch-off voltage is measured with Ids = 0.6 mA.
4. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
5. The minimum noise figure has S = L = OPT.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
Drain to Source Voltage
Gate to Source Voltage
Gate Current
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 qC
-55 to +150 qC
+7 V
-6 V
4.5 mA
4 dB above Input P1dB
+220 qC
Ordering Information
Part No.
FH1-G
Description
High Dynamic Range FET
(lead-free/green/RoHS-compliant SOT-89 package)
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 1 of 7 July 2006
FH1
The Communications Edge TM
Product Information
High Dynamic Range FET
Typical Device Data
Data is shown at a biasing configuration of VDS = +5 V, IDS = 140 mA, 25 C for the unmatched device in a 50 ohm system)
S11
0.8
1.0
Swp Max
6GHz
2.
0
2.
0
6
0.
1.0
0.8
DB(GMax())
0.
4
22
0
3.
0
3.
0
4.
20
0
4.
5.0
5.0
0.2
0.2
10.0
10.0
5.0
4.0
3.0
2.0
1.0
0.8
0.6
0.4
0
0.2
10.0
10.0
5.0
4.0
3.0
2.0
1.0
0.8
0.6
0.4
0
0.2
18
16
-10.
0
-10.0
2
-0.
-5.
0
-0.
14
2
-5.
0
-4
.0
-3
.0
.0
-2
Swp Min
0.01GHz
-1.0
Swp Min
0.01GHz
-0.8
-0
.6
Frequency (GHz)
.4
-0
.0
-2
3
-1.0
2
-0.8
1
-0
.6
0
-3
.0
.4
-0
12
-4
.0
S21 and MSG (dB)
6
0.
DB(|S(2,1)|)
S22
Swp Max
6GHz
0.
4
Gain and Max. Stable Gain
24
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a tuned circuit for a particular frequency, it
is expected that actual gain will be higher, as high as the maximum stable gain. The maximum stable gain is shown in the red line. The
impedance plots are shown from 10 – 6000 MHz, with markers placed at 0.5 – 6.0 GHz in 0.5 GHz increments.
Output IP3 vs. Temperature
Output IP3 vs. Output Power
40
35
30
40
35
30
5V 100% Idss
5V 100% Idss
25
25
-40
-15
10
35
60
85
Noise Figure vs. Frequency
2.5
Noise Figure (dB)
45
OIP3 (dBm)
OIP3 (dBm)
45
NF (unmatched device)
2
Minimum NF
1.5
1
0.5
0
0
2
Temperature ( C)
4
6
8
10
12
0.5
1
Output Power per tone (dBm)
1.5
2
Frequency (GHz)
S-Parameters (VD = +5 V, ID = 140 mA, VG = 0 V, 25 C, calibrated to device leads)
Freq (MHz)
50
250
500
750
1000
1250
1500
1750
2000
2250
2500
2750
3000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
0.00
-0.13
-0.34
-0.55
-0.83
-1.16
-1.50
-1.80
-2.03
-2.25
-2.37
-2.55
-2.62
-4.08
-19.64
-39.41
-58.33
-75.93
-93.29
-110.36
-125.64
-140.92
-155.64
-169.80
177.26
165.93
19.36
19.19
18.85
18.47
17.95
17.47
16.82
16.21
15.65
15.05
14.42
13.74
13.18
176.06
164.65
150.19
136.21
123.24
110.92
99.18
88.19
77.53
67.15
57.62
48.11
39.86
-51.05
-37.15
-31.34
-28.24
-26.22
-24.88
-23.95
-23.27
-22.81
-22.39
-22.25
-22.08
-22.01
87.96
78.37
66.75
55.74
45.25
35.22
26.69
18.17
9.87
2.11
-4.68
-11.35
-17.16
-4.38
-4.52
-4.77
-5.19
-5.77
-6.44
-7.14
-7.94
-8.84
-9.57
-10.43
-11.43
-12.30
-3.34
-11.51
-22.43
-33.05
-43.46
-53.09
-61.08
-69.92
-78.43
-86.41
-93.92
-101.88
-108.95
Noise Parameters (VD = +5 V, ID = 140 mA, VG = 0 V, 25 C, calibrated to device leads)
Freq (MHz)
700
800
900
1000
1100
1200
1300
1400
NF,min (dB)
0.51
0.77
0.66
0.74
0.85
0.85
0.95
1.07
MagOpt (mag)
0.574
0.535
0.508
0.488
0.463
0.458
0.446
0.450
AngOpt (deg)
32.8
37.4
44.1
50.4
56.4
62.0
67.3
73.3
Rn
0.403
0.409
0.379
0.365
0.357
0.345
0.335
0.323
Device S-parameters and noise are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 2 of 7 July 2006
FH1
The Communications Edge TM
Product Information
High Dynamic Range FET
Reference Design: 35 MHz, 17 dB Gain
30
16.6
-19
-21
35
16.8
-20
-16
+21
+39
3.4
+5
140
4.0
40
16.8
-13
-14
Gain / Return Loss
18
3.2
DB(|S(2,1)|) (L)
ID=C6
C=1000 pF
ID=R7
R=390 Ohm
-5
16
-10
15
-15
14
-20
13
-25
ID=R1
C=68 pF
30
35
Frequency (MHz)
40
45
ID=C3
C=1000 pF
+5V
ID=L1
L=470 nH
NET="FH1"
ID=C1
R=3.9 Ohm
0
DB(|S(2,2)|) (R)
17
25
ID=R6
R=390 Ohm
DB(|S(1,1)|) (R)
S11, S22 (dB)
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Gain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Supply Voltage
Supply Current
2
1
ID=C2
C=1000 pF
ID=R8
L=390 nH
Notes:
!#"$ %&('*)# +-,,/. r 0 ! )21 3 #4 #5#5 687#:9/ ;<9/ = 5/ ;7#2=* ; 9<5 # ; #>8?2 1.
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
Reference Design: 170 MHz, 14 dB Gain
ID=R6
R=240 Ohm
ID=C6
ID=R7
C=1000 pF R=240 Ohm
160
14.1
-25
-21
170
14.2
-33
-23
+21.6
+42
2.7
+5
140
2.7
+5V
180
14.3
-28
-26
Gain / Return Loss (dB)
15
DB(|S(2,1)|) (L)
2.7
DB(|S(1,1)|) (R)
0
DB(|S(2,2)|) (R)
14
-10
13
-20
12
-30
11
S11, S22 (dB)
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Gain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Supply Voltage
Supply Current
-40
0.12
0.14
0.16
0.18
Frequency (GHz)
0.2
0.22
ID=C3
C=1000 pF
ID=L1
L=220 nH
NET="FH1"
2
ID=R1
C=24 pF
1
ID=R2
R=4 Ohm
ID=C2
C=1000 pF
ID=R8
L=82 nH
Notes:
1.
Circuit Board Material: .014” Getek ML200DSS ( r 0 ! )21 3 #4 #5#5 687#:9/ ;<9/ = 5/ ;7#2=* ; 9<5 # ; #>8?2
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 3 of 7 July 2006
FH1
The Communications Edge TM
Product Information
High Dynamic Range FET
Reference Design: 260 MHz, 25 dB Gain
250
25.2
-23
-12
1.8
260
25.1
-22
-14
+22.4
+39.5
1.9
+5
140
ID=C6
ID=R7
C=1000 pF R=2000 Ohm
ID=R6
R=2000 Ohm
ID=C1
C=1000 pF
270
24.9
-13
-17
Gain / Return Loss
26
2.1
0
25
-5
24
-10
23
-15
22
S11, S22 (dB)
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Gain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Supply Voltage
Supply Current
-20
DB(|S(2,1)|) (L)
DB(|S(1,1)|) (R)
DB(|S(2,2)|) (R)
21
-25
0.2
0.22
0.24
0.26
Frequency (GHz)
0.28
0.3
ID=C3
C=1.8e4 pF
+5V
NET="FH1"
ID=L1
L=220 nH
2
ID=R1
L=120 nH
1
ID=C2
C=1000 pF
ID=C5
R=1e4 Ohm
C=0.2 pF
R=3.3 Ohm
Notes:
1.
Circuit Board Material: .0 !#"$ %&('*)# +-,,/. r 0 ! )21 3 #4 #5#5 687#:9/ ;<9/ = 5/ ;7#2=* ; 9<5 # ; #>8?2
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
Reference Design: 460 MHz, 20 dB Gain
ID=R6
R=750 Ohm
ID=C6
C=1000 pF
450
19.9
-24
-16
1.95
460
19.9
-24
-15
+21.6
+42
2.08
+5
140
ID=R7
+5V
R=750 Ohm
NET="FH1"
ID=C1
C=1000 pF
ID=R1
L=36 nH
470
19.9
-21
-15
Gain / Return Loss
21
2.17
DB(|S(2,1)|) (L)
DB(|S(1,1)|) (R)
0
DB(|S(2,2)|) (R)
20
-5
19
-10
18
-15
17
-20
16
S11, S22 (dB)
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Gain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Supply Voltage
Supply Current
-25
0.34
0.38
0.42
0.46
0.5
Frequency (GHz)
0.54
0.58
ID=C3
C=1000 pF
ID=L1
L=100 nH
2
1
ID=R2
L=10 nH
ID=C2
C=1000 pF
ID=C5
R=5000 Ohm
Notes:
1.
Circuit Board Material: .0 !#"$ %&('*)# +-,,/. r 0 ! )21 3 #4 #5#5 687#:9/ ;<9/ = 5/ ;7#2=* ; 9<5 # ; #>8?2
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 4 of 7 July 2006
FH1
The Communications Edge TM
Product Information
High Dynamic Range FET
Reference Design: 790 MHz, 19 dB Gain
746
19.2
-20
-22
790
19.4
-28
-23
+22
+41
2.3
+5
140
835
19.3
-15
-22
Gain / Return Loss
20
DB(|S(2,1)|) (L)
DB(|S(1,1)|) (R)
0
DB(|S(2,2)|) (R)
19.5
-5
19
-10
18.5
-15
18
-20
17.5
-25
17
S11, S22 (dB)
GHz
dB
dB
dB
dBm
dBm
dB
V
mA
Gain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Supply Voltage
Supply Current
-30
0.7
0.75
0.8
Frequency (GHz)
0.85
0.9
+5V
ID=C4
C=1e4 pF
ID=C6
C=100 pF
ID=R6
R=560 Ohm
ID=C3
C=100 pF
ID=R7
R=560 Ohm
ID=L1
L=27 nH
NET="FH1"
ID=C1
C=100 pF
2
1
ID=R2
L=2.2 nH
ID=R1
L=8.2 nH
ID=C2
C=100 pF
ID=C5
L=10 nH
Notes:
1.
Circuit Board Material: .0 !#"$ %&('*)# +-,,/. 0 ! )#1 3 #4 #5#5 687#9< ;/9< = 5/ ;7#2=* ; 9<5 # ; #>8?2
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
Reference Design: 790 MHz, 17 dB Gain
2.0
790
17.4
-19
-22
+22
+41
2.1
+5
140
835
17.4
-16
-21
Gain / Return Loss
19
DB(|S(1,1)|) (R)
2.2
DB(|S(2,1)|) (L)
0
18
-5
17
-10
16
-15
15
-20
14
-25
0.7
0.75
+5V
0.8
Frequency (GHz)
0.85
0.9
Noise Figure vs. Frequency
4
DB(|S(2,2)|) (R)
25 °C
50 °C
90 °C
3
NF (dB)
746
17.3
-19
-22
S 11, S22 (dB )
GHz
dB
dB
dB
dBm
dBm
dB
V
mA
G ain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Voltage
Current
2
1
0
740
760
780
800
820
840
Frequency (MHz)
ID=C4
C=10000 pF
ID=C6
ID=R7
C=100 pF R=360 Ohm
ID=C3
C=100 pF
ID=R6
R=360 Ohm
NET="FH1"
ID=C1
C=100 pF
ID=L1
L=33 nH
2
ID=R1
L=12 nH
ID=C2
C=100 pF
1
ID=C5
R=10000 Ohm
Notes:
1.
Circuit Board Material: .0 !#"$ %&('*)# +-,,/. 0 ! )#1 3 #4 #5#5 687#9< ;/9< = 5/ ;7#2=* ; 9<5 # ; #>8?2
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 5 of 7 July 2006
FH1
The Communications Edge TM
Product Information
High Dynamic Range FET
Reference Design: 880 MHz, 18 dB Gain
850
17.95
-16
-23
875
17.96
-15
-22
+22
+41
1.83
+5
140
1.8
900
18.00
-15
-22
Gain / Return Loss (dB)
19
DB(|S(1,1)|) (R)
1.85
DB(|S(2,1)|) (L)
0
DB(|S(2,2)|) (R)
18
-5
17
-10
16
-15
15
-20
14
S11, S22 (dB)
GHz
dB
dB
dB
dBm
dBm
dB
V
mA
Gain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Supply Voltage
Supply Current
-25
0.7
0.8
0.9
1
Frequency (GHz)
+5V
ID=C4
C=1e4 pF
ID=C6
ID=R7
C=100 pF R=360 Ohm
ID=C3
C=100 pF
ID=R6
R=360 Ohm
ID=L1
L=33 nH
NET="FH1"
2
ID=R1
L=10 nH
ID=C1
C=100 pF
ID=C2
C=100 pF
1
ID=C5
R=1e4 Ohm
Notes:
1.
Circuit Board Material: .0 !#"$ %&('*)# +-,,/. 0 ! )#1 3 #4 #5#5 687#9< ;/9< = 5/ ;7#2=* ; 9<5 # ; #>8?2
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
Reference Design: 800 - 2200 MHz, 15 dB Gain
900
14.9
-22
-14
+22.1
+40.7
2.4
1900
16.3
-10
-9.7
+22.4
+42.0
2.6
+5
140
2140
16.4
-18
-9.6
+22.1
+41.0
2.8
Gain / Return Loss
18
DB(|S(1,1)|) (R)
DB(|S(2,1)|) (L)
DB(|S(2,2)|) (R)
16
10
14
0
12
-10
10
-20
8
-30
0.75
+5V
20
Return Loss (dB)
GHz
dB
dB
dB
dBm
dBm
dB
V
mA
Gain (dB)
Frequency
Gain
S11
S22
P1dB
OIP3
Noise Figure
Supply Voltage
Supply Current
1
1.25
1.5
1.75
Frequency (GHz)
2
2.25
ID=C4
C=100 pF
ID=C6
C=100 pF ID=R7
R=240 Ohm
ID=C1
R=2.2 Ohm
ID=R6
R=240 Ohm
TLINP
ID=TL1
Z0=50 Ohm
L=80 mil
Eeff=3.4
Loss=0
F0=0 GHz
ID=C3
C=100 pF
NET="FH1"
ID=R1
L=2.7 nH
2
ID=L1
L=18 nH
1
ID=C2
C=100 pF
C=2 pF
ID=C5
L=6.8 nH
Notes:
R
1.
Circuit Board Material: .0 A B#CDE F E G&H(I*JK#K L-MM/N O8PQBR J#S T A U#VW U#X#XE O RY8Z#E[<\ ] ^/[<] W O U_ F O ] X/` ] ^EZ#\2_*\` ] ^E] [<XE a#\ ^W EU#b8c2K
2.
Components not shown in the schematic are either not used or loaded with a thru. Gain for the circuit can be adjusted slightly with the modification of the feedback resistance.
3.
A dc blocking capacitor needs to be placed before C1 if dc is present at the input of the circuit.
Specifications and information are subject to change without notice.
WJ Communications, Inc
@
Phone 1-800-WJ1-4401
@
FAX: 408-577-6621
@
e-mail: [email protected]
@
Web site: www.wj.com
Page 6 of 7 July 2006
FH1
The Communications Edge TM
Product Information
High Dynamic Range FET
FH1-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes.
Outline Drawing
Product Marking
The FH1-G will be marked with an “FH1G”
designator.
An alphanumeric lot code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
an “FH1” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes e 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes e 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 d C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
-40 to +85 qC
59 qC / W
126 qC
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 140 mA at an 85 d C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 d C.
MTTF vs. GND Tab Temperature
1000
MTTF (million hrs)
Thermal Specifications
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135” ) diameter drill and
have a final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
100
10
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice.
WJ Communications, Inc
@
Phone 1-800-WJ1-4401
@
FAX: 408-577-6621
@
e-mail: [email protected]
@
Web site: www.wj.com
Page 7 of 7 July 2006
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